JP2004260179A - 高電圧デュアルゲート素子の形成方法 - Google Patents
高電圧デュアルゲート素子の形成方法 Download PDFInfo
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- JP2004260179A JP2004260179A JP2004047298A JP2004047298A JP2004260179A JP 2004260179 A JP2004260179 A JP 2004260179A JP 2004047298 A JP2004047298 A JP 2004047298A JP 2004047298 A JP2004047298 A JP 2004047298A JP 2004260179 A JP2004260179 A JP 2004260179A
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- 238000000034 method Methods 0.000 title claims abstract description 49
- 230000009977 dual effect Effects 0.000 title claims abstract description 36
- 150000004767 nitrides Chemical class 0.000 claims abstract description 32
- 238000002955 isolation Methods 0.000 claims abstract description 18
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 4
- 238000000151 deposition Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 230000015556 catabolic process Effects 0.000 description 6
- 238000005468 ion implantation Methods 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823462—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76224—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using trench refilling with dielectric materials
- H01L21/76229—Concurrent filling of a plurality of trenches having a different trench shape or dimension, e.g. rectangular and V-shaped trenches, wide and narrow trenches, shallow and deep trenches
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/823493—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type with a particular manufacturing method of the wells or tubs, e.g. twin tubs, high energy well implants, buried implanted layers for lateral isolation [BILLI]
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Abstract
【解決手段】低電圧素子形成領域及び高電圧素子形成領域を有する半導体基板の高電圧素子形成領域に高電圧N型ウェル領域24及び高電圧P型ウェル領域25を形成する。次に、高電圧N型ウェル領域24及び高電圧P型ウェル領域25内に高電圧NMOSトランジスターのソース/ドレーン領域27及び高電圧PMOSトランジスターのソース/ドレーン領域26を形成する。さらに、素子隔離領域にSTI工程による素子分離層31を形成して全面にバッファー用ナイトライド32を形成する。バッファー用ナイトライド32上に高電圧用ゲート酸化膜33を形成して高電圧素子形成領域だけを残し、低電圧形成領域に低電圧P型ウェル領域35、低電圧N型ウェル領域34を形成して表面に低電圧用ゲート酸化膜36を形成する。
【選択図】図2p
Description
Claims (3)
- 低電圧素子形成領域及び高電圧素子形成領域を有する半導体基板の高電圧素子形成領域に高電圧N型及びP型ウェル領域を形成する段階と、
前記高電圧N型及びP型ウェル領域内に高電圧NMOSトランジスター及び高電圧PMOSトランジスターのソース/ドレーン領域を形成する段階と、
素子隔離領域にSTI工程による素子分離層を形成して全面にバッファー用ナイトライド膜を形成する段階と、
前記バッファー用ナイトライド膜上に高電圧用ゲート酸化膜を形成して高電圧素子形成領域だけを残す段階と、
低電圧形成領域に低電圧P型、N型ウェル領域を形成して表面に低電圧用ゲート酸化膜を形成する段階と、
を含むことを特徴とする高電圧デュアルゲート素子の形成方法。 - 請求項1に記載の高電圧デュアルゲート素子の形成方法において、
前記高電圧用ゲート酸化膜をパターニングする段階においてバッファー用ナイトライド膜により素子分離層がブロッキングされることを特徴とする高電圧デュアルゲート素子の形成方法。 - 請求項1に記載の高電圧デュアルゲート素子の形成方法において、
前記素子分離層はHDP酸化膜を蒸着した後にCMP工程で平坦化して形成することを特徴とする高電圧デュアルゲート素子の形成方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2003-0012403A KR100460272B1 (ko) | 2003-02-27 | 2003-02-27 | 고전압 듀얼 게이트 소자의 형성 방법 |
KR2003-012403 | 2003-02-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004260179A true JP2004260179A (ja) | 2004-09-16 |
JP4738750B2 JP4738750B2 (ja) | 2011-08-03 |
Family
ID=32906561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004047298A Expired - Lifetime JP4738750B2 (ja) | 2003-02-27 | 2004-02-24 | 高電圧デュアルゲート素子の形成方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6927114B2 (ja) |
JP (1) | JP4738750B2 (ja) |
KR (1) | KR100460272B1 (ja) |
CN (1) | CN1525552A (ja) |
TW (1) | TWI340408B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7205201B2 (en) * | 2004-08-09 | 2007-04-17 | System General Corp. | CMOS compatible process with different-voltage devices |
