CN116372786B - Wafer polishing equipment - Google Patents

Wafer polishing equipment Download PDF

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Publication number
CN116372786B
CN116372786B CN202310653791.7A CN202310653791A CN116372786B CN 116372786 B CN116372786 B CN 116372786B CN 202310653791 A CN202310653791 A CN 202310653791A CN 116372786 B CN116372786 B CN 116372786B
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CN
China
Prior art keywords
driving
disc
driving device
bearing
wafer polishing
Prior art date
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Active
Application number
CN202310653791.7A
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Chinese (zh)
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CN116372786A (en
Inventor
郝元龙
寇明虎
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Beijing Tesidi Semiconductor Equipment Co ltd
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Beijing Tesidi Semiconductor Equipment Co ltd
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Application filed by Beijing Tesidi Semiconductor Equipment Co ltd filed Critical Beijing Tesidi Semiconductor Equipment Co ltd
Priority to CN202310653791.7A priority Critical patent/CN116372786B/en
Publication of CN116372786A publication Critical patent/CN116372786A/en
Application granted granted Critical
Publication of CN116372786B publication Critical patent/CN116372786B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/068—Table-like supports for panels, sheets or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The application provides wafer polishing equipment, which is characterized in that a second driving device can be placed below a force transmission piece through the combination of the force transmission piece, a transmission assembly and the second driving device, when a driving ring needs to be driven to rotate, the second driving device transmits power to the force transmission piece from the lower part of a machine shell through the transmission assembly, the force transmission piece further drives the driving ring to rotate, and external force directly acts on the lower part of the driving ring, so that a bearing disc drives a wafer to rotate. In the application, external force directly acts on the driving ring, and the driving ring further drives the bearing disc to rotate, but the mode that the driving pin further drives the bearing disc to rotate is not adopted in the prior art when the external force acts on the driving pin. The prior horizontal arrangement mode between the driving device and the driving ring is adjusted to be arranged along the height direction. Such an arrangement can greatly reduce the space occupied by the entire polishing apparatus in the horizontal direction.

Description

Wafer polishing equipment
Technical Field
The application relates to the technical field of wafer processing equipment, in particular to wafer polishing equipment.
Background
In the chip preparation process, a wafer polishing device is required to be used, the surface of the wafer is polished through the wafer polishing device, and subsequent processing procedures such as further cutting and the like can be performed after the polishing is completed.
In the prior art, a planetary double-sided polishing method is often used for polishing, the structure of the planetary double-sided polishing method comprises an upper processing disc and a lower processing disc, a bearing disc is arranged between the upper processing disc and the lower processing disc, a notch is arranged on the bearing disc, a wafer to be polished is arranged on the bearing disc through the notch, the upper processing disc is used for processing the upper surface of the wafer, and the lower processing disc is used for processing the lower surface of the wafer. Meanwhile, in order to realize the rotation of the bearing plate, a gear tooth structure is arranged at the outer edge of the bearing plate, and the driving device acts on the gear tooth structure to drive the bearing plate to rotate. The driving device comprises: the driving device is started to drive the driving ring to rotate, and the driving ring further drives the driving pin and drives the bearing disc to rotate.
The transmission mode of the force has the following defects: in the process of driving the driving ring, the driving device is arranged at the horizontal side position of the bearing disc, and the driving device occupies the space on the upper part of the lower processing disc, so that the space occupied by the whole device is increased, and the miniaturization of equipment is not facilitated.
Disclosure of Invention
Therefore, the technical problem to be solved by the application is to overcome the defects that the wafer polishing equipment in the prior art occupies a larger space in the horizontal direction and is not beneficial to the miniaturization of the equipment.
To this end, the present application provides a wafer polishing apparatus comprising: a lower processing plate on which a carrier plate is supported; the driving ring is used for driving the bearing disc to rotate, and a space for bearing the wafer is arranged on the bearing disc; the lower end of the force transmission piece extends towards the direction away from the driving ring and forms a power part; the second driving device is provided with a power output end, and the power output end acts on the power part; and the transmission assembly is arranged between the second driving device and the power part.
