JP2005093772A - ウエハレベルｃｓｐの製造方法 - Google Patents

ウエハレベルｃｓｐの製造方法 Download PDF

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JP2005093772A
JP2005093772A JP2003325938A JP2003325938A JP2005093772A JP 2005093772 A JP2005093772 A JP 2005093772A JP 2003325938 A JP2003325938 A JP 2003325938A JP 2003325938 A JP2003325938 A JP 2003325938A JP 2005093772 A JP2005093772 A JP 2005093772A
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thermal stress
stress relaxation
post
solder
insulating layer
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JP4360873B2 (ja
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Takehiko Murakami
武彦 村上
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Minami Co Ltd
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Minami Co Ltd
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Priority to JP2003325938A priority Critical patent/JP4360873B2/ja
Priority to TW093127629A priority patent/TWI253128B/zh
Priority to US10/939,416 priority patent/US20050064624A1/en
Priority to KR1020040073293A priority patent/KR100742902B1/ko
Priority to EP04255574A priority patent/EP1517369A3/en
Priority to MYPI20043805A priority patent/MY139562A/en
Priority to CNA2004100781750A priority patent/CN1604295A/zh
Priority to SG200407966-1A priority patent/SG157220A1/en
Publication of JP2005093772A publication Critical patent/JP2005093772A/ja
Priority to US12/007,406 priority patent/US20080145973A1/en
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Abstract

【課題】熱応力緩和ポスト、絶縁層並びにはんだバンプの形成を能率よく行うようになして全体の製造能率を大幅に向上させる。
【解決手段】ウエハ１上にメッキによる再配線回路３を形成すると共に該再配線回路３上にはんだ等の導電材による熱応力緩和ポスト４を形成する。また、これら再配線回路３と熱応力緩和ポスト４の周囲に、該熱応力緩和ポスト４の上面を除いてポリイミド等からなる絶縁層６を形成し、更に前記熱応力緩和ポスト４上にはんだバンプ７を形成する。そしてまた、前記熱応力緩和ポスト４、絶縁層６並びにはんだバンプ７はスクリーン印刷により形成する。
【選択図】図１

