JP2004068151A - 基板のメッキ方法及びメッキ装置 - Google Patents

基板のメッキ方法及びメッキ装置 Download PDF

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Publication number
JP2004068151A
JP2004068151A JP2003276970A JP2003276970A JP2004068151A JP 2004068151 A JP2004068151 A JP 2004068151A JP 2003276970 A JP2003276970 A JP 2003276970A JP 2003276970 A JP2003276970 A JP 2003276970A JP 2004068151 A JP2004068151 A JP 2004068151A
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JP
Japan
Prior art keywords
substrate
plating
plating solution
plated
film
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Pending
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JP2003276970A
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English (en)
Japanese (ja)
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JP2004068151A5 (enExample
Inventor
Hideji Hirao
秀司 平尾
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2003276970A priority Critical patent/JP2004068151A/ja
Publication of JP2004068151A publication Critical patent/JP2004068151A/ja
Publication of JP2004068151A5 publication Critical patent/JP2004068151A5/ja
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2003276970A 2002-07-25 2003-07-18 基板のメッキ方法及びメッキ装置 Pending JP2004068151A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003276970A JP2004068151A (ja) 2002-07-25 2003-07-18 基板のメッキ方法及びメッキ装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002216344 2002-07-25
JP2003276970A JP2004068151A (ja) 2002-07-25 2003-07-18 基板のメッキ方法及びメッキ装置

Publications (2)

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JP2004068151A true JP2004068151A (ja) 2004-03-04
JP2004068151A5 JP2004068151A5 (enExample) 2005-05-26

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JP2003276970A Pending JP2004068151A (ja) 2002-07-25 2003-07-18 基板のメッキ方法及びメッキ装置

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012253258A (ja) * 2011-06-06 2012-12-20 Fujitsu Semiconductor Ltd 半導体装置の製造方法
WO2021108466A1 (en) * 2019-11-27 2021-06-03 Lam Research Corporation Edge removal for through-resist plating
CN114540929A (zh) * 2020-11-26 2022-05-27 长鑫存储技术有限公司 电镀方法以及电镀装置
CN115244228A (zh) * 2021-02-25 2022-10-25 株式会社荏原制作所 镀覆装置以及镀覆装置的气泡除去方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279797A (ja) * 1998-03-27 1999-10-12 Dainippon Screen Mfg Co Ltd 基板メッキ装置
JP2000087296A (ja) * 1998-09-17 2000-03-28 Dainippon Screen Mfg Co Ltd 基板メッキ装置
WO2000061498A2 (en) * 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
JP2001024307A (ja) * 1999-07-08 2001-01-26 Ebara Corp めっき装置
JP2001049495A (ja) * 1999-08-12 2001-02-20 Ebara Corp めっき装置及びめっき方法
JP2001247996A (ja) * 2000-03-06 2001-09-14 Ebara Corp めっき装置
JP2001316890A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理方法及びメッキ処理装置
JP2001316869A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 電解メッキ方法
JP2001323398A (ja) * 2000-03-09 2001-11-22 Ebara Corp 基板のめっき装置およびめっき方法
JP2002129385A (ja) * 2000-10-25 2002-05-09 Applied Materials Inc めっき方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11279797A (ja) * 1998-03-27 1999-10-12 Dainippon Screen Mfg Co Ltd 基板メッキ装置
JP2000087296A (ja) * 1998-09-17 2000-03-28 Dainippon Screen Mfg Co Ltd 基板メッキ装置
WO2000061498A2 (en) * 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
JP2001024307A (ja) * 1999-07-08 2001-01-26 Ebara Corp めっき装置
JP2001049495A (ja) * 1999-08-12 2001-02-20 Ebara Corp めっき装置及びめっき方法
JP2001247996A (ja) * 2000-03-06 2001-09-14 Ebara Corp めっき装置
JP2001323398A (ja) * 2000-03-09 2001-11-22 Ebara Corp 基板のめっき装置およびめっき方法
JP2001316890A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd メッキ処理方法及びメッキ処理装置
JP2001316869A (ja) * 2000-05-08 2001-11-16 Tokyo Electron Ltd 電解メッキ方法
JP2002129385A (ja) * 2000-10-25 2002-05-09 Applied Materials Inc めっき方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012253258A (ja) * 2011-06-06 2012-12-20 Fujitsu Semiconductor Ltd 半導体装置の製造方法
WO2021108466A1 (en) * 2019-11-27 2021-06-03 Lam Research Corporation Edge removal for through-resist plating
US12331421B2 (en) 2019-11-27 2025-06-17 Lam Research Corporation Edge removal for through-resist plating in an electro-plating cup assembly
CN114540929A (zh) * 2020-11-26 2022-05-27 长鑫存储技术有限公司 电镀方法以及电镀装置
CN114540929B (zh) * 2020-11-26 2023-09-08 长鑫存储技术有限公司 电镀方法以及电镀装置
CN115244228A (zh) * 2021-02-25 2022-10-25 株式会社荏原制作所 镀覆装置以及镀覆装置的气泡除去方法
CN115244228B (zh) * 2021-02-25 2023-08-25 株式会社荏原制作所 镀覆装置以及镀覆装置的气泡除去方法

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