KR100843413B1 - 기판 보유 지지 장치, 기판 처리 장치, 기판 검사 장치, 기판 보유 지지 방법 및 포토 마스크의 제조 방법 - Google Patents

기판 보유 지지 장치, 기판 처리 장치, 기판 검사 장치, 기판 보유 지지 방법 및 포토 마스크의 제조 방법 Download PDF

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Publication number
KR100843413B1
KR100843413B1 KR1020040076185A KR20040076185A KR100843413B1 KR 100843413 B1 KR100843413 B1 KR 100843413B1 KR 1020040076185 A KR1020040076185 A KR 1020040076185A KR 20040076185 A KR20040076185 A KR 20040076185A KR 100843413 B1 KR100843413 B1 KR 100843413B1
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South Korea
Prior art keywords
substrate
holding
board
stage
flow rate
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KR1020040076185A
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English (en)
Korean (ko)
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KR20050030136A (ko
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다조에다까히사
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호야 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Jigs For Machine Tools (AREA)
KR1020040076185A 2003-09-24 2004-09-23 기판 보유 지지 장치, 기판 처리 장치, 기판 검사 장치, 기판 보유 지지 방법 및 포토 마스크의 제조 방법 Expired - Fee Related KR100843413B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003332238A JP2005101226A (ja) 2003-09-24 2003-09-24 基板保持装置，基板処理装置，基板検査装置及び基板保持方法
JPJP-P-2003-00332238 2003-09-24

Publications (2)

Publication Number Publication Date
KR20050030136A KR20050030136A (ko) 2005-03-29
KR100843413B1 true KR100843413B1 (ko) 2008-07-04

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KR1020040076185A Expired - Fee Related KR100843413B1 (ko) 2003-09-24 2004-09-23 기판 보유 지지 장치, 기판 처리 장치, 기판 검사 장치, 기판 보유 지지 방법 및 포토 마스크의 제조 방법

Country Status (3)

Country Link
JP (1) JP2005101226A (enExample)
KR (1) KR100843413B1 (enExample)
TW (1) TW200512795A (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4917780B2 (ja) * 2005-09-08 2012-04-18 住友化学株式会社 露光装置
KR101071471B1 (ko) * 2006-02-28 2011-10-10 호야 가부시키가이샤 포토마스크 블랭크 및 포토마스크와 그들의 제조 방법
JP4516089B2 (ja) * 2007-03-30 2010-08-04 アプライド マテリアルズ インコーポレイテッド ウェハ搬送用ブレード
TWI417980B (zh) * 2009-02-04 2013-12-01 Hoya Corp 載台清潔器、描繪裝置及基板處理裝置
JP5470601B2 (ja) * 2009-03-02 2014-04-16 新光電気工業株式会社 静電チャック
JP5440035B2 (ja) * 2009-08-31 2014-03-12 横浜ゴム株式会社 板状部材の支持装置
JP5526862B2 (ja) * 2010-02-25 2014-06-18 カシオ計算機株式会社 基板吸着方法および基板吸着装置
NL2006514A (en) * 2010-05-11 2011-11-14 Asml Netherlands Bv Apparatus and method for contactless handling of an object.
CN102736429B (zh) * 2011-04-07 2015-06-17 上海微电子装备有限公司 硅片温度稳定装置
JP6037199B2 (ja) * 2011-06-02 2016-12-07 株式会社ブイ・テクノロジー 露光装置及び露光方法
JP2017129848A (ja) * 2016-01-18 2017-07-27 Hoya株式会社 基板保持装置、描画装置、フォトマスク検査装置、および、フォトマスクの製造方法
CN110320758B (zh) * 2018-03-30 2021-06-29 上海微电子装备（集团）股份有限公司 一种基底边缘保护装置、光刻设备及保护方法
US12094747B2 (en) * 2018-07-19 2024-09-17 Bondtech Co., Ltd. Substrate bonding device
JP7444428B2 (ja) * 2019-03-15 2024-03-06 株式会社ナノテム パッドユニット、真空チャック装置及び工作機械
KR20220158233A (ko) 2020-03-26 2022-11-30 니혼덴산리드가부시키가이샤 기판 검사 장치
CN113777891B (zh) * 2021-08-19 2022-08-26 杭州新诺微电子有限公司 可移动压板结构及具有该结构的曝光机及曝光机压板方法
CN115890513B (zh) * 2022-11-01 2025-12-02 苏州硕贝德通讯技术有限公司 一种用于陶瓷基板贴片的真空吸块及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010067414A (ko) * 1999-12-20 2001-07-12 히가시 데쓰로 도포막 형성장치 및 도포막 형성방법
KR20030065412A (ko) * 2002-01-30 2003-08-06 가부시끼가이샤 도시바 성막 방법, 성막 장치, 패턴 형성 방법, 및 반도체 장치의제조 방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010067414A (ko) * 1999-12-20 2001-07-12 히가시 데쓰로 도포막 형성장치 및 도포막 형성방법
KR20030065412A (ko) * 2002-01-30 2003-08-06 가부시끼가이샤 도시바 성막 방법, 성막 장치, 패턴 형성 방법, 및 반도체 장치의제조 방법

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Publication number Publication date
TW200512795A (en) 2005-04-01
KR20050030136A (ko) 2005-03-29
JP2005101226A (ja) 2005-04-14

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