JP2004531711A5 - - Google Patents
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- Publication number
- JP2004531711A5 JP2004531711A5 JP2002577538A JP2002577538A JP2004531711A5 JP 2004531711 A5 JP2004531711 A5 JP 2004531711A5 JP 2002577538 A JP2002577538 A JP 2002577538A JP 2002577538 A JP2002577538 A JP 2002577538A JP 2004531711 A5 JP2004531711 A5 JP 2004531711A5
- Authority
- JP
- Japan
- Prior art keywords
- hermetic sealing
- sealing member
- measurement method
- wall portions
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000691 measurement method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
Images
Description
基板1を、封止部材4を設けた蓋3上に上下逆に配置する。封止を良好なものとするために、銅重り10をアセンブリの頂部に配置し、このアセンブリ全体を加熱板11上で100℃で15分間加熱する。基板が銅重りに貼りつくのを防止するために、テフロン(登録商標)のスペーサを一時的に挿入することができる。上述した構成は、単なる一例であり、使用する材料に応じて異なるものとすることができることは明らかである。
Claims (1)
- 請求項1又は2に記載の測定方法において、前記ハーメチック封止を、少なくとも2つの壁部を有するハーメチック封止部材により行うようにする測定方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP01201229 | 2001-03-29 | ||
EP02075202 | 2002-01-17 | ||
PCT/IB2002/000754 WO2002079757A2 (en) | 2001-03-29 | 2002-03-13 | Method and device for measuring a permeation rate |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004531711A JP2004531711A (ja) | 2004-10-14 |
JP2004531711A5 true JP2004531711A5 (ja) | 2005-06-09 |
JP4209194B2 JP4209194B2 (ja) | 2009-01-14 |
Family
ID=26076870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002577538A Expired - Fee Related JP4209194B2 (ja) | 2001-03-29 | 2002-03-13 | 浸透率の測定及び検査方法並びに測定及び検査装置 |
Country Status (8)
Country | Link |
---|---|
US (2) | US6993956B2 (ja) |
EP (1) | EP1373861A2 (ja) |
JP (1) | JP4209194B2 (ja) |
KR (1) | KR100859818B1 (ja) |
CN (1) | CN1242250C (ja) |
AU (1) | AU2002237478A1 (ja) |
TW (1) | TWI229733B (ja) |
WO (1) | WO2002079757A2 (ja) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2601665B2 (ja) * | 1987-10-19 | 1997-04-16 | 富士写真フイルム株式会社 | ハロゲン化銀カラー写真感光材料の処理方法 |
US5110713A (en) * | 1987-10-30 | 1992-05-05 | Fuji Photo Film Co., Ltd. | Method for processing silver halide color photographic material |
EP1373861A2 (en) * | 2001-03-29 | 2004-01-02 | Koninklijke Philips Electronics N.V. | A method for measuring a permeation rate, a test and an apparatus for measuring and testing |
US7344901B2 (en) * | 2003-04-16 | 2008-03-18 | Corning Incorporated | Hermetically sealed package and method of fabricating of a hermetically sealed package |
US6998776B2 (en) * | 2003-04-16 | 2006-02-14 | Corning Incorporated | Glass package that is hermetically sealed with a frit and method of fabrication |
GB0316106D0 (en) * | 2003-07-09 | 2003-08-13 | Cambridge Display Tech Ltd | Test structures and methods |
US7178384B2 (en) * | 2004-02-04 | 2007-02-20 | General Atomics | Method and apparatus for measuring ultralow permeation |
EP1730490B1 (en) | 2004-03-31 | 2013-02-27 | Agency for Science, Technology and Research | A sensor for measuring gas permeability of a test material |
CN100507510C (zh) * | 2004-09-30 | 2009-07-01 | 清华大学 | 一种水氧渗透率的测试方法及其测试设备 |
GB0505517D0 (en) | 2005-03-17 | 2005-04-27 | Dupont Teijin Films Us Ltd | Coated polymeric substrates |
US7257990B2 (en) * | 2005-04-25 | 2007-08-21 | General Atomics | Accelerated ultralow moisture permeation measurement |
DE102005057031B4 (de) * | 2005-11-25 | 2011-04-21 | Innovent E.V. Technologieentwicklung | Vorrichtung für Permeations-oder Stoffdurchgangsuntersuchungen |
US20080124558A1 (en) * | 2006-08-18 | 2008-05-29 | Heather Debra Boek | Boro-silicate glass frits for hermetic sealing of light emitting device displays |
