CN100423242C - 导热衬底封装 - Google Patents

导热衬底封装 Download PDF

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CN100423242C
CN100423242C CNB2003801020500A CN200380102050A CN100423242C CN 100423242 C CN100423242 C CN 100423242C CN B2003801020500 A CNB2003801020500 A CN B2003801020500A CN 200380102050 A CN200380102050 A CN 200380102050A CN 100423242 C CN100423242 C CN 100423242C
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substrate
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heat conduction
electrically conductive
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CN1708848A (zh
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C·怀兰
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Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Abstract

一种用来安装集成电路(100)的衬底材料(130)，它包含导热材料的不导电网格(135)。由于网格是不导电的，故能够有目的地被构成来接触衬底附近的任何一个或所有电路迹线(155)，从而用电路迹线(155)作为热耦合的热沉。在一个优选实施方案中，导热的网格(135)取代了通常用于衬底的结构性玻璃纤维网格，从而使网格(135)能够起结构和热的双重功能。

Description

导热衬底封装
技术领域
本发明涉及集成电路封装领域，确切地说是涉及提供有效导热性的衬底。
背景技术
输出大电流的电路产生必须耗散的热。美国专利6121680公开了利用固定到集成电路顶部的热鳍结构来将热从集成电路耗散到热鳍结构各个鳍周围的空气中。美国专利5960863提到了采用散热块，此散热块由用螺栓连接到固定于集成电路的导热基板的一些重叠的筛板组成，热从散热块耗散。
美国专利5309321提到了一种被包封到形成封闭集成电路芯片的外壳的不导电的热固性或热塑性材料中的引线网格。美国专利5500555提到了一种用来安装集成电路的衬底，此衬底包含绝缘预栓定材料和导热网格或丝网的叠层。
各个现有技术实施方案依赖于将导热材料分隔于集成电路导体的或将导热材料分隔于其上安装集成电路器件的印刷电路板导体的绝缘材料层。各个现有技术实施方案需要一个或多个加工步骤来产生从集成电路散热的多层(导体或非导体)结构。此外，在各个现有技术实施方案中，分隔的散热结构被用来耗散集成电路产生的热。
发明内容
本发明的目的是提供一种低成本的装置来从诸如集成电路芯片之类的电路散热。本发明的另一目的是提供一种能够将热从电路耗散到印刷电路板上的多个迹线的散热装置。本发明的再一目的是提供一种尽可能减小散热装置中导热材料引起的短路危险的散热装置。
根据本发明的一方面，一种集成电路器件，包含：集成电路以及用来安装集成电路的衬底；其中，衬底包含：至少一个导热且不导电的材料层，其配置为传导来自集成电路的热，配置用于提供集成电路到印刷电路板上多个迹线的电耦合的多个接触；且其中该至少一个导热且不导电的材料层的层配置用于提供集成电路到印刷电路板上多个迹线的热耦合。
借助于提供一种包含不导电的导热材料网格的衬底材料，达到了这些和其它的目的。由于网格是不导电的，故能够有目的地构造成接触衬底附近任何一个和所有电路迹线，从而用电路迹线作为热耦合的散热结构。在一个优选实施方案中，导热性网格取代了通常用于衬底的结构性玻璃纤维网格，从而使网格能够起结构和散热的双重功能。
附图说明
参照附图，用举例的方法来更详细地解释本发明，其中：图1示出了根据本发明的具有导热衬底的示例性集成电路器件。
具体实施方式
此处，利用用来安装集成电路芯片的衬底的范例，具体地说是用来将集成电路芯片寄主在球栅阵列中的衬底，提出了本发明。如本技术领域一般熟练人员可以理解的那样，本发明的原理可应用于使用衬底的其它结构，或将衬底附着到另一结构的其它技术。同样，虽然本发明特别适用于与较大的吸热装置接触的衬底，但依赖于要耗散的热量，衬底本身可以构成整个吸热装置。
图1示出了具有导热衬底130的一种示例性集成电路器件100。集成电路110经由影响集成电路110与衬底130之间的热耦合的管芯固定化合物120而固定到衬底130。集成电路110与印刷电路板150上的迹线155之间的导电性经由接合引线112、穿过衬底的“通孔”(未示出)、以及焊料球140来实现。
根据本发明，衬底130包括导热但不导电的网格或栅格135，如交替层135a和135b所示。导热但不导电的栅格的例子包括氧化锌、氧化钨、或阳极氧化的铝栅格。基本材料形成为引线，然后被氧化以便在引线表面上形成完整的不导电表面，然后编织成网格或栅格。或者，基本材料可以形成或压印成栅格图形，然后被氧化或加工，以便形成完整的不导电表面。也可以将不导电材料形成、压印、或编织成网格或栅格图形，虽然编织氧化的材料可能是不可行的。
在本发明的一个优选实施方案中，网格135取代了用于常规衬底中的玻璃纤维网格，氧化锌或氧化钨栅格的使用，提供了超越玻璃纤维网格的优点。除了提供比玻璃纤维显著更高的热导率之外，锌还提供了比玻璃纤维更接近环氧树脂和铜的热膨胀系数，从而减小了衬底130与印刷电路板150上的迹线155之间的热应力。或者，钨提供了比铜更接近硅的热膨胀系数，从而减小了衬底130与集成电路110之间的热应力，以及提供了比玻璃纤维显著更高的热导率。
在一个优选实施方案中，通孔(未示出)和栅格135被设计成使得通孔位置对应于栅格135中的间隙，以便避免在通孔位置处穿透栅网135的氧化物绝缘。或者，栅网/网格135的氧化可以在衬底中产生通孔的孔之后发生，从而使栅网/网格135的暴露的上层和下层、以及各个通道孔中的任何暴露的金属绝缘。
与采用集成电路110或印刷电路板150与现有技术导热层之间的一个或多个分立的绝缘材料层的现有技术形成对照，本公开的发明提供了更高的热耦合度。由于本发明的导热层135是不导电的，故这些层可以延伸到衬底130的表面，与发热的器件110和/或与吸热结构150直接接触或几乎直接接触。例如，与采用一层绝缘预栓(prepeg)材料来绝缘铜导热层的美国专利5500555形成对照，氧化锌或氧化钨的热导率比预栓材料的热导率显著地更高。
上面仅仅说明了本发明的原理。可以理解的是，本技术领域的熟练人员能够提出各种此处未曾明确描述的体现本发明的原理并在下列权利要求发构思与范围内的各种安排。

