JP2003533359A5 - - Google Patents

Download PDF

Info

Publication number
JP2003533359A5
JP2003533359A5 JP2001583983A JP2001583983A JP2003533359A5 JP 2003533359 A5 JP2003533359 A5 JP 2003533359A5 JP 2001583983 A JP2001583983 A JP 2001583983A JP 2001583983 A JP2001583983 A JP 2001583983A JP 2003533359 A5 JP2003533359 A5 JP 2003533359A5
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001583983A
Other languages
Japanese (ja)
Other versions
JP2003533359A (en
Filing date
Publication date
Priority claimed from US09/570,370 external-priority patent/US6506105B1/en
Priority claimed from US09/570,369 external-priority patent/US6558232B1/en
Application filed filed Critical
Priority claimed from PCT/US2001/015306 external-priority patent/WO2001087541A2/en
Publication of JP2003533359A publication Critical patent/JP2003533359A/en
Publication of JP2003533359A5 publication Critical patent/JP2003533359A5/ja
Pending legal-status Critical Current

Links

JP2001583983A 2000-05-12 2001-05-11 Pneumatic diaphragm head with independent retainer ring and multi-region pressure control and method using the pneumatic diaphragm head Pending JP2003533359A (en)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US20421200P 2000-05-12 2000-05-12
US09/570,369 2000-05-12
US09/570,370 2000-05-12
US09/570,370 US6506105B1 (en) 2000-05-12 2000-05-12 System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US09/570,369 US6558232B1 (en) 2000-05-12 2000-05-12 System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US60/204,212 2000-05-12
PCT/US2001/015306 WO2001087541A2 (en) 2000-05-12 2001-05-11 Pneumatic diaphragm head having an independent retaining ring and multi-region pressure control, and method to use the same

Publications (2)

Publication Number Publication Date
JP2003533359A JP2003533359A (en) 2003-11-11
JP2003533359A5 true JP2003533359A5 (en) 2008-09-04

Family

ID=27394636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001583983A Pending JP2003533359A (en) 2000-05-12 2001-05-11 Pneumatic diaphragm head with independent retainer ring and multi-region pressure control and method using the pneumatic diaphragm head

Country Status (6)

