CN104347467A - Substrate holding module and substrate processing device comprising same - Google Patents
Substrate holding module and substrate processing device comprising same Download PDFInfo
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- CN104347467A CN104347467A CN201410350052.1A CN201410350052A CN104347467A CN 104347467 A CN104347467 A CN 104347467A CN 201410350052 A CN201410350052 A CN 201410350052A CN 104347467 A CN104347467 A CN 104347467A
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- substrate
- holder
- fixing
- fixing block
- upper substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a substrate holding module and a substrate processing apparatus including the substrate holding module, the substrate holding module comprising: a holder, holding a substrate having a surface; and a substrate holding unit for holding the insert in reactor. The substrate holding unit comprises: an elastic deformable diaphragm, mounted on a holding surface of said block and having a through holding block and the exposed surface; and a movable member, disposed in the holder, wherein the moving member one end connected to said holding block, and the moving member in the direction of deformation of the elastic deformation of the diaphragm opposite to the direction of movement of said holding block. When the elastic deformation of the diaphragm expansion to unload the substrate, the substrate holding unit is moved backward by the moving member. Thus, according to the elastic deformation of the diaphragm of the expansion stress applied to the substrate is reduced, thereby preventing the substrate from being damaged in the process of unloading the substrate.
Description
Technical field
The present invention relates to substrate fixing module and the substrate-treating apparatus comprising described substrate fixing module, and more particularly, particularly relate to easily from substrate fixing module and the substrate-treating apparatus comprising described substrate fixing module of substrate removal.
Background technology
The two-d display panels such as such as display panels (LCD), plasma display (PDP) and organic light emitting apparatus (OLED) manufacture by engaging a pair flat substrate (hereinafter, referred to upper substrate and lower substrate).
For this reason, substrate junction apparatus comprises: chamber; Vertically moving below chuck, arrange in the cavity, wherein lower substrate is placed on the chuck of described below; And vertically moving top chuck, to be arranged on above the chuck of described below and in the face of described below chuck is with fixing upper substrate.Described top chuck comprises: upper plate, has the area of the area being equal to or greater than described upper substrate; Multiple adhesive chuck, in described upper plate, (in a lateral direction) is spaced from each other with holding substrate in the direction of the width; And barrier film, to be arranged between described adhesive chuck and to pass through supplied gas and expand, as in No. 0869088 Korean Patent invent.
Now be described through substrate junction apparatus and the method that upper substrate and lower substrate is bonded with each other of using.For example, in order to manufacture display panels, comprised the lower substrate of multiple thin-film transistor and multiple pixel electrode by described below chuck fixing, along described lower substrate edge and apply the encapsulants such as such as sealant, and liquid crystal drop to be dropped on described lower substrate.By described top chuck fixing and fixed packet containing the upper substrate of colored filter and common electrode.For this reason, use the adhesion strength of described adhesive chuck and be formed in the vacuum hole in described upper plate.Then, described top chuck is moved down, or described below chuck is moved up, with so that described upper substrate is contacted with the upper section of described lower substrate.Then, inert gas (such as, nitrogen) is incorporated in multiple barrier film.Therefore, described barrier film expands towards described upper substrate, and the expansive force of described barrier film promote downwards described upper substrate with so that remove described upper substrate from described adhesive chuck.
When being incorporated in described barrier film by described inert gas as mentioned above, described barrier film expands towards described upper substrate.Now, the membrane contacts expanded and promote described upper substrate until described upper substrate drops from described top chuck or removes.Therefore, stress is applied to described upper substrate and damages described upper substrate by the barrier film expanded, and then improves the ratio of defects of display panels or damage display panels.
In addition, the stress applied from the barrier film expanded may make upper substrate and lower substrate misalignment.
< citing document >
[patent documentation]
No. 0869088 Korean Patent
Summary of the invention
The invention provides substrate fixing module and the substrate-treating apparatus comprising described substrate fixing module, it prevents from causing damage and misalignment when unloading substrate to substrate.
The present invention also provides substrate fixing module and comprises the substrate-treating apparatus of described substrate fixing module, and it to reduce with the strain diaphragm unloading substrate by expanding or prevents from being applied to the stress of substrate.
According to one exemplary embodiment, a kind of substrate fixing module comprises: holder, has the surface of holding substrate; And substrate holder unit, be inserted in described holder, wherein said substrate holder unit comprises: fixing block, to be inserted in described holder and to have the surface of substrate described in fixing; Strain diaphragm, to be arranged on described fixing block and to have the surface exposed by the surface of described fixing block; And mobile member, be arranged in described holder, one end of wherein said mobile member is connected to described fixing block, and described mobile member has elastic force and moves up to move described fixing block in said opposite direction in the side contrary with the deformation direction of described strain diaphragm.
