JP2004518285A5 - - Google Patents

Download PDF

Info

Publication number
JP2004518285A5
JP2004518285A5 JP2002558327A JP2002558327A JP2004518285A5 JP 2004518285 A5 JP2004518285 A5 JP 2004518285A5 JP 2002558327 A JP2002558327 A JP 2002558327A JP 2002558327 A JP2002558327 A JP 2002558327A JP 2004518285 A5 JP2004518285 A5 JP 2004518285A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002558327A
Other versions
JP2004518285A (ja
JP4252309B2 (ja
Filing date
Publication date
Priority claimed from US09/730,621 external-priority patent/US6535386B2/en
Application filed filed Critical
Publication of JP2004518285A publication Critical patent/JP2004518285A/ja
Publication of JP2004518285A5 publication Critical patent/JP2004518285A5/ja
Application granted granted Critical
Publication of JP4252309B2 publication Critical patent/JP4252309B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002558327A 2000-12-05 2001-11-09 電子アセンブリ Expired - Fee Related JP4252309B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/730,621 US6535386B2 (en) 2000-12-05 2000-12-05 Electronic assembly having a heat pipe that conducts heat from a semiconductor die
PCT/US2001/049897 WO2002058138A2 (en) 2000-12-05 2001-11-09 An electronic assembly having a heat pipe that conducts heat from a semiconductor die

Publications (3)

Publication Number Publication Date
JP2004518285A JP2004518285A (ja) 2004-06-17
JP2004518285A5 true JP2004518285A5 (ja) 2005-12-22
JP4252309B2 JP4252309B2 (ja) 2009-04-08

Family

ID=24936082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002558327A Expired - Fee Related JP4252309B2 (ja) 2000-12-05 2001-11-09 電子アセンブリ

Country Status (11)