The wafer polishing device provided by the application is characterized in that the transmission assembly is a gear pair, and the gear pair comprises a first gear arranged at the power output end and a second gear arranged on the transmission assembly.
According to the wafer polishing equipment provided by the application, the third gear is arranged on the force transmission piece at the position corresponding to the second gear.
The wafer polishing equipment provided by the application is characterized in that an annular part is connected with the driving ring; the power part is connected with the annular part and extends towards the second gear, and the third gear is arranged on the power part.
The wafer polishing device provided by the application further comprises: a housing; the first liquid draining part is annularly arranged on the shell and positioned at the outer side of the driving ring, and a liquid draining hole is formed in the first liquid draining part.
According to the wafer polishing equipment provided by the application, the second liquid draining part capable of containing polishing liquid is formed in the force transmission piece, and the second liquid draining part is communicated with the first liquid draining part.
According to the wafer polishing equipment provided by the application, the inner wall of the force transmission piece is provided with at least one notch part, and the notch part is communicated with the first liquid draining part.
The wafer polishing equipment provided by the application further comprises a third liquid discharging part which is arranged below the lower processing disc; and one end of the conveying pipe is communicated with the third liquid draining part, and the other end of the conveying pipe extends into the second liquid draining part.
The wafer polishing device provided by the application further comprises: the support disc is annularly sleeved on the driving shaft, and the force transmission piece is arranged at the upper part of the support disc; the lifting devices are arranged on the shell and are provided with lifting heads, and the end parts of the lifting heads are propped against the lower part of the supporting disc; the third driving device is arranged on the shell, and the power output end of the third driving device is in transmission connection with the lifting device.
The supporting disc comprises a sleeving part and a supporting part which is arranged to extend along the sleeving part, the sleeving part is sleeved on the driving shaft, a first bearing is arranged on the outer wall of the sleeving part, and the outer ring of the first bearing is propped against the inner wall of the force transmission piece.
According to the wafer polishing equipment provided by the application, the shell is provided with the through hole corresponding to the second driving device, the second driving device is provided with the connecting shell, the edge of the supporting part is connected with the connecting shell, and the connecting shell penetrates through the through hole and can be driven by the supporting part to lift in the through hole.
According to the wafer polishing equipment provided by the application, a gap is arranged between the outer ring of the first bearing and the supporting part.
According to the wafer polishing equipment provided by the application, the upper surface of the supporting part is thinned so as to form the gap.
The wafer polishing device provided by the application further comprises: the gland is arranged above the supporting disc, the gland is arranged on the sleeving part, and the lower end face of the gland abuts against the inner ring of the first bearing.
The technical scheme of the application has the following advantages:
1. the wafer polishing equipment provided by the application is characterized in that a force transmission piece is arranged below a driving ring, and the lower end of the force transmission piece extends towards the direction away from the driving ring and forms a power part; the second driving device is provided with a power output end which acts on the power part; the transmission assembly is arranged between the second driving device and the power part.
In the prior art, in order to realize the rotation of the driving ring, external force can directly act on the driving pin, and the driving pin further drives the bearing disc to rotate.
According to the wafer driving device, the second driving device can be placed below the force transmission piece through the combination of the force transmission piece, the transmission assembly and the second driving device, when the driving ring is required to be driven to rotate, the second driving device transmits power to the force transmission piece from the lower side of the machine shell through the transmission assembly, the force transmission piece further drives the driving ring to rotate, external force directly acts on the lower portion of the driving ring, and therefore the wafer driving device is driven to rotate by the bearing disc. In the application, external force directly acts on the driving ring, and the driving ring further drives the bearing disc to rotate, but the mode that the driving pin further drives the bearing disc to rotate is not adopted in the prior art when the external force acts on the driving pin.
Through the arrangement mode, the original horizontal arrangement mode between the driving device and the driving ring in the prior art is adjusted to be arranged along the height direction. Such an arrangement can greatly reduce the space occupied by the entire polishing apparatus in the horizontal direction.