According to one exemplary embodiment, a kind of substrate-treating apparatus, comprising:
Chamber, has inner space, and in described inner space, upper substrate and lower substrate are bonded with each other;
Below holder, install in the cavity, wherein said lower substrate is placed on the holder of described below;
Top holder, to be arranged on above the holder of described below and in the face of described below holder is with upper substrate described in fixing; And
Substrate holder unit, being inserted in the holder of described top and being provided with the strain diaphragm that the side to the described top holder of upper substrate described in fixing exposes, wherein said substrate holder unit has elastic force and moves up in the side contrary with the deformation direction of described strain diaphragm to make described substrate holder unit.
Accompanying drawing explanation
One exemplary embodiment can be understood in more detail by reference to the accompanying drawings from following description.
Fig. 1 is the cross-sectional view of the major part of the substrate-treating apparatus illustrated according to one exemplary embodiment.
Fig. 2 is the perspective view of the substrate holder unit illustrated according to one exemplary embodiment.
Fig. 3 illustrates the perspective view being arranged on the substrate holder unit on holder according to one exemplary embodiment.
Fig. 4 illustrates the cross-sectional view being arranged on the substrate holder unit on holder according to one exemplary embodiment.
Fig. 5 is the cross-sectional view of the operation of the substrate holder unit illustrated according to one exemplary embodiment.
Fig. 6 be illustrate according to the top holder of one exemplary embodiment and below holder in substrate-treating apparatus close to each other to make upper substrate and lower substrate contact with each other so that the cross-sectional view of the state that upper substrate and lower substrate are bonded with each other.
Fig. 7 be illustrate according to one exemplary embodiment in substrate-treating apparatus by make strain diaphragm expand to make upper substrate and lower substrate be bonded with each other and remove the cross-sectional view of the operation of (unloading) upper substrate from top holder.
Fig. 8 illustrates that top holder moves up and the cross-sectional view of state that upper substrate removes from top holder.
[main element label declaration]
1000: chamber
2000: below holder
3000: below drive part
3100: below driving shaft
3200: below power section
4000: substrate fixing module
4100: top holder
4110: insert space
4200: vacuum hole adjustment member
4210: the first extensional pipelines are arranged
4220: vacuum pump
4230: the first gas storage portions
4240: pump-line is arranged
4250: valve
4260: the first gas pipelines are arranged
4270: valve
4300: substrate holder unit
4310: fixing block
4320: adhesive chuck
4330: strain diaphragm
4340: mobile member
4341: main body
4342: elastic component
4343: bar
4400: strain adjustment member
4410: the second extensional pipelines are arranged
4420: exhaust pump
4430: the second gas storage portions
4440: discharge duct is arranged
4450: valve
4460: the second gas pipelines are arranged
4470: valve
4480: nozzle
4481: branched pipe
4490: nozzle holding members
4500: vacuum hole
5000: top drive part
S1: upper substrate
S2: lower substrate
Embodiment
Hereinafter, specific embodiment will be described in detail referring to accompanying drawing.But the present invention should be able to be considered as being limited to the embodiment set forth herein by multi-form embodiment and not.But, provide these embodiments to make the present invention more detailed and complete, and scope of the present invention will be passed on all sidedly to those skilled in the art.Same reference numbers refers to same components in the text.
Fig. 1 is the cross-sectional view of the major part of the substrate-treating apparatus illustrated according to one exemplary embodiment.Fig. 2 is the perspective view of the substrate holder unit illustrated according to present example.Fig. 3 illustrates the perspective view being arranged on the substrate holder unit on the holder of top according to present example.Fig. 4 illustrates the cross-sectional view being arranged on the substrate holder unit on holder according to present example.Fig. 5 is the cross-sectional view of the operation of the substrate holder unit illustrated according to present example.
Referring to Fig. 1, be the substrate junction apparatus for upper substrate and lower substrate are bonded with each other according to the substrate-treating apparatus of present example, and comprise: chamber 1000, has inner space; Substrate fixing module 4000, it comprises and is arranged on the top holder 4100 of fixing upper substrate S1 in chamber 1000, and is arranged on the holder 4100 of top with adhesion strength fixing and multiple substrate holder unit 4300 of fixing upper substrate S1; Below holder 2000, is arranged on described top holder 4100 times with in the face of top holder 4100, and wherein lower substrate S2 to be placed on the holder 2000 of below and to be fixed to below holder 2000; Top drive part 5000, is connected to the upper section of top holder 4100 vertically to move top holder 4100; And below drive part 3000, be connected to the inferior portion of below holder 2000 vertically to move below holder 2000.