Claims (11)

1. 一种集成电路器件(100)，包含：
集成电路(110)以及
用来安装集成电路(110)的衬底(130)；
其中，
衬底(130)包含：
至少一个导热且不导电的材料(135)层，其配置为传导来自集成电路(110)的热，
配置用于提供集成电路(110)到印刷电路板(150)上多个迹线(155)的电耦合的多个接触(140)；且
其中，
该至少一个导热且不导电的材料(135)层的层(135b)配置用于提供集成电路(110)到印刷电路板(150)上多个迹线(155)的热耦合。
2. 权利要求1的集成电路器件(100)，其中，多个接触(140)包括球栅阵列的接触。
3. 权利要求1的集成电路器件(100)，其中，导热且不导电的材料包括至少下列材料之一：氧化锌材料、氧化钨材料、以及阳极氧化的铝材料。
4. 权利要求1的集成电路器件(100)，其中，至少一个导热且不导电的材料(135)层的层包含衬底(130)的表面。
5. 权利要求1的集成电路器件(100)，其中，至少一个导热且不导电的材料(135)层包含多个相邻的导热且不导电的材料层，且多个相邻层的第一层和最后层构成衬底(130)的第一表面和第二表面，从而提供从第一表面处的发热器件到衬底第二表面处的散热结构的热传导。
6. 一种用来支持电子电路的衬底(130)，它包含配置用于传导来自电子电路的热的至少一个导热且不导电的材料(135)层，
其中，该至少一个导热且不导电的材料(135)层的层配置用于提供电路(110)到印刷电路板(150)上多个迹线(155)的热耦合。
7. 权利要求6的衬底(130)，其中，导热且不导电的材料包括下列材料至少之一：氧化锌材料、氧化钨材料、以及阳极氧化的铝材料。
8. 权利要求6的衬底(130)，其中，该至少一个导热且不导电的材料(135)层的层包含衬底(130)的表面。
9. 权利要求6的衬底(130)，其中：该至少一个导热且不导电的材料(135)层包含多个相邻的导热且不导电的材料层，且该多个相邻层的第一层和最后一层构成衬底(130)的第一表面和第二表面，从而提供从第一表面处的发热器件到衬底(130)的第二表面处的吸热结构的热传导。
10. 一种便于集成电路(110)到吸热装置的热耦合的方法，包含：
提供衬底(130)，其包括配置用于传导来自集成电路(110)的热的至少一个导热且不导电的材料(135)层，以及将集成电路(110)安装在衬底(130)上，使集成电路(110)与此至少一个导热且不导电的材料(135)层热接触，以及
配置用于提供集成电路(110)到印刷电路板(150)上多个迹线(155)的电耦合的多个接触(140)；且其中，该至少一个导热且不导电的材料(135)层的其它层配置用于提供集成电路(110)到印刷电路板(150)上多个迹线(155)的热耦合。
11. 权利要求10的方法，其中，导热且不导电的材料包括下列材料中至少之一：氧化锌材料、氧化钨材料、以及阳极氧化的铝材料。
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