JP2004111937A5 - - Google Patents

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Publication number
JP2004111937A5
JP2004111937A5 JP2003298801A JP2003298801A JP2004111937A5 JP 2004111937 A5 JP2004111937 A5 JP 2004111937A5 JP 2003298801 A JP2003298801 A JP 2003298801A JP 2003298801 A JP2003298801 A JP 2003298801A JP 2004111937 A5 JP2004111937 A5 JP 2004111937A5
Authority
JP
Japan
Prior art keywords
light emitting
concave portion
light
mold member
ceramic base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2003298801A
Other languages
English (en)
Japanese (ja)
Other versions
JP4407204B2 (ja
JP2004111937A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003298801A priority Critical patent/JP4407204B2/ja
Priority claimed from JP2003298801A external-priority patent/JP4407204B2/ja
Publication of JP2004111937A publication Critical patent/JP2004111937A/ja
Publication of JP2004111937A5 publication Critical patent/JP2004111937A5/ja
Application granted granted Critical
Publication of JP4407204B2 publication Critical patent/JP4407204B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2003298801A 2002-08-30 2003-08-22 発光装置 Expired - Lifetime JP4407204B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003298801A JP4407204B2 (ja) 2002-08-30 2003-08-22 発光装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002253536 2002-08-30
JP2003298801A JP4407204B2 (ja) 2002-08-30 2003-08-22 発光装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009104604A Division JP5077282B2 (ja) 2002-08-30 2009-04-23 発光素子搭載用パッケージおよび発光装置

Publications (3)

Publication Number Publication Date
JP2004111937A JP2004111937A (ja) 2004-04-08
JP2004111937A5 true JP2004111937A5 (ko) 2006-05-11
JP4407204B2 JP4407204B2 (ja) 2010-02-03

Family

ID=32301344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003298801A Expired - Lifetime JP4407204B2 (ja) 2002-08-30 2003-08-22 発光装置

Country Status (1)

Country Link
JP (1) JP4407204B2 (ko)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4670251B2 (ja) * 2004-04-13 2011-04-13 日亜化学工業株式会社 発光装置
JP2005310911A (ja) * 2004-04-19 2005-11-04 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
WO2005106973A1 (ja) 2004-04-27 2005-11-10 Kyocera Corporation 発光素子用配線基板
KR100900372B1 (ko) 2004-04-27 2009-06-02 파나소닉 주식회사 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을이용한 발광 장치
JP4525193B2 (ja) * 2004-06-15 2010-08-18 パナソニック株式会社 光半導体素子用パッケージとそれを用いた発光装置
EP1785464A4 (en) 2004-06-30 2009-10-21 Mitsubishi Chem Corp LUMINOPHORE, LIGHT EMITTING DEVICE USING THE SAME, IMAGE DISPLAY, AND LIGHTING DEVICE
JP5320655B2 (ja) * 2004-06-30 2013-10-23 三菱化学株式会社 発光装置、照明、表示装置用バックライトユニット及び表示装置
US8324641B2 (en) 2007-06-29 2012-12-04 Ledengin, Inc. Matrix material including an embedded dispersion of beads for a light-emitting device
US8816369B2 (en) 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
US7473933B2 (en) * 2004-10-29 2009-01-06 Ledengin, Inc. (Cayman) High power LED package with universal bonding pads and interconnect arrangement
US9929326B2 (en) 2004-10-29 2018-03-27 Ledengin, Inc. LED package having mushroom-shaped lens with volume diffuser
JP4802533B2 (ja) * 2004-11-12 2011-10-26 日亜化学工業株式会社 半導体装置
US7683393B2 (en) 2004-12-07 2010-03-23 Ngk Spark Plug Co., Ltd. Wiring substrate for mounting light emitting element
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
JP2006222358A (ja) * 2005-02-14 2006-08-24 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP4638761B2 (ja) * 2005-04-14 2011-02-23 日本特殊陶業株式会社 配線基板
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
JP2006351611A (ja) * 2005-06-13 2006-12-28 Rohm Co Ltd 発光素子搭載用基板及びそれを用いた光半導体装置
JP4938255B2 (ja) * 2005-06-29 2012-05-23 京セラ株式会社 発光素子収納用パッケージ、光源および発光装置
DE102005041153A1 (de) * 2005-08-30 2007-03-01 Leuchtstoffwerk Breitungen Gmbh Nitridocarbid-Leuchtstoffe
JP2007110060A (ja) * 2005-09-15 2007-04-26 Nichia Chem Ind Ltd 発光装置
JP4715422B2 (ja) * 2005-09-27 2011-07-06 日亜化学工業株式会社 発光装置
JP2007242738A (ja) * 2006-03-06 2007-09-20 Sumitomo Metal Electronics Devices Inc 発光素子収納用パッケージ
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
EP1848042A1 (en) * 2006-04-21 2007-10-24 LEXEDIS Lighting GmbH LED package with submount
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
JP4611937B2 (ja) * 2006-06-07 2011-01-12 日亜化学工業株式会社 表面実装型発光装置及びその製造方法
JP2008021670A (ja) 2006-07-10 2008-01-31 Nec Lighting Ltd 発光装置
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP5380774B2 (ja) 2006-12-28 2014-01-08 日亜化学工業株式会社 表面実装型側面発光装置及びその製造方法
JP4856558B2 (ja) * 2007-01-22 2012-01-18 日本特殊陶業株式会社 配線基板
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP5196107B2 (ja) * 2007-03-29 2013-05-15 日亜化学工業株式会社 発光装置
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
JP2009267274A (ja) * 2008-04-30 2009-11-12 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
KR100992778B1 (ko) 2008-05-23 2010-11-05 엘지이노텍 주식회사 발광소자 패키지 및 그 제조방법
US8075165B2 (en) 2008-10-14 2011-12-13 Ledengin, Inc. Total internal reflection lens and mechanical retention and locating device
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8507300B2 (en) 2008-12-24 2013-08-13 Ledengin, Inc. Light-emitting diode with light-conversion layer
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
JP5640632B2 (ja) 2010-03-12 2014-12-17 旭硝子株式会社 発光装置
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
JP5809440B2 (ja) * 2011-05-10 2015-11-10 ローム株式会社 Ｌｅｄモジュール
JP5734090B2 (ja) * 2011-05-23 2015-06-10 日本カーバイド工業株式会社 発光素子搭載用基板及び発光装置
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9897284B2 (en) 2012-03-28 2018-02-20 Ledengin, Inc. LED-based MR16 replacement lamp
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
US9865779B2 (en) 2015-09-30 2018-01-09 Nichia Corporation Methods of manufacturing the package and light-emitting device

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