JP2004271527A5 - - Google Patents

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Publication number
JP2004271527A5
JP2004271527A5 JP2004065493A JP2004065493A JP2004271527A5 JP 2004271527 A5 JP2004271527 A5 JP 2004271527A5 JP 2004065493 A JP2004065493 A JP 2004065493A JP 2004065493 A JP2004065493 A JP 2004065493A JP 2004271527 A5 JP2004271527 A5 JP 2004271527A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2004065493A
Other versions
JP4146812B2 (ja
JP2004271527A (ja
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Publication date
Priority claimed from US10/384,887 external-priority patent/US6739199B1/en
Application filed filed Critical
Publication of JP2004271527A publication Critical patent/JP2004271527A/ja
Publication of JP2004271527A5 publication Critical patent/JP2004271527A5/ja
Application granted granted Critical
Publication of JP4146812B2 publication Critical patent/JP4146812B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004065493A 2003-03-10 2004-03-09 Ｍｅｍｓ基板およびｍｅｍｓ基板の形成方法 Expired - Fee Related JP4146812B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/384,887 US6739199B1 (en) 2003-03-10 2003-03-10 Substrate and method of forming substrate for MEMS device with strain gage

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008132869A Division JP2008275630A (ja) 2003-03-10 2008-05-21 流体吐出素子

Publications (3)

Publication Number Publication Date
JP2004271527A JP2004271527A (ja) 2004-09-30
JP2004271527A5 true JP2004271527A5 (ja) 2007-08-23
JP4146812B2 JP4146812B2 (ja) 2008-09-10

Family

ID=32312413

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2004065493A Expired - Fee Related JP4146812B2 (ja) 2003-03-10 2004-03-09 Ｍｅｍｓ基板およびｍｅｍｓ基板の形成方法
JP2008132869A Pending JP2008275630A (ja) 2003-03-10 2008-05-21 流体吐出素子

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008132869A Pending JP2008275630A (ja) 2003-03-10 2008-05-21 流体吐出素子

Country Status (5)

Country Link
US (1) US6739199B1 (ja)
EP (1) EP1457766B1 (ja)
JP (2) JP4146812B2 (ja)
KR (1) KR101083903B1 (ja)
TW (1) TWI306831B (ja)

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JP2004358799A (ja) * 2003-06-04 2004-12-24 Canon Inc キャリッジ駆動制御方法
US6988412B1 (en) * 2004-11-30 2006-01-24 Endevco Corporation Piezoresistive strain concentrator
WO2008048212A2 (en) * 2005-07-07 2008-04-24 The Regents Of The University Of California Infrared sensor systems and devices
CN101657747B (zh) * 2006-12-05 2014-12-10 维斯普瑞公司 带有开槽金属的基板及相关方法
JP5026144B2 (ja) * 2007-05-18 2012-09-12 日本電信電話株式会社 記憶素子
KR100917649B1 (ko) * 2007-11-12 2009-09-17 주식회사 이오테크닉스 플렉시블 기판의 평탄화 방법 및 평탄화 장치
WO2010089234A1 (en) * 2009-02-03 2010-08-12 Oce-Technologies B.V. A print head and a method for measuring on the print head
US7938016B2 (en) * 2009-03-20 2011-05-10 Freescale Semiconductor, Inc. Multiple layer strain gauge
JP5632964B2 (ja) * 2010-05-27 2014-11-26 ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． プリントヘッド及び関連する方法及びシステム
GB201117343D0 (en) * 2011-10-07 2011-11-23 Airbus Uk Ltd Method and apparatus for measuring residual stresses in a component
DE102012208492A1 (de) * 2012-05-22 2013-11-28 Continental Teves Ag & Co. Ohg Dehnmessstreifenanordnung
US8857271B2 (en) * 2012-07-24 2014-10-14 The Boeing Company Wraparound strain gage assembly for brake rod
JP6987497B2 (ja) * 2016-01-08 2022-01-05 キヤノン株式会社 液体吐出モジュールおよび液体吐出ヘッド
US11135840B2 (en) 2017-04-24 2021-10-05 Hewlett-Packard Development Company, L.P. Fluid ejection dies including strain gauge sensors
WO2018199888A1 (en) * 2017-04-24 2018-11-01 Hewlett-Packard Development Company, L.P. Fluid ejection dies including strain gauge sensors
WO2018199910A1 (en) * 2017-04-24 2018-11-01 Hewlett-Packard Development Company, L.P. Fluid back pressure sensing with a strain sensor
KR102271425B1 (ko) * 2017-04-24 2021-06-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 스트레인 게이지 센서를 포함하는 유체 분사 다이
CN107329615B (zh) * 2017-06-30 2020-06-16 上海天马微电子有限公司 显示面板及显示装置
WO2019017907A1 (en) 2017-07-18 2019-01-24 Hewlett-Packard Development Company, L.P. CHIPS COMPRISING STRAIN GAUGE SENSORS AND TEMPERATURE SENSORS
CN108731858B (zh) * 2018-06-01 2019-07-30 中国石油大学(华东) 一种mems压力传感器及其制作方法
EP3969287A1 (en) * 2019-05-15 2022-03-23 Hewlett-Packard Development Company, L.P. Integrated circuits including strain gauge sensors
CZ308886B6 (cs) * 2019-10-11 2021-08-04 4Dot Mechatronic Systems S.R.O. Snímač přetvoření a sestava pro měření přetvoření obsahující tento snímač
US11630018B2 (en) * 2021-03-18 2023-04-18 Becs Technology, Inc. Calibrated load cell
EP4155488A1 (en) * 2021-09-23 2023-03-29 U-Shin Italia S.p.A. Detection device and detection system for activating at least on function of an apparatus, and apparatus comprising the detection system

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US4373399A (en) 1981-02-05 1983-02-15 Beloglazov Alexei V Semiconductor strain gauge transducer
US4462018A (en) 1982-11-05 1984-07-24 Gulton Industries, Inc. Semiconductor strain gauge with integral compensation resistors
JPS59217375A (ja) 1983-05-26 1984-12-07 Toyota Central Res & Dev Lab Inc 半導体機械−電気変換装置
US4658233A (en) 1984-03-16 1987-04-14 Fuji Electric Corporate Research & Development Ltd. Strain gauge
US4737473A (en) 1985-03-26 1988-04-12 Endevco Corporation Piezoresistive transducer
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US5408253A (en) 1992-08-03 1995-04-18 Eastman Kodak Company Integrated galvanometer scanning device
US5275055A (en) 1992-08-31 1994-01-04 Honeywell Inc. Resonant gauge with microbeam driven in constant electric field
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JPH09232595A (ja) 1996-02-26 1997-09-05 Denso Corp 圧力検出装置
FR2746919B1 (fr) 1996-03-28 1998-04-24 Commissariat Energie Atomique Capteur a jauge de contrainte utilisant l'effet piezoresistif et son procede de fabrication
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JP2002131161A (ja) * 2000-10-27 2002-05-09 Denso Corp 半導体圧力センサ
US6398329B1 (en) * 2000-11-13 2002-06-04 Hewlett-Packard Company Thermal inkjet pen having a backpressure sensor
WO2002101347A1 (en) 2001-06-08 2002-12-19 Radi Medical Systems Ab Miniaturized pressure sensor

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