JP2004066327A - レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法 - Google Patents

レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法 Download PDF

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Publication number
JP2004066327A
JP2004066327A JP2002232609A JP2002232609A JP2004066327A JP 2004066327 A JP2004066327 A JP 2004066327A JP 2002232609 A JP2002232609 A JP 2002232609A JP 2002232609 A JP2002232609 A JP 2002232609A JP 2004066327 A JP2004066327 A JP 2004066327A
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JP
Japan
Prior art keywords
laser
laser beam
optical path
laser light
energy distribution
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Pending
Application number
JP2002232609A
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English (en)
Japanese (ja)
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JP2004066327A5 (enExample
Inventor
Akira Akasaka
赤坂　朗
Toshifumi Ito
伊藤　敏文
Kikuo Takahashi
高橋　喜久夫
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TDK Corp
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TDK Corp
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Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP2002232609A priority Critical patent/JP2004066327A/ja
Priority to CNB038188279A priority patent/CN100396424C/zh
Priority to US10/523,392 priority patent/US7807944B2/en
Priority to PCT/JP2003/010052 priority patent/WO2004014595A1/ja
Publication of JP2004066327A publication Critical patent/JP2004066327A/ja
Publication of JP2004066327A5 publication Critical patent/JP2004066327A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0029—Etching of the substrate by chemical or physical means by laser ablation of inorganic insulating material

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
JP2002232609A 2002-08-09 2002-08-09 レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法 Pending JP2004066327A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002232609A JP2004066327A (ja) 2002-08-09 2002-08-09 レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法
CNB038188279A CN100396424C (zh) 2002-08-09 2003-08-07 激光加工设备、加工方法及利用其制造电路板的方法
US10/523,392 US7807944B2 (en) 2002-08-09 2003-08-07 Laser processing device, processing method, and method of producing circuit substrate using the method
PCT/JP2003/010052 WO2004014595A1 (ja) 2002-08-09 2003-08-07 レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002232609A JP2004066327A (ja) 2002-08-09 2002-08-09 レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法

Publications (2)

Publication Number Publication Date
JP2004066327A true JP2004066327A (ja) 2004-03-04
JP2004066327A5 JP2004066327A5 (enExample) 2005-08-25

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JP2002232609A Pending JP2004066327A (ja) 2002-08-09 2002-08-09 レーザ加工装置、加工方法、および当該加工方法を用いた回路基板の製造方法

Country Status (4)

Country Link
US (1) US7807944B2 (enExample)
JP (1) JP2004066327A (enExample)
CN (1) CN100396424C (enExample)
WO (1) WO2004014595A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
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WO2006114445A1 (de) * 2005-04-28 2006-11-02 Sms Elotherm Gmbh Vorrichtung und verfahren zum behandeln von zylindrisch geformten flächen mittels eines im wesentlichen kreisrunden querschnitt aufweisenden laserstrahls
KR20180114918A (ko) * 2016-02-18 2018-10-19 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 노광 시스템, 노광 장치 및 노광 방법

