JP2005101075A - 電子部品内蔵基板の製造方法 - Google Patents
電子部品内蔵基板の製造方法 Download PDFInfo
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Abstract
【解決手段】 例えば、端子部を有する電子部品としてWCSP10及びチップ部品12を搭載用プリプレグ(第1絶縁性シート)に搭載し(b)、この搭載用プリプレグ(第1絶縁性シート)をそのまま層間絶縁層として、当該層上に例えばビルドアップ工法により配線構造を形成する。
【選択図】 図1
Description
即ち、本発明の電子部品内蔵基板の製造方法は、
端子部を有する電子部品を準備する工程と、
第1絶縁性シートを準備する工程と、
前記端子部が前記第1絶縁性シートに向き合うよう、前記電子部品を前記第1絶縁性シート上に搭載する工程と、
前記端子部の表面が露出するよう、前記第1絶縁性シートに開口部を形成する工程と、
前記端子部から前記第1絶縁性シート上部に延在する導電部材を形成する工程と、
を有することを特徴とする。
また、感光性シートとは、例えば、感光性の部位を有する熱可塑性樹脂(例えばポリアミド、ポリイミドなど)で構成されたシートや、当該熱可塑性樹脂のフィラー(例えばシリカ、炭酸カルシウムなど)含有物で構成されたシートが挙げられる。
主表面に端子部を有し、第1の厚さを有する第1電子部品を準備する工程と、
主表面に端子部を有し、前記第1の厚さよりも厚い第2の厚さを有する第2電子部品を準備する工程と、
第1絶縁性シートを準備する工程と、
前記端子部が前記第1絶縁性シートに向き合うよう、前記第1及び第2電子部品を前記第1絶縁性シート上に搭載する工程と、
前記第1及び第2電子部品の前記端子部の表面が露出するよう、前記第1絶縁性シートに開口部を形成する工程と、
前記第1及び第2電子部品の前記端子部から前記第1絶縁性シート上部に延在する配線層を形成する工程と、
前記第1及び第2電子部品を樹脂で覆う工程と、
を有することを特徴としている。
図1は、第1の実施の形態に係る電子部品内蔵基板の製造方法を示す工程図である。
図2は、第2の実施の形態に係る電子部品内蔵基板の製造方法を示す工程図である。
本実施形態は、搭載用プリプレグ14として、絶縁性の感光性シートを用い、ビルドアップ工法におけるvia開口20を形成する際に、以下に示すようにホトリソグラフィー法を適用する形態である(図1(e)或いは図2(f)参照)。これ以外は、上記第1或いは第2の実施形態と同様であるので、説明を省略する。
12 チップ部品(電子部品)
14 搭載用プリプレグ(第1絶縁シート)
16 埋め込み用プリプレグ(第2絶縁シート)
18 プリプレグ
20 開口
22 配線層
24 ハンダボール
26 封止樹脂
Claims (9)
- 端子部を有する電子部品を準備する工程と、
第1絶縁性シートを準備する工程と、
前記端子部が前記第1絶縁性シートに向き合うよう、前記電子部品を前記第1絶縁性シート上に搭載する工程と、
前記端子部の表面が露出するよう、前記第1絶縁性シートに開口部を形成する工程と、
前記端子部から前記第1絶縁性シート上部に延在する導電部材を形成する工程と、
を有することを特徴とする電子部品内蔵基板の製造方法。 - 前記第1絶縁性シート上に搭載された電子部品を、第2絶縁性シートに埋め込む工程を有することを特徴とする請求項1に記載の電子部品内蔵基板の製造方法。
- 前記第1絶縁性シート上に搭載された電子部品を、樹脂封止する工程を有することを特徴とする請求項1に記載の電子部品内蔵基板の製造方法。
- 前記第1絶縁性シートは、プリプレグであることを特徴とする請求項1に記載の電子部品内蔵基板の製造方法。
- 前記第1絶縁性シートは、感光性シートであることを特徴とする請求項1に記載の電子部品内蔵基板の製造方法。
- 主表面に端子部を有し、第1の厚さを有する第1電子部品を準備する工程と、
主表面に端子部を有し、前記第1の厚さよりも厚い第2の厚さを有する第2電子部品を準備する工程と、
第1絶縁性シートを準備する工程と、
前記端子部が前記第1絶縁性シートに向き合うよう、前記第1及び第2電子部品を前記第1絶縁性シート上に搭載する工程と、
前記第1及び第2電子部品の前記端子部の表面が露出するよう、前記第1絶縁性シートに開口部を形成する工程と、
前記第1及び第2電子部品の前記端子部から前記第1絶縁性シート上部に延在する配線層を形成する工程と、
前記第1及び第2電子部品を樹脂で覆う工程と、
