JP2005136311A5 - - Google Patents

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Publication number
JP2005136311A5
JP2005136311A5 JP2003372477A JP2003372477A JP2005136311A5 JP 2005136311 A5 JP2005136311 A5 JP 2005136311A5 JP 2003372477 A JP2003372477 A JP 2003372477A JP 2003372477 A JP2003372477 A JP 2003372477A JP 2005136311 A5 JP2005136311 A5 JP 2005136311A5
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JP
Japan
Prior art keywords
groove
nitride semiconductor
manufacturing
semiconductor substrate
forming
Prior art date
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Pending
Application number
JP2003372477A
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English (en)
Japanese (ja)
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JP2005136311A (ja
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Publication date
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Priority to JP2003372477A priority Critical patent/JP2005136311A/ja
Priority claimed from JP2003372477A external-priority patent/JP2005136311A/ja
Publication of JP2005136311A publication Critical patent/JP2005136311A/ja
Publication of JP2005136311A5 publication Critical patent/JP2005136311A5/ja
Pending legal-status Critical Current

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JP2003372477A 2003-10-31 2003-10-31 窒化物半導体基板及びその製造方法 Pending JP2005136311A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003372477A JP2005136311A (ja) 2003-10-31 2003-10-31 窒化物半導体基板及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003372477A JP2005136311A (ja) 2003-10-31 2003-10-31 窒化物半導体基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2005136311A JP2005136311A (ja) 2005-05-26
JP2005136311A5 true JP2005136311A5 (enExample) 2006-11-30

Family

ID=34648850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003372477A Pending JP2005136311A (ja) 2003-10-31 2003-10-31 窒化物半導体基板及びその製造方法

Country Status (1)

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JP (1) JP2005136311A (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019099A (ja) * 2005-07-05 2007-01-25 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP5137435B2 (ja) * 2007-03-28 2013-02-06 古河電気工業株式会社 半導体ウェハのチップ化処理方法
US7824929B2 (en) 2007-10-22 2010-11-02 Toyoda Gosei Co., Ltd. Method for producing group III nitride-based compound semiconductor
JP5223112B2 (ja) * 2007-10-22 2013-06-26 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体の製造方法
JP4404162B2 (ja) * 2008-02-27 2010-01-27 住友電気工業株式会社 窒化物半導体ウエハ−
JP4395812B2 (ja) 2008-02-27 2010-01-13 住友電気工業株式会社 窒化物半導体ウエハ−加工方法
JP4924563B2 (ja) * 2008-07-29 2012-04-25 住友電気工業株式会社 マクロステップを有する基板生産物を作製する方法、エピタキシャルウエハを作製する方法、及び窒化物系半導体発光素子を作製する方法
KR101292619B1 (ko) 2011-09-07 2013-08-02 한솔테크닉스(주) 기판 제조방법
KR102100841B1 (ko) * 2013-03-29 2020-04-14 엔지케이 인슐레이터 엘티디 Iii족 질화물 기판의 처리 방법 및 에피택셜 기판의 제조 방법
JP6212203B2 (ja) 2014-04-14 2017-10-11 住友化学株式会社 窒化物半導体単結晶基板の製造方法
IT201900001201A1 (it) * 2019-01-28 2020-07-28 St Microelectronics Srl Piastrina a semiconduttore con migliorato isolamento termico tra una porzione di potenza ed una porzione periferica, metodo di fabbricazione, e package alloggiante la piastrina

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