Perform in the inner space of chamber 1000 by the technique that upper substrate S1 and lower substrate S2 is bonded with each other.For example, chamber 1000 can be divided into the upper chambers 1000 and lower chamber 1000 that mutually couple removedly.For individually and vertically move upper chambers 1000 and lower chamber 1000 independent lift component (not shown) can through arrange so that upper chambers 1000 and lower chamber 1000 are coupled mutually removedly.Therefore, upper chambers 1000 or lower chamber 1000 vertically can move that substrate S 1 and S2 are moved into chamber 1000 and shift out chamber 1000.Although not shown, be provided with independent pressure adjustment component (that is, pump) of the internal pressure for adjusting chamber 1000 and the independent exhaustion component for discharging impurity.
The inner lower that below holder 2000 is arranged on chamber 1000 is with fixing and fixing lower substrate S2.Below holder 2000 can have the shape (such as, having the plate shape of quadrangular cross section) corresponding to lower substrate S2, and is provided with for fixing and multiple vacuum holes (not shown) of fixing lower substrate S2.That is, below holder 2000 can be provided with and extend perpendicularly through below holder 2000 and multiple vacuum holes with one end of the upper surface exposure of holder 2000 from below, and pump can be connected to vacuum hole.Therefore, when pump operated, in vacuum hole, form vacuum.Now, lower substrate S2 is attached to the upper surface of below holder 2000 by vacsorb retain strength.
As mentioned above, below holder 2000 uses vacsorb retain strength, but the present invention is not limited thereto.Therefore, below holder 2000 can be and uses electrostatic force to carry out fixing and the electrostatic chuck of fixing lower substrate S2.
Below drive part 3000 is mobile below holder 2000 vertically, and comprises: below driving shaft 3100, is connected to the inferior portion of below holder 2000; And below power section 3200, be connected to below driving shaft 3100 inferior portion with by vertical mobile power supply to below driving shaft 3100.Below driving shaft 3100 is through a part for the inferior portion of chamber 1000.Bellows can around below driving shaft 3100 with the sealing state preventing below driving shaft 3100 from damaging chamber 1000.Alignment members (not shown) through arranging to rotate up below holder 2000 in X-direction, Y-direction and θ side, and then can adjust the position of lower substrate S2.
Upper substrate fixing module 4000 is with vacsorb retain strength and adhesion strength fixing and fixing upper substrate S1.Upper substrate fixing module 4000 comprises: top holder 4100, be arranged in chamber 1000 with in the face of below holder 2000 above the holder 2000 of below, and have for vacsorb retain strength fixing and multiple vacuum holes 4500 of fixing upper substrate S1; Substrate holder unit 4300, being inserted in the holder 4100 of top and the bearing of trend of holder 4100 is up spaced from each other, each in holding unit 4300 at the bottom of time wherein comprises adhesive chuck 4320 and strain diaphragm 4330; Vacuum hole adjustment member 4200, is connected to vacuum hole 4500 to bleed to the inside of vacuum hole 4500 or to supply a gas to vacuum hole 4500; And strain adjustment member 4400, be connected to substrate holder unit 4300 to adjust the strain of strain diaphragm 4330.
Top holder 4100 has the shape (such as, having the plate shape of quadrangle cross sections) corresponding to upper substrate S1, and is provided with multiple insertion spaces 4110 of vacuum hole 4500 and substrate holder unit 4300 insertion.The side (that is, on the downside of it) in the insertion space 4110 of fixing upper substrate S1 is open.Referring to Fig. 1, vacuum hole 4500 extends perpendicularly through a part for top holder 4100, and its one end is exposed by the surface (that is, by the lower surface of top holder 4100) of the top holder 4100 of fixing upper substrate S1.Vacuum hole 4500 to be arranged between substrate holder unit 4300 and to be arranged on that it is outside.
Vacuum hole adjustment member 4200 comprises: the first extensional pipeline arranges 4210, and it is connected to the other end of vacuum hole 4500 set in the holder 4100 of top, and has at least one end of extending from chamber 1000; Vacuum pump 4220, is arranged on the outside of chamber 1000; First gas storage portion 4230, wherein stores inert gas; Pump-line arranges 4240, and its one end is connected to vacuum pump 4220, and its other end is connected to the first extensional pipeline layout 4210; First gas pipeline arranges 4260, and its one end is connected to the first gas storage portion 4230, and its other end is connected to the first extensional pipeline layout 4210; And valve 4250 and 4270, be arranged on respectively in pump-line layout 4240 and the first gas pipeline layout 4260.Therefore, when vacuum pump 4220 operate to load upper substrate S1 make it to contact with the lower surface of top holder 4100 time, pump-line arrange 4240 and first extensional pipeline arrange that 4210 form vacuum in vacuum hole 4500.Now, vacsorb retain strength is produced upper substrate S1 to be closely attached to top holder 4100.After this, stop the operation of vacuum pump 4220 to unload upper substrate S1, and by the first gas pipeline layout 4260 and the first extensional pipeline layout 4210, inert gas (such as, nitrogen (N2)) is fed to vacuum hole 4500 from the first gas storage portion 4230.Now, effectively upper substrate S1 is removed from top holder 4100 by being expelled to the injection pressure of the nitrogen of upper substrate S1 from vacuum hole 4500.