2. The wafer polishing equipment provided by the application further comprises a first liquid discharge part which is annularly arranged on the shell and positioned at the outer side of the driving ring, wherein liquid discharge holes are formed in the first liquid discharge part. Through setting up first flowing back portion, when the polishing solution sprays to the periphery under centrifugal force effect, can collect the polishing solution through first flowing back portion, then discharge to the external world through the flowing back hole. In addition, the driving device is transferred to the lower part of the driving ring, so that the driving device can avoid interference to the top area of the first liquid discharge part, and the polishing equipment provided by the application is very convenient for cleaning the first liquid discharge part, so that inconvenience caused by dismantling the driving device when the driving device is arranged in a horizontal position in the prior art is avoided.
3. According to the wafer polishing equipment provided by the application, the second liquid draining part capable of containing polishing liquid is formed in the force transmission piece, and the second liquid draining part is communicated with the first liquid draining part.
When the bearing plate rotates, the part of the polishing liquid on the lower polishing head inevitably flows downwards directly, the polishing liquid flowing downwards directly enters the second liquid draining part, then enters the first liquid draining part through the second liquid draining part and further flows out to the outside, so that the pollution to structures such as force transmission parts and the like is avoided.
4. The wafer polishing equipment provided by the application is characterized in that at least one notch part is arranged on the inner wall of the force transmission piece, and the notch part is communicated with the first liquid draining part. The arrangement of the notch portion can effectively reduce the overall mass of the force transmission piece, so that the torque born by the driving device is reduced. In addition, through setting up the notch, when also can conveniently wasing inner structure, tools such as brush can directly enter into the inboard of passing the power piece through the notch to conveniently wasing.
5. The wafer polishing device provided by the application further comprises: the support disc is annularly sleeved on the driving shaft, and the force transmission piece is arranged at the upper part of the support disc; the lifting devices are arranged on the shell and are provided with lifting heads, and the end parts of the lifting heads are propped against the lower part of the supporting disc; the third driving device is arranged on the shell, and the power output end of the third driving device is in transmission connection with the lifting device.
According to the application, the lifting device is driven to lift by the third driving device, the lifting device further drives the supporting disc to lift, and the lifting device further drives the supporting disc to lift.
6. According to the wafer polishing equipment provided by the application, the gap is arranged between the outer ring of the first bearing and the supporting part. By providing the slit, when the outer ring of the first bearing rotates, it does not rub against the supporting portion, thereby ensuring smooth rotation of the outer ring of the first bearing.
7. The wafer polishing device provided by the application further comprises: the gland is arranged above the supporting disc, the gland is arranged on the sleeving part, and the lower end face of the gland abuts against the inner ring of the first bearing. The gland is simultaneously acted on the sleeving part and the inner ring, so that the stability of the first bearing on the supporting disc can be improved, and the first bearing is prevented from falling off.
8. According to the wafer polishing equipment provided by the application, the shell is provided with the through hole corresponding to the second driving device, the second driving device is provided with the connecting shell, the edge of the supporting part is connected with the connecting shell, and the connecting shell penetrates through the through hole and can be driven by the supporting part to lift in the through hole.
In the application, besides the lifting of the force transmission piece, in order to ensure that the transmission assembly and the second driving device can synchronously lift, the connecting shell is independently arranged, the edge of the supporting part is connected to the connecting shell, and meanwhile, the through hole is formed in the shell, so that the second driving device, the transmission assembly and the force transmission piece can synchronously lift under the driving of the supporting part, and the problem of error in butt joint caused by the fact that the force transmission piece and the transmission assembly cannot synchronously lift is avoided.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present application, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a wafer polishing apparatus according to the present application;
FIG. 2 is a cross-sectional view of a wafer polishing apparatus provided by the present application;
FIG. 3 is a schematic view of a first liquid draining part according to the present application;
FIG. 4 is a cross-sectional view of a lifting device provided by the present application;
FIG. 5 is a schematic view of a portion of a wafer polishing apparatus according to the present application;
FIG. 6 is a partial cross-sectional view of a wafer polishing apparatus provided by the present application;
fig. 7 is a partial enlarged view of the area a in fig. 2.
