JP2004311978A - 分離製品を形成する物体分離法 - Google Patents
分離製品を形成する物体分離法 Download PDFInfo
- Publication number
- JP2004311978A JP2004311978A JP2004084492A JP2004084492A JP2004311978A JP 2004311978 A JP2004311978 A JP 2004311978A JP 2004084492 A JP2004084492 A JP 2004084492A JP 2004084492 A JP2004084492 A JP 2004084492A JP 2004311978 A JP2004311978 A JP 2004311978A
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- Prior art keywords
- material layer
- layer
- laser
- base material
- cuts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 102
- 239000010410 layer Substances 0.000 claims description 107
- 238000000926 separation method Methods 0.000 claims description 35
- 229920000690 Tyvek Polymers 0.000 claims description 12
- 239000004775 Tyvek Substances 0.000 claims description 10
- 230000010365 information processing Effects 0.000 claims description 9
- 229920002799 BoPET Polymers 0.000 claims description 6
- 239000005041 Mylar™ Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 6
- 239000002861 polymer material Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 5
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 229920006267 polyester film Polymers 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000003698 laser cutting Methods 0.000 abstract description 2
- 239000003351 stiffener Substances 0.000 description 9
- 239000000047 product Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000011282 treatment Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B31—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER
- B31D—MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER, NOT PROVIDED FOR IN SUBCLASSES B31B OR B31C
- B31D1/00—Multiple-step processes for making flat articles ; Making flat articles
- B31D1/02—Multiple-step processes for making flat articles ; Making flat articles the articles being labels or tags
- B31D1/026—Cutting or perforating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1064—Partial cutting [e.g., grooving or incising]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Laminated Bodies (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
【解決手段】ベース物質層を提供し、第1物質層と分離物質層を前記ベース物質層上に配置し、その際、該分離物質層を該ベース物質層と該第1物質層との間に挟み、前記第1物質層内にのみ複数の第1カットを提供し、前記分離層と前記第1物質層内にのみ複数のさらに深い第2カットを提供し、前記第1物質層を前記ベース物質層から分離する際に該第1物質層の選択部分のみを分離し、その他の部分を該ベース物質層上に残す、ステップを含んでいること。
【選択図】図5
Description
米国特許第5565120号(ラ・ロッカ)
米国特許第5578229号(バルネコフ他)
米国特許第5667707号(クリンゲル他)
米国特許第5688418号(ヨシヤス他)
米国特許第6313432号B1(ナガタ他)
米国特許第6376798号B1(レムエ他)
米国特許第6476348号B1(グリムズ)
これらのプロセスのさらなる説明は不要であろう。
11 誘電ポリマー物質層
13、15 接着層
17 ベース物質層
19 分離物質層
21 大型シート
22 セクション
30 電子パッケージ
31 補強部材(スティッフナー)
33 半導体チップ
35 ヒートシンク
37、39 ハンダボール
41 回路基板
51 情報処理装置
Claims (20)
- ベース物質から第1物質の選択部分を分離する方法であって、
ベース物質層を提供し、
第1物質層と分離物質層を前記ベース物質層上に配置し、その際、該分離物質層を該ベース物質層と該第1物質層との間に挟み、
前記第1物質層内にのみ複数の第1カットを提供し、
前記分離層と前記第1物質層内にのみ複数のさらに深い第2カットを提供し、
前記第1物質層を前記ベース物質層から分離する際に該第1物質層の選択部分のみを分離し、その他の部分を該ベース物質層上に残す、
ステップを含んでいることを特徴とする方法。 - 複数の第1カットはレーザで提供されることを特徴とする請求項1記載の方法。
- レーザはUVレーザであることを特徴とする請求項2記載の方法。
- 複数の第2カットはレーザで提供されることを特徴とする請求項1記載の方法。
- レーザはUVレーザであることを特徴とする請求項4記載の方法。
- 第1物質層は3層構造であることを特徴とする請求項1記載の方法。
- 第1物質層はポリマー層と、該ポリマー層の上下両側の接着層とで成ることを特徴とする請求項6記載の方法。
- 第1物質層はピララックスであることを特徴とする請求項7記載の方法。
- 分離物質層はポリマー物質で成ることを特徴とする請求項1記載の方法。
- 分離物質層はポリエステルフィルムであることを特徴とする請求項9記載の方法。
- ポリエステルフィルムはマイラーであることを特徴とする請求項10記載の方法。
- ベース物質層はポリマ物質で成ることを特徴とする請求項1記載の方法。
- ポリマー物質は高密度ポリエチレン繊維を含んでいることを特徴とする請求項12記載の方法。
