JP2004355519A - Ｉｃラベル - Google Patents

Ｉｃラベル Download PDF

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Publication number
JP2004355519A
JP2004355519A JP2003155135A JP2003155135A JP2004355519A JP 2004355519 A JP2004355519 A JP 2004355519A JP 2003155135 A JP2003155135 A JP 2003155135A JP 2003155135 A JP2003155135 A JP 2003155135A JP 2004355519 A JP2004355519 A JP 2004355519A
Authority
JP
Japan
Prior art keywords
chip
label
adherend
inlet
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003155135A
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English (en)
Japanese (ja)
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JP2004355519A5 (enExample
Inventor
Satoshi Ooume
聡 大梅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Oji Paper Co Ltd
Original Assignee
Oji Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oji Paper Co Ltd filed Critical Oji Paper Co Ltd
Priority to JP2003155135A priority Critical patent/JP2004355519A/ja
Publication of JP2004355519A publication Critical patent/JP2004355519A/ja
Publication of JP2004355519A5 publication Critical patent/JP2004355519A5/ja
Pending legal-status Critical Current

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  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003155135A 2003-05-30 2003-05-30 Ｉｃラベル Pending JP2004355519A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003155135A JP2004355519A (ja) 2003-05-30 2003-05-30 Ｉｃラベル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003155135A JP2004355519A (ja) 2003-05-30 2003-05-30 Ｉｃラベル

Publications (2)

Publication Number Publication Date
JP2004355519A true JP2004355519A (ja) 2004-12-16
JP2004355519A5 JP2004355519A5 (enExample) 2005-11-04

Family

ID=34049597

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003155135A Pending JP2004355519A (ja) 2003-05-30 2003-05-30 Ｉｃラベル

Country Status (1)

Country Link
JP (1) JP2004355519A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006343878A (ja) * 2005-06-07 2006-12-21 Dainippon Printing Co Ltd Ｉｃタグ及びｉｃタグの取り付け構造
JP2006343432A (ja) * 2005-06-07 2006-12-21 Dainippon Printing Co Ltd Ｉｃタグ及びｉｃタグの取り付け構造
JP2007065250A (ja) * 2005-08-31 2007-03-15 Brother Ind Ltd 無線タグラベル、タグテープロール、無線タグ回路素子カートリッジ、及びタグラベル作成装置
JP2007233673A (ja) * 2006-03-01 2007-09-13 Toyo Seikan Kaisha Ltd Ｉｃタグ用膜
JP2008139501A (ja) * 2006-11-30 2008-06-19 Dainippon Printing Co Ltd シート状非接触データキャリア
JP2012252448A (ja) * 2011-06-01 2012-12-20 Dainippon Printing Co Ltd Ｉｃタグおよびｉｃタグの製造方法
KR20130059630A (ko) * 2011-11-29 2013-06-07 엘지이노텍 주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
KR101823688B1 (ko) * 2011-09-02 2018-03-14 엘지이노텍 주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
JP2019117509A (ja) * 2017-12-27 2019-07-18 トッパン・フォームズ株式会社 Ｒｆｉｄラベル

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006343878A (ja) * 2005-06-07 2006-12-21 Dainippon Printing Co Ltd Ｉｃタグ及びｉｃタグの取り付け構造
JP2006343432A (ja) * 2005-06-07 2006-12-21 Dainippon Printing Co Ltd Ｉｃタグ及びｉｃタグの取り付け構造
JP2007065250A (ja) * 2005-08-31 2007-03-15 Brother Ind Ltd 無線タグラベル、タグテープロール、無線タグ回路素子カートリッジ、及びタグラベル作成装置
JP2007233673A (ja) * 2006-03-01 2007-09-13 Toyo Seikan Kaisha Ltd Ｉｃタグ用膜
JP2008139501A (ja) * 2006-11-30 2008-06-19 Dainippon Printing Co Ltd シート状非接触データキャリア
JP2012252448A (ja) * 2011-06-01 2012-12-20 Dainippon Printing Co Ltd Ｉｃタグおよびｉｃタグの製造方法
KR101823688B1 (ko) * 2011-09-02 2018-03-14 엘지이노텍 주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
KR20130059630A (ko) * 2011-11-29 2013-06-07 엘지이노텍 주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
KR101875946B1 (ko) * 2011-11-29 2018-08-02 엘지이노텍 주식회사 칩 내장형 인쇄회로기판 및 그 제조 방법
JP2019117509A (ja) * 2017-12-27 2019-07-18 トッパン・フォームズ株式会社 Ｒｆｉｄラベル

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