Description of the reference numerals in the examples:
1-a shell; 2-driving shaft; 3-a first drive means; 4-a lower processing disc; 5-a second drive means; 6-a force transmission piece; 61-a ring; 62-a power section; 7-driving ring; 8-a first gear; 9-a second gear; 10-a first liquid discharge part; 11-a liquid discharge hole; 12-a second liquid discharge part; 13-notch portion; 14-a third liquid discharge part; 15-a conveying pipe; 16-a support plate; 161-sleeving part; 162-a support;
17-lifting device; 171-a housing; 172-lifting head; 173-an inner sleeve; 174—a second bearing;
18-a third drive; 19-a first bearing; 20-through holes; 21-a connection housing; 22-slit; 23-pressing plate; 24-sprocket.
Detailed Description
The following description of the embodiments of the present application will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the application are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present application described below may be combined with each other as long as they do not collide with each other.
Examples
The present embodiment provides a wafer polishing apparatus for performing a polishing operation on a surface of a wafer, and it should be noted that the wafer indicated in the present embodiment may also be referred to as a wafer. Specifically, as shown in fig. 1 to 7, the wafer polishing apparatus includes:
a lower processing tray 4 on which a carrier tray is supported;
specifically, the carrier plate is used for supporting the wafer, and the upper end surface of the lower processing plate 4 is provided with a processing surface for polishing the lower end surface of the wafer on the carrier plate; as an embodiment, the lower processing disc 4 may have polishing tools such as polishing cloth placed thereon, and after the lower processing disc rotates, it drives the polishing cloth to rotate, and then drives the polishing cloth to perform polishing operation on the lower surface of the wafer. In this embodiment, the bearing disc may be made of plastic, and the bearing disc has external teeth, and external force acts on the external teeth to drive the bearing disc to rotate;
the driving ring 7 is used for driving the bearing disc to rotate, and a space for bearing the wafer is arranged on the bearing disc;
specifically, the manner of transmission between the drive ring 7 and the carrier plate is not limited. As an implementation manner, the driving ring 7 and the bearing disc can be driven by the driving pin, the driving ring is provided with the pin arranged along the vertical direction, and the pin can be clamped with the bearing disc and further drives the bearing disc to complete rotation.
In this embodiment, as an implementation manner, the driving pin may be a single cylindrical pin, and further, in order to improve smoothness of rotation, a sleeve structure may be disposed outside the driving pin, where the sleeve structure rotates relative to the cylindrical pin.
A force transmission member 6 annularly arranged below the driving ring 7, wherein the lower end of the force transmission member 6 extends in a direction away from the driving ring 7 and forms a power part 62;
a second driving device 5, on which a power output end is provided, said power output end acting on said power section 62;
and a transmission assembly arranged between the second driving device 5 and the power part 62.
As shown in fig. 2, the driving ring 7 is arranged above the force transmission member 6, the force formed by the power output end of the second driving device 5 further acts on the force transmission member 6 through the transmission assembly, the force transmission member 6 can rotate itself, the force transmission member further transfers the force to the driving ring 7, and the driving ring further drives the bearing disc to rotate.
In this embodiment, the force-transmitting member 6 itself has a ring-like structure, and a chamber is formed inside the force-transmitting member 6. The external power drives the force transfer piece 6 through the lower part of the force transfer piece 6.
Specifically, the force-transmitting member 6 may be disposed in a regular bowl shape, or may be of a discontinuous structure, as long as it has a ring-like structure as a whole.