Referring to Fig. 1, substrate holder unit 4300 is contained in insertion space 4110 set in the holder 4100 of top respectively, and the movement in insertion space 4110 relative to the strain (such as, the expansion of strain diaphragm 4330 and contraction) of strain diaphragm 4330.That is, when the downside that strain diaphragm 4330 expands with convex substrate S upward 1 or top holder 4100, substrate holder unit 4300 moves up in insertion space 4110.Upon inflation, when strain diaphragm 4330 shrinks to turn back to its reset condition, substrate holder unit 4300 moves down to turn back to its reset condition in insertion space 4110.
Hereinafter, for ease of describing, moving up of substrate holder unit 4300 is called " moving backward ", and moving down of substrate holder unit 4300 is called " moving forward ".
Substrate holder unit 4300 according to the direction of the strain of strain diaphragm 4330 or according to the expansion of strain diaphragm 4330 and contraction (returning) and relative movement, to reduce the stress expanding to be applied to when unloading upper substrate S1 upper substrate S1 at strain diaphragm 4330.Referring to Fig. 2 to Fig. 5, substrate holder unit 4300 comprises: fixing block 4310, is inserted in insertion space 4110 set in the holder 4100 of top; Adhesive chuck 4320, is arranged on fixing block 4310 with adhesion strength fixing and fixing upper substrate S1; Strain diaphragm 4330, on its side being arranged on adhesive chuck 4320 on fixing block 4310 and elastically deformable; And mobile member 4340, be arranged in insertion space 4110 set in the holder 4100 of top, wherein one end of mobile member 4340 is connected to fixing block 4310, and its other end is connected to top holder 4100, to make mobile member 4340 relative movement or extend in an opposite direction according to strain or shrink according to the strain of strain diaphragm 4330 (such as, expand or shrink).
Referring to Fig. 2 and Fig. 3, fixing block 4310 has circular slab shape, and the surface of adhesive chuck 4320 and strain diaphragm 4330 is exposed by the surface (that is, by the lower surface of fixing block 4310) of the fixing block 4310 of fixing upper substrate S1.In the central authorities that strain diaphragm 4330 is arranged on fixing block 4310 or zone line, and adhesive chuck 4320 is arranged on around strain diaphragm 4330.In other words, adhesive chuck 4320 along fixing block 4310 edge and install, and strain diaphragm 4330 is arranged on the inside of adhesive chuck 4320 on fixing block 4310.But the installation site of adhesive chuck 4320 and strain diaphragm 4330 is not limited thereto.Therefore, strain diaphragm 4330 can be installed along the edge of fixing block 4310, and adhesive chuck 4320 can be arranged on the inside of strain diaphragm 4330 on fixing block 4310.
Adhesive chuck 4320 uses adhesion strength fixing and fixing upper substrate S1, and adhesive chuck 4320 is arranged in substrate holder unit 4300 with multiple.Referring to Fig. 2, adhesive chuck 4320 arranges along the external boundary of strain diaphragm 4330 and is spaced from each other on the bearing of trend of fixing block 4310.Or replace adhesive chuck 4320, the adhesive chuck 4320 in single main body can be arranged on fixing block 4310.Adhesive chuck 4320 is formed by a kind of material, even if to make upper substrate S1 adhere to adhesive chuck 4320 and then to remove from adhesive chuck 4320, upper substrate S1 also can not have adhesive label, and adhesive chuck 4320 is still arranged on fixing block 4310.For example, the material for the formation of adhesive chuck 4320 can be silicone-based adhesion sheet material, acrylic acid series adhesion sheet material or fluorine system adhesion sheet material.Multiple protuberance can be arranged on the surface of adhesive chuck 4320, and the surface of the protuberance of contact upper substrate S1 can have one in planar rondure and various polygon.
Strain diaphragm 4330 stably removes upper substrate S1 from adhesive chuck 4320 or top holder 4100, and is arranged on the inside of adhesive chuck 4320 on fixing block 4310.Strain diaphragm 4330 has the fringe region being inserted in fixing block 4310 and being couple to fixing block 4310 by individual member (not shown) regularly, and the remaining area of strain diaphragm 4330 is exposed by the surface of fixing block 4310.Strain diaphragm 4330 is inert gas by injecting towards strain diaphragm 4330 and expands.When discharge inert gas time, strain diaphragm 4330 strain and shrink to turn back to its reset condition.Strain diaphragm 4330 is fabricated to the diaphragm or sheet material that are formed by the such as deformable material such as rubber or engineering plastics.More particularly, strain diaphragm 4330 can be barrier film.
