JP2004363126A5 - - Google Patents

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Publication number
JP2004363126A5
JP2004363126A5 JP2003155889A JP2003155889A JP2004363126A5 JP 2004363126 A5 JP2004363126 A5 JP 2004363126A5 JP 2003155889 A JP2003155889 A JP 2003155889A JP 2003155889 A JP2003155889 A JP 2003155889A JP 2004363126 A5 JP2004363126 A5 JP 2004363126A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003155889A
Other versions
JP3951966B2 (ja
JP2004363126A (ja
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Publication date
Application filed filed Critical
Priority to JP2003155889A priority Critical patent/JP3951966B2/ja
Priority claimed from JP2003155889A external-priority patent/JP3951966B2/ja
Priority to US10/852,860 priority patent/US7087989B2/en
Publication of JP2004363126A publication Critical patent/JP2004363126A/ja
Publication of JP2004363126A5 publication Critical patent/JP2004363126A5/ja
Priority to US11/356,280 priority patent/US7436061B2/en
Application granted granted Critical
Publication of JP3951966B2 publication Critical patent/JP3951966B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003155889A 2003-05-30 2003-05-30 半導体装置 Expired - Fee Related JP3951966B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003155889A JP3951966B2 (ja) 2003-05-30 2003-05-30 半導体装置
US10/852,860 US7087989B2 (en) 2003-05-30 2004-05-25 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
US11/356,280 US7436061B2 (en) 2003-05-30 2006-02-15 Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003155889A JP3951966B2 (ja) 2003-05-30 2003-05-30 半導体装置

Publications (3)

Publication Number Publication Date
JP2004363126A JP2004363126A (ja) 2004-12-24
JP2004363126A5 true JP2004363126A5 (ja) 2005-06-23
JP3951966B2 JP3951966B2 (ja) 2007-08-01

Family

ID=33562178

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003155889A Expired - Fee Related JP3951966B2 (ja) 2003-05-30 2003-05-30 半導体装置

Country Status (2)