Through the combination of the power transmission piece, the transmission assembly and the second driving device along the height direction, the second driving device can be placed at the lower part of the power transmission piece, when the driving ring is required to be driven to rotate, the second driving device transmits power to the power transmission piece from the lower part of the power transmission piece through the transmission assembly, the power transmission piece further drives the driving ring to rotate, external force directly acts on the lower part of the driving ring, and therefore the bearing disc is driven to rotate, and the mode that the bearing disc is further driven to rotate by the driving pin is not the external force acting on the driving pin adopted in the prior art.
Through the arrangement mode, the original horizontal arrangement mode between the driving device and the driving ring in the prior art is adjusted to be arranged along the height direction. The arrangement mode can greatly reduce the space occupied by the whole polishing equipment in the horizontal direction, and in addition, by adopting the arrangement mode, the driving device can not interfere the upper part of the lower processing disc, so that the smooth proceeding of the polishing operation is ensured.
In this embodiment, as shown in fig. 1, the method further includes:
a housing 1 on which a drive shaft 2 is provided;
as shown in fig. 2, the drive shaft 2 itself extends in the height direction, and a foundation on which the lower processing disk 4 can be rotated can be formed by providing the drive shaft 2;
a first driving device 3 provided on the drive shaft 2;
as shown in fig. 2, the second driving device 5 is disposed on the left side of the first driving device 3, in this embodiment, the first driving device 3 is disposed at the center of the casing 1, and the second driving device 5 includes a driving motor and a power output end disposed on the driving motor, where the power output end may be a power output shaft, and the torque of the driving motor is transmitted to the outside through the power output shaft.
In this embodiment, the structure of the transmission assembly itself is not limited, as long as the transmission operation can be realized:
as an embodiment, as shown in fig. 2, the transmission assembly is a gear pair, the gear pair includes a first gear 8 disposed at the power output end, and a second gear 9 disposed on the transmission assembly, the second driving device 5 is started to drive the power output end to rotate, and the first gear 8 further drives the second gear 9 to rotate, so as to rotate the rear force transmission member 6 to serve as a power basis;
as a further embodiment, the transmission assembly may be a belt transmission, or any transmission known in the art, as long as the power of the first drive means 3 can be transmitted to the force-transmitting member 6. When belt transmission is adopted, the belt tensioning is arranged on the power output end and the force transmission piece 6, and in order to improve transmission efficiency, chain wheels 24 can be respectively arranged on the power output end and the force transmission piece 6, and at the moment, the belt tensioning can be transmitted through a chain.
Further, when the gear pair is used for transmitting force, in order to realize the force transmission action between the second gear 9 and the force transmission member 6, a third gear is arranged on the force transmission member 6 at a position corresponding to the second gear 9. The rotation of the force-transmitting member 6 is achieved by the cooperation of the second gear wheel 9 and the second gear wheel 9.
As a further embodiment, the second gear wheel 9 and the force-transmitting member 6 may also be driven by a belt, in which case the belt is tensioned against the transmission shaft of the second gear wheel 9 and against the outer surface of the force-transmitting member 6.
In this embodiment, the specific structure of the force transmitting member 6 is not limited, and only an annular structure can be formed and the driving ring 7 can be driven to rotate:
as an embodiment the force-transmitting member 6 comprises a ring-shaped portion 61 and a power portion 62 arranged on said ring-shaped portion 61 and extending towards said second gear wheel 9, said third gear wheel being arranged on said power portion 62.
Specifically, the annular portion 61 is provided at an upper portion of the power portion 62, and an inner diameter of the annular portion 61 is larger than an inner diameter of the power portion 62, so that the shape of the entire force transmitting member 6 assumes a shape with a large upper portion and a small lower portion. Meanwhile, the third gear may be a tooth structure arranged outside the power portion 62, or may be a complete gear, which is sleeved on the power portion 62 and is in interference fit with the power portion 62.
It should be noted that the side wall of the force-transmitting member 6 itself may be of continuous construction, which may be shaped like a bowl without a base; as a further embodiment, the side walls of the force-transmitting element 6 may also be provided with notches or hollows, as long as the overall strength and force-transmitting effect are not impaired.
In this embodiment, when the polishing apparatus performs polishing, a polishