JP2004158875A5 - - Google Patents
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- Publication number
- JP2004158875A5 JP2004158875A5 JP2004012736A JP2004012736A JP2004158875A5 JP 2004158875 A5 JP2004158875 A5 JP 2004158875A5 JP 2004012736 A JP2004012736 A JP 2004012736A JP 2004012736 A JP2004012736 A JP 2004012736A JP 2004158875 A5 JP2004158875 A5 JP 2004158875A5
- Authority
- JP
- Japan
- Prior art keywords
- support
- semiconductor chip
- sides
- inner lead
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 20
- 238000007789 sealing Methods 0.000 claims 10
- 239000012790 adhesive layer Substances 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004012736A JP4015118B2 (ja) | 1996-03-18 | 2004-01-21 | 半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6042196 | 1996-03-18 | ||
| JP2004012736A JP4015118B2 (ja) | 1996-03-18 | 2004-01-21 | 半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9008964A Division JPH09312375A (ja) | 1996-03-18 | 1997-01-21 | リードフレーム、半導体装置及び半導体装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004158875A JP2004158875A (ja) | 2004-06-03 |
| JP2004158875A5 true JP2004158875A5 (enExample) | 2005-09-15 |
| JP4015118B2 JP4015118B2 (ja) | 2007-11-28 |
Family
ID=32827161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004012736A Expired - Fee Related JP4015118B2 (ja) | 1996-03-18 | 2004-01-21 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4015118B2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6100648B2 (ja) | 2013-08-28 | 2017-03-22 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
-
2004
- 2004-01-21 JP JP2004012736A patent/JP4015118B2/ja not_active Expired - Fee Related
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