EP1983079A1 (en) | 2007-04-17 | 2008-10-22 | Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO | Barrier layer and method for making the same |
CN101246095B (zh) * | 2008-01-07 | 2011-03-30 | 电子科技大学 | 阻隔材料气体渗透率的测量装置 |
US20100095705A1 (en) | 2008-10-20 | 2010-04-22 | Burkhalter Robert S | Method for forming a dry glass-based frit |
WO2010093237A1 (en) | 2009-02-11 | 2010-08-19 | Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno | Optoelectronic device and method for fabricating such device |
US8388742B2 (en) * | 2010-01-13 | 2013-03-05 | E I Du Pont De Nemours And Company | Apparatus to measure permeation of a gas through a membrane |
EP2476784A1 (en) | 2011-01-18 | 2012-07-18 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method for manufacturing an electronic device by electrodeposition from an ionic liquid |
CN102141504B (zh) * | 2011-01-27 | 2013-06-12 | 中国商用飞机有限责任公司 | 在铺层厚度方向上测试气体渗透率的测试装置及其方法 |
CN102183444B (zh) * | 2011-01-27 | 2013-09-25 | 中国商用飞机有限责任公司 | 在铺层面内方向上测试气体渗透率的测试装置及其方法 |
JP5810556B2 (ja) * | 2011-03-09 | 2015-11-11 | 凸版印刷株式会社 | ガス透過性試験片及びガス透過性評価方法 |
US20140048824A1 (en) | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
US9356070B2 (en) | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
US9086351B1 (en) * | 2013-03-14 | 2015-07-21 | The United States Of America As Represented By The Secretary Of The Army | Fixture for system-level glove testing of contact permeation |
CN103217459A (zh) * | 2013-05-06 | 2013-07-24 | 深圳市华星光电技术有限公司 | Oled面板封装效果的检测方法 |
KR101469533B1 (ko) * | 2013-05-30 | 2014-12-05 | 전자부품연구원 | 외기 침투율 측정을 위한 반응 물질 카트리지 및 이를 포함하는 기판의 외기 침투율 측정 장치 |
DE102013022032A1 (de) | 2013-12-19 | 2015-06-25 | Technische Universität Ilmenau | Verfahren zum Nachweis von Fremdstoffen oder Degradationsprodukten in verkapselten Systemen sowie dessen Verwendung |
WO2015194558A1 (ja) * | 2014-06-17 | 2015-12-23 | コニカミノルタ株式会社 | 水蒸気透過度評価方法及び水蒸気透過度評価装置 |
CN104048901B (zh) * | 2014-06-26 | 2016-03-30 | 河南省嵩阳高速公路有限公司 | 透层乳化沥青渗透效果测试方法 |
CN104465622B (zh) * | 2014-12-08 | 2017-09-15 | 京东方科技集团股份有限公司 | 检测背板水氧透过率的方法和封装结构 |
US9529188B2 (en) | 2015-03-25 | 2016-12-27 | Amazon Technologies, Inc. | Electrowetting device with multi layer support plate |
CN105043935A (zh) * | 2015-05-18 | 2015-11-11 | 华南理工大学 | 基于数字图像处理多孔金属材料浸润性能测量装置及方法 |
CN105938084B (zh) * | 2016-06-28 | 2018-08-14 | 中国石油天然气股份有限公司 | 一种化学渗吸剂渗透性能评价方法 |
CN106442260B (zh) * | 2016-09-27 | 2019-11-01 | 江西理工大学 | 一种测量稀土浸矿过程中渗透系数的方法 |
US11181460B1 (en) * | 2019-06-20 | 2021-11-23 | The United States Of America As Represented By The Secretary Of The Army | Apparatus and method for measuring permeation of contaminants through a complex protective material swatch |
US11624672B2 (en) * | 2020-06-23 | 2023-04-11 | Ateq | Apparatus and method for automatic leak detection |
CN114295602B (zh) * | 2021-12-30 | 2024-03-01 | 中国石油大学(华东) | 一种测试氢渗透路径的拉曼池系统 |
WO2024126566A1 (en) | 2022-12-14 | 2024-06-20 | Basf Coatings Gmbh | Multilayer barrier film coated polymeric substrate, its manufacture and use in electronic devices |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4326514A (en) * | 1980-06-20 | 1982-04-27 | Minnesota Mining And Manufacturing Company | Cartridge respirator with service life indicator |
JPS6020135A (ja) * | 1983-07-15 | 1985-02-01 | Daicel Chem Ind Ltd | 膜性能測定用および漏洩検査用物質 |
JPS6131937A (ja) * | 1984-07-25 | 1986-02-14 | Mitsubishi Heavy Ind Ltd | 漏洩欠陥部検知法 |
US4822743A (en) * | 1984-12-13 | 1989-04-18 | Lockheed Corporation | Method and cloth for detecting leaks in closed bodies |
JPS6232336A (ja) * | 1985-08-05 | 1987-02-12 | Toshiba Corp | Itvカメラによる液体漏洩検出方法 |