- ポリマー物質はタイベックであることを特徴とする請求項13記載の方法。
- 複数の第1カットは0.05ミリジュールから0.15ミリジュールのレーザパルスエネルギーで、パルススペースは5μmから15μmであるレーザで提供されることを特徴とする請求項1記載の方法。
- 複数の第2カットは0.07ミリジュールから0.20ミリジュールのレーザパルスエネルギーで、パルススペースは2μmから10μmであるレーザで提供されることを特徴とする請求項15記載の方法。
- 第1物質は接着剤を含んでおり、本方法は第1回路基板とコンポーネントとを提供し、該第1物質を使用して該コンポーネントを該第1回路基板に固定するステップをさらに含んでいることを特徴とする請求項1記載の方法。
- 半導体チップをコンポーネントに隣接させて第1回路基板と電気的にカップリングするステップをさらに含んでいることを特徴とする請求項17記載の方法。
- 第1回路基板を第2回路基板と電気的にカップリングするステップをさらに含んでいることを特徴とする請求項18記載の方法。
- 第1回路基板と第2回路基板を情報処理システムの一部に採用するステップをさらに含んでいることを特徴とする請求項19記載の方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/409,066 US6958106B2 (en) | 2003-04-09 | 2003-04-09 | Material separation to form segmented product |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004311978A true JP2004311978A (ja) | 2004-11-04 |
Family
ID=32869187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004084492A Pending JP2004311978A (ja) | 2003-04-09 | 2004-03-23 | 分離製品を形成する物体分離法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US6958106B2 (ja) |
EP (1) | EP1466707A3 (ja) |
JP (1) | JP2004311978A (ja) |
CA (1) | CA2460577C (ja) |
TW (1) | TWI334380B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007116145A (ja) * | 2005-10-20 | 2007-05-10 | Endicott Interconnect Technologies Inc | 複数のはんだ接続部を上面に備える回路基板を製造する方法 |
CN106255350A (zh) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | 埋铜板制作方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200812445A (en) * | 2006-08-18 | 2008-03-01 | Wintek Corp | Connection structure of printed-circuit board in LCD module |
US7964974B2 (en) * | 2008-12-02 | 2011-06-21 | General Electric Company | Electronic chip package with reduced contact pad pitch |
US20120188721A1 (en) * | 2011-01-21 | 2012-07-26 | Nxp B.V. | Non-metal stiffener ring for fcbga |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001042806A (ja) * | 1999-05-24 | 2001-02-16 | General Kk | 一方向可視性印刷用部材 |
JP2001353987A (ja) * | 2000-06-13 | 2001-12-25 | Dainippon Printing Co Ltd | 配送伝票用帳票 |
JP2003001475A (ja) * | 2001-06-21 | 2003-01-08 | Toppan Printing Co Ltd | レーザー加工定盤およびフィルムキャリアの製造方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3867179A (en) * | 1972-10-06 | 1975-02-18 | William H Page | Coated polymeric fibers |
GB1477203A (en) * | 1974-02-11 | 1977-06-22 | Whiley Ltd G | Manufacture of image-bearing cards and other documents |
US3996089A (en) * | 1975-04-30 | 1976-12-07 | United Technologies Corporation | Method for the handling of pre-impregnated composite tapes |
US4391853A (en) * | 1979-12-10 | 1983-07-05 | The Datak Corporation | Methods of making adhesive articles and resulting products |
JPS5988780A (ja) * | 1982-11-08 | 1984-05-22 | アメリカン・バンク・ノ−ト・カムパニ− | 光回折記録体及び光回折パタ−ンを作る方法 |
US4776904A (en) * | 1985-07-19 | 1988-10-11 | Miles Inc. | Multilayer analytical element and method of making, using ultrasonic or laser energy |
US5011570A (en) * | 1988-11-21 | 1991-04-30 | Konica Corporation | ID card, ID booklet, and manufacturing method thereof |
JP2712723B2 (ja) | 1990-03-07 | 1998-02-16 | 松下電器産業株式会社 | レーザ切断方法 |
US5106451A (en) * | 1990-11-15 | 1992-04-21 | International Business Machines Corporation | Heat sink and method of attachment |
US5240755A (en) * | 1991-04-23 | 1993-08-31 | Zimmer Industries, Inc. | Perforated label web and method of producing such web |
