JP2004076022A5 - - Google Patents

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Publication number
JP2004076022A5
JP2004076022A5 JP2002213209A JP2002213209A JP2004076022A5 JP 2004076022 A5 JP2004076022 A5 JP 2004076022A5 JP 2002213209 A JP2002213209 A JP 2002213209A JP 2002213209 A JP2002213209 A JP 2002213209A JP 2004076022 A5 JP2004076022 A5 JP 2004076022A5
Authority
JP
Japan
Prior art keywords
substrate
holding member
movable holding
fixed
fixed holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002213209A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004076022A (ja
JP4124327B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2002213209A external-priority patent/JP4124327B2/ja
Priority to JP2002213209A priority Critical patent/JP4124327B2/ja
Priority to KR1020047000836A priority patent/KR100980051B1/ko
Priority to CNB038008459A priority patent/CN100370578C/zh
Priority to US10/482,476 priority patent/US7601248B2/en
Priority to TW092116755A priority patent/TWI316097B/zh
Priority to EP03760917A priority patent/EP1516357A2/fr
Priority to PCT/JP2003/007855 priority patent/WO2004001813A2/fr
Priority to CN2008100040249A priority patent/CN101281858B/zh
Publication of JP2004076022A publication Critical patent/JP2004076022A/ja
Publication of JP2004076022A5 publication Critical patent/JP2004076022A5/ja
Priority to JP2008075465A priority patent/JP4669019B2/ja
Application granted granted Critical
Publication of JP4124327B2 publication Critical patent/JP4124327B2/ja
Priority to US12/585,141 priority patent/US7901551B2/en
Priority to US13/017,294 priority patent/US8337680B2/en
Priority to US13/684,902 priority patent/US8936705B2/en
Priority to US14/565,841 priority patent/US9388505B2/en
Priority to US15/180,448 priority patent/US9506162B2/en
Priority to US15/180,457 priority patent/US9624596B2/en
Priority to US15/180,477 priority patent/US9593430B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2002213209A 2002-06-21 2002-07-22 基板ホルダ及びめっき装置 Expired - Lifetime JP4124327B2 (ja)

Priority Applications (16)

Application Number Priority Date Filing Date Title
JP2002213209A JP4124327B2 (ja) 2002-06-21 2002-07-22 基板ホルダ及びめっき装置
KR1020047000836A KR100980051B1 (ko) 2002-06-21 2003-06-20 기판홀더 및 도금장치
CNB038008459A CN100370578C (zh) 2002-06-21 2003-06-20 基片保持装置和电镀设备
US10/482,476 US7601248B2 (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
TW092116755A TWI316097B (en) 2002-06-21 2003-06-20 Substrate holder and plating apparatus
EP03760917A EP1516357A2 (fr) 2002-06-21 2003-06-20 Dispositif de retenue de substrat et appareil de placage
PCT/JP2003/007855 WO2004001813A2 (fr) 2002-06-21 2003-06-20 Dispositif de retenue de substrat et appareil de placage
CN2008100040249A CN101281858B (zh) 2002-06-21 2003-06-20 基片保持装置和电镀设备
JP2008075465A JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置
US12/585,141 US7901551B2 (en) 2002-06-21 2009-09-04 Substrate holder and plating apparatus
US13/017,294 US8337680B2 (en) 2002-06-21 2011-01-31 Substrate holder and plating apparatus
US13/684,902 US8936705B2 (en) 2002-06-21 2012-11-26 Electrochemical deposition apparatus
US14/565,841 US9388505B2 (en) 2002-06-21 2014-12-10 Electrochemical deposition method
US15/180,477 US9593430B2 (en) 2002-07-22 2016-06-13 Electrochemical deposition method
US15/180,457 US9624596B2 (en) 2002-07-22 2016-06-13 Electrochemical deposition method
US15/180,448 US9506162B2 (en) 2002-06-21 2016-06-13 Electrochemical deposition method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002182236 2002-06-21
JP2002213209A JP4124327B2 (ja) 2002-06-21 2002-07-22 基板ホルダ及びめっき装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008075465A Division JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置