Mobile member 4340 the strain with strain diaphragm 4330 side in the opposite direction on operate, to go up mobile fixing block 4310 in the opposite direction in the side of the strain with strain diaphragm 4330.That is, when substrate S 1 expands strain diaphragm 4330 upward, mobile member 4340 entirety moving substrate holding unit 4300 backward on the direction away from upper substrate S1.Therefore, reduce and prevent the expansion according to strain diaphragm 4330 and be applied to the stress of upper substrate S1.Upon inflation, when strain diaphragm 4330 shrinks to turn back to its reset condition, or when power is backward applied to the strain diaphragm 4330 maintaining reset condition, substrate holder unit 4300 moves forward completely.Mobile member 4340 is arranged in the insertion space 4110 of top holder 4100.One end of mobile member 4340 is connected to fixing block 4310, and its other end is connected to top holder 4100.More particularly, mobile member 4340 is arranged in the insertion space 4110 of top holder 4100, and one end of mobile member 4340 is connected to fixing block 4310, and its other end is connected to the upper wall inserting space 4110.
Mobile member 4340 can towards fixing block 4310 (that is, forward) or (that is, backward) movement on the direction away from fixing block 4310.Mobile member 4340 can be the spring piston comprising spring.That is, the mobile member 4340 with inner space vertically extends and comprises: main body 4341, is arranged between fixing block 4310 and the upper wall inserting space 4110; Elastic component 4342 (that is, spring), is arranged in main body 4341; And bar 4343, its one end to be inserted in main body 4341 and to be connected to elastic component 4342, and its other end is outstanding to carry out fixing to fixing block 4310 from main body 4341.Bar 4343 according to the extension of elastic component 4342 or contraction towards fixing block 4310 forward (that is, downward) or on the direction away from fixing block 4310 backward (that is, upwards) mobile.Therefore, when strain diaphragm 4330 expands, the bar 4343 of mobile member 4340 moves backward, and elastic component 4342 shrinks.Upon inflation, when strain diaphragm 4330 shrinks and turns back to its reset condition, the bar 4343 of mobile member 4340 moves forward, and elastic component 4342 extends and turns back to its reset condition.That is, bar 4343 according to the strain of strain diaphragm 4330 (such as, expand and shrink) by extensible and contractile elastic component 4342 (namely, spring) move forward and backward, and substrate holder unit 4300 (and more particularly, fixing block 4310) moved forward and backward by bar 4343 according to the strain of strain diaphragm 4330.
The spring piston comprising spring is demonstrated as mobile member 4340, as mentioned above.But, the present invention is not limited thereto.Therefore, can select there is elastic force and apply power in an opposite direction to move the various components of fixing block 4310 forward or backward according to the expansion of strain diaphragm 4330 or contraction.
Strain diaphragm 4330 is expanded by strain adjustment member 4400 or turns back to its reset condition.Strain adjustment member 4400 comprises: multiple nozzle 4480, and wherein each has and is inserted in fixing block 4310 with by inert gas injection one end to the rear side of strain diaphragm 4330; Multiple branched pipe 4481, its one end is connected to each in nozzle 4480 so that inert gas is fed to nozzle 4480; Second extensional pipeline arranges 4410, extends up and be connected to branched pipe 4481 in holder 4100, and extends to make its one end be arranged on chamber 1000 outside; Exhaust pump 4420 and the second gas storage portion 4430, it is outside that it is arranged on chamber 1000; Discharge duct arranges 4440, and its one end is connected to exhaust pump 4420, and its other end is connected to the second extensional pipeline layout 4410; Second gas pipeline arranges 4460, and its one end is connected to the second gas storage portion 4430, and its other end is connected to the second extensional pipeline layout 4410; And valve 4450 and 4470, be arranged on respectively in discharge duct layout 4440 and the second gas pipeline layout 4460.In addition, strain adjustment member 4400 comprises to extend perpendicularly through the nozzle holding members 4490 of described part at least one part being inserted in top holder 4100 and fixing block 4310, and nozzle 4480 to be inserted in nozzle holding members 4490 and by nozzle holding members 4490 fixing.