Country Link
EP (1) EP1284840A2 (en)
JP (1) JP2003533359A (en)
KR (1) KR100811172B1 (en)
CN (2) CN100433269C (en)
AU (1) AU2001259745A1 (en)
WO (1) WO2001087541A2 (en)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6506105B1 (en) 2000-05-12 2003-01-14 Multi-Planar Technologies, Inc. System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control
US6558232B1 (en) 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6540590B1 (en) 2000-08-31 2003-04-01 Multi-Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a rotating retaining ring
TWI246448B (en) * 2000-08-31 2006-01-01 Multi Planar Technologies Inc Chemical mechanical polishing (CMP) head, apparatus, and method and planarized semiconductor wafer produced thereby
KR100470227B1 (en) * 2001-06-07 2005-02-05 두산디앤디 주식회사 Carrier Head for Chemical Mechanical Polishing
JP4353673B2 (en) * 2002-04-18 2009-10-28 株式会社荏原製作所 Polishing method
CN100400236C (en) 2002-09-27 2008-07-09 小松电子金属股份有限公司 Polishing apparatus, polishing head, and polishing method
TWI238754B (en) * 2002-11-07 2005-09-01 Ebara Tech Inc Vertically adjustable chemical mechanical polishing head having a pivot mechanism and method for use thereof
EP2797109B1 (en) * 2004-11-01 2018-02-28 Ebara Corporation Polishing apparatus
US20080032603A1 (en) * 2006-08-03 2008-02-07 3M Innovative Properties Company Sanding tool
JP5464820B2 (en) * 2007-10-29 2014-04-09 株式会社荏原製作所 Polishing equipment
KR101617716B1 (en) 2008-03-25 2016-05-03 어플라이드 머티어리얼스, 인코포레이티드 Improved carrier head membrane
DE102009030298B4 (en) * 2009-06-24 2012-07-12 Siltronic Ag Process for local polishing of a semiconductor wafer
US20120021673A1 (en) * 2010-07-20 2012-01-26 Applied Materials, Inc. Substrate holder to reduce substrate edge stress during chemical mechanical polishing
CN102172887B (en) * 2011-02-16 2013-01-30 清华大学 Polishing head
KR101196652B1 (en) * 2011-05-31 2012-11-02 주식회사 케이씨텍 Membrane assembly in carrier head
CN102922411B (en) * 2011-08-10 2015-12-16 无锡华润上华科技有限公司 Prevent the chemical and mechanical grinding method of wafer slide plate
WO2013112764A1 (en) * 2012-01-25 2013-08-01 Applied Materials, Inc. Retaining ring monitoring and control of pressure
US9050700B2 (en) * 2012-01-27 2015-06-09 Applied Materials, Inc. Methods and apparatus for an improved polishing head retaining ring
JP5807580B2 (en) * 2012-02-15 2015-11-10 信越半導体株式会社 Polishing head and polishing apparatus
KR101301001B1 (en) * 2012-06-14 2013-08-28 에스엔유 프리시젼 주식회사 Substrate processing system with function for preventing damage
KR200465446Y1 (en) 2012-09-09 2013-02-19 전용준 Carrier head in chemical mechanical polishing apparatus capable of checking conjunction status between carrier head housing and retaining ring
CN103817591B (en) * 2012-11-16 2016-08-03 有研半导体材料有限公司 A kind of buffing machine debris handling devices
KR102191916B1 (en) * 2013-06-26 2020-12-16 주식회사 케이씨텍 Membrane in carrier head
CN104347467A (en) * 2013-07-23 2015-02-11 Ap系统股份有公司 Substrate holding module and substrate processing device comprising same
KR101494757B1 (en) * 2013-07-23 2015-02-25 에이피시스템 주식회사 Substrate holder module and apparatus for treatmenting substrate having the same
KR101487414B1 (en) * 2013-09-11 2015-01-29 주식회사 엘지실트론 Apparatus for polishing a wafer
JP6232297B2 (en) 2014-01-21 2017-11-15 株式会社荏原製作所 Substrate holding device and polishing device
TWI656944B (en) * 2014-05-14 2019-04-21 日商荏原製作所股份有限公司 Polishing apparatus
KR101559282B1 (en) 2014-05-19 2015-10-19 주식회사 티에스시 Membrane for Chemical-Mechanical Polishing of Wafer and Apparatus therewith
US9566687B2 (en) * 2014-10-13 2017-02-14 Sunedison Semiconductor Limited (Uen201334164H) Center flex single side polishing head having recess and cap
CN105856056B (en) * 2015-01-19 2018-03-02 大族激光科技产业集团股份有限公司 A kind of shaped face automatic polishing device
CN105058225A (en) * 2015-07-07 2015-11-18 武汉新芯集成电路制造有限公司 Grinding pad fixing device and chemical machinery grinder
US9744640B2 (en) * 2015-10-16 2017-08-29 Applied Materials, Inc. Corrosion resistant retaining rings
CN105397574B (en) * 2015-12-09 2017-08-25 浙江工业大学 The adjustable pressure suspension polishing device that surges in one kind processing gap
CN105538045B (en) * 2015-12-09 2018-06-26 浙江工业大学 Pressure suspension polishing method and device of surging based on adaptive and fixed processing gap
CN105479325B (en) * 2015-12-30 2018-04-17 天通吉成机器技术有限公司 A kind of subregion pressue device and method suitable for large-scale single side polishing grinding equipment
US9873179B2 (en) * 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
US10654216B2 (en) * 2016-03-30 2020-05-19 Canon Kabushiki Kaisha System and methods for nanoimprint lithography
TWI568537B (en) * 2016-09-08 2017-02-01 Vibration grinding machine structure
TWI572444B (en) * 2016-09-08 2017-03-01 Vibration grinding machine structure
JP7162000B2 (en) * 2017-03-06 2022-10-27 アプライド マテリアルズ インコーポレイテッド Spiral and concentric motion designed for CMP Location Specific Polishing (LSP)
JP6986930B2 (en) * 2017-11-07 2021-12-22 株式会社荏原製作所 Substrate polishing equipment and polishing method
CN108145586B (en) * 2018-01-03 2019-10-11 京东方科技集团股份有限公司 Polissoir and polishing method
CN109202697A (en) * 2018-11-20 2019-01-15 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） The application method of rubbing head, polissoir and rubbing head
KR20200070825A (en) * 2018-12-10 2020-06-18 삼성전자주식회사 chemical mechanical polishing apparatus for controlling polishing uniformity
CN110142689B (en) * 2019-04-17 2021-09-14 杭州众硅电子科技有限公司 Wafer loading support, wafer loading system and wafer loading method
CN110802507A (en) * 2019-11-11 2020-02-18 上海华力微电子有限公司 Grinding head and chemical mechanical grinding equipment
CN111496658B (en) * 2020-03-13 2021-06-04 郑玲佳 Light machine is swept to strong adaptability
CN111496598B (en) * 2020-04-24 2021-08-24 广东博智林机器人有限公司 Plane grinding device and plane grinding robot
CN111571444A (en) * 2020-05-15 2020-08-25 中国科学院微电子研究所 Polishing pad dressing device
US11890715B2 (en) 2020-06-24 2024-02-06 Applied Materials, Inc. Polishing carrier head with piezoelectric pressure control
CN111823130A (en) * 2020-07-17 2020-10-27 中国科学院微电子研究所 Polishing head and polishing device
CN111922888B (en) * 2020-08-11 2022-04-29 西安奕斯伟材料科技有限公司 Edge polishing apparatus and polishing method
US20220143779A1 (en) * 2020-11-10 2022-05-12 Applied Materials, Inc. Polishing head with local wafer pressure
CN114505782B (en) * 2020-11-17 2023-08-04 长鑫存储技术有限公司 Fixing device and detection system
CN112605848A (en) * 2020-11-29 2021-04-06 厦门理工学院 Electromagnetic polishing disk mechanism with adjustable gravity center and polishing method
CN112792725B (en) * 2021-02-03 2022-09-30 华海清科股份有限公司 Flexible membrane for chemical mechanical polishing, bearing head and polishing equipment
KR102650422B1 (en) * 2021-03-17 2024-03-22 미크로 기켄 가부시키가이샤 Polishing head and polishing processing device
CN113290426B (en) * 2021-04-15 2022-10-21 金华博蓝特新材料有限公司 Method for improving polishing thickness uniformity of wafer
CN113878488B (en) * 2021-10-18 2022-09-06 华海清科(北京)科技有限公司 Chemical mechanical polishing head and polishing system
CN114310652A (en) * 2021-12-30 2022-04-12 金陵科技学院 Flexible grinding device for soft and brittle materials
CN114700871B (en) * 2022-03-11 2023-11-24 上海致领半导体科技发展有限公司 Third-generation semiconductor chemical mechanical polishing device
CN115091359B (en) * 2022-05-26 2023-09-05 浙江晶盛机电股份有限公司 polishing carrier
CN115008342B (en) * 2022-06-15 2023-08-25 安徽禾臣新材料有限公司 Corner collapse preventing wax-free pad for wafer polishing and production process thereof
CN115431176B (en) * 2022-11-08 2023-01-31 烟台环球机床装备股份有限公司 Polishing pressure adjusting device for polishing machine tool
CN115816298A (en) * 2022-12-29 2023-03-21 西安奕斯伟材料科技有限公司 Fixed disc, polishing equipment and polishing method
CN116372786B (en) * 2023-06-05 2023-08-18 北京特思迪半导体设备有限公司 Wafer polishing equipment
CN116442103B (en) * 2023-06-13 2023-08-29 深圳市鲁光电子科技有限公司 Third-generation semiconductor precision machining device
CN117245542B (en) * 2023-11-17 2024-01-23 苏州博宏源机械制造有限公司 Wafer double-sided polishing equipment and process

