JP2004363343A5 - - Google Patents

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Publication number
JP2004363343A5
JP2004363343A5 JP2003160246A JP2003160246A JP2004363343A5 JP 2004363343 A5 JP2004363343 A5 JP 2004363343A5 JP 2003160246 A JP2003160246 A JP 2003160246A JP 2003160246 A JP2003160246 A JP 2003160246A JP 2004363343 A5 JP2004363343 A5 JP 2004363343A5
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JP
Japan
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JP2003160246A
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JP4374913B2 (ja
JP2004363343A (ja
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Publication of JP2004363343A5 publication Critical patent/JP2004363343A5/ja
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JP2003160246A 2003-06-05 2003-06-05 発光装置 Expired - Lifetime JP4374913B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003160246A JP4374913B2 (ja) 2003-06-05 2003-06-05 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003160246A JP4374913B2 (ja) 2003-06-05 2003-06-05 発光装置

Publications (3)

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JP2004363343A JP2004363343A (ja) 2004-12-24
JP2004363343A5 true JP2004363343A5 (ja) 2006-05-25
JP4374913B2 JP4374913B2 (ja) 2009-12-02

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JP2003160246A Expired - Lifetime JP4374913B2 (ja) 2003-06-05 2003-06-05 発光装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages

Families Citing this family (42)

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KR20110137403A (ko) 2003-02-26 2011-12-22 크리, 인코포레이티드 복합 백색 광원 및 그 제조 방법
JP2006525682A (ja) 2003-04-30 2006-11-09 クリー　インコーポレイテッド 高出力固体発光素子パッケージ
US7592192B2 (en) * 2004-03-05 2009-09-22 Konica Minolta Holdings, Inc. White light emitting diode (white LED) and method of manufacturing white LED
DE102004047727B4 (de) * 2004-09-30 2018-01-18 Osram Opto Semiconductors Gmbh Lumineszenzdiodenchip mit einer Konverterschicht und Verfahren zur Herstellung eines Lumineszenzdiodenchips mit einer Konverterschicht
JP4792751B2 (ja) * 2005-01-26 2011-10-12 日亜化学工業株式会社 発光装置およびその製造方法
CN101138278A (zh) 2005-03-09 2008-03-05 皇家飞利浦电子股份有限公司 包括辐射源和荧光材料的照明系统
US7341878B2 (en) * 2005-03-14 2008-03-11 Philips Lumileds Lighting Company, Llc Wavelength-converted semiconductor light emitting device
US8748923B2 (en) 2005-03-14 2014-06-10 Philips Lumileds Lighting Company Llc Wavelength-converted semiconductor light emitting device
JP2006319238A (ja) * 2005-05-16 2006-11-24 Koito Mfg Co Ltd 発光装置および車両用灯具
KR101161383B1 (ko) 2005-07-04 2012-07-02 서울반도체 주식회사 발광 다이오드 및 이를 제조하기 위한 방법
JP2007088273A (ja) * 2005-09-22 2007-04-05 Matsushita Electric Works Ltd 半導体発光素子およびその製造方法
JP4843284B2 (ja) * 2005-09-22 2011-12-21 パナソニック電工株式会社 半導体発光素子およびその製造方法
JP4699158B2 (ja) * 2005-09-30 2011-06-08 大日本印刷株式会社 色変換層形成用塗工液
KR100723247B1 (ko) * 2006-01-10 2007-05-29 삼성전기주식회사 칩코팅형 ｌｅｄ 패키지 및 그 제조방법
KR100799859B1 (ko) * 2006-03-22 2008-01-31 삼성전기주식회사 백색 발광 소자
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
JP5308618B2 (ja) * 2006-04-26 2013-10-09 日亜化学工業株式会社 半導体発光装置
TWI407583B (zh) * 2006-06-27 2013-09-01 Mitsubishi Chem Corp 照明裝置
US9111950B2 (en) * 2006-09-28 2015-08-18 Philips Lumileds Lighting Company, Llc Process for preparing a semiconductor structure for mounting
KR100862532B1 (ko) * 2007-03-13 2008-10-09 삼성전기주식회사 발광 다이오드 패키지 제조방법
US9401461B2 (en) 2007-07-11 2016-07-26 Cree, Inc. LED chip design for white conversion
US10505083B2 (en) 2007-07-11 2019-12-10 Cree, Inc. Coating method utilizing phosphor containment structure and devices fabricated using same
JP4829190B2 (ja) * 2007-08-22 2011-12-07 株式会社東芝 発光素子
CN100483762C (zh) * 2008-02-25 2009-04-29 鹤山丽得电子实业有限公司 一种发光二极管器件的制造方法
US8877524B2 (en) 2008-03-31 2014-11-04 Cree, Inc. Emission tuning methods and devices fabricated utilizing methods
JP5121783B2 (ja) * 2009-06-30 2013-01-16 株式会社日立ハイテクノロジーズ Ｌｅｄ光源およびその製造方法ならびにｌｅｄ光源を用いた露光装置及び露光方法
KR100986336B1 (ko) 2009-10-22 2010-10-08 엘지이노텍 주식회사 발광소자, 발광소자 제조방법 및 발광소자 패키지
JP4952842B2 (ja) * 2010-12-24 2012-06-13 大日本印刷株式会社 色変換層形成用塗工液および有機エレクトロルミネッセンス素子用基板、ならびにこれらの製造方法
WO2012116114A1 (en) * 2011-02-24 2012-08-30 Nitto Denko Corporation Light emitting composite with phosphor components
CN103180974A (zh) 2011-06-27 2013-06-26 松下电器产业株式会社 氮化物类半导体发光元件
JP5772293B2 (ja) * 2011-06-28 2015-09-02 日亜化学工業株式会社 発光装置及びその製造方法
JP5886105B2 (ja) * 2012-03-29 2016-03-16 スタンレー電気株式会社 発光ダイオード発光装置の製造方法
CN102795005B (zh) * 2012-07-09 2015-12-02 厦门飞德利照明科技有限公司 一种led模组的荧光粉丝网印刷工艺
TWI483434B (zh) * 2013-02-18 2015-05-01 Lextar Electronics Corp 發光二極體的轉置基材與使用該轉置基材的發光裝置製造方法
DE102013205179A1 (de) * 2013-03-25 2014-09-25 Osram Gmbh Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
JP2016163015A (ja) * 2015-03-05 2016-09-05 旭化成株式会社 紫外線発光素子及びその製造方法
JP6720887B2 (ja) * 2017-02-02 2020-07-08 豊田合成株式会社 発光装置の製造方法
JP7007923B2 (ja) * 2018-01-16 2022-01-25 日機装株式会社 半導体発光素子および半導体発光素子の製造方法
JP2019032563A (ja) * 2018-11-15 2019-02-28 シャープ株式会社 発光装置および照明装置
CN114316978A (zh) * 2020-09-30 2022-04-12 日亚化学工业株式会社 波长转换构件及发光装置
CN112788807B (zh) * 2020-12-30 2022-09-13 宁波升谱光电股份有限公司 农业病虫害防治用集成式led光源制备装置及其方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9431589B2 (en) 2007-12-14 2016-08-30 Cree, Inc. Textured encapsulant surface in LED packages

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