CN100416780C (zh) * | 2005-06-03 | 2008-09-03 | 联华电子股份有限公司 | 高压金属氧化物半导体晶体管元件及其制造方法 |
CN100428443C (zh) * | 2005-08-05 | 2008-10-22 | 联华电子股份有限公司 | 一种降低晶片电荷伤害的方法 |
JP2007234861A (ja) * | 2006-03-01 | 2007-09-13 | Renesas Technology Corp | 半導体装置の製造方法 |
KR100760924B1 (ko) * | 2006-09-13 | 2007-09-21 | 동부일렉트로닉스 주식회사 | 반도체 소자 형성방법 |
KR100847837B1 (ko) * | 2006-12-29 | 2008-07-23 | 동부일렉트로닉스 주식회사 | 디모스 소자 및 그 제조 방법 |
US7842577B2 (en) * | 2008-05-27 | 2010-11-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Two-step STI formation process |
CN102110655B (zh) * | 2009-12-24 | 2013-09-11 | 上海华虹Nec电子有限公司 | Eeprom器件的制作方法 |
US8502316B2 (en) * | 2010-02-11 | 2013-08-06 | Taiwan Semiconductor Manufacturing Company, Ltd. | Self-aligned two-step STI formation through dummy poly removal |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183409A (ja) * | 1993-12-24 | 1995-07-21 | Seiko Epson Corp | 半導体装置とその製造方法 |
JP2002170888A (ja) * | 2000-11-30 | 2002-06-14 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
JP2003031679A (ja) * | 2001-07-13 | 2003-01-31 | Umc Japan | 半導体装置の製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
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US4978628A (en) * | 1986-11-19 | 1990-12-18 | Teledyne Industries, Inc. | Drail-well/extension high voltage MOS transistor structure and method of fabrication |
US6249030B1 (en) * | 1992-12-07 | 2001-06-19 | Hyundai Electronics Industries Co., Ltd. | BI-CMOS integrated circuit |
US5369052A (en) * | 1993-12-06 | 1994-11-29 | Motorola, Inc. | Method of forming dual field oxide isolation |
US5861347A (en) * | 1997-07-03 | 1999-01-19 | Motorola Inc. | Method for forming a high voltage gate dielectric for use in integrated circuit |
EP0986100B1 (en) * | 1998-09-11 | 2010-05-19 | STMicroelectronics Srl | Electronic device comprising EEPROM memory cells, HV transistors, and LV transistors with silicided junctions, as well as manufacturing method thereof |
KR100281908B1 (ko) * | 1998-11-20 | 2001-02-15 | 김덕중 | 반도체소자 및 그 제조방법 |
US6399448B1 (en) * | 1999-11-19 | 2002-06-04 | Chartered Semiconductor Manufacturing Ltd. | Method for forming dual gate oxide |
KR100364599B1 (ko) * | 2001-02-13 | 2002-12-16 | 삼성전자 주식회사 | 반도체 소자 제조방법 |
KR100387531B1 (ko) * | 2001-07-30 | 2003-06-18 | 삼성전자주식회사 | 반도체소자 제조방법 |
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2003
- 2003-02-27 KR KR10-2003-0012403A patent/KR100460272B1/ko active IP Right Grant
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2004
- 2004-02-24 US US10/785,493 patent/US6927114B2/en not_active Expired - Lifetime
- 2004-02-24 JP JP2004047298A patent/JP4738750B2/ja not_active Expired - Lifetime
- 2004-02-27 CN CNA2004100072148A patent/CN1525552A/zh active Pending
- 2004-02-27 TW TW093105171A patent/TWI340408B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07183409A (ja) * | 1993-12-24 | 1995-07-21 | Seiko Epson Corp | 半導体装置とその製造方法 |
JP2002170888A (ja) * | 2000-11-30 | 2002-06-14 | Hitachi Ltd | 半導体集積回路装置およびその製造方法 |
JP2003031679A (ja) * | 2001-07-13 | 2003-01-31 | Umc Japan | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US6927114B2 (en) | 2005-08-09 |
KR100460272B1 (ko) | 2004-12-08 |
CN1525552A (zh) | 2004-09-01 |
JP4738750B2 (ja) | 2011-08-03 |
TW200423236A (en) | 2004-11-01 |
US20040171197A1 (en) | 2004-09-02 |
KR20040077026A (ko) | 2004-09-04 |
TWI340408B (en) | 2011-04-11 |
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