Publications (3)

Publication Number Publication Date
JP2004076022A JP2004076022A (ja) 2004-03-11
JP2004076022A5 true JP2004076022A5 (fr) 2007-11-08
JP4124327B2 JP4124327B2 (ja) 2008-07-23

Family

ID=32032640

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2002213209A Expired - Lifetime JP4124327B2 (ja) 2002-06-21 2002-07-22 基板ホルダ及びめっき装置
JP2008075465A Expired - Lifetime JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2008075465A Expired - Lifetime JP4669019B2 (ja) 2002-06-21 2008-03-24 基板ホルダ及び電解めっき装置

Country Status (1)

Country Link
JP (2) JP4124327B2 (fr)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0741191U (ja) * 1993-12-21 1995-07-21 株式会社イナックス フランジ付き防振配管具
JP5766048B2 (ja) * 2010-08-19 2015-08-19 株式会社荏原製作所 基板ホルダ及びめっき装置
US9728435B2 (en) 2010-10-21 2017-08-08 Ebara Corporation Plating apparatus and plating method
JP5750327B2 (ja) * 2010-10-21 2015-07-22 株式会社荏原製作所 めっき装置、めっき処理方法及びめっき装置用基板ホルダの姿勢変換方法
JP5908266B2 (ja) * 2011-11-30 2016-04-26 株式会社Ｓｃｒｅｅｎホールディングス 陽極化成装置及びそれを備えた陽極化成システム並びに半導体ウエハ
JP5643239B2 (ja) 2012-01-30 2014-12-17 株式会社荏原製作所 基板ホルダ及びめっき装置
JP5782398B2 (ja) 2012-03-27 2015-09-24 株式会社荏原製作所 めっき方法及びめっき装置
JP6077886B2 (ja) 2013-03-04 2017-02-08 株式会社荏原製作所 めっき装置
JP6508935B2 (ja) * 2014-02-28 2019-05-08 株式会社荏原製作所 基板ホルダ、めっき装置及びめっき方法
JP2016000851A (ja) * 2014-06-12 2016-01-07 株式会社村田製作所 めっき用治具
JP6455778B2 (ja) * 2014-12-04 2019-01-23 株式会社オジックテクノロジーズ 治具及び治具生産方法
WO2017150657A1 (fr) * 2016-03-04 2017-09-08 株式会社荏原製作所 Appareil de placage et procédé de placage
JP6747859B2 (ja) * 2016-05-09 2020-08-26 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
US10283396B2 (en) * 2016-06-27 2019-05-07 Asm Nexx, Inc. Workpiece holder for a wet processing system
JP6713863B2 (ja) * 2016-07-13 2020-06-24 株式会社荏原製作所 基板ホルダ及びこれを用いためっき装置
JP6979900B2 (ja) 2018-02-13 2021-12-15 株式会社荏原製作所 基板保持部材、基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体
KR102373893B1 (ko) * 2018-03-13 2022-03-11 가부시키가이샤 야마모토메키시켄키 도금 장치 및 도금 시스템
JP7132136B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132135B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132134B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7264780B2 (ja) * 2019-09-10 2023-04-25 株式会社荏原製作所 基板ホルダ及びそれを備えた基板めっき装置、並びに電気接点
JP7256728B2 (ja) 2019-10-04 2023-04-12 株式会社荏原製作所 基板ホルダ及び基板処理装置
JP7421302B2 (ja) * 2019-10-07 2024-01-24 上村工業株式会社 保持治具
CN116419990A (zh) * 2021-11-09 2023-07-11 株式会社荏原制作所 镀覆装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2617848B2 (ja) * 1992-02-07 1997-06-04 株式会社荏原製作所 半導体ウエハの鍍金治具
JP2000239898A (ja) * 1999-02-22 2000-09-05 Ebara Corp めっき装置
KR100586478B1 (ko) * 1999-05-18 2006-06-07 가부시키가이샤 에바라 세이사꾸쇼 반도체웨이퍼의 도금지그 및 반도체웨이퍼의 도금장치

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