JP2004323764A5 - - Google Patents
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- Publication number
- JP2004323764A5 JP2004323764A5 JP2003123326A JP2003123326A JP2004323764A5 JP 2004323764 A5 JP2004323764 A5 JP 2004323764A5 JP 2003123326 A JP2003123326 A JP 2003123326A JP 2003123326 A JP2003123326 A JP 2003123326A JP 2004323764 A5 JP2004323764 A5 JP 2004323764A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon
- weight
- polyorganosiloxane
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 125000003342 alkenyl group Chemical group 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- -1 Platinum group metal compound Chemical class 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 150000003961 organosilicon compounds Chemical class 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 150000001875 compounds Chemical group 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 229930195735 unsaturated hydrocarbon Natural products 0.000 description 2
- LMVLVUPTDRWATB-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-ol Chemical compound CO[Si](C)(OC)CCCO LMVLVUPTDRWATB-UHFFFAOYSA-N 0.000 description 1
- MCDBEBOBROAQSH-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propyl prop-2-enoate Chemical compound CO[Si](C)(OC)CCCOC(=O)C=C MCDBEBOBROAQSH-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 229920005601 base polymer Polymers 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- ZLNAFSPCNATQPQ-UHFFFAOYSA-N ethenyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C=C ZLNAFSPCNATQPQ-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- UMFJXASDGBJDEB-UHFFFAOYSA-N triethoxy(prop-2-enyl)silane Chemical compound CCO[Si](CC=C)(OCC)OCC UMFJXASDGBJDEB-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003123326A JP2004323764A (ja) | 2003-04-28 | 2003-04-28 | 接着性ポリオルガノシロキサン組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003123326A JP2004323764A (ja) | 2003-04-28 | 2003-04-28 | 接着性ポリオルガノシロキサン組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004323764A JP2004323764A (ja) | 2004-11-18 |
| JP2004323764A5 true JP2004323764A5 (enExample) | 2006-06-15 |
Family
ID=33501250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003123326A Pending JP2004323764A (ja) | 2003-04-28 | 2003-04-28 | 接着性ポリオルガノシロキサン組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004323764A (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4522816B2 (ja) * | 2004-10-22 | 2010-08-11 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 難燃性を有する接着性ポリオルガノシロキサン組成物 |
| EP1845133B1 (en) | 2005-01-24 | 2015-10-14 | Momentive Performance Materials Japan LLC | Silicone composition for encapsulating luminescent element and luminescent device |
| JP4804775B2 (ja) * | 2005-03-18 | 2011-11-02 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | シール用硬化性ポリオルガノシロキサン組成物、およびガスケット |
| JP2008007542A (ja) * | 2006-06-27 | 2008-01-17 | Mitsui Chemicals Inc | 室温硬化性ゴム組成物 |
| JP5259947B2 (ja) * | 2006-11-24 | 2013-08-07 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 半導体封止用シリコーン組成物および半導体装置 |
| JP5014774B2 (ja) * | 2006-12-26 | 2012-08-29 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 付加反応硬化型シリコーン組成物および半導体装置 |
| JP2008222828A (ja) * | 2007-03-12 | 2008-09-25 | Momentive Performance Materials Japan Kk | 凸レンズ形成用シリコーンゴム組成物及びそれを用いた光半導体装置 |
| JP4913858B2 (ja) * | 2009-04-14 | 2012-04-11 | 日東電工株式会社 | 熱硬化性シリコーン樹脂用組成物 |
| JP2012012563A (ja) * | 2010-06-02 | 2012-01-19 | Nitto Denko Corp | 熱硬化性シリコーン樹脂用組成物 |
| US9724451B2 (en) * | 2011-03-31 | 2017-08-08 | Sumitomo Bakelite Co., Ltd. | Silicone rubber-based curable composition, method for producing silicone rubber, silicone rubber, molded article, and tube for medical use |
| JP2013064089A (ja) * | 2011-09-20 | 2013-04-11 | Shin-Etsu Chemical Co Ltd | 付加硬化性シリコーンゴム組成物及びその硬化物 |
| JP2013124297A (ja) * | 2011-12-14 | 2013-06-24 | Momentive Performance Materials Inc | 硬化性ポリオルガノシロキサン組成物 |
| CN108602280B (zh) * | 2015-11-06 | 2021-06-29 | 瓦克化学（中国）有限公司 | 基板贴合法及使用该方法制备的产品 |
| US10894883B2 (en) * | 2016-06-15 | 2021-01-19 | Momentive Performance Materials Japan Llc | Curable polyorganosiloxane composition and use thereof |
| CN110546107B (zh) * | 2017-05-01 | 2022-12-09 | Ａｇｃ株式会社 | 含六硼化镧的复合粒子的制造方法和成形品的制造方法 |
| TWI788442B (zh) | 2017-11-16 | 2023-01-01 | 美商陶氏有機矽公司 | 矽氫化可固化聚矽氧組成物 |
| KR102750550B1 (ko) | 2018-11-13 | 2025-01-09 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 접착성 폴리오르가노실록산 조성물 |
| JP7147966B2 (ja) * | 2019-04-01 | 2022-10-05 | 信越化学工業株式会社 | 自己接着性シリコーンゲル組成物及びその硬化物からなるシリコーンゲル |
| CN112980196A (zh) * | 2019-12-18 | 2021-06-18 | 富士高分子工业株式会社 | 导热性组合物、导热性片材及其制造方法 |
| EP4039750B1 (en) * | 2020-07-07 | 2026-04-29 | Fuji Polymer Industries Co., Ltd. | Thermally conductive silicone gel composition and thermally conductive silicone gel sheet and method for producing same |
-
2003
- 2003-04-28 JP JP2003123326A patent/JP2004323764A/ja active Pending
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