IT1250872B (it) | 1991-12-06 | 1995-04-21 | Altec Srl | Metodo per alimentare un gas di assistenza su un pezzo sottoposto a taglio laser ed apparecchiatura di taglio operante secondo tale metodo |
JP3162255B2 (ja) | 1994-02-24 | 2001-04-25 | 三菱電機株式会社 | レーザ加工方法及びその装置 |
DE9407288U1 (de) | 1994-05-02 | 1994-08-04 | Trumpf Gmbh & Co, 71254 Ditzingen | Laserschneidmaschine mit Fokuslageneinstellung |
US5578229A (en) | 1994-10-18 | 1996-11-26 | Michigan State University | Method and apparatus for cutting boards using opposing convergent laser beams |
US5709979A (en) | 1994-10-21 | 1998-01-20 | Sheldahl, Inc. | Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor |
US5922225A (en) | 1996-03-06 | 1999-07-13 | Blake; Ronald J. | Apparatus for reducing vaporized material deposits during laser cutting |
US5726079A (en) | 1996-06-19 | 1998-03-10 | International Business Machines Corporation | Thermally enhanced flip chip package and method of forming |
US5757073A (en) * | 1996-12-13 | 1998-05-26 | International Business Machines Corporation | Heatsink and package structure for wirebond chip rework and replacement |
WO1998052178A1 (en) | 1997-05-13 | 1998-11-19 | Optical Security Group, Inc. | Security label and method of use |
JP4183779B2 (ja) | 1997-06-20 | 2008-11-19 | 日酸Tanaka株式会社 | レーザ切断方法およびレーザ切断装置 |
US6022051A (en) * | 1998-08-31 | 2000-02-08 | Casagrande; Charles L. | Self-laminating integrated card and method |
US6376798B1 (en) | 1999-07-23 | 2002-04-23 | Lillbacka Jetair Oy | Laser cutting system |
US6288900B1 (en) | 1999-12-02 | 2001-09-11 | International Business Machines Corporation | Warpage compensating heat spreader |
US6476348B1 (en) | 2000-03-10 | 2002-11-05 | Diebold, Incorporated | Laser cutting system with a sheet loading device |
US6746051B1 (en) * | 2000-10-10 | 2004-06-08 | Eastman Kodak Company | Two sided image product |
US7357486B2 (en) * | 2001-12-20 | 2008-04-15 | Hewlett-Packard Development Company, L.P. | Method of laser machining a fluid slot |
-
2003
- 2003-04-09 US US10/409,066 patent/US6958106B2/en not_active Expired - Lifetime
-
2004
- 2004-03-10 CA CA2460577A patent/CA2460577C/en not_active Expired - Fee Related
- 2004-03-23 JP JP2004084492A patent/JP2004311978A/ja active Pending
- 2004-03-26 TW TW093108328A patent/TWI334380B/zh not_active IP Right Cessation
- 2004-03-26 EP EP04251813A patent/EP1466707A3/en not_active Withdrawn
-
2005
- 2005-06-13 US US11/150,198 patent/US20050224167A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001042806A (ja) * | 1999-05-24 | 2001-02-16 | General Kk | 一方向可視性印刷用部材 |
JP2001353987A (ja) * | 2000-06-13 | 2001-12-25 | Dainippon Printing Co Ltd | 配送伝票用帳票 |
JP2003001475A (ja) * | 2001-06-21 | 2003-01-08 | Toppan Printing Co Ltd | レーザー加工定盤およびフィルムキャリアの製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007116145A (ja) * | 2005-10-20 | 2007-05-10 | Endicott Interconnect Technologies Inc | 複数のはんだ接続部を上面に備える回路基板を製造する方法 |
CN106255350A (zh) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | 埋铜板制作方法 |
Also Published As
Publication number | Publication date |
---|---|
US20050224167A1 (en) | 2005-10-13 |
CA2460577C (en) | 2012-02-07 |
TWI334380B (en) | 2010-12-11 |
US6958106B2 (en) | 2005-10-25 |
EP1466707A3 (en) | 2005-03-23 |
TW200503881A (en) | 2005-02-01 |
EP1466707A2 (en) | 2004-10-13 |
US20040201136A1 (en) | 2004-10-14 |
CA2460577A1 (en) | 2004-10-09 |
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