JP2004320013A - 厚膜インクにおける特徴の形成 - Google Patents
厚膜インクにおける特徴の形成 Download PDFInfo
- Publication number
- JP2004320013A JP2004320013A JP2004112380A JP2004112380A JP2004320013A JP 2004320013 A JP2004320013 A JP 2004320013A JP 2004112380 A JP2004112380 A JP 2004112380A JP 2004112380 A JP2004112380 A JP 2004112380A JP 2004320013 A JP2004320013 A JP 2004320013A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive material
- substrate
- thick film
- film ink
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H29/28—Switches having at least one liquid contact with level of surface of contact liquid displaced by fluid pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H35/00—Switches operated by change of a physical condition
- H01H35/24—Switches operated by change of fluid pressure, by fluid pressure waves, or by change of fluid flow
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H29/00—Switches having at least one liquid contact
- H01H2029/008—Switches having at least one liquid contact using micromechanics, e.g. micromechanical liquid contact switches or [LIMMS]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacture Of Switches (AREA)
- Printing Methods (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/413,854 US7070908B2 (en) | 2003-04-14 | 2003-04-14 | Feature formation in thick-film inks |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004320013A true JP2004320013A (ja) | 2004-11-11 |
| JP2004320013A5 JP2004320013A5 (https=) | 2007-05-17 |
Family
ID=32176449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004112380A Pending JP2004320013A (ja) | 2003-04-14 | 2004-04-06 | 厚膜インクにおける特徴の形成 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7070908B2 (https=) |
| JP (1) | JP2004320013A (https=) |
| DE (1) | DE10360987A1 (https=) |
| GB (1) | GB2401993B (https=) |
| TW (1) | TW200421374A (https=) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012092590A2 (en) | 2010-12-31 | 2012-07-05 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| CN108262695A (zh) | 2011-06-30 | 2018-07-10 | 圣戈本陶瓷及塑料股份有限公司 | 包括氮化硅磨粒的磨料制品 |
| CN103764349B (zh) | 2011-06-30 | 2017-06-09 | 圣戈本陶瓷及塑料股份有限公司 | 液相烧结碳化硅研磨颗粒 |
| EP2760639B1 (en) | 2011-09-26 | 2021-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming |
| KR102074138B1 (ko) | 2011-12-30 | 2020-02-07 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자 및 이의 형성방법 |
| EP2797716B1 (en) | 2011-12-30 | 2021-02-17 | Saint-Gobain Ceramics & Plastics, Inc. | Composite shaped abrasive particles and method of forming same |
| BR112014016159A8 (pt) | 2011-12-30 | 2017-07-04 | Saint Gobain Ceramics | formação de partículas abrasivas moldadas |
| EP3705177A1 (en) | 2012-01-10 | 2020-09-09 | Saint-Gobain Ceramics & Plastics Inc. | Abrasive particles having complex shapes and methods of forming same |
| WO2013106602A1 (en) | 2012-01-10 | 2013-07-18 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| WO2013149209A1 (en) | 2012-03-30 | 2013-10-03 | Saint-Gobain Abrasives, Inc. | Abrasive products having fibrillated fibers |
| KR102534897B1 (ko) | 2012-05-23 | 2023-05-30 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자들 및 이의 형성방법 |
| US10106714B2 (en) | 2012-06-29 | 2018-10-23 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| KR101736085B1 (ko) | 2012-10-15 | 2017-05-16 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 특정한 형태들을 가진 연마 입자들 및 이러한 입자들을 형성하는 방법들 |
| US9074119B2 (en) | 2012-12-31 | 2015-07-07 | Saint-Gobain Ceramics & Plastics, Inc. | Particulate materials and methods of forming same |
| CN105073343B (zh) | 2013-03-29 | 2017-11-03 | 圣戈班磨料磨具有限公司 | 具有特定形状的磨粒、形成这种粒子的方法及其用途 |
| TW201502263A (zh) | 2013-06-28 | 2015-01-16 | Saint Gobain Ceramics | 包含成形研磨粒子之研磨物品 |
| CN105764653B (zh) | 2013-09-30 | 2020-09-11 | 圣戈本陶瓷及塑料股份有限公司 | 成形磨粒及其形成方法 |
| EP3089851B1 (en) | 2013-12-31 | 2019-02-06 | Saint-Gobain Abrasives, Inc. | Abrasive article including shaped abrasive particles |
| US9771507B2 (en) | 2014-01-31 | 2017-09-26 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particle including dopant material and method of forming same |
| WO2015160855A1 (en) | 2014-04-14 | 2015-10-22 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
| MX394114B (es) | 2014-04-14 | 2025-03-24 | Saint Gobain Ceramics | Articulo abrasivo que incluye particulas abrasivas conformadas. |
