TW200512795A - Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method - Google Patents

Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method

Info

Publication number
TW200512795A
TW200512795A TW093126538A TW93126538A TW200512795A TW 200512795 A TW200512795 A TW 200512795A TW 093126538 A TW093126538 A TW 093126538A TW 93126538 A TW93126538 A TW 93126538A TW 200512795 A TW200512795 A TW 200512795A
Authority
TW
Taiwan
Prior art keywords
substrate
substrate holding
processing apparatus
holding
testing device
Prior art date
Application number
TW093126538A
Other languages
English (en)
Chinese (zh)
Inventor
Takahisa Tazoe
Original Assignee
Hoya Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hoya Corp filed Critical Hoya Corp
Publication of TW200512795A publication Critical patent/TW200512795A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Jigs For Machine Tools (AREA)
TW093126538A 2003-09-24 2004-09-02 Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method TW200512795A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003332238A JP2005101226A (ja) 2003-09-24 2003-09-24 基板保持装置，基板処理装置，基板検査装置及び基板保持方法

Publications (1)

Publication Number Publication Date
TW200512795A true TW200512795A (en) 2005-04-01

Family

ID=34460647

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093126538A TW200512795A (en) 2003-09-24 2004-09-02 Substrate holding device, substrate processing apparatus, substrate testing device, and substrate holding method

Country Status (3)

Country Link
JP (1) JP2005101226A (enExample)
KR (1) KR100843413B1 (enExample)
TW (1) TW200512795A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715953B (zh) * 2018-03-30 2021-01-11 大陸商上海微電子裝備（集團）股份有限公司 一種基底邊緣保護裝置、光刻設備及保護方法
CN115890513A (zh) * 2022-11-01 2023-04-04 苏州硕贝德通讯技术有限公司 一种用于陶瓷基板贴片的真空吸块及其制备方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4917780B2 (ja) * 2005-09-08 2012-04-18 住友化学株式会社 露光装置
KR101071471B1 (ko) * 2006-02-28 2011-10-10 호야 가부시키가이샤 포토마스크 블랭크 및 포토마스크와 그들의 제조 방법
JP4516089B2 (ja) * 2007-03-30 2010-08-04 アプライド マテリアルズ インコーポレイテッド ウェハ搬送用ブレード
TWI417980B (zh) * 2009-02-04 2013-12-01 Hoya Corp 載台清潔器、描繪裝置及基板處理裝置
JP5470601B2 (ja) * 2009-03-02 2014-04-16 新光電気工業株式会社 静電チャック
JP5440035B2 (ja) * 2009-08-31 2014-03-12 横浜ゴム株式会社 板状部材の支持装置
JP5526862B2 (ja) * 2010-02-25 2014-06-18 カシオ計算機株式会社 基板吸着方法および基板吸着装置
NL2006514A (en) * 2010-05-11 2011-11-14 Asml Netherlands Bv Apparatus and method for contactless handling of an object.
CN102736429B (zh) * 2011-04-07 2015-06-17 上海微电子装备有限公司 硅片温度稳定装置
JP6037199B2 (ja) * 2011-06-02 2016-12-07 株式会社ブイ・テクノロジー 露光装置及び露光方法
JP2017129848A (ja) * 2016-01-18 2017-07-27 Hoya株式会社 基板保持装置、描画装置、フォトマスク検査装置、および、フォトマスクの製造方法
US12094747B2 (en) * 2018-07-19 2024-09-17 Bondtech Co., Ltd. Substrate bonding device
JP7444428B2 (ja) * 2019-03-15 2024-03-06 株式会社ナノテム パッドユニット、真空チャック装置及び工作機械
KR20220158233A (ko) 2020-03-26 2022-11-30 니혼덴산리드가부시키가이샤 기판 검사 장치
CN113777891B (zh) * 2021-08-19 2022-08-26 杭州新诺微电子有限公司 可移动压板结构及具有该结构的曝光机及曝光机压板方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6383948B1 (en) * 1999-12-20 2002-05-07 Tokyo Electron Limited Coating film forming apparatus and coating film forming method
US6800569B2 (en) * 2002-01-30 2004-10-05 Kabushiki Kaisha Toshiba Film forming method, film forming apparatus, pattern forming method, and manufacturing method of semiconductor apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI715953B (zh) * 2018-03-30 2021-01-11 大陸商上海微電子裝備（集團）股份有限公司 一種基底邊緣保護裝置、光刻設備及保護方法
CN115890513A (zh) * 2022-11-01 2023-04-04 苏州硕贝德通讯技术有限公司 一种用于陶瓷基板贴片的真空吸块及其制备方法

Also Published As

Publication number Publication date
KR20050030136A (ko) 2005-03-29
JP2005101226A (ja) 2005-04-14
KR100843413B1 (ko) 2008-07-04

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