JP2004346315A5 - - Google Patents
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- Publication number
- JP2004346315A5 JP2004346315A5 JP2004133774A JP2004133774A JP2004346315A5 JP 2004346315 A5 JP2004346315 A5 JP 2004346315A5 JP 2004133774 A JP2004133774 A JP 2004133774A JP 2004133774 A JP2004133774 A JP 2004133774A JP 2004346315 A5 JP2004346315 A5 JP 2004346315A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- molding material
- material according
- curable resin
- unsaturated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000011342 resin composition Substances 0.000 claims 10
- 239000012778 molding material Substances 0.000 claims 9
- 229920005989 resin Polymers 0.000 claims 8
- 239000011347 resin Substances 0.000 claims 8
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 150000002148 esters Chemical class 0.000 claims 2
- 239000000446 fuel Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 claims 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 239000011853 conductive carbon based material Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011259 mixed solution Substances 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- ARJOQCYCJMAIFR-UHFFFAOYSA-N prop-2-enoyl prop-2-enoate Chemical compound C=CC(=O)OC(=O)C=C ARJOQCYCJMAIFR-UHFFFAOYSA-N 0.000 claims 1
- 239000007870 radical polymerization initiator Substances 0.000 claims 1
- 239000012779 reinforcing material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000002562 thickening agent Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004133774A JP4687004B2 (ja) | 2003-04-30 | 2004-04-28 | 硬化性樹脂組成物、成形材料及び燃料電池セパレーター |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003125092 | 2003-04-30 | ||
| JP2003125092 | 2003-04-30 | ||
| JP2004133774A JP4687004B2 (ja) | 2003-04-30 | 2004-04-28 | 硬化性樹脂組成物、成形材料及び燃料電池セパレーター |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004346315A JP2004346315A (ja) | 2004-12-09 |
| JP2004346315A5 true JP2004346315A5 (enrdf_load_stackoverflow) | 2008-09-25 |
| JP4687004B2 JP4687004B2 (ja) | 2011-05-25 |
Family
ID=33543391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004133774A Expired - Fee Related JP4687004B2 (ja) | 2003-04-30 | 2004-04-28 | 硬化性樹脂組成物、成形材料及び燃料電池セパレーター |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4687004B2 (enrdf_load_stackoverflow) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005074060A1 (en) * | 2004-01-22 | 2005-08-11 | Henkel Corporation | Polymerizable compositions for bonding and sealing low surface energy substrates for fuel cells |
| JP4731929B2 (ja) * | 2005-02-02 | 2011-07-27 | ニチアス株式会社 | 導電性エポキシ樹脂組成物及び燃料電池用セパレータ |
| JP5118830B2 (ja) * | 2006-08-07 | 2013-01-16 | 共栄社化学株式会社 | エポキシ基含有硬化性樹脂成分 |
| JP5204459B2 (ja) * | 2007-10-17 | 2013-06-05 | 共栄社化学株式会社 | 硬化性樹脂成分の製造方法 |
| JP5509709B2 (ja) | 2009-07-24 | 2014-06-04 | 日清紡ケミカル株式会社 | 燃料電池セパレータ |
| JP6168241B2 (ja) * | 2015-05-13 | 2017-07-26 | Dic株式会社 | （メタ）アクリレート樹脂及び光学部材 |
| WO2017073142A1 (ja) * | 2015-10-26 | 2017-05-04 | 昭和電工株式会社 | 硬化性樹脂組成物、硬化物、接着剤 |
| JP6721858B2 (ja) * | 2016-02-23 | 2020-07-15 | Dic株式会社 | 不飽和基含有アルカリ現像性樹脂及びソルダーレジスト用樹脂材料 |
| JP2019112548A (ja) * | 2017-12-25 | 2019-07-11 | Dic株式会社 | （メタ）アクリレート樹脂及び光学部材 |
| JP2023074688A (ja) * | 2021-11-18 | 2023-05-30 | Dic株式会社 | 酸基及び重合性不飽和基を有する樹脂の製造方法 |
| KR20240006902A (ko) * | 2022-07-07 | 2024-01-16 | 주식회사 엘지화학 | (메트)아크릴레이트계 수지, 및 이를 포함하는 드라이 필름 솔더 레지스트 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5512043B2 (enrdf_load_stackoverflow) * | 1972-10-28 | 1980-03-29 | ||
| JP3526918B2 (ja) * | 1994-09-22 | 2004-05-17 | マックダーミッド・インコーポレーテッド | 感光性樹脂組成物 |
| JP3543409B2 (ja) * | 1995-03-24 | 2004-07-14 | 大日本インキ化学工業株式会社 | 活性エネルギ−線硬化型エポキシアクリレ−ト樹脂組成物 |
| JPH0987346A (ja) * | 1995-09-19 | 1997-03-31 | Dainippon Ink & Chem Inc | エネルギ−線硬化型エポキシアクリレ−ト樹脂組成物 |
| JPH11140144A (ja) * | 1997-11-04 | 1999-05-25 | Nippon Kayaku Co Ltd | 樹脂組成物及びその硬化物 |
| JP2000169553A (ja) * | 1998-12-09 | 2000-06-20 | Kyoeisha Chem Co Ltd | 高耐熱性樹脂組成物 |
| JP2001151833A (ja) * | 1999-09-13 | 2001-06-05 | Showa Denko Kk | 導電性に優れた硬化性樹脂組成物及びその硬化体 |
| JP4859308B2 (ja) * | 2000-09-13 | 2012-01-25 | ジャパンコンポジット株式会社 | 固体高分子型燃料電池用セパレーターおよびその製造方法 |
-
2004
- 2004-04-28 JP JP2004133774A patent/JP4687004B2/ja not_active Expired - Fee Related
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