を有することを特徴とする電子部品内蔵基板の製造方法。 - 前記第1及び第2電子部品を樹脂で覆う工程は、第2絶縁性シートを準備する工程と、前記第2絶縁性シートを前記第1及び第2電子部品に押圧し、前記第2絶縁性シート内に前記第1及び第2電子部品を埋め込む工程と、を有することを特徴とする請求項6に記載の電子部品内蔵基板の製造方法。
- 前記第1及び第2電子部品を樹脂で覆う工程は、
前記第1及び第2電子部品上に液状樹脂を滴下する工程を含むことを特徴とする請求項6に記載の電子部品内蔵基板の製造方法。 - 前記第1絶縁性シートに開口部を形成する工程は、前記第1絶縁性シートとして感光性シートを用い、当該感光性シートに直接、露光・現像を施して、前記第1及び第2電子部品の前記端子部の表面が露出する前記開口部を形成する工程を含むことを特徴とする請求項6に記載の電子部品内蔵基板の製造方法。
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JP2003330072A JP4362056B2 (ja) | 2003-09-22 | 2003-09-22 | 電子部品内蔵基板の製造方法 |
US10/742,749 US7049224B2 (en) | 2003-09-22 | 2003-12-23 | Manufacturing method of electronic components embedded substrate |
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Cited By (2)
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KR101475080B1 (ko) * | 2008-07-16 | 2014-12-23 | 삼성전자주식회사 | 인쇄회로 기판 조립체 및 그 제조 방법 |
JP2017199702A (ja) * | 2016-04-25 | 2017-11-02 | 京セラ株式会社 | 半導体素子内蔵基板およびその製造方法 |
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US7485489B2 (en) * | 2002-06-19 | 2009-02-03 | Bjoersell Sten | Electronics circuit manufacture |
CA2521620C (en) | 2003-04-11 | 2012-11-27 | Cargill, Incorporated | Pellet systems for preparing beverages |
WO2012005394A1 (en) * | 2010-07-09 | 2012-01-12 | Lg Innotek Co., Ltd. | Printed circuit board and method of manufacturing the same |
US20160218092A1 (en) * | 2015-01-27 | 2016-07-28 | Mediatek Inc. | Chip package with embedded passive device |
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KR100237328B1 (ko) * | 1997-02-26 | 2000-01-15 | 김규현 | 반도체 패키지의 구조 및 제조방법 |
JP2002110714A (ja) | 2000-10-02 | 2002-04-12 | Sony Corp | チップ集積ボード及びその製造方法、チップ状電子部品及びその製造方法、電子機器及びその製造方法 |
JP2002290006A (ja) | 2001-03-27 | 2002-10-04 | Ibiden Co Ltd | 部品内蔵基板の製造方法 |
CN1577819A (zh) * | 2003-07-09 | 2005-02-09 | 松下电器产业株式会社 | 带内置电子部件的电路板及其制造方法 |
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KR101475080B1 (ko) * | 2008-07-16 | 2014-12-23 | 삼성전자주식회사 | 인쇄회로 기판 조립체 및 그 제조 방법 |
JP2017199702A (ja) * | 2016-04-25 | 2017-11-02 | 京セラ株式会社 | 半導体素子内蔵基板およびその製造方法 |
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