JP2004538353A5 - - Google Patents
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- JP2004538353A5 JP2004538353A5 JP2003520583A JP2003520583A JP2004538353A5 JP 2004538353 A5 JP2004538353 A5 JP 2004538353A5 JP 2003520583 A JP2003520583 A JP 2003520583A JP 2003520583 A JP2003520583 A JP 2003520583A JP 2004538353 A5 JP2004538353 A5 JP 2004538353A5
- Authority
- JP
- Japan
- Prior art keywords
- carbon nanofibers
- polymer
- solvent
- film
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002134 carbon nanofiber Substances 0.000 description 51
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical class C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 45
- 229920000642 polymer Polymers 0.000 description 44
- 238000000034 method Methods 0.000 description 25
- 239000000203 mixture Substances 0.000 description 25
- 239000002904 solvent Substances 0.000 description 25
- 239000002114 nanocomposite Substances 0.000 description 24
- 239000010408 film Substances 0.000 description 19
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 14
- 239000000835 fiber Substances 0.000 description 13
- 238000001704 evaporation Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 9
- 239000002121 nanofiber Substances 0.000 description 9
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- 239000010409 thin film Substances 0.000 description 8
- 229920001940 conductive polymer Polymers 0.000 description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 6
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 6
- 239000002131 composite material Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 238000013329 compounding Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 5
- 239000006185 dispersion Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 230000008020 evaporation Effects 0.000 description 3
- 229940098779 methanesulfonic acid Drugs 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- SSLVPYVFJJMPPZ-UHFFFAOYSA-N 2,5,19,21-tetrazahexacyclo[12.11.0.03,12.04,9.017,25.018,22]pentacosa-1,3(12),4(9),5,7,10,14,16,18,20,22,24-dodecaene Chemical compound N1=CN=C2C1=CC=C1C2=CC=C2CC=3C=CC=4C=CC=NC=4C=3N=C21 SSLVPYVFJJMPPZ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 125000006615 aromatic heterocyclic group Chemical group 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000008240 homogeneous mixture Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229920000137 polyphosphoric acid Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000009503 electrostatic coating Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006112 polar polymer Polymers 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/932,169 US6680016B2 (en) | 2001-08-17 | 2001-08-17 | Method of forming conductive polymeric nanocomposite materials |
| PCT/US2002/019514 WO2003016048A1 (en) | 2001-08-17 | 2002-06-20 | Method of forming conductive polymeric nanocomposite materials and materials produced thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004538353A JP2004538353A (ja) | 2004-12-24 |
| JP2004538353A5 true JP2004538353A5 (enExample) | 2006-01-05 |
Family
ID=25461890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003520583A Pending JP2004538353A (ja) | 2001-08-17 | 2002-06-20 | 伝導性高分子ナノ複合材料を形成する方法及びそれによって製造された材料 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6680016B2 (enExample) |
| EP (1) | EP1425166B1 (enExample) |
| JP (1) | JP2004538353A (enExample) |
| KR (1) | KR100661249B1 (enExample) |
| CN (1) | CN1263596C (enExample) |
| CA (1) | CA2454493C (enExample) |
| DE (1) | DE60235557D1 (enExample) |
| WO (1) | WO2003016048A1 (enExample) |
Families Citing this family (104)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6635331B2 (en) * | 1998-03-23 | 2003-10-21 | Ronald N. Kessler | Universal mat with removable strips |
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| US6680016B2 (en) * | 2001-08-17 | 2004-01-20 | University Of Dayton | Method of forming conductive polymeric nanocomposite materials |
| US20050127329A1 (en) * | 2001-08-17 | 2005-06-16 | Chyi-Shan Wang | Method of forming nanocomposite materials |
| US20050272847A1 (en) * | 2001-08-17 | 2005-12-08 | Chyi-Shan Wang | Method of forming nanocomposite materials |
| US20050245665A1 (en) * | 2001-08-17 | 2005-11-03 | Chenggang Chen | Method of forming nanocomposite materials |
| US20060079623A1 (en) * | 2001-08-17 | 2006-04-13 | Chenggang Chen | Method of forming nanocomposite materials |
| WO2003020638A1 (en) * | 2001-08-29 | 2003-03-13 | Georgia Tech Research Corporation | Compositions comprising rigid-rod polymers and carbon nanotubes and process for making the same |
| US6946410B2 (en) * | 2002-04-05 | 2005-09-20 | E. I. Du Pont De Nemours And Company | Method for providing nano-structures of uniform length |
| US7935415B1 (en) * | 2002-04-17 | 2011-05-03 | Conductive Composites Company, L.L.C. | Electrically conductive composite material |
| US20040034177A1 (en) * | 2002-05-02 | 2004-02-19 | Jian Chen | Polymer and method for using the polymer for solubilizing nanotubes |
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| GB2400605A (en) * | 2003-02-18 | 2004-10-20 | Univ Cardiff | Nanocomposites |
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| DE10327530A1 (de) * | 2003-06-17 | 2005-01-20 | Electrovac Gesmbh | Vorrichtung mit wenigstens einer von einem zu kühlenden Funktionselement gebildeten Wärmequelle, mit wenigstens einer Wärmesenke und mit wenigstens einer Zwischenlage aus einer thermischen leitenden Masse zwischen der Wärmequelle und der Wärmesenke sowie thermische leitende Masse, insbesondere zur Verwendung bei einer solchen Vorrichtung |
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