JP2005079441A - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

Info

Publication number
JP2005079441A
JP2005079441A JP2003310031A JP2003310031A JP2005079441A JP 2005079441 A JP2005079441 A JP 2005079441A JP 2003310031 A JP2003310031 A JP 2003310031A JP 2003310031 A JP2003310031 A JP 2003310031A JP 2005079441 A JP2005079441 A JP 2005079441A
Authority
JP
Japan
Prior art keywords
semiconductor device
manufacturing
forming
wafer
mask layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003310031A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005079441A5 (cg-RX-API-DMAC10.html
Inventor
Masakazu Okada
昌和 岡田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003310031A priority Critical patent/JP2005079441A/ja
Publication of JP2005079441A publication Critical patent/JP2005079441A/ja
Publication of JP2005079441A5 publication Critical patent/JP2005079441A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003310031A 2003-09-02 2003-09-02 半導体装置の製造方法 Pending JP2005079441A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003310031A JP2005079441A (ja) 2003-09-02 2003-09-02 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003310031A JP2005079441A (ja) 2003-09-02 2003-09-02 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2005079441A true JP2005079441A (ja) 2005-03-24
JP2005079441A5 JP2005079441A5 (cg-RX-API-DMAC10.html) 2006-10-05

Family

ID=34412015

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003310031A Pending JP2005079441A (ja) 2003-09-02 2003-09-02 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JP2005079441A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278820A (ja) * 2005-03-30 2006-10-12 Nikon Corp 露光方法及び装置
JP2006310376A (ja) * 2005-04-26 2006-11-09 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2007284681A (ja) * 2006-04-19 2007-11-01 Samsung Electronics Co Ltd 樹脂組成物、これを利用したパターン形成方法、及びキャパシタ形成方法
JP2007311507A (ja) * 2006-05-17 2007-11-29 Mitsumi Electric Co Ltd 半導体装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133313A (ja) * 2001-10-25 2003-05-09 Hitachi Ltd 半導体装置の製造方法
JP2003197621A (ja) * 2001-12-27 2003-07-11 Sony Corp 埋め込み配線の形成方法
JP2004311570A (ja) * 2003-04-03 2004-11-04 Nec Electronics Corp 半導体装置とその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133313A (ja) * 2001-10-25 2003-05-09 Hitachi Ltd 半導体装置の製造方法
JP2003197621A (ja) * 2001-12-27 2003-07-11 Sony Corp 埋め込み配線の形成方法
JP2004311570A (ja) * 2003-04-03 2004-11-04 Nec Electronics Corp 半導体装置とその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006278820A (ja) * 2005-03-30 2006-10-12 Nikon Corp 露光方法及び装置
JP2006310376A (ja) * 2005-04-26 2006-11-09 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2007284681A (ja) * 2006-04-19 2007-11-01 Samsung Electronics Co Ltd 樹脂組成物、これを利用したパターン形成方法、及びキャパシタ形成方法
JP2007311507A (ja) * 2006-05-17 2007-11-29 Mitsumi Electric Co Ltd 半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JP4977842B2 (ja) 半導体素子
JP2015167153A (ja) 集積回路装置及びその製造方法
JP2006286932A (ja) 半導体装置の製造方法
US6930038B2 (en) Dual damascene partial gap fill polymer fabrication process
JP3408746B2 (ja) 半導体装置の製造方法
US7645679B2 (en) Method for forming isolation layer in semiconductor devices
JP4023236B2 (ja) 金属配線の形成方法
JP2012033607A (ja) 半導体装置の製造方法
KR100422949B1 (ko) 소자분리막 형성 방법
KR100906306B1 (ko) 반도체 소자의 구리 배선 형성 방법
JPH08288385A (ja) 半導体装置の製造方法
JP2001332621A (ja) 半導体装置及びその製造方法
US8932937B2 (en) Photoresist mask-free oxide define region (ODR)
KR100789612B1 (ko) 금속 배선 형성 방법
KR100800728B1 (ko) 반도체 소자의 금속배선 형성방법
US7429518B2 (en) Method for forming shallow trench isolation of semiconductor device
US20090263968A1 (en) Method of fabricating semiconductor device
JP2006344815A (ja) 半導体装置の製造方法
KR100870299B1 (ko) 반도체 소자의 제조방법
KR20030002942A (ko) 반도체 소자의 금속 배선 형성 방법
JP2006049534A (ja) 半導体装置の製造方法及び半導体装置
KR100707595B1 (ko) 반도체 소자의 소자 분리막 형성 방법
JP2011124427A (ja) 半導体装置の製造方法
US7842608B2 (en) Method for manufacturing semiconductor device having via plug
JPH1140667A (ja) 半導体装置の製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060821

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060821

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081020

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20091110

A711 Notification of change in applicant

Free format text: JAPANESE INTERMEDIATE CODE: A712

Effective date: 20100524

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100615

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20101026