Country Link
US (1) US6535386B2 (ja)
EP (1) EP1340257B1 (ja)
JP (1) JP4252309B2 (ja)
KR (1) KR100491697B1 (ja)
CN (1) CN100364082C (ja)
AT (1) ATE468607T1 (ja)
AU (1) AU2002246787A1 (ja)
DE (1) DE60142176D1 (ja)
HK (1) HK1056258A1 (ja)
MY (1) MY119151A (ja)
WO (1) WO2002058138A2 (ja)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6302192B1 (en) * 1999-05-12 2001-10-16 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
US6650546B2 (en) * 2001-02-27 2003-11-18 3Com Corporation Chip component assembly
DE10125636B4 (de) * 2001-05-25 2004-03-25 Agilent Technologies, Inc. (n.d.Ges.d.Staates Delaware), Palo Alto Kühler für elektrische und/oder elektronische Bauteile
US6653755B2 (en) * 2001-05-30 2003-11-25 Intel Corporation Radial air flow fan assembly having stator fins surrounding rotor blades
TWI231416B (en) * 2001-09-27 2005-04-21 Quanta Comp Inc Heat sink module for notebook computer
US7131487B2 (en) * 2001-12-14 2006-11-07 Intel Corporation Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers
JP3634825B2 (ja) * 2002-06-28 2005-03-30 株式会社東芝 電子機器
TW551612U (en) * 2002-07-26 2003-09-01 Tai Sol Electronics Co Ltd Piercing type IC heat dissipating device
US7021891B2 (en) * 2002-12-18 2006-04-04 Intel Corporation Micro-impeller miniature centrifugal compressor
US20060102323A1 (en) * 2003-02-14 2006-05-18 Prosenjit Ghosh Radially shaped heat pipe
US20040188079A1 (en) * 2003-03-31 2004-09-30 Arima Computer Corporation Heat-dissipation module for chip
US6802363B1 (en) * 2003-06-03 2004-10-12 Pei Choa Wang Flat type heat pipe with opening
US7057895B2 (en) * 2003-06-30 2006-06-06 Intel Corporation Thermal standoff for close proximity thermal management
US7242097B2 (en) * 2003-06-30 2007-07-10 Intel Corporation Electromigration barrier layers for solder joints
US7233492B2 (en) * 2004-04-22 2007-06-19 Hewlett-Packard Development Company, L.P. Cooling systems and methods for same
JP4551729B2 (ja) * 2004-09-30 2010-09-29 株式会社東芝 冷却装置および冷却装置を有する電子機器
US20060250205A1 (en) * 2005-05-04 2006-11-09 Honeywell International Inc. Thermally conductive element for cooling an air gap inductor, air gap inductor including same and method of cooling an air gap inductor
JP2007088282A (ja) * 2005-09-22 2007-04-05 Mitsubishi Electric Corp 周辺機器及び電子機器
JP4234722B2 (ja) * 2006-02-28 2009-03-04 株式会社東芝 冷却装置および電子機器
CN101031193B (zh) * 2006-03-03 2010-09-29 富准精密工业(深圳)有限公司 散热模组
JP4719084B2 (ja) * 2006-05-30 2011-07-06 株式会社東芝 電子機器
CN101102655A (zh) * 2006-07-07 2008-01-09 富准精密工业(深圳)有限公司 散热装置
CN100531540C (zh) * 2006-09-15 2009-08-19 富准精密工业(深圳)有限公司 散热模组
JP2008251687A (ja) * 2007-03-29 2008-10-16 Toshiba Corp プリント回路板、およびこれを備えた電子機器
US8837139B2 (en) * 2007-09-29 2014-09-16 Biao Qin Flat heat pipe radiator and application thereof
TWM337966U (en) * 2008-03-06 2008-08-01 Celsia Technologies Taiwan Inc Flat plate heat sink
JP4352091B2 (ja) * 2008-03-27 2009-10-28 株式会社東芝 電子機器、冷却装置
US20220228811A9 (en) * 2008-07-21 2022-07-21 The Regents Of The University Of California Titanium-based thermal ground plane
US8081478B1 (en) * 2008-12-09 2011-12-20 Lockheed Martin Corporation Fluid cooled electronics module cover
CN101754655B (zh) * 2008-12-10 2013-03-06 富瑞精密组件(昆山)有限公司 散热模组
CN101765352B (zh) * 2008-12-23 2013-04-24 富瑞精密组件(昆山)有限公司 扁平型热导管及使用该热导管的散热模组
TWI491341B (zh) * 2009-01-09 2015-07-01 Foxconn Tech Co Ltd 扁平型熱導管及使用該熱導管的散熱模組
JP4875181B2 (ja) 2010-04-09 2012-02-15 株式会社東芝 電子機器
JP4908610B2 (ja) 2010-04-09 2012-04-04 株式会社東芝 電子機器
TW201212800A (en) * 2010-09-03 2012-03-16 Hon Hai Prec Ind Co Ltd Heat dissipating device and electronic device having the same
TWI495423B (zh) * 2010-09-21 2015-08-01 Foxconn Tech Co Ltd 散熱模組及採用該散熱模組之電子裝置
JP5367745B2 (ja) * 2011-03-04 2013-12-11 レノボ・シンガポール・プライベート・リミテッド ヒート・シンクの熱交換率を向上する方法および電子機器
CN102811588A (zh) * 2011-05-30 2012-12-05 富准精密工业(深圳)有限公司 电子设备
TWI524046B (zh) * 2011-08-17 2016-03-01 奇鋐科技股份有限公司 散熱元件之固定結構
TWI479302B (zh) * 2011-08-17 2015-04-01 Asia Vital Components Co Ltd 散熱裝置之固定結構
TWI484890B (zh) * 2011-08-17 2015-05-11 Asia Vital Components Co Ltd 散熱單元之固定結構
JP5709704B2 (ja) * 2011-09-14 2015-04-30 三菱電機株式会社 半導体装置
US20130092353A1 (en) * 2011-10-17 2013-04-18 Asia Vital Components Co., Ltd. Vapor chamber structure and method of manufacturing same
US20130098592A1 (en) * 2011-10-25 2013-04-25 Asia Vital Components Co., Ltd. Heat dissipation device and manufacturing method thereof
EP2660155B1 (en) * 2012-04-30 2015-12-09 Airbus Defence and Space Limited Apparatus and method for mounting heat pipes to panels
US20140138811A1 (en) * 2012-11-21 2014-05-22 Nvidia Corporation A semiconductor device including a heat-spreading lid
KR20150091905A (ko) * 2014-02-04 2015-08-12 엘지전자 주식회사 증기 챔버
KR101941024B1 (ko) * 2014-03-27 2019-01-22 삼성전자주식회사 쉴드 캔 조립체 및 그것을 갖는 전자 장치
KR102099255B1 (ko) * 2014-05-07 2020-04-10 삼성전자주식회사 방열장치 및 이를 구비한 전자장치
KR20160015949A (ko) * 2014-08-01 2016-02-15 삼성전자주식회사 셋톱 박스
JP6473920B2 (ja) * 2014-09-22 2019-02-27 パナソニックIpマネジメント株式会社 電子機器
US10222125B2 (en) * 2015-04-06 2019-03-05 International Business Machines Corporation Burst resistant thin wall heat sink
US10215504B2 (en) 2015-04-06 2019-02-26 International Business Machines Corporation Flexible cold plate with enhanced flexibility
GB2542353A (en) * 2015-09-15 2017-03-22 Alstom Technology Ltd A busbar assembly
US9835382B2 (en) * 2015-09-16 2017-12-05 Acer Incorporated Thermal dissipation module
US10948240B2 (en) * 2016-06-16 2021-03-16 Asia Vital Components Co., Ltd. Vapor chamber structure
US20180170553A1 (en) * 2016-12-20 2018-06-21 Qualcomm Incorporated Systems, methods, and apparatus for passive cooling of uavs
JP6886877B2 (ja) * 2017-07-12 2021-06-16 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
US10473404B2 (en) * 2017-11-14 2019-11-12 Asia Vital Components Co., Ltd. Straight-through structure of heat dissipation unit
US10458718B2 (en) * 2017-11-29 2019-10-29 Asia Vital Components Co., Ltd. Airtight penetration structure for heat dissipation device
CN108770283A (zh) * 2018-05-04 2018-11-06 北京空间飞行器总体设计部 基于小尺寸冷凝器的大功率风冷环路热管散热器
US11304334B2 (en) * 2018-06-14 2022-04-12 Microsoft Technology Licensing, Llc Vapor chamber having an electromagnetic shielding layer and methods of manufacturing the same
US10746476B2 (en) * 2018-11-30 2020-08-18 United States Of America As Represented By The Secretary Of The Navy Underwater remote cooling apparatus
RU196690U1 (ru) * 2019-12-27 2020-03-11 Федеральное государственное бюджетное образовательное учреждение высшего образования "Московский авиационный институт (национальный исследовательский университет") Приемо-передающий модуль активной фазированной антенной решетки Ка-диапазона с двухступенчатой системой охлаждения
US11303064B2 (en) * 2020-07-10 2022-04-12 Beijing Voyager Technology Co., Ltd. Methods and apparatuses for aligning and coupling a circuit board with a chassis and another circuit board
JP2022094020A (ja) * 2020-12-14 2022-06-24 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
WO2023235524A1 (en) * 2022-06-02 2023-12-07 Apple Inc. Heat sink assembly