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JP4579575B2 (ja) * 2004-05-14 2010-11-10 株式会社半導体エネルギー研究所 レーザ照射方法及びレーザ照射装置
WO2007049525A1 (en) 2005-10-26 2007-05-03 Semiconductor Energy Laboratory Co., Ltd. Laser irradiation apparatus and manufacturing method of semiconductor device
KR101414867B1 (ko) * 2006-06-26 2014-07-03 오르보테크 엘티디. 인쇄 회로 기판 타깃의 정렬
US7945087B2 (en) 2006-06-26 2011-05-17 Orbotech Ltd. Alignment of printed circuit board targets
US8173931B2 (en) * 2008-06-13 2012-05-08 Electro Scientific Industries, Inc. Automatic recipe management for laser processing a work piece
TWI469842B (zh) * 2010-09-30 2015-01-21 Mitsuboshi Diamond Ind Co Ltd 雷射加工裝置、被加工物之加工方法及被加工物之分割方法
CN102350591B (zh) * 2011-07-08 2015-01-28 厦门大学 矩形水波导激光加工装置
US9931712B2 (en) * 2012-01-11 2018-04-03 Pim Snow Leopard Inc. Laser drilling and trepanning device
JP6388823B2 (ja) * 2014-12-01 2018-09-12 株式会社ディスコ レーザー加工装置
JP6599098B2 (ja) * 2014-12-12 2019-10-30 株式会社ディスコ レーザー加工装置
WO2017109928A1 (ja) * 2015-12-25 2017-06-29 ギガフォトン株式会社 レーザ照射装置
JP6306659B1 (ja) * 2016-10-19 2018-04-04 ファナック株式会社 ビーム分配器
CN107234345B (zh) * 2017-07-14 2019-06-14 大族激光科技产业集团股份有限公司 一种激光切割系统及其切割方法
CN107702797B (zh) * 2017-08-31 2023-06-23 中国工程物理研究院激光聚变研究中心 可调谐脉冲序列发生装置
TWI686256B (zh) * 2018-04-13 2020-03-01 財團法人工業技術研究院 雷射清潔裝置及方法
CN111438447A (zh) * 2018-12-29 2020-07-24 东泰高科装备科技有限公司 一种薄膜开孔方法、太阳能电池封装膜及开孔方法
CN110587123A (zh) * 2019-09-17 2019-12-20 深圳市牧激科技有限公司 激光加工装置及其加工方法
CN110893519A (zh) * 2019-12-26 2020-03-20 深圳中科光子科技有限公司 一种双光源四工位的激光加工设备及加工方法
CN111922511A (zh) * 2020-06-12 2020-11-13 大族激光科技产业集团股份有限公司 一种激光加工装置、加工设备、加工系统及加工方法
CN111922521B (zh) * 2020-07-10 2021-09-03 清华大学 一种实现聚酰亚胺烧蚀或碳化的飞秒激光加工系统和方法
CN112589813B (zh) * 2020-12-15 2025-10-28 青岛丰光精密机械股份有限公司 工业机器人手臂关节切割系统
JP2022105463A (ja) * 2021-01-02 2022-07-14 大船企業日本株式会社 プリント基板のレーザ加工方法およびプリント基板のレーザ加工機
CN114465080A (zh) * 2022-02-09 2022-05-10 江苏亮点光电科技有限公司 一种扇角可切换的一字线激光器
CN114951975A (zh) * 2022-05-31 2022-08-30 苏州科韵激光科技有限公司 激光加工设备和方法
CN119794622B (zh) * 2024-12-18 2025-11-28 北京理工大学 一种时/频整形激光在厚电极上构建超低损耗通孔的方法

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Publication number Priority date Publication date Assignee Title
WO2006114445A1 (de) * 2005-04-28 2006-11-02 Sms Elotherm Gmbh Vorrichtung und verfahren zum behandeln von zylindrisch geformten flächen mittels eines im wesentlichen kreisrunden querschnitt aufweisenden laserstrahls
KR20180114918A (ko) * 2016-02-18 2018-10-19 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 노광 시스템, 노광 장치 및 노광 방법
JP2019505850A (ja) * 2016-02-18 2019-02-28 シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド 露光システム、露光装置及び露光方法
KR102143085B1 (ko) * 2016-02-18 2020-08-10 상하이 마이크로 일렉트로닉스 이큅먼트(그룹) 컴퍼니 리미티드 노광 시스템, 노광 장치 및 노광 방법
US10942458B2 (en) 2016-02-18 2021-03-09 Shanghai Micro Electronics Equipment (Group) Co., Ltd. Exposure system, exposure device and exposure method

Also Published As

Publication number Publication date
CN1675020A (zh) 2005-09-28
CN100396424C (zh) 2008-06-25
US7807944B2 (en) 2010-10-05
US20050232316A1 (en) 2005-10-20
WO2004014595A1 (ja) 2004-02-19

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