JP4987231B2 - 熱伝導性基板パッケージ - Google Patents

熱伝導性基板パッケージ Download PDF

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JP4987231B2
JP4987231B2 JP2004546238A JP2004546238A JP4987231B2 JP 4987231 B2 JP4987231 B2 JP 4987231B2 JP 2004546238 A JP2004546238 A JP 2004546238A JP 2004546238 A JP2004546238 A JP 2004546238A JP 4987231 B2 JP4987231 B2 JP 4987231B2
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substrate
integrated circuit
thermally conductive
conductive
layer
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JP2006515712A (ja
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クリス、ワイランド
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Description

この発明は、集積回路のパッケージングに関し、特に、効果的に熱を伝える基板に関する。
高電流を引き出す回路は熱を発生し、それは消散されねばならない。米国特許６，１２１，６８０は熱フィン構造の使用を開示しており、これは集積回路の上部に固定されて熱を集積回路から熱フィン構造のフィン周囲の空気に消散させるものである。米国特許５，９６０，８６３は複数の重なり合うスクリーンプレートより成る消散ブロックの使用を教示しており、これは、熱が消散する集積回路に固定された熱伝導性ベースプレートにボルトで留められている。
米国特許５，３０９，３２１はワイヤメッシュを教示しており、これは、集積回路チップを入れるハウジングを形成する非導電性の熱硬化性又は熱可塑性材料に包み込まれている。米国特許５，５００，５５５は集積回路チップを搭載する基板を教示しており、これは絶縁性プリプレグ材料と熱伝導性メッシュ又はスクリーンより成るサンドイッチ構造となっている。
各従来技術の実施形態は絶縁材料の層に頼っており、これは、集積回路の導電体から、又は集積回路装置が搭載される集積回路ボードの導電体から熱伝導性材料を分離するものである。各従来技術の実施形態は、集積回路から熱を消散させる多層（導体、非導体）構造を形成するために一つ又はそれ以上の処理工程を必要とする。さらには、各従来技術の実施形態においては、分離型熱消散構造を用いて集積回路から発生した熱を消散させている。
この発明の目的は、集積回路チップのような回路から熱を消散させるコスト的に効果的な手段を提供することである。この発明のさらなる目的は、回路から熱をプリント回路ボード上の複数のトレースに消散させる熱消散装置を提供することである。この発明のさらなる目的は、熱消散装置内の熱伝導性材料に起因する短絡のリスクを最小限に抑える熱消散装置を提供することである。
とりわけこれらの目的は熱伝導性材料の非導電性メッシュを含む基板材料を提供することにより達成される。このメッシュは非導電性なので、基板近傍のありとあらゆる回路トレースを接触させ、これら回路トレースを熱結合ヒートシンクとして用いことができる。好ましい実施形態では、基板において従来用いられている構造物ファイバーグラスメッシュの代わりに熱伝導性メッシュを用いるので、メッシュが二重構造的に且つ熱的に機能する。
この発明を図を参照して例を挙げてさらに詳細に説明する。図１はこの発明の熱伝導性基板を有する集積回路装置の例を示している。
ここに示すこの発明は、集積回路チップを搭載するために用いられる基板、そして、特に、ボールグリッド・アレイ中に集積回路を受け容れる基板を実例をとして用いる。この分野の当業者には明らかなように、この発明は、基板を用いる他の構造、又は、基板を他の構造に固定する他の技術に適用できるものである。同様に、この発明は、特に、より大きなヒートシンクに接触して置かれる基板に適しているが、基板自体がヒートシンク全体を形成してもよく、これは消散される熱量による。
図１は、例として熱伝導性基板１３０を有する集積回路装置１００を示している。集積回路１１０が、この集積回路１１０と基板１３０との間に熱結合をもたらすダイ固定複合体１２０を介して基板１３０に固定されている。集積回路１１０とプリント回路ボード１５０上のトレース１５５との間の熱伝導性がボンディングワイヤ１１２、基板を通じたバイア（図示されない）、そしてハンダ玉１４０を介してもたらされる。
この発明に従って、基板１３０は、交互の層１３５ａ、１３５ｂで示されている熱伝導性であるが非導電性のメッシュ又はグリッド１３５を含んでいる。熱伝導性であるが非導電性のグリッドの例には酸化亜鉛、酸化タングステン、又は、陽極酸化アルミグリッドがある。基礎材料がワイヤに成形され、酸化されてワイヤ上に一体となった非導電性表面を形成し、そして、メッシュ又はグリッドに編み込まれる。これとは別に、基礎材料をグリッドパターンに成形又はスタンピングし、そして酸化又は他の処理により一体化非導電性表面を形成してもよい。さらに別の方法として、酸化した材料を織り上げるのは現実的ではないが、非導電性材料をメッシュ又はグリッドパターンに成形、スタンピング又は織り上げてもよい。
この発明の好ましい実施形態では、従来の基板で用いられているファイバーグラスメッシュの代わりにメッシュ１３５が用いられている。酸化亜鉛又は酸化タングステンのグリッドを用いるとファイバーグラスメッシュより効果的になる。亜鉛を用いると、ファイバーグラスに比べて熱伝導性が実質的に高くなることに加えて、ファイバーグラスよりもエポキシ及び銅に近い熱膨張係数が得られ、基板１３０とプリント回路ボード１５０上のトレース１５５との間の熱応力を低減できる。もしくは、タングステンを用いると、銅よりもシリコンに近い熱膨張係数が得られ、基板１３０と集積回路１１０との間の熱応力を低減でき、さらに、ファイバーグラスよりも熱伝導性が実質的に高くなる。
好ましい実施形態においては、バイア（図示しない）とグリッド１３５とが、グリッド１３５中のギャップにバイアが位置するように配されて、バイア位置においてグリッド１３５の酸化絶縁に穴があかないようにする。あるいは、基板内にバイア用の穴をあけたあとにグリッド／メッシュ１３５に酸化が生じて、グリッド／メッシュ１３５の露出した上部層及び下部層を絶縁し、さらに、各バイア穴内の如何なる露出金属をも絶縁する。
集積回路１１０又はプリント回路ボード１５０と従来の熱伝導性層との間に一つ又はそれ以上の別々の絶縁材料を用いる従来技術に比べ、この発明の開示では、より高い熱結合性をもたらす。何故ならば、この発明の熱伝導性層１３５は非導電性であり、これらの層は基板１３０の表面まで拡張され、熱生成装置１１０且つ又はヒートシンク構造１５０と直接又は間接的に接触する。例えば、銅の熱伝導性層を分離するのにプリプレグ材料層を用いる米国特許５，５００，５５５に対し、酸化亜鉛又は酸化タングステンはプリプレグ材料よりも熱伝導性が実質的に高い。
上記記載は単にこの発明の原理を述べたに過ぎない。従って、当業者であれば、ここに明瞭に記載され又は示されていなくとも、この発明の原理を含み、各請求項の精神と範囲内で様々な態様を考案できることは明らかである。
この発明の熱伝導性基板を有する集積回路装置の例を示す図である。

Claims (8)

  1. 集積回路と該集積回路を搭載する基板とを備えた集積回路装置であって、前記基板は、 前記集積回路からの熱を伝えるように構成された熱伝導性且つ非導電性材料の少なくとも一つの層と、
    前記集積回路からプリント回路ボード上の複数のトレースへ電気的結合をもたらすように構成された複数のコンタクトを備え、
    前記基板が前記集積回路から前記プリント回路ボード上の前記複数のトレースへ電気的結合をもたらすように構成されており、
    前記熱伝導性且つ非導電性材料は酸化亜鉛材料、酸化タングステン材料、そして、陽極酸化アルミニウム材料の内の少なくとも一つを含むことを特徴とする集積回路装置。
  2. 前記複数のコンタクトは複数コンタクトのボールグリッド・アレイを含むことを特徴とする請求項１に記載の集積回路装置。
  3. 前記熱伝導性且つ非導電性材料の少なくとも一つの層が前記基板の表面を備えることを特徴とする請求項１に記載の集積回路装置。
  4. 前記熱伝導性且つ非導電性材料の少なくとも一つの層は、熱伝導性且つ非導電性材料の複数の隣接層を備え、該複数の隣接層の最初の層と最後の層が前記基板の第一の表面と第二の表面とを形成し、前記第一の表面の熱発生装置から前記基板の前記第二の表面のヒートシンク構造へ熱を伝えることを特徴とする請求項１に記載の集積回路装置。
  5. 電子回路からの熱を伝えるように構成された熱伝導性且つ非導電性材料の少なくとも一つの層を備え、前記電子回路を支持するための基板であって、該基板が前記電子回路からプリント回路ボード上の複数のトレースへ電気的結合をもたらすように構成されており、
    前記熱伝導性且つ非導電性材料は酸化亜鉛材料、酸化タングステン材料、そして、陽極酸化アルミニウム材料の内の少なくとも一つを含むことを特徴とする基板。
  6. 前記熱伝導性且つ非導電性材料の少なくとも一つの層が前記基板の表面を備えることを特徴とする請求項５に記載の基板。
  7. 前記熱伝導性且つ非導電性材料の少なくとも一つの層は、熱伝導性且つ非導電性材料の複数の隣接層を備え、該複数の隣接層の最初の層と最後の層が前記基板の第一の表面と第二の表面とを形成し、前記第一の表面の熱発生装置から前記基板の前記第二の表面のヒートシンク構造へ熱を伝えることを特徴とする請求項５に記載の基板。
  8. 集積回路からヒートシンクへ熱結合を促進する方法であって、
    前記集積回路から熱を伝えるように構成された熱伝導性且つ非導電性材料の少なくとも一つの層を含む基板を準備し、
    前記集積回路が前記少なくとも一つの層に熱的に接触するように前記集積回路を前記基板上に搭載し、
    前記集積回路からプリント回路ボード上の複数のトレースへ電気的結合をもたらすように構成された複数のコンタクトを設け、
    前記基板が前記集積回路から前記プリント回路ボード上の前記複数のトレースへ電気的結合をもたらす工程を備え、
    前記熱伝導性且つ非導電性材料は酸化亜鉛材料、酸化タングステン材料、そして、陽極酸化アルミニウム材料の内の少なくとも一つを含むことを特徴とする方法。
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