JP2005136394A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2005136394A5 JP2005136394A5 JP2004292643A JP2004292643A JP2005136394A5 JP 2005136394 A5 JP2005136394 A5 JP 2005136394A5 JP 2004292643 A JP2004292643 A JP 2004292643A JP 2004292643 A JP2004292643 A JP 2004292643A JP 2005136394 A5 JP2005136394 A5 JP 2005136394A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- semiconductor device
- insulating film
- substrate
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 37
- 239000010408 film Substances 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 12
- 239000011521 glass Substances 0.000 claims 5
- 239000004033 plastic Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000010409 thin film Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 3
- 238000000034 method Methods 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 229910052718 tin Inorganic materials 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004292643A JP4481135B2 (ja) | 2003-10-06 | 2004-10-05 | 半導体装置及びその作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003347676 | 2003-10-06 | ||
| JP2004292643A JP4481135B2 (ja) | 2003-10-06 | 2004-10-05 | 半導体装置及びその作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005136394A JP2005136394A (ja) | 2005-05-26 |
| JP2005136394A5 true JP2005136394A5 (enExample) | 2007-08-16 |
| JP4481135B2 JP4481135B2 (ja) | 2010-06-16 |
Family
ID=34655940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004292643A Expired - Fee Related JP4481135B2 (ja) | 2003-10-06 | 2004-10-05 | 半導体装置及びその作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4481135B2 (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4532418B2 (ja) * | 2005-02-18 | 2010-08-25 | 株式会社半導体エネルギー研究所 | 光センサ及びその作製方法 |
| US7492028B2 (en) | 2005-02-18 | 2009-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method of the same, and a semiconductor device |
| EP1724844A2 (en) | 2005-05-20 | 2006-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device, manufacturing method thereof and semiconductor device |
| DE602006001686D1 (de) | 2005-05-23 | 2008-08-21 | Semiconductor Energy Lab | Photoelektrische Umwandleranordnung und Verfahren zu ihrer Herstellung |
| JP5082036B2 (ja) * | 2005-10-31 | 2012-11-28 | 株式会社リキッド・デザイン・システムズ | 半導体装置の製造方法および半導体装置 |
| KR101315282B1 (ko) | 2006-04-27 | 2013-10-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 및 이를 사용한 전자기기 |
| US8514165B2 (en) | 2006-12-28 | 2013-08-20 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| US8207589B2 (en) * | 2007-02-15 | 2012-06-26 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and electronic device, and method for manufacturing photoelectric conversion device |
| US8354724B2 (en) | 2007-03-26 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and electronic device |
| KR101423055B1 (ko) * | 2007-04-18 | 2014-07-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치를 갖는 광전 변환 소자 및 이것을 사용한반도체 장치 |
| WO2009014155A1 (en) * | 2007-07-25 | 2009-01-29 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and electronic device having the same |
| WO2015049852A1 (ja) * | 2013-10-01 | 2015-04-09 | パナソニックＩｐマネジメント株式会社 | 半導体装置 |
| TWI656631B (zh) * | 2014-03-28 | 2019-04-11 | 日商半導體能源研究所股份有限公司 | 攝像裝置 |
| US10468383B2 (en) * | 2015-01-16 | 2019-11-05 | Makoto Shizukuishi | Semiconductor device and manufacturing method thereof |
| JP2021072583A (ja) | 2019-10-31 | 2021-05-06 | 株式会社村田製作所 | 高周波モジュール及び通信装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05326618A (ja) * | 1992-05-15 | 1993-12-10 | Rohm Co Ltd | 半導体装置 |
| JP3393842B2 (ja) * | 1992-09-11 | 2003-04-07 | 株式会社半導体エネルギー研究所 | 光電変換装置の作製方法 |
| JP3507251B2 (ja) * | 1995-09-01 | 2004-03-15 | キヤノン株式会社 | 光センサｉｃパッケージおよびその組立方法 |
| JP3725266B2 (ja) * | 1996-11-07 | 2005-12-07 | 株式会社半導体エネルギー研究所 | 配線形成方法 |
| JP3523815B2 (ja) * | 1999-08-30 | 2004-04-26 | シャープ株式会社 | 半導体装置 |
| JP2001036097A (ja) * | 2000-01-01 | 2001-02-09 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
-
2004
- 2004-10-05 JP JP2004292643A patent/JP4481135B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2005136394A5 (enExample) | ||
| TW200641969A (en) | Sensor type semiconductor device and method for fabricating thereof | |
| EP1646092A3 (en) | Contact and omni directional reflective mirror for flip chipped light emitting devices | |
| PT1547158E (pt) | Eléctrodo para células fotovoltaicas, célula fotovoltaica e módulo fotovoltaico | |
| WO2007089723A3 (en) | Thermal enhanced package | |
| JP2005340821A (ja) | ソーラーモジュール及びその製造方法 | |
| WO2003065472A3 (en) | Structures and materials for dye sensitized solar cells | |
| WO2007000697A3 (en) | Method of manufacturing an assembly and assembly | |
| EP1806790A3 (en) | Light-emitting diode having a silver-based electrode and method for manufacturing the same | |
| JP2009027166A (ja) | 化合物半導体デバイスのパッケージ封入構造及びその作成方法 | |
| TW200610116A (en) | Micro-electronic package structure and method for fabricating the same | |
| KR20140034683A (ko) | 태양 전지 모듈 및 그 제조 방법 | |
| TWM558999U (zh) | 發光封裝元件 | |
| SG133571A1 (en) | Semiconductor device, method of manufacturing the same, and camera module | |
| JP2011211015A5 (enExample) | ||
| TW200636943A (en) | Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure | |
| EP2989662A1 (en) | Back-contact back-sheet for photovoltaic modules with pass-through electric contacts | |
| CN106784082A (zh) | 一种柔性薄膜光伏太阳能电池组件及制作方法 | |
| JP2010050173A5 (enExample) | ||
| US10115877B2 (en) | Method for manufacturing semiconductor device | |
| EP1605519A3 (en) | Semiconductor device and manufacturing method of the same | |
| CN100382344C (zh) | 发光二极管封装结构及其制作方法 | |
| US20180076370A1 (en) | Light-emitting component and method of producing a light-emitting component | |
| CN103904074B (zh) | 电路和用于制造电路的方法 | |
| JP2002076392A5 (enExample) |