JP2004035315A - 脆性材料基板の分断方法および脆性材料基板分断装置 - Google Patents

脆性材料基板の分断方法および脆性材料基板分断装置 Download PDF

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Publication number
JP2004035315A
JP2004035315A JP2002193919A JP2002193919A JP2004035315A JP 2004035315 A JP2004035315 A JP 2004035315A JP 2002193919 A JP2002193919 A JP 2002193919A JP 2002193919 A JP2002193919 A JP 2002193919A JP 2004035315 A JP2004035315 A JP 2004035315A
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Japan
Prior art keywords
brittle material
material substrate
heating
region
laser beam
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JP2002193919A
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English (en)
Japanese (ja)
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JP2004035315A5 (enExample
Inventor
Masato Matsumoto
松本　真人
Togo Itsudo
五戸　統悟
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2002193919A priority Critical patent/JP2004035315A/ja
Publication of JP2004035315A publication Critical patent/JP2004035315A/ja
Publication of JP2004035315A5 publication Critical patent/JP2004035315A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/10—Glass-cutting tools, e.g. scoring tools
    • C03B33/102—Glass-cutting tools, e.g. scoring tools involving a focussed radiation beam, e.g. lasers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2002193919A 2002-07-02 2002-07-02 脆性材料基板の分断方法および脆性材料基板分断装置 Pending JP2004035315A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002193919A JP2004035315A (ja) 2002-07-02 2002-07-02 脆性材料基板の分断方法および脆性材料基板分断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002193919A JP2004035315A (ja) 2002-07-02 2002-07-02 脆性材料基板の分断方法および脆性材料基板分断装置

Publications (2)

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JP2004035315A true JP2004035315A (ja) 2004-02-05
JP2004035315A5 JP2004035315A5 (enExample) 2005-10-20

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ID=31702779

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JP2002193919A Pending JP2004035315A (ja) 2002-07-02 2002-07-02 脆性材料基板の分断方法および脆性材料基板分断装置

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JP (1) JP2004035315A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100656397B1 (ko) * 2005-01-07 2006-12-13 엘지전자 주식회사 평판 디스플레이용 글래스 절단장치
JP2007043100A (ja) * 2005-06-30 2007-02-15 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2008246808A (ja) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置
JP2009504432A (ja) * 2005-08-06 2009-02-05 イェーノプティク アウトマティジールングステヒニーク ゲゼルシャフト ミット ベシュレンクテル ハフツング 先に作られたトレースを用いてレーザービームにより脆い平坦部材を裂く方法
JP2010067350A (ja) * 2008-09-08 2010-03-25 Hitachi Displays Ltd 有機ｅｌ表示装置およびその製造方法
KR101010125B1 (ko) * 2004-03-31 2011-01-24 엘지디스플레이 주식회사 기판 절단장치 및 그 절단방법
US8710403B2 (en) * 2008-02-19 2014-04-29 M-Solv Ltd. Laser processing a multi-device panel
CN103831527A (zh) * 2014-02-28 2014-06-04 华中科技大学 一种激光快速分离光学晶体方法及装置
WO2014175146A1 (ja) * 2013-04-26 2014-10-30 旭硝子株式会社 ガラス板の切断方法
WO2014175147A1 (ja) * 2013-04-26 2014-10-30 旭硝子株式会社 ガラス板の切断方法
CN114274384A (zh) * 2021-12-24 2022-04-05 唐山国芯晶源电子有限公司 一种石英晶圆的切割工艺方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101010125B1 (ko) * 2004-03-31 2011-01-24 엘지디스플레이 주식회사 기판 절단장치 및 그 절단방법
KR100656397B1 (ko) * 2005-01-07 2006-12-13 엘지전자 주식회사 평판 디스플레이용 글래스 절단장치
JP2007043100A (ja) * 2005-06-30 2007-02-15 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
KR101323078B1 (ko) * 2005-08-06 2013-10-29 예놉틱 아우토마티지어룽스테히닉 게엠베하 미리 만들어 놓은 트레이스를 따라 레이저 빔에 의해 취성평판 물질들을 절단하는 방법
JP2009504432A (ja) * 2005-08-06 2009-02-05 イェーノプティク アウトマティジールングステヒニーク ゲゼルシャフト ミット ベシュレンクテル ハフツング 先に作られたトレースを用いてレーザービームにより脆い平坦部材を裂く方法
JP2008246808A (ja) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置
US8710403B2 (en) * 2008-02-19 2014-04-29 M-Solv Ltd. Laser processing a multi-device panel
JP2010067350A (ja) * 2008-09-08 2010-03-25 Hitachi Displays Ltd 有機ｅｌ表示装置およびその製造方法
WO2014175146A1 (ja) * 2013-04-26 2014-10-30 旭硝子株式会社 ガラス板の切断方法
WO2014175147A1 (ja) * 2013-04-26 2014-10-30 旭硝子株式会社 ガラス板の切断方法
CN103831527A (zh) * 2014-02-28 2014-06-04 华中科技大学 一种激光快速分离光学晶体方法及装置
CN103831527B (zh) * 2014-02-28 2016-01-20 华中科技大学 一种激光快速分离光学晶体方法及装置
CN114274384A (zh) * 2021-12-24 2022-04-05 唐山国芯晶源电子有限公司 一种石英晶圆的切割工艺方法

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