When inert gas (such as, nitrogen (N2)) from the second gas storage portion 4430 be fed to second gas pipeline arrange 4460 and second extensional pipeline arrange 4410 to unload upper substrate S1 time, nitrogen is discharged to strain diaphragm 4330 from nozzle 4480.Now, the injection pressure being expelled to the inert gas in the inert gas of the rear side of strain diaphragm 4330 or the space between filling strain diaphragm 4330 and fixing block 4310 makes strain diaphragm 4330 expand with convex substrate S upward 1 (referring to Fig. 5), and the expansive force of strain diaphragm 4330 is delivered to upper substrate S1.Because upper substrate S1 is fixed by the adhesion strength of adhesive chuck 4320, thus resistance the side of the expansive force with strain diaphragm 4330 in the opposite direction on produce and be delivered to fixing block 4310.Therefore, when strain diaphragm 4330 expands and promotes upper substrate S1 downwards, power is delivered to mobile member 4340 by fixing block 4310 on the direction away from upper substrate S1.Therefore, when strain diaphragm 4330 expands, fixing block 4310 is moved backward by mobile member 4340, and then reduction is applied to the stress of upper substrate S1 according to the expansion of strain diaphragm 4330.Along with inert gas is without interruption and make strain diaphragm 4330 expand, upper substrate S1 removes from adhesive chuck 4320 and therefore completely to remove from substrate holder unit 4300.
Fig. 6 be illustrate according to the top holder of one exemplary embodiment and below holder in substrate-treating apparatus close to each other to make upper substrate and lower substrate contact with each other so that the cross-sectional view of the state that upper substrate and lower substrate are bonded with each other.Fig. 7 is the cross-sectional view that the operation removing (unloading) upper substrate from top holder is described.Fig. 8 illustrates that top holder moves up and the cross-sectional view of state that upper substrate removes from top holder.
Hereinafter, the existing method referring to Fig. 1 to Fig. 8 is described through use substrate-treating apparatus, upper substrate and lower substrate are bonded with each other according to present example.For this reason, demonstration manufactures the technique of display panels.
Referring to Fig. 1, by top holder 4100 fixing and fixed packet containing the upper substrate S1 of common electrode (not shown) and color filter patterns (not shown), and below the lower substrate S2 with the liquid crystal of drippage is placed on holder 2000.Upper substrate S1 and top holder 4100 close to each other, to make upper substrate S1 contact with the lower surface of top holder 4100, so that by top holder 4100 fixing upper substrate S1, and vacuum pump 4220 operates.Vacuum pump 4220 operates and forms vacuum to arrange that at pump-line the 4240, first extensional pipeline is arranged in 4210 and vacuum hole 4500, and produces the vacsorb retain strength making upper substrate S1 and top holder 4100 close contact.Now, upper substrate S1 is fixed to substrate holder unit 4300 by the adhesion strength of adhesive chuck 4320 set in each in substrate holder unit 4300.When vacsorb retain strength makes upper substrate S1 and substrate holder unit 4300 close contact, upper substrate S1 can be out of shape according to scheduled volume.
In addition, power upper substrate S1 being tightly fixed to top holder 4100 produced by the vacsorb retain strength of vacuum hole 4500 and the adhesion strength of adhesive chuck 4320 is as mentioned above delivered to substrate holder unit 4300.Therefore, substrate holder unit 4300 entirety moves preset distance by mobile member 4340 backward so that assisted vacuum draws fixing.Then, when the adhesion strength of adhesive chuck 4320 is by upper substrate S1 fixing and when being fixed to top holder 4100, the operation of vacuum pump 4220 stops.Now, fixing block 4310 is moved forward to turn back to its reset condition by mobile member 4340.Therefore, the upper substrate S1 be out of shape during vacsorb fixing turns back to its reset condition.In addition, even if the operation of vacuum pump 4220 stops, but because the inside of chamber 1000 is in vacuum state, so chamber 1000 has the internal pressure identical with vacuum pressure with vacuum hole 4500.Therefore, upper substrate S1 can not drop.
When individually fixing and fixing upper substrate S1 and lower substrate S2 time, aim at upper substrate S1 and lower substrate S2, and then, sealant (such as, light curable sealant) be coated to the edge of in upper substrate S1 and lower substrate S2.Referring to Fig. 6, at least one movement in top holder 4100 and below holder 2000 contacts with each other to make upper substrate S1 and lower substrate S2.
Then, illustrated by Fig. 5 and Fig. 7, strain diaphragm 4330 expand into upper substrate S1 to remove upper substrate S1 from top holder 4100.For this reason, it is expelled to the rear side of upper substrate S1 from vacuum hole 4500 from the first gas storage portion 4230 supplying inert gas (such as, nitrogen) of vacuum hole adjustment member 4200.Therefore, easily upper substrate S1 is removed from adhesive chuck 4320.Therefore, when by inert gas (such as, nitrogen) from the second gas storage portion 4430 be fed to the second gas pipeline arrange 4460 time, nitrogen supply (NS) is arranged 4410 and nozzle 4480 to the second extensional pipeline, and by the rear side of the inert gas injection to strain diaphragm 4330 that are fed to nozzle 4480.Therefore, illustrated by Fig. 5 and Fig. 7, strain diaphragm 4330 upward substrate S 1 expands.
