JP2004355519A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2004355519A5 JP2004355519A5 JP2003155135A JP2003155135A JP2004355519A5 JP 2004355519 A5 JP2004355519 A5 JP 2004355519A5 JP 2003155135 A JP2003155135 A JP 2003155135A JP 2003155135 A JP2003155135 A JP 2003155135A JP 2004355519 A5 JP2004355519 A5 JP 2004355519A5
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- adherend
- inlet
- label according
- adhesive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 7
- 230000001070 adhesive effect Effects 0.000 claims 7
- 239000012790 adhesive layer Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 2
- 230000001464 adherent effect Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000002787 reinforcement Effects 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003155135A JP2004355519A (ja) | 2003-05-30 | 2003-05-30 | Icラベル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003155135A JP2004355519A (ja) | 2003-05-30 | 2003-05-30 | Icラベル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004355519A JP2004355519A (ja) | 2004-12-16 |
| JP2004355519A5 true JP2004355519A5 (enExample) | 2005-11-04 |
Family
ID=34049597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003155135A Pending JP2004355519A (ja) | 2003-05-30 | 2003-05-30 | Icラベル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004355519A (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4742689B2 (ja) * | 2005-06-07 | 2011-08-10 | 大日本印刷株式会社 | Icタグ |
| JP2006343432A (ja) * | 2005-06-07 | 2006-12-21 | Dainippon Printing Co Ltd | Icタグ及びicタグの取り付け構造 |
| JP2007065250A (ja) * | 2005-08-31 | 2007-03-15 | Brother Ind Ltd | 無線タグラベル、タグテープロール、無線タグ回路素子カートリッジ、及びタグラベル作成装置 |
| JP4935113B2 (ja) * | 2006-03-01 | 2012-05-23 | 東洋製罐株式会社 | Icタグ用膜 |
| JP4807242B2 (ja) * | 2006-11-30 | 2011-11-02 | 大日本印刷株式会社 | シート状非接触データキャリア |
| JP5724641B2 (ja) * | 2011-06-01 | 2015-05-27 | 大日本印刷株式会社 | Icタグおよびicタグの製造方法 |
| KR101823688B1 (ko) * | 2011-09-02 | 2018-03-14 | 엘지이노텍 주식회사 | 칩 내장형 인쇄회로기판 및 그 제조 방법 |
| KR101875946B1 (ko) * | 2011-11-29 | 2018-08-02 | 엘지이노텍 주식회사 | 칩 내장형 인쇄회로기판 및 그 제조 방법 |
| JP2019117509A (ja) * | 2017-12-27 | 2019-07-18 | トッパン・フォームズ株式会社 | Rfidラベル |
-
2003
- 2003-05-30 JP JP2003155135A patent/JP2004355519A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200613508A (en) | Wafer-processing tape | |
| DE60141712D1 (de) | Heissversiegelbares laminat | |
| JP2008527470A5 (enExample) | ||
| JP2004355519A5 (enExample) | ||
| EP2277695A3 (en) | Labels and labeling process | |
| EP1757442A3 (en) | Articles comprising nanoparticles | |
| DE50005348D1 (de) | Strukturiertes reaktionssubstrat | |
| WO2008081561A1 (ja) | 孔あきサポートプレート | |
| TW200736361A (en) | Pressure-sensitive adhesive sheet and process for producing electronic part therewith | |
| FR2866983B1 (fr) | Realisation d'une entite en materiau semiconducteur sur substrat | |
| TW200638859A (en) | Structure having a characteristic of conducting or absorbing electromagnetic waves | |
| AU5711001A (en) | Adhesive sheet and adhesion structure | |
| TW200617134A (en) | Pressure-sensitive adhesive tape | |
| WO2009051120A1 (ja) | 半導体素子搭載基板 | |
| TW200510225A (en) | Battery package | |
| TW200635781A (en) | Method for bonding members and composite film, and uses thereof | |
| ATE344516T1 (de) | Verbundmaterial | |
| TWI264127B (en) | Chip package and substrate thereof | |
| WO2003058713A3 (de) | Chipmodul für chipkarten | |
| JP2003101193A5 (enExample) | ||
| CN101383235B (zh) | 防水键盘 | |
| ATE438156T1 (de) | Rfid-etikett | |
| JP2005116857A5 (enExample) | ||
| JP4511159B2 (ja) | 粘着体 | |
| JP2007094621A5 (enExample) |