JP2005072584A - 低誘電率及び低膜応力を有するシリコン系絶縁膜を形成する方法 - Google Patents
低誘電率及び低膜応力を有するシリコン系絶縁膜を形成する方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 41
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 35
- 239000010703 silicon Substances 0.000 title claims abstract description 35
- 239000012528 membrane Substances 0.000 title abstract description 3
- 239000007789 gas Substances 0.000 claims abstract description 97
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 27
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 27
- 239000000654 additive Substances 0.000 claims abstract description 26
- 230000000996 additive effect Effects 0.000 claims abstract description 26
- 239000012495 reaction gas Substances 0.000 claims abstract description 26
- 238000006243 chemical reaction Methods 0.000 claims abstract description 13
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims description 37
- 229930195734 saturated hydrocarbon Natural products 0.000 claims description 28
- 239000000126 substance Substances 0.000 claims description 27
- 229920006395 saturated elastomer Polymers 0.000 claims description 20
- 229930195735 unsaturated hydrocarbon Natural products 0.000 claims description 20
- 150000003377 silicon compounds Chemical class 0.000 claims description 18
- 230000001590 oxidative effect Effects 0.000 claims description 13
- 150000001923 cyclic compounds Chemical class 0.000 claims description 10
- 230000000087 stabilizing effect Effects 0.000 claims description 10
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000012159 carrier gas Substances 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 7
- 229910052734 helium Inorganic materials 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 229910018557 Si O Inorganic materials 0.000 claims description 5
- 229910052786 argon Inorganic materials 0.000 claims description 5
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Inorganic materials [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 claims description 5
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- -1 vinyl compound Chemical class 0.000 abstract description 14
- 229920001296 polysiloxane Polymers 0.000 abstract 3
- 230000001960 triggered effect Effects 0.000 abstract 1
- QRHCILLLMDEFSD-UHFFFAOYSA-N bis(ethenyl)-dimethylsilane Chemical compound C=C[Si](C)(C)C=C QRHCILLLMDEFSD-UHFFFAOYSA-N 0.000 description 17
- 229910052760 oxygen Inorganic materials 0.000 description 17
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 16
- 239000001301 oxygen Substances 0.000 description 16
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 10
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 10
- 239000004215 Carbon black (E152) Substances 0.000 description 6
- 229930195733 hydrocarbon Natural products 0.000 description 6
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 230000008021 deposition Effects 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 239000001272 nitrous oxide Substances 0.000 description 4
- 238000011144 upstream manufacturing Methods 0.000 description 4
- UUFQTNFCRMXOAE-UHFFFAOYSA-N 1-methylmethylene Chemical compound C[CH] UUFQTNFCRMXOAE-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
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- XKINWJBZPLWKCW-UHFFFAOYSA-N methoxy-[methoxy(dimethyl)silyl]oxy-dimethylsilane Chemical compound CO[Si](C)(C)O[Si](C)(C)OC XKINWJBZPLWKCW-UHFFFAOYSA-N 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- BVTLTBONLZSBJC-UHFFFAOYSA-N 2,4,6-tris(ethenyl)-2,4,6-trimethyl-1,3,5,2,4,6-trioxatrisilinane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O1 BVTLTBONLZSBJC-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- CVQVSVBUMVSJES-UHFFFAOYSA-N dimethoxy-methyl-phenylsilane Chemical compound CO[Si](C)(OC)C1=CC=CC=C1 CVQVSVBUMVSJES-UHFFFAOYSA-N 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