The injection pressure being expelled to the nitrogen in the nitrogen of the rear side of strain diaphragm 4330 or the space between filling strain diaphragm 4330 and fixing block 4310 makes strain diaphragm 4330 expand with convex substrate S upward 1, illustrated by Fig. 5 and Fig. 7.Now, because upper substrate S1 is attached to adhesive chuck 4320, thus power the expansive force with strain diaphragm 4330 side in the opposite direction on produce.Therefore, the fixing block 4310 of substrate holder unit 4300 is moved backward by mobile member 4340 respectively.When nitrogen supplies to the rear side of strain diaphragm 4330, the strain diaphragm 4330 of expansion removes upper substrate S1 from adhesive chuck 4320.Therefore, upper substrate S1 removes from top holder 4100 completely, and is placed on lower substrate S2.
Therefore, when strain diaphragm 4330 expands to unload upper substrate S1, substrate holder unit 4300 is moved backward by mobile member 4340, and then reduces or prevent the expansion according to strain diaphragm 4330 and be applied to the stress of upper substrate S1.Therefore, prevent upper substrate S1 to be damaged in the uninstall process removing upper substrate S1 from top holder 4100, and prevent upper substrate S1 and lower substrate S2 because unloading upper substrate S1 and misalignment.
In addition, because employ strain diaphragm 4330 (its be drive source for moving substrate holding unit 4300 backward and in the prior art for unloading upper substrate S1), be unnecessary for the drive part of moving substrate holding unit 4300 backward.In addition, because substrate holder unit 4300 entirety being provided with adhesive chuck 4320 is moved backward by strain diaphragm 4330, so substrate easily removes from adhesive chuck 4320.
When removing upper substrate S1 from top holder 4100 and placing it on lower substrate S2, closed second gas pipeline that is arranged on arranges that valve 4470 on 4460 is to stop the supply of nitrogen.After this, when at discharge duct, opening installation arranges that valve 4450 on 4440 is operate exhaust pump 4420, by nozzle 4480, branched pipe 4481, second extensional pipeline arrange 4410 and second gas pipeline arrange 4460 inert gases of discharging the rear side of filling strain diaphragm 4330.Therefore, as illustrated in fig. 8, the strain diaphragm 4330 of expansion shrinks to turn back to its reset condition (that is, flat condition), and then substrate holder unit 4300 also moves forward to turn back to its reset condition.Then, top holder 4100 moves up, and upper substrate S1 is removed.
As mentioned above, after strain diaphragm 4330 turns back to its reset condition, top holder 4100 moves up.Or after holder 4100 moves up up, strain diaphragm 4330 can turn back to its reset condition.
After this, holder 2000 removes engaged upper substrate S1 and lower substrate S2 from below, is moved to separate curing device.Then, when light (such as, ultraviolet) is transmitted into sealant from solidification equipment, sealant cures is mutually to adhere to upper substrate S1 and lower substrate S2 completely.
In the aforementioned embodiment, substrate holder unit 4300 is applied to the top holder 4100 for fixing upper substrate S1.But, the present invention is not limited thereto, and therefore, substrate holder unit 4300 may be used on below holder 2000.
In addition, substrate holder unit 4300 is applied to substrate junction apparatus, but the present invention is not limited thereto.Therefore, the various substrate-treating apparatus that substrate holder unit 4300 may be used on needing fixing, fixes and remove substrate, such as, for the formation of depositing device or the etching machines of film.
According to one exemplary embodiment, when strain diaphragm expands to unload substrate, substrate holder unit is moved backward by mobile member.Therefore, the stress being applied to substrate according to the expansion of strain diaphragm reduces, and then prevents substrate to be damaged in substrate uninstall process.In addition, can prevent upper substrate and lower substrate because of the stress applied from strain diaphragm misalignment.
In addition, because employ strain diaphragm (its be drive source for moving substrate holding unit backward and for unloading substrate), be unnecessary for the drive part of moving substrate holding unit backward.In addition, because the substrate holder unit entirety being provided with adhesive chuck is moved by strain diaphragm, backward so substrate easily removes from adhesive chuck.
Although substrate fixing module and the substrate-treating apparatus comprising described substrate fixing module are described referring to particular exemplary embodiment, it is not limited thereto.Therefore, those skilled in the art should be readily appreciated that when do not depart from defined by the appended claims the spirit and scope of the present invention can carry out various amendment and change to it.
Claims (14)
1. a substrate fixing module, is characterized in that comprising:
Holder, has the surface of holding substrate; And
Substrate holder unit, is inserted in described holder,
Wherein said substrate holder unit comprises:
Fixing block, to be inserted in described holder and to have the surface of substrate described in fixing,
Strain diaphragm, to be arranged on described fixing block and to have the surface exposed by the surface of described fixing block, and
Mobile member, is arranged in described holder, and one end of wherein said mobile member is connected to described fixing block, the described fixing block and described mobile member moves up in the side contrary with the deformation direction of described strain diaphragm.