EP0247098B1 (de) * | 1985-11-29 | 1992-03-25 | Emil BÄCHLI | Wärmeisolierendes bau- und/oder lichtelement |
JPH01307635A (ja) * | 1988-06-03 | 1989-12-12 | Hamamatsu Photonics Kk | 被試験用薄膜の物質透過性能を評価する方法 |
US4848138A (en) * | 1988-07-15 | 1989-07-18 | Marshall John M | Window gas monitor |
DE3828531A1 (de) * | 1988-08-23 | 1990-03-15 | Rudolf Dr Ing Ernst | Sauerstoffabsorptionsmittel und verwendung desselben |
JPH02306132A (ja) * | 1989-05-19 | 1990-12-19 | Hitachi Cable Ltd | 漏油検知法 |
US4987849A (en) * | 1989-09-22 | 1991-01-29 | Sherman Daniel A | Signal device |
US5001346A (en) * | 1990-02-26 | 1991-03-19 | Rockwell International Corporation | Leak detection system with background compensation |
US5128106A (en) * | 1990-07-12 | 1992-07-07 | Gte Products Corporation | Lamp with an oxygen detector |
US5047947A (en) * | 1990-07-25 | 1991-09-10 | Grumman Aerospace Corporation | Method of modeling the assembly of products to increase production yield |
US5447688A (en) * | 1991-12-30 | 1995-09-05 | Moore; Robert E. | Detector, and method of using same |
DE4214239C2 (de) * | 1992-04-30 | 1994-06-16 | Draegerwerk Ag | Atemschutzmaske mit einem indikator |
GB9311427D0 (en) * | 1993-06-03 | 1993-07-21 | Trigon Ind Ltd | A multi-wall film |
US5449912A (en) * | 1994-06-15 | 1995-09-12 | Modern Controls, Inc. | Measurement cell for water vapor sensor |
US5963881A (en) * | 1995-09-22 | 1999-10-05 | Texas Instruments Incorporated | Method and system for enhancing the identification of causes of variations in the performance of manufactured articles |
US5926262A (en) * | 1997-07-01 | 1999-07-20 | Lj Laboratories, L.L.C. | Apparatus and method for measuring optical characteristics of an object |
US5783110A (en) * | 1997-04-17 | 1998-07-21 | R-Tect, Inc. | Composition for the detection of electrophilic gases and methods of use thereof |
US6336753B1 (en) * | 1999-01-20 | 2002-01-08 | Sony Corporation | Optical device, a fabricating method thereof, a driving method thereof and a camera system |
JP2001051307A (ja) * | 1999-01-20 | 2001-02-23 | Sony Corp | 光学装置、その製造方法、その駆動方法及びカメラシステム |
US6259370B1 (en) * | 1999-08-03 | 2001-07-10 | Technical & Try Co., Ltd. | Leak sensor |
US7448258B2 (en) * | 1999-10-29 | 2008-11-11 | Avery Dennison Corporation | High throughput screening for moisture barrier characteristics of materials |
KR20010102160A (ko) * | 1999-12-14 | 2001-11-15 | 사토 아키오 | 액정표시셀용 실링제, 액정표시셀실링제용 조성물 및액정표시소자 |
US6622059B1 (en) * | 2000-04-13 | 2003-09-16 | Advanced Micro Devices, Inc. | Automated process monitoring and analysis system for semiconductor processing |
EP1373861A2 (en) * | 2001-03-29 | 2004-01-02 | Koninklijke Philips Electronics N.V. | A method for measuring a permeation rate, a test and an apparatus for measuring and testing |
JP2005507557A (ja) * | 2001-05-24 | 2005-03-17 | テスト アドバンテージ, インコーポレイテッド | 半導体テストのための方法および装置 |
-
2002
- 2002-03-13 EP EP02703801A patent/EP1373861A2/en not_active Withdrawn
- 2002-03-13 CN CNB028008804A patent/CN1242250C/zh not_active Expired - Fee Related
- 2002-03-13 AU AU2002237478A patent/AU2002237478A1/en not_active Abandoned
- 2002-03-13 JP JP2002577538A patent/JP4209194B2/ja not_active Expired - Fee Related
- 2002-03-13 WO PCT/IB2002/000754 patent/WO2002079757A2/en active Application Filing
- 2002-03-13 KR KR1020027016047A patent/KR100859818B1/ko not_active IP Right Cessation
- 2002-03-18 TW TW091105083A patent/TWI229733B/zh not_active IP Right Cessation
- 2002-03-26 US US10/106,951 patent/US6993956B2/en not_active Ceased
-
2005
- 2005-12-12 US US11/298,651 patent/US7117720B2/en not_active Expired - Fee Related
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