JP2005101226A - 基板保持装置，基板処理装置，基板検査装置及び基板保持方法 - Google Patents

基板保持装置，基板処理装置，基板検査装置及び基板保持方法 Download PDF

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Publication number
JP2005101226A
JP2005101226A JP2003332238A JP2003332238A JP2005101226A JP 2005101226 A JP2005101226 A JP 2005101226A JP 2003332238 A JP2003332238 A JP 2003332238A JP 2003332238 A JP2003332238 A JP 2003332238A JP 2005101226 A JP2005101226 A JP 2005101226A
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JP
Japan
Prior art keywords
substrate
holding
stage
gas
substrate holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003332238A
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English (en)
Japanese (ja)
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JP2005101226A5 (enExample
Inventor
Takahisa Tazoe
貴久 田添
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hoya Corp
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Priority to JP2003332238A priority Critical patent/JP2005101226A/ja
Priority to TW093126538A priority patent/TW200512795A/zh
Priority to KR1020040076185A priority patent/KR100843413B1/ko
Publication of JP2005101226A publication Critical patent/JP2005101226A/ja
Publication of JP2005101226A5 publication Critical patent/JP2005101226A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Jigs For Machine Tools (AREA)
JP2003332238A 2003-09-24 2003-09-24 基板保持装置，基板処理装置，基板検査装置及び基板保持方法 Pending JP2005101226A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003332238A JP2005101226A (ja) 2003-09-24 2003-09-24 基板保持装置，基板処理装置，基板検査装置及び基板保持方法
TW093126538A TW200512795A (en) 2003-09-24 2004-09-02 Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method
KR1020040076185A KR100843413B1 (ko) 2003-09-24 2004-09-23 기판 보유 지지 장치, 기판 처리 장치, 기판 검사 장치, 기판 보유 지지 방법 및 포토 마스크의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003332238A JP2005101226A (ja) 2003-09-24 2003-09-24 基板保持装置，基板処理装置，基板検査装置及び基板保持方法

Publications (2)

Publication Number Publication Date
JP2005101226A true JP2005101226A (ja) 2005-04-14
JP2005101226A5 JP2005101226A5 (enExample) 2006-09-07

Family

ID=34460647

Family Applications (1)

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JP2003332238A Pending JP2005101226A (ja) 2003-09-24 2003-09-24 基板保持装置，基板処理装置，基板検査装置及び基板保持方法

Country Status (3)