2. substrate fixing module according to claim 1, comprises adhesive chuck, and at least side that described adhesive chuck is arranged on described strain diaphragm is arranged on described fixing block with substrate described in adhesion strength fixing.
3. substrate fixing module according to claim 2, wherein said holder has the insertion space of inserting for described substrate holder unit;
The one end being arranged on the described mobile member in described insertion space is connected to described fixing block, and its other end is connected to described holder; And
Described fixing block moves forward to described substrate by described mobile member in described insertion space, or moves backward on the direction away from described substrate.
4. substrate fixing module according to claim 3, wherein said mobile member comprises:
Main body, has inner space, and one end of wherein said main body is connected to described fixing block, and its other end by described holder in described insertion space;
Elastic component, is arranged in described main body; And
Bar, there is the one end being inserted in described main body and being connected to described elastic component, the other end of wherein said bar is given prominence to from described main body and is connected to described fixing block, and described bar moves forward to described substrate by described elastic component or moves backward on the direction away from described substrate.
5. substrate fixing module according to claim 4, wherein said elastic component comprises spring.
6. substrate fixing module according to claim 2, wherein multiple protuberance is formed on the surface of described adhesive chuck.
7. substrate fixing module according to claim 1, comprises vacuum hole, and described vacuum hole is extended perpendicularly through described holder and has the one end exposed by the described surface of the described holder of substrate described in fixing.
8. the substrate fixing module according to claim arbitrary in claim 1 to 7, wherein said holder has spaced multiple insertion space on the bearing of trend of described holder; And
Described substrate holder unit is arranged with multiple, is arranged on respectively in described insertion space.
9. substrate fixing module according to claim 8, wherein said vacuum hole is arranged with multiple, on described holder between described substrate holder unit of the outer setting of multiple substrate holder unit.
10. a substrate-treating apparatus, is characterized in that comprising:
Chamber, has inner space, and in described inner space, upper substrate and lower substrate are bonded with each other;
Below holder, install in the cavity, wherein said lower substrate is placed on the holder of described below;
Top holder, to be arranged on above the holder of described below and in the face of described below holder is with upper substrate described in fixing; And
Substrate holder unit, being inserted in the holder of described top and being provided with the strain diaphragm that the side to the described top holder of upper substrate described in fixing exposes, wherein said substrate holder unit has elastic force and moves up in the side contrary with the deformation direction of described strain diaphragm to make described substrate holder unit.
11. substrate-treating apparatus according to claim 10, wherein said substrate holder unit comprises:
Fixing block, to be inserted in the holder of described top and to have the surface of upper substrate described in fixing;
Adhesive chuck, is arranged on described fixing block with upper substrate described in adhesion strength fixing; And
Mobile member, is arranged in the holder of described top, and one end of wherein said mobile member is connected to described fixing block, and described mobile member has elastic force to move up in the side contrary with the described deformation direction of described strain diaphragm,
Wherein said strain diaphragm is arranged on described fixing block in the side of described adhesive chuck.
12. substrate-treating apparatus according to claim 11, comprise multiple vacuum hole, described vacuum hole is extended perpendicularly through described top holder and has the one end exposed by the surface of the described top holder of upper substrate described in fixing, and wherein said vacuum hole is spaced from each other.
13. substrate-treating apparatus according to claim 12, wherein said mobile member comprises:
Main body, is arranged in the holder of described top, is connected to described fixing block to make one end of described main body;
Elastic component, is arranged in described main body; And
Bar, there is the one end being inserted in described main body and being connected to described elastic component, the other end of wherein said bar is given prominence to from described main body and is connected to described fixing block, and described bar moves forward to described upper substrate by described elastic component or moves backward on the direction away from described upper substrate.
14. substrate-treating apparatus according to claim 12 or 13, wherein said substrate holder unit is arranged with multiple, is individually arranged between described vacuum hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0086640 | 2013-07-23 | ||
| KR20130086640 | 2013-07-23 |
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| CN104347467A true CN104347467A (en) | 2015-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410350052.1A Pending CN104347467A (en) | 2013-07-23 | 2014-07-22 | Substrate holding module and substrate processing device comprising same |
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| CN107247351A (en) * | 2016-11-11 | 2017-10-13 | 塔工程有限公司 | Apparatus and method for combining panel |
| CN107390921A (en) * | 2016-11-11 | 2017-11-24 | 塔工程有限公司 | For combining the apparatus and method of panel |
| CN109264403A (en) * | 2017-07-17 | 2019-01-25 | 塔工程有限公司 | Index unit for splice panel and the panel including index unit engage equipment |
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