| US9902045B2 (en) | 2014-05-30 | 2018-02-27 | Saint-Gobain Abrasives, Inc. | Method of using an abrasive article including shaped abrasive particles |
| US9707529B2 (en) | 2014-12-23 | 2017-07-18 | Saint-Gobain Ceramics & Plastics, Inc. | Composite shaped abrasive particles and method of forming same |
| US9914864B2 (en) | 2014-12-23 | 2018-03-13 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particles and method of forming same |
| US9676981B2 (en) | 2014-12-24 | 2017-06-13 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particle fractions and method of forming same |
| CN116967949A (zh) | 2015-03-31 | 2023-10-31 | 圣戈班磨料磨具有限公司 | 固定磨料制品和其形成方法 |
| TWI634200B (zh) | 2015-03-31 | 2018-09-01 | 聖高拜磨料有限公司 | 固定磨料物品及其形成方法 |
| US10711171B2 (en) | 2015-06-11 | 2020-07-14 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
| CN121249321A (zh) | 2016-05-10 | 2026-01-02 | 圣戈本陶瓷及塑料股份有限公司 | 磨料颗粒及其形成方法 |
| US11718774B2 (en) | 2016-05-10 | 2023-08-08 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles and methods of forming same |
| US11230653B2 (en) | 2016-09-29 | 2022-01-25 | Saint-Gobain Abrasives, Inc. | Fixed abrasive articles and methods of forming same |
| US10563105B2 (en) | 2017-01-31 | 2020-02-18 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
| US10759024B2 (en) | 2017-01-31 | 2020-09-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
| WO2018236989A1 (en) | 2017-06-21 | 2018-12-27 | Saint-Gobain Ceramics & Plastics, Inc. | Particulate materials and methods of forming same |
| WO2021133876A1 (en) | 2019-12-27 | 2021-07-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles and methods of forming same |
| US11926019B2 (en) | 2019-12-27 | 2024-03-12 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles and methods of forming same |
| WO2021133888A1 (en) | 2019-12-27 | 2021-07-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles and methods of forming same |
| KR20240148817A (ko) | 2021-12-30 | 2024-10-11 | 세인트-고바인 아브라시브즈 인크. | 연마 물품 및 이의 형성 방법 |
| US12508688B2 (en) | 2021-12-30 | 2025-12-30 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods of forming same |
| CN118541241A (zh) | 2021-12-30 | 2024-08-23 | 圣戈班磨料磨具有限公司 | 磨料制品及其形成方法 |
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| US6490384B2 (en) | 2001-04-04 | 2002-12-03 | Yoon-Joong Yong | Light modulating system using deformable mirror arrays |
| JP4420581B2 (ja) | 2001-05-09 | 2010-02-24 | 三菱電機株式会社 | 光スイッチおよび光導波路装置 |
| US6729352B2 (en) * | 2001-06-07 | 2004-05-04 | Nanostream, Inc. | Microfluidic synthesis devices and methods |
| US20030035611A1 (en) | 2001-08-15 | 2003-02-20 | Youchun Shi | Piezoelectric-optic switch and method of fabrication |
| US6512322B1 (en) | 2001-10-31 | 2003-01-28 | Agilent Technologies, Inc. | Longitudinal piezoelectric latching relay |
| US6515404B1 (en) | 2002-02-14 | 2003-02-04 | Agilent Technologies, Inc. | Bending piezoelectrically actuated liquid metal switch |
| US6633213B1 (en) | 2002-04-24 | 2003-10-14 | Agilent Technologies, Inc. | Double sided liquid metal micro switch |
| US6559420B1 (en) | 2002-07-10 | 2003-05-06 | Agilent Technologies, Inc. | Micro-switch heater with varying gas sub-channel cross-section |
| US6855898B2 (en) | 2002-12-12 | 2005-02-15 | Agilent Technologies, Inc. | Ceramic channel plate for a switch |
| US6809277B2 (en) | 2003-01-22 | 2004-10-26 | Agilent Technologies, Inc. | Method for registering a deposited material with channel plate channels, and switch produced using same |
| US6747222B1 (en) | 2003-02-04 | 2004-06-08 | Agilent Technologies, Inc. | Feature formation in a nonphotoimagable material and switch incorporating same |
-
2003
- 2003-04-14 US US10/413,854 patent/US7070908B2/en not_active Expired - Fee Related
- 2003-10-24 TW TW092129566A patent/TW200421374A/zh unknown
- 2003-12-23 DE DE10360987A patent/DE10360987A1/de not_active Withdrawn
-
2004
- 2004-03-15 GB GB0405762A patent/GB2401993B/en not_active Expired - Fee Related
- 2004-04-06 JP JP2004112380A patent/JP2004320013A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20040202844A1 (en) | 2004-10-14 |
| DE10360987A1 (de) | 2004-11-25 |
| TW200421374A (en) | 2004-10-16 |
| GB2401993A (en) | 2004-11-24 |
| GB0405762D0 (en) | 2004-04-21 |
| GB2401993B (en) | 2006-07-05 |
| US7070908B2 (en) | 2006-07-04 |
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