JP2005136311A - 窒化物半導体基板及びその製造方法 - Google Patents

窒化物半導体基板及びその製造方法 Download PDF

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Publication number
JP2005136311A
JP2005136311A JP2003372477A JP2003372477A JP2005136311A JP 2005136311 A JP2005136311 A JP 2005136311A JP 2003372477 A JP2003372477 A JP 2003372477A JP 2003372477 A JP2003372477 A JP 2003372477A JP 2005136311 A JP2005136311 A JP 2005136311A
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Japan
Prior art keywords
polishing
semiconductor substrate
processing
nitride semiconductor
substrate
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JP2003372477A
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Japanese (ja)
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JP2005136311A5 (enExample
Inventor
Toshitaka Shimamoto
敏孝 嶋本
Yasutoshi Kawaguchi
靖利 川口
Akihiko Ishibashi
明彦 石橋
Isao Kidoguchi
勲 木戸口
Toshiya Yokogawa
俊哉 横川
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Priority to JP2003372477A priority Critical patent/JP2005136311A/ja
Publication of JP2005136311A publication Critical patent/JP2005136311A/ja
Publication of JP2005136311A5 publication Critical patent/JP2005136311A5/ja
Pending legal-status Critical Current

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JP2003372477A 2003-10-31 2003-10-31 窒化物半導体基板及びその製造方法 Pending JP2005136311A (ja)

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JP2005136311A5 JP2005136311A5 (enExample) 2006-11-30

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019099A (ja) * 2005-07-05 2007-01-25 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP2008244356A (ja) * 2007-03-28 2008-10-09 Furukawa Electric Co Ltd:The 半導体ウェハのチップ化処理方法
WO2009107567A1 (ja) * 2008-02-27 2009-09-03 住友電気工業株式会社 窒化物半導体ウエハーの加工方法と窒化物半導体ウエハー及び窒化物半導体デバイスの製造方法並びに窒化物半導体デバイス
JP2009231833A (ja) * 2008-02-27 2009-10-08 Sumitomo Electric Ind Ltd 窒化物半導体ウエハ−
JP2010034314A (ja) * 2008-07-29 2010-02-12 Sumitomo Electric Ind Ltd マクロステップを有する基板生産物を作製する方法、エピタキシャルウエハを作製する方法、及び窒化物系半導体発光素子を作製する方法
US7824929B2 (en) 2007-10-22 2010-11-02 Toyoda Gosei Co., Ltd. Method for producing group III nitride-based compound semiconductor
CN101419912B (zh) * 2007-10-22 2011-04-06 丰田合成株式会社 制造第ⅲ族氮化物基化合物半导体的方法
KR101292619B1 (ko) 2011-09-07 2013-08-02 한솔테크닉스(주) 기판 제조방법
WO2014156914A1 (ja) * 2013-03-29 2014-10-02 日本碍子株式会社 Ｉｉｉ族窒化物基板の処理方法およびエピタキシャル基板の製造方法
US10100434B2 (en) 2014-04-14 2018-10-16 Sumitomo Chemical Company, Limited Nitride semiconductor single crystal substrate manufacturing method
CN111490016A (zh) * 2019-01-28 2020-08-04 意法半导体股份有限公司 半导体管芯及其制造方法和容纳管芯的封装件

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019099A (ja) * 2005-07-05 2007-01-25 Sumitomo Electric Ind Ltd 発光装置およびその製造方法
JP2008244356A (ja) * 2007-03-28 2008-10-09 Furukawa Electric Co Ltd:The 半導体ウェハのチップ化処理方法
US7824929B2 (en) 2007-10-22 2010-11-02 Toyoda Gosei Co., Ltd. Method for producing group III nitride-based compound semiconductor
CN101419912B (zh) * 2007-10-22 2011-04-06 丰田合成株式会社 制造第ⅲ族氮化物基化合物半导体的方法
US8101523B2 (en) 2008-02-27 2012-01-24 Sumitomo Electric Industries, Ltd. Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device
JP2010010705A (ja) * 2008-02-27 2010-01-14 Sumitomo Electric Ind Ltd 窒化物半導体ウエハー及び窒化物半導体デバイスの製造方法並びに窒化物半導体デバイス
JP2009231814A (ja) * 2008-02-27 2009-10-08 Sumitomo Electric Ind Ltd 窒化物半導体ウエハ−加工方法
US7872331B2 (en) 2008-02-27 2011-01-18 Sumitomo Electric Industries, Ltd. Nitride semiconductor wafer
JP2009231833A (ja) * 2008-02-27 2009-10-08 Sumitomo Electric Ind Ltd 窒化物半導体ウエハ−
WO2009107567A1 (ja) * 2008-02-27 2009-09-03 住友電気工業株式会社 窒化物半導体ウエハーの加工方法と窒化物半導体ウエハー及び窒化物半導体デバイスの製造方法並びに窒化物半導体デバイス
US8183669B2 (en) 2008-02-27 2012-05-22 Sumitomo Electric Industries, Ltd. Nitride semiconductor wafer having a chamfered edge
CN101884094B (zh) * 2008-02-27 2013-02-13 住友电气工业株式会社 氮化物半导体晶片的加工方法和氮化物半导体晶片
JP2010034314A (ja) * 2008-07-29 2010-02-12 Sumitomo Electric Ind Ltd マクロステップを有する基板生産物を作製する方法、エピタキシャルウエハを作製する方法、及び窒化物系半導体発光素子を作製する方法
KR101292619B1 (ko) 2011-09-07 2013-08-02 한솔테크닉스(주) 기판 제조방법
WO2014156914A1 (ja) * 2013-03-29 2014-10-02 日本碍子株式会社 Ｉｉｉ族窒化物基板の処理方法およびエピタキシャル基板の製造方法
CN104246987A (zh) * 2013-03-29 2014-12-24 日本碍子株式会社 Iii族氮化物基板的处理方法及外延基板的制造方法
EP2821532A4 (en) * 2013-03-29 2015-10-07 Ngk Insulators Ltd PROCESS FOR PROCESSING GROUP III NITRIDE SUBSTRATES AND METHOD FOR PRODUCING EPITACTIC SUBSTRATES
US9196480B2 (en) 2013-03-29 2015-11-24 Ngk Insulators, Ltd. Method for treating group III nitride substrate and method for manufacturing epitaxial substrate
KR20150140202A (ko) * 2013-03-29 2015-12-15 엔지케이 인슐레이터 엘티디 Iii족 질화물 기판의 처리 방법 및 에피택셜 기판의 제조 방법
JP6019129B2 (ja) * 2013-03-29 2016-11-02 日本碍子株式会社 Ｉｉｉ族窒化物基板の処理方法およびエピタキシャル基板の製造方法
KR102100841B1 (ko) 2013-03-29 2020-04-14 엔지케이 인슐레이터 엘티디 Iii족 질화물 기판의 처리 방법 및 에피택셜 기판의 제조 방법
US10100434B2 (en) 2014-04-14 2018-10-16 Sumitomo Chemical Company, Limited Nitride semiconductor single crystal substrate manufacturing method
CN111490016A (zh) * 2019-01-28 2020-08-04 意法半导体股份有限公司 半导体管芯及其制造方法和容纳管芯的封装件

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