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5166864A (en) * 1991-05-17 1992-11-24 Hughes Aircraft Company Protected circuit card assembly and process
US5784256A (en) * 1994-09-14 1998-07-21 Kabushiki Kaisha Toshiba Portable computer having a circuit board including a heat-generating IC chip and a metal frame supporting the circuit board
JP3158983B2 (ja) * 1994-10-03 2001-04-23 住友精密工業株式会社 Lsiパッケージ冷却用コルゲート型放熱フィン
US6082443A (en) * 1997-02-13 2000-07-04 The Furukawa Electric Co., Ltd. Cooling device with heat pipe
US5808236A (en) 1997-04-10 1998-09-15 International Business Machines Corporation High density heatsink attachment
US5982616A (en) * 1997-08-20 1999-11-09 Compaq Computer Corporation Electronic apparatus with plug-in heat pipe module cooling system
US6084178A (en) * 1998-02-27 2000-07-04 Hewlett-Packard Company Perimeter clamp for mounting and aligning a semiconductor component as part of a field replaceable unit (FRU)
US6008987A (en) * 1998-04-21 1999-12-28 Nortel Networks Corporation Electronic circuitry
US6160223A (en) * 1998-06-03 2000-12-12 At&T Corporation Heat pipe attached to a printed wiring board
JP4119008B2 (ja) * 1998-06-23 2008-07-16 株式会社東芝 回路部品の冷却装置および電子機器
JP4140100B2 (ja) * 1998-10-29 2008-08-27 ソニー株式会社 ヒートパイプ内蔵プリント配線基板
US6075700A (en) 1999-02-02 2000-06-13 Compaq Computer Corporation Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures
US6144557A (en) * 1999-04-09 2000-11-07 Lucent Technologies, Inc. Self-locking conductive pin for printed wiring substrate electronics case
US6304450B1 (en) * 1999-07-15 2001-10-16 Incep Technologies, Inc. Inter-circuit encapsulated packaging
US6169660B1 (en) * 1999-11-01 2001-01-02 Thermal Corp. Stress relieved integrated circuit cooler

Similar Documents

Publication Publication Date Title
BE2022C531I2 (ja)
BE2022C502I2 (ja)
BE2022C547I2 (ja)
BE2017C055I2 (ja)
BE2017C051I2 (ja)
BE2017C032I2 (ja)
BE2016C051I2 (ja)
BE2015C046I2 (ja)
BE2014C036I2 (ja)
BE2014C026I2 (ja)
BE2014C004I2 (ja)
BE2014C006I2 (ja)
BE2017C050I2 (ja)
BE2011C034I2 (ja)
BE2007C047I2 (ja)
AU2002307149A8 (ja)
JP2004518285A5 (ja)
BE2016C021I2 (ja)
JP2002072964A5 (ja)
IN221751B (ja)
BE2014C008I2 (ja)
BRPI0204884B1 (ja)
BE2017C059I2 (ja)
BRPI0101486B8 (ja)
BE2012C051I2 (ja)