JP2005150283A - Ｂｇａパッケージ - Google Patents

Ｂｇａパッケージ Download PDF

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Publication number
JP2005150283A
JP2005150283A JP2003383617A JP2003383617A JP2005150283A JP 2005150283 A JP2005150283 A JP 2005150283A JP 2003383617 A JP2003383617 A JP 2003383617A JP 2003383617 A JP2003383617 A JP 2003383617A JP 2005150283 A JP2005150283 A JP 2005150283A
Authority
JP
Japan
Prior art keywords
bga package
pads
pad
bypass capacitor
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003383617A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005150283A5 (enExample
Inventor
Kyoko Kobayashi
恭子 小林
Hirokazu Fukui
宏和 福井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2003383617A priority Critical patent/JP2005150283A/ja
Publication of JP2005150283A publication Critical patent/JP2005150283A/ja
Publication of JP2005150283A5 publication Critical patent/JP2005150283A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16265—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being a discrete passive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19103—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
    • H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2003383617A 2003-11-13 2003-11-13 Ｂｇａパッケージ Pending JP2005150283A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003383617A JP2005150283A (ja) 2003-11-13 2003-11-13 Ｂｇａパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003383617A JP2005150283A (ja) 2003-11-13 2003-11-13 Ｂｇａパッケージ

Publications (2)

Publication Number Publication Date
JP2005150283A true JP2005150283A (ja) 2005-06-09
JP2005150283A5 JP2005150283A5 (enExample) 2006-11-24

Family

ID=34692286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003383617A Pending JP2005150283A (ja) 2003-11-13 2003-11-13 Ｂｇａパッケージ

Country Status (1)

Country Link
JP (1) JP2005150283A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173669A (ja) * 2005-12-26 2007-07-05 Murata Mfg Co Ltd 多層回路基板及びｉｃパッケージ
JP2007250928A (ja) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp 多層プリント配線板
US9847299B2 (en) 2014-09-30 2017-12-19 Murata Manufacturing Co., Ltd. Semiconductor package and mounting structure thereof
JP2020520121A (ja) * 2017-05-15 2020-07-02 エイブイエックス コーポレイション 積層コンデンサ、および積層コンデンサを含む回路板
WO2020250947A1 (ja) * 2019-06-14 2020-12-17 キヤノン株式会社 半導体モジュールの製造方法、電子機器の製造方法、半導体モジュール、及び電子機器
JP2020205409A (ja) * 2019-06-14 2020-12-24 キヤノン株式会社 半導体モジュールの製造方法、電子機器の製造方法、半導体モジュール、及び電子機器
WO2023022047A1 (ja) * 2021-08-20 2023-02-23 株式会社村田製作所 高周波モジュール
JP2023531696A (ja) * 2020-07-01 2023-07-25 インターナショナル・ビジネス・マシーンズ・コーポレーション はんだカラムグリッドアレイコンデンサ
US12387877B2 (en) 2021-07-08 2025-08-12 KYOCERA AVX Components Corporation Multilayer ceramic capacitor

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007173669A (ja) * 2005-12-26 2007-07-05 Murata Mfg Co Ltd 多層回路基板及びｉｃパッケージ
JP2007250928A (ja) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp 多層プリント配線板
US9847299B2 (en) 2014-09-30 2017-12-19 Murata Manufacturing Co., Ltd. Semiconductor package and mounting structure thereof
JP2023093671A (ja) * 2017-05-15 2023-07-04 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 積層コンデンサ、および積層コンデンサを含む回路板
US11636978B2 (en) 2017-05-15 2023-04-25 KYOCERA AVX Components Corporation Multilayer capacitor and circuit board containing the same
US12112891B2 (en) 2017-05-15 2024-10-08 KYOCERA AVX Components Corporation Multilayer capacitor and circuit board containing the same
JP2020520121A (ja) * 2017-05-15 2020-07-02 エイブイエックス コーポレイション 積層コンデンサ、および積層コンデンサを含む回路板
JP2020520122A (ja) * 2017-05-15 2020-07-02 エイブイエックス コーポレイション 積層コンデンサ、および積層コンデンサを含む回路板
JP2023093670A (ja) * 2017-05-15 2023-07-04 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 積層コンデンサ、および積層コンデンサを含む回路板
CN114145079A (zh) * 2019-06-14 2022-03-04 佳能株式会社 半导体模块制造方法、电子装置制造方法、半导体模块和电子装置
US20220102330A1 (en) * 2019-06-14 2022-03-31 Canon Kabushiki Kaisha Semiconductor module manufacturing method, electronic equipment manufacturing method, semiconductor module, and electronic equipment
JP2020205409A (ja) * 2019-06-14 2020-12-24 キヤノン株式会社 半導体モジュールの製造方法、電子機器の製造方法、半導体モジュール、及び電子機器
WO2020250947A1 (ja) * 2019-06-14 2020-12-17 キヤノン株式会社 半導体モジュールの製造方法、電子機器の製造方法、半導体モジュール、及び電子機器
JP7592402B2 (ja) 2019-06-14 2024-12-02 キヤノン株式会社 半導体モジュールの製造方法、電子機器の製造方法、半導体モジュール、及び電子機器
JP2023531696A (ja) * 2020-07-01 2023-07-25 インターナショナル・ビジネス・マシーンズ・コーポレーション はんだカラムグリッドアレイコンデンサ
JP7566054B2 (ja) 2020-07-01 2024-10-11 インターナショナル・ビジネス・マシーンズ・コーポレーション はんだカラムグリッドアレイコンデンサ
US12387877B2 (en) 2021-07-08 2025-08-12 KYOCERA AVX Components Corporation Multilayer ceramic capacitor
WO2023022047A1 (ja) * 2021-08-20 2023-02-23 株式会社村田製作所 高周波モジュール

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