Description

本発明はウエハレベルＣＳＰの製造方法に関するものである。
携帯電話、デジタルビデオ、デジタルカメラなどにおける高密度実装への要求から、小型パッケージであるＣＳＰ（Ｃｈｉｐ Ｓｉｚｅ Ｐａｃｋａｇｅ）が急速に普及し始めている。
斯かるＣＳＰは、ＴＳＯＰ（Ｔｈｉｎ Ｓｍａｌｌ Ｏｕｔｌｉｎｅ Ｐａｃｋａｇｅ）やＱＦＰ（Ｑｕａｄ Ｆｌａｔ Ｐａｃｋａｇｅ）のような従来型のリードタイプパッケージと比べて実装面積が小さく、また配線長が短いために、高周波デバイスにも適用し易いという特徴がある。また、チップを直接基板に実装するフリップチップと比較すると、パッドピッチを広げることが可能なため、基板への実装が容易であるという特徴もある。言い換えると、ＴＳＯＰ並みの扱い易さで、フリップチップ並みの高速・高密度実装を実現できるという点が、急速に普及し始めた要因となっているのである。
而して、斯かるウエハレベルＣＳＰの従来の製造方法は、図２に示す通りであり、ウエハ１００上に絶縁材からなる所要の厚味の熱応力緩和層１０１を形成し、該熱応力緩和層１０１の上面にランド１０２と、該ランド１０２と接合パッド１０３とを結ぶ再配線回路１０４を形成し、更に該再配線回路１０４上に絶縁層１０５を形成した後、ランド１０２上にはんだバンプ１０６を形成するものである。尚、熱応力緩和層１０１はウエハをプリント基板に実装したとき、ウエハとプリント基板の線膨張係数差に起因して発生するはんだバンプの熱ひずみを低減し、接続寿命を向上させるためのものである。該熱応力緩和層１０１は、弾性を有する樹脂を主材とし、はんだバンプ１０６のひずみに応じて変形し、この変形によってひずみを低減するものである。またその他１０７は１００上に形成した絶縁層である。
そして、従来にあっては熱応力緩和層１０１は印刷によって、また再配線回路１０４はメッキによって、また絶縁層１０５は塗布により、そしてまたはんだバンプ１０６は、はんだボールをランド１０２上に転載し、リフロー炉で加熱して形成していた。しかし、絶縁層１０５とはんだバンプ１０６の形成に手間と時間がかかり過ぎ、作業能率が悪いという問題点があった。また、従来にあっては熱応力緩和層１０１が絶縁材であることから、これの上面中央にランド１０２を形成しなければならず、これの形成に余分の時間がかかるという問題点もあった。
本発明は上記の点に鑑みなされたものであって、作業能率を大幅に向上させることができるようになしたウエハレベルＣＳＰの製造方法を提供せんとするものである。
而して、本発明の要旨とするところは、ウエハ上にメッキによる再配線回路を形成すると共に該再配線回路上にはんだ等の導電材による熱応力緩和ポストを形成し、これら再配線回路と熱応力緩和ポストの周囲に、該該熱応力緩和ポストの上面を除いてポリイミド等からなる絶縁層を形成し、更に前記熱応力緩和ポスト上にはんだバンプを形成するウエハレベルＣＳＰの製造方法であって、前記熱応力緩和ポスト、絶縁層並びにはんだバンプの形成をスクリーン印刷によって行うようになしたことを特徴とするウエハレベルＣＳＰの製造方法にある。
また、上記製造方法において、熱応力緩和ポストを形成する導電材としてはんだを用いることが好ましい。この場合には、熱応力緩和ポストの材料であるはんだとはんだバンプとの接合が、金属間化合物による融合となり、熱応力緩和ポストの材料であるはんだとメッキによる再配線回路との間の相互拡散による融合よりも強固になる。
また、上記製造方法において、絶縁層の上面に、熱応力緩和ポストの位置にはんだバンプの下部外周の受容部を設けた絶縁材からなる熱応力サポート層をスクリーン印刷により形成するようにしてもよい。これによりはんだバンプの熱ひずみを一層低減することが可能となるものである。
本発明は上記の如く熱応力緩和ポスト、絶縁層並びにはんだバンプの形成をスクリーン印刷によって行うものであるから、従来の製造方法に比して作業能率を大幅に向上させることができるものである。また、熱応力緩和ポスト上に直接はんだバンプを形成するものであるから、従来の如くランドを形成する必要がない。したがって、この分の作業工程を減らすことができる。
また、熱応力緩和ポストを形成する導電材としてはんだを用いる場合には、はんだバンプとの接合が金属間化合物による融合となり、強固な接合となる。
また、絶縁層の上面に、熱応力緩和ポストの位置にはんだバンプの下部外周の受容部を設けた絶縁材からなる熱応力サポート層をスクリーン印刷により形成するようにした場合には、はんだバンプの熱ひずみを一層低減することができるものである。
本発明を実施するための最良の形態は、熱応力緩和ポスト、絶縁層並びにはんだバンプの形成をスクリーン印刷によって行うことにある。
以下、本発明の実施例について図面を参照しつつ説明する。
図１は本発明によって製造したウエハレベルＣＳＰの断面を示すものである。
図中、１はウエハである。２は前記ウエハ１上に形成した接合パッドであり、金のＵＢＭである。３は前記ウエハ１上にメッキによって形成した再配線回路である。４は前記再配線回路３上に形成したはんだ等の導電材による熱応力緩和ポストであり、加圧式スクリーン印刷機によるスクリーン印刷によって形成している。尚、本実施例では導電材としてはんだを用いている。
５はウエハ１上に形成した絶縁層、６は前記再配線回路３と熱応力緩和ポスト４の周囲に、該熱応力緩和ポスト４の上面を除いて形成したポリイミド等からなる絶縁層である。また該絶縁層６は加圧式スクリーン印刷機によるスクリーン印刷によって形成している。
７は前記熱応力緩和ポスト４上に形成したはんだバンプであり、加圧式スクリーン印刷機によるスクリーン印刷によって形成している。８は前記絶縁層６の上面に形成した、熱応力緩和ポスト４の位置にはんだバンプ７の下部外周の受容部８ａを設けた熱応力サポート層である。また、該熱応力サポート層８はポリイミド等の絶縁材からなり、スクリーン印刷によって形成している。
本発明によって製造したウエハレベルＣＳＰの断面図である。 従来方法によって製造したウエハレベルＣＳＰの断面図である。
符号の説明
１ ウエハ
２ 接合パッド
３ 再配線回路
４ 熱応力緩和ポスト
５ 絶縁層
６ 絶縁層
７ はんだバンプ
８ 熱応力サポート層
８ａ はんだバンプの下部外周の受容部

Claims (3)

  1. ウエハ上にメッキによる再配線回路を形成すると共に該再配線回路上にはんだ等の導電材による熱応力緩和ポストを形成し、これら再配線回路と熱応力緩和ポストの周囲に、該熱応力緩和ポストの上面を除いてポリイミド等からなる絶縁層を形成し、更に前記熱応力緩和ポスト上にはんだバンプを形成するウエハレベルＣＳＰの製造方法であって、前記熱応力緩和ポスト、絶縁層並びにはんだバンプの形成をスクリーン印刷によって行うようになしたことを特徴とするウエハレベルＣＳＰの製造方法。
  2. 熱応力緩和ポストを形成する導電材がはんだである請求項１記載のウエハレベルＣＳＰの製造方法。
  3. 絶縁層の上面に、熱応力緩和ポストの位置にはんだバンプの下部外周の受容部を設けた絶縁材からなる熱応力サポート層をスクリーン印刷により形成してなる請求項１又は２記載のウエハレベルＣＳＰの製造方法。
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