Country Link
US (2) US7087989B2 (ja)
JP (1) JP3951966B2 (ja)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
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US7265446B2 (en) * 2003-10-06 2007-09-04 Elpida Memory, Inc. Mounting structure for semiconductor parts and semiconductor device
JP2006049569A (ja) * 2004-08-04 2006-02-16 Sharp Corp スタック型半導体装置パッケージおよびその製造方法
US7445962B2 (en) * 2005-02-10 2008-11-04 Stats Chippac Ltd. Stacked integrated circuits package system with dense routability and high thermal conductivity
US7518224B2 (en) * 2005-05-16 2009-04-14 Stats Chippac Ltd. Offset integrated circuit package-on-package stacking system
US7746656B2 (en) * 2005-05-16 2010-06-29 Stats Chippac Ltd. Offset integrated circuit package-on-package stacking system
JP4703356B2 (ja) * 2005-10-19 2011-06-15 パナソニック株式会社 積層型半導体装置
JP4473807B2 (ja) 2005-10-27 2010-06-02 パナソニック株式会社 積層半導体装置及び積層半導体装置の下層モジュール
JP4512545B2 (ja) 2005-10-27 2010-07-28 パナソニック株式会社 積層型半導体モジュール
JP5259053B2 (ja) 2005-12-15 2013-08-07 パナソニック株式会社 半導体装置および半導体装置の検査方法
JP5005321B2 (ja) * 2006-11-08 2012-08-22 パナソニック株式会社 半導体装置
JP5068990B2 (ja) * 2006-12-26 2012-11-07 新光電気工業株式会社 電子部品内蔵基板
US8163600B2 (en) * 2006-12-28 2012-04-24 Stats Chippac Ltd. Bridge stack integrated circuit package-on-package system
JP2008187101A (ja) * 2007-01-31 2008-08-14 Yamaha Corp 半導体装置及び半導体装置の実装構造
JP5207659B2 (ja) * 2007-05-22 2013-06-12 キヤノン株式会社 半導体装置
JP5071084B2 (ja) * 2007-12-10 2012-11-14 パナソニック株式会社 配線用基板とそれを用いた積層用半導体装置および積層型半導体モジュール
JP5162226B2 (ja) 2007-12-12 2013-03-13 新光電気工業株式会社 配線基板及び半導体装置
US7750459B2 (en) * 2008-02-01 2010-07-06 International Business Machines Corporation Integrated module for data processing system
US8816487B2 (en) * 2008-03-18 2014-08-26 Stats Chippac Ltd. Integrated circuit packaging system with package-in-package and method of manufacture thereof
JP5143211B2 (ja) 2009-12-28 2013-02-13 パナソニック株式会社 半導体モジュール
US8847376B2 (en) 2010-07-23 2014-09-30 Tessera, Inc. Microelectronic elements with post-assembly planarization
US20120162928A1 (en) * 2010-10-22 2012-06-28 Endicott Interconnect Technologies, Inc. Electronic package and method of making same
JP2013045863A (ja) * 2011-08-24 2013-03-04 Elpida Memory Inc 半導体装置およびその製造方法
US8704364B2 (en) * 2012-02-08 2014-04-22 Xilinx, Inc. Reducing stress in multi-die integrated circuit structures
US8704384B2 (en) 2012-02-17 2014-04-22 Xilinx, Inc. Stacked die assembly
US8901730B2 (en) 2012-05-03 2014-12-02 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for package on package devices
US8957512B2 (en) 2012-06-19 2015-02-17 Xilinx, Inc. Oversized interposer
US8869088B1 (en) 2012-06-27 2014-10-21 Xilinx, Inc. Oversized interposer formed from a multi-pattern region mask
US9026872B2 (en) 2012-08-16 2015-05-05 Xilinx, Inc. Flexible sized die for use in multi-die integrated circuit
US9547034B2 (en) 2013-07-03 2017-01-17 Xilinx, Inc. Monolithic integrated circuit die having modular die regions stitched together
US10933489B2 (en) * 2013-07-09 2021-03-02 Raytheon Technologies Corporation Transient liquid phase bonding of surface coatings metal-covered materials
KR102243285B1 (ko) * 2014-07-01 2021-04-23 삼성전자주식회사 반도체 패키지
US9915869B1 (en) 2014-07-01 2018-03-13 Xilinx, Inc. Single mask set used for interposer fabrication of multiple products
JP6620989B2 (ja) * 2015-05-25 2019-12-18 パナソニックＩｐマネジメント株式会社 電子部品パッケージ
KR102324628B1 (ko) * 2015-07-24 2021-11-10 삼성전자주식회사 솔리드 스테이트 드라이브 패키지 및 이를 포함하는 데이터 저장 시스템
JP6631905B2 (ja) * 2015-07-28 2020-01-15 ローム株式会社 マルチチップモジュールおよびその製造方法
KR102497239B1 (ko) * 2015-12-17 2023-02-08 삼성전자주식회사 고속 신호 특성을 갖는 반도체 모듈

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02306657A (ja) * 1989-05-22 1990-12-20 Nec Corp 半導体装置
US5783870A (en) * 1995-03-16 1998-07-21 National Semiconductor Corporation Method for connecting packages of a stacked ball grid array structure
US5994166A (en) * 1997-03-10 1999-11-30 Micron Technology, Inc. Method of constructing stacked packages
JP2964983B2 (ja) 1997-04-02 1999-10-18 日本電気株式会社 三次元メモリモジュール及びそれを用いた半導体装置
JPH11243175A (ja) * 1998-02-25 1999-09-07 Rohm Co Ltd 複合半導体装置
US6274929B1 (en) * 1998-09-01 2001-08-14 Texas Instruments Incorporated Stacked double sided integrated circuit package
JP3668074B2 (ja) * 1999-10-07 2005-07-06 松下電器産業株式会社 半導体装置およびその製造方法
US6607937B1 (en) * 2000-08-23 2003-08-19 Micron Technology, Inc. Stacked microelectronic dies and methods for stacking microelectronic dies
JP3925615B2 (ja) 2001-07-04 2007-06-06 ソニー株式会社 半導体モジュール
JP3813489B2 (ja) * 2001-10-29 2006-08-23 シャープ株式会社 積層型半導体装置
US6906415B2 (en) * 2002-06-27 2005-06-14 Micron Technology, Inc. Semiconductor device assemblies and packages including multiple semiconductor devices and methods

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