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- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- AWFYPPSBLUWMFQ-UHFFFAOYSA-N 2-[5-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1,3,4-oxadiazol-2-yl]-1-(1,4,6,7-tetrahydropyrazolo[4,3-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1=NN=C(O1)CC(=O)N1CC2=C(CC1)NN=C2 AWFYPPSBLUWMFQ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- ODUCDPQEXGNKDN-UHFFFAOYSA-N Nitrogen oxide(NO) Natural products O=N ODUCDPQEXGNKDN-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
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- 125000003545 alkoxy group Chemical group 0.000 description 1
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- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
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Abstract
【解決手段】シリコン系絶縁膜は、(i)少なくともひとつのビニル基を含むシリコン系炭化水素化合物(シリコン-ビニル化合物)から成るソースガス、及び(ii)添加ガスから成る反応ガスを基板が配置された反応チャンバ内に導入し、基板上に絶縁膜を蒸着するべくプラズマ重合反応を生じさせるよう反応ガスにRF電力を印加することによって、プラズマ重合反応により基板上に形成される。
【選択図】図1
Description
プラズマCVD装置を使って、ソースガスとしてDVDMS及びTMDMOSを使用し、添加ガスとしてHe、O2及びイソプロピルアルコール(IPA)を使用することにより、φ200mmシリコン基板上に絶縁膜が形成された。実験条件及び結果が表4に示される。上記Rt(滞留時間)は実施例13及び15では約93msecであり、実施例14及び16では約73msecであった。
Claims (24)
- プラズマ重合反応により基板上にシリコン系絶縁膜を形成するための方法であって、
(i)少なくともひとつのビニル基を含むシリコン系炭化水素化合物(シリコン-ビニル化合物)から成るソースガスと、(ii)添加ガスと、から成る反応ガスを基板が配置されている反応チャンバ内に導入する工程と、
プラズマ重合反応を生じさせるべく前記反応ガスにRF電力を印加する工程であって、それによって基板上に絶縁膜を蒸着するところの工程と、
から成る方法。 - 請求項1に記載の方法であって、シリコン-ビニル化合物は、化学式SiαOα−1R2α−β+2(OR)β(ここで、αは1〜3の整数、βは0、1または2、RはC1-6飽和または不飽和炭化水素であり、Siに結合される少なくともひとつのRはビニル基を含む)を有する直鎖状シリコン系炭化水素化合物、化学式SinOnR2n(ここで、nは3〜6の整数、RはC1-6飽和または不飽和炭化水素であり、Siに結合される少なくともひとつのRはビニル基を含む)を有する環式化合物、及び化学式Sip(C2H2)pR2p(ここで、pは3〜6の整数、RはC1-6飽和または不飽和炭化水素である)を有する環式化合物から成る集合から選択される化合物である、ところの方法。
- 請求項2に記載の方法であって、Rは-CzH2(z−w)+1であり、ここで、zは2〜4の整数、wは不飽和炭素結合の数を表し1〜3の整数である、ところの方法。
- 請求項3に記載の方法であって、シリコン-ビニル化合物はαが1でβが0であるところの直鎖状化合物である、ところの方法。
- 請求項4に記載の方法であって、前記シリコン-ビニル化合物は、(CH3)2Si(C2H3)2である、ところの方法。
- 請求項2に記載の方法であって、シリコン-ビニル化合物はnが3であるところの環式化合物である、ところの方法。
- 請求項1に記載の方法であって、ソースガスはさらに、ビニル基を有しないシリコン系炭化水素化合物(シリコン化合物)から成る、ところの方法。
- 請求項7に記載の方法であって、シリコン化合物は、化学式SiαOα−1R2α−β+2(OR)β(ここで、αは1〜3の整数、βは0、1または2、RはC1-6飽和炭化水素である)を有する直鎖状化合物、及び化学式SinOnR2n(ここで、nは3〜6の整数、RはC1-6飽和炭化水素である)を有する環式化合物から選択される化合物である、ところの方法。
- 請求項7に記載の方法であって、シリコン化合物に対するシリコン-ビニル化合物の流量比率は、10%から100%の範囲である、ところの方法。
- 請求項1に記載の方法であって、添加ガスは、キャリアガス、酸化ガス、及びプラズマ安定化ガスから成る集合から選択される、ところの方法。
- 請求項10に記載の方法であって、プラズマ安定化ガスは、H2、CnH2n+2、CnH2n、及びCnH2n+1OH(ここで、nは1〜5の整数)から成る集合から選択される、ところの方法。
- 請求項10に記載の方法であって、酸化ガスは、O2、CO2、H2O、O3及びNO2から成る集合から選択される、ところの方法。
- 請求項10に記載の方法であって、キャリアガスはHe、Ar及びN2から成る集合から選択される不活性ガスである、ところの方法。
- 請求項1に記載の方法であって、RF電力は高周波電力である、ところの方法。
- 請求項14に記載の方法であって、高周波電力は2MHzまたはそれ以上の周波数を有する、ところの方法。
- 請求項7に記載の方法であって、比率は、40MPaまたはそれ以下の膜応力及び3.0またはそれ以下の比誘電率を有するシロキサン重合体を得るよう制御される、ところの方法。
- 請求項1に記載の方法であって、シリコン-ビニル化合物はSi-O結合を含まず、絶縁膜はシリコンカーバイド材料から成るハード膜である、ところの方法。
- プラズマ重合反応により基板上にシリコン系絶縁膜を形成するための方法であって、
(i)少なくともひとつのビニル基を含むシリコン系炭化水素化合物(シリコン-ビニル化合物)から成るソースガスと、(ii)ビニル基を有しないシリコン系炭化水素化合物(シリコン化合物)と、(iii)添加ガスと、から成る反応ガスを基板が配置されている反応チャンバ内に導入する工程と、
シリコン化合物に対するシリコン-ビニル化合物の比率を50%から100%の範囲に制御する工程と、
プラズマ重合反応を生じさせるべく前記反応ガスにRF電力を印加する工程であって、それによって基板上に絶縁膜を蒸着するところの工程と、
から成る方法。 - 請求項18に記載の方法であって、シリコン-ビニル化合物は、化学式SiαOα−1R2α−β+2(OR)β(ここで、αは1〜3の整数、βは0、1または2、RはC1-6飽和または不飽和炭化水素であり、Siに結合される少なくともひとつのRはビニル基を含む)を有する直鎖状シリコン系炭化水素化合物、化学式SinOnR2n(ここで、nは3〜6の整数、RはC1-6飽和または不飽和炭化水素であり、Siに結合される少なくともひとつのRはビニル基を含む)を有する環式化合物、及び化学式R-(SiR3)p-H(ここで、pは1〜3の整数、RはC1-6飽和または不飽和炭化水素であり、Siに結合される少なくともひとつのRはビニル基を含む)を有する直鎖状化合物から成る集合から選択される化合物である、ところの方法。
- 請求項18に記載の方法であって、シリコン化合物は、化学式SiαOα−1R2α−β+2(OR)β(ここで、αは1〜3の整数、βは0、1または2、RはC1-6飽和炭化水素である)を有する直鎖状化合物、及び化学式SinOnR2n(ここで、nは3〜6の整数、RはC1-6飽和炭化水素である)を有する環式化合物から選択される化合物である、ところの方法。
- 請求項18に記載の方法であって、添加ガスは、キャリアガス、酸化ガス、及びプラズマ安定化ガスから成る集合から選択される、ところの方法。
- 請求項18に記載の方法であって、RF電力は高周波電力である、ところの方法。
- 請求項18に記載の方法であって、比率は、40MPaまたはそれ以下の膜応力及び3.0またはそれ以下の比誘電率を有するシロキサン重合体を得るよう制御される、ところの方法。
- 請求項17に記載の方法であって、シリコン-ビニル化合物及びシリコン化合物はSi-O結合を含まず、絶縁膜はシリコンカーバイド材料から成るハード膜である、ところの方法。
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