Country Link
JP (1) JP2005101226A (enExample)
KR (1) KR100843413B1 (enExample)
TW (1) TW200512795A (enExample)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007072267A (ja) * 2005-09-08 2007-03-22 Sumitomo Chemical Co Ltd 露光装置
JP2008252012A (ja) * 2007-03-30 2008-10-16 Applied Materials Inc ウェハ搬送用ブレード
JP2010205813A (ja) * 2009-03-02 2010-09-16 Shinko Electric Ind Co Ltd 静電チャック
JP2010204650A (ja) * 2009-02-04 2010-09-16 Hoya Corp ステージクリーナ、描画装置及び基板処理装置
WO2011024485A1 (ja) * 2009-08-31 2011-03-03 横浜ゴム株式会社 板状部材の支持装置
JP2011176241A (ja) * 2010-02-25 2011-09-08 Casio Computer Co Ltd 基板吸着方法および基板吸着装置
JP2011238927A (ja) * 2010-05-11 2011-11-24 Asml Netherlands Bv 物体の非接触ハンドリング装置および方法
CN102736429A (zh) * 2011-04-07 2012-10-17 上海微电子装备有限公司 硅片温度稳定装置
JP2013229536A (ja) * 2011-06-02 2013-11-07 Nsk Technology Co Ltd 露光装置及び露光方法
JP5412107B2 (ja) * 2006-02-28 2014-02-12 Ｈｏｙａ株式会社 フォトマスクブランクの製造方法、及びフォトマスクの製造方法
JP2017129848A (ja) * 2016-01-18 2017-07-27 Hoya株式会社 基板保持装置、描画装置、フォトマスク検査装置、および、フォトマスクの製造方法
JP2020151842A (ja) * 2019-03-15 2020-09-24 株式会社ナノテム パッドユニット、真空チャック装置及び工作機械
JP2021145145A (ja) * 2018-07-19 2021-09-24 ボンドテック株式会社 基板接合装置
CN115335712A (zh) * 2020-03-26 2022-11-11 日本电产理德股份有限公司 基板检查装置
WO2023019725A1 (zh) * 2021-08-19 2023-02-23 杭州新诺微电子有限公司 可移动压板结构及具有该结构的曝光机及曝光机压板方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110320758B (zh) * 2018-03-30 2021-06-29 上海微电子装备（集团）股份有限公司 一种基底边缘保护装置、光刻设备及保护方法
CN115890513B (zh) * 2022-11-01 2025-12-02 苏州硕贝德通讯技术有限公司 一种用于陶瓷基板贴片的真空吸块及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383948B1 (en) * 1999-12-20 2002-05-07 Tokyo Electron Limited Coating film forming apparatus and coating film forming method
US6800569B2 (en) * 2002-01-30 2004-10-05 Kabushiki Kaisha Toshiba Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007072267A (ja) * 2005-09-08 2007-03-22 Sumitomo Chemical Co Ltd 露光装置
JP5412107B2 (ja) * 2006-02-28 2014-02-12 Ｈｏｙａ株式会社 フォトマスクブランクの製造方法、及びフォトマスクの製造方法
JP2008252012A (ja) * 2007-03-30 2008-10-16 Applied Materials Inc ウェハ搬送用ブレード
TWI417980B (zh) * 2009-02-04 2013-12-01 Hoya Corp 載台清潔器、描繪裝置及基板處理裝置
JP2010204650A (ja) * 2009-02-04 2010-09-16 Hoya Corp ステージクリーナ、描画装置及び基板処理装置
JP2010205813A (ja) * 2009-03-02 2010-09-16 Shinko Electric Ind Co Ltd 静電チャック
JP2011052371A (ja) * 2009-08-31 2011-03-17 Yokohama Rubber Co Ltd:The 板状部材の支持装置
WO2011024485A1 (ja) * 2009-08-31 2011-03-03 横浜ゴム株式会社 板状部材の支持装置
JP2011176241A (ja) * 2010-02-25 2011-09-08 Casio Computer Co Ltd 基板吸着方法および基板吸着装置
JP2011238927A (ja) * 2010-05-11 2011-11-24 Asml Netherlands Bv 物体の非接触ハンドリング装置および方法
CN102736429A (zh) * 2011-04-07 2012-10-17 上海微电子装备有限公司 硅片温度稳定装置
JP2013229536A (ja) * 2011-06-02 2013-11-07 Nsk Technology Co Ltd 露光装置及び露光方法
JP2017129848A (ja) * 2016-01-18 2017-07-27 Hoya株式会社 基板保持装置、描画装置、フォトマスク検査装置、および、フォトマスクの製造方法
JP7479700B2 (ja) 2018-07-19 2024-05-09 ボンドテック株式会社 基板接合装置
JP2021145145A (ja) * 2018-07-19 2021-09-24 ボンドテック株式会社 基板接合装置
JP2020151842A (ja) * 2019-03-15 2020-09-24 株式会社ナノテム パッドユニット、真空チャック装置及び工作機械
JP7444428B2 (ja) 2019-03-15 2024-03-06 株式会社ナノテム パッドユニット、真空チャック装置及び工作機械
CN115335712A (zh) * 2020-03-26 2022-11-11 日本电产理德股份有限公司 基板检查装置
US12055580B2 (en) 2020-03-26 2024-08-06 Nidec Read Corporation Circuit board inspecting apparatus
WO2023019725A1 (zh) * 2021-08-19 2023-02-23 杭州新诺微电子有限公司 可移动压板结构及具有该结构的曝光机及曝光机压板方法

Also Published As

Publication number Publication date
TW200512795A (en) 2005-04-01
KR20050030136A (ko) 2005-03-29
KR100843413B1 (ko) 2008-07-04

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