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0169932B1 (en) * 1984-08-03 1987-04-22 Wilhelm Loh Wetzlar Optikmaschinen GmbH & Co. KG Supporting device for vulnerable objects, in particular optical lenses and other optical elements
US4918869A (en) * 1987-10-28 1990-04-24 Fujikoshi Machinery Corporation Method for lapping a wafer material and an apparatus therefor
JP3311116B2 (en) * 1993-10-28 2002-08-05 株式会社東芝 Semiconductor manufacturing equipment
US5820448A (en) * 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
JP3552845B2 (en) * 1996-04-25 2004-08-11 株式会社ルネサステクノロジ Method for manufacturing semiconductor device
US6183354B1 (en) * 1996-11-08 2001-02-06 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
DE19651761A1 (en) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Method and device for polishing semiconductor wafers
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
TW431942B (en) * 1997-04-04 2001-05-01 Tokyo Seimitsu Co Ltd Polishing device
US5957751A (en) * 1997-05-23 1999-09-28 Applied Materials, Inc. Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US6107203A (en) * 1997-11-03 2000-08-22 Motorola, Inc. Chemical mechanical polishing system and method therefor
FR2778129B1 (en) * 1998-05-04 2000-07-21 St Microelectronics Sa MEMBRANE SUPPORT DISC OF A POLISHING MACHINE AND METHOD OF OPERATING SUCH A MACHINE
US6251215B1 (en) * 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6422927B1 (en) * 1998-12-30 2002-07-23 Applied Materials, Inc. Carrier head with controllable pressure and loading area for chemical mechanical polishing
US6093089A (en) * 1999-01-25 2000-07-25 United Microelectronics Corp. Apparatus for controlling uniformity of polished material
DE19941903A1 (en) * 1999-09-02 2001-03-15 Wacker Siltronic Halbleitermat Semiconductor wafers polishing method e.g. for manufacture of microelectronic devices, allows individual treatment of wafers by independent adjustment of pressure of polishing chambers

Similar Documents

Publication Publication Date Title
BE2022C531I2 (en)
BE2022C547I2 (en)
BE2017C055I2 (en)
BE2017C051I2 (en)
BE2016C051I2 (en)
BE2015C077I2 (en)
BE2015C046I2 (en)
BE2014C052I2 (en)
BE2014C004I2 (en)
BE2014C006I2 (en)
BE2011C034I2 (en)
BE2007C047I2 (en)
AU2002307149A8 (en)
JP2002021507A5 (en)
JP2003533359A5 (en)
JP2001287365A5 (en)
BRPI0204884A2 (en)
CH1379220H1 (en)
JP2002246053A5 (en)
JP2002239096A5 (en)
IN220565B (en)
BRPI0101486B8 (en)
BE2012C051I2 (en)
JP2001292131A5 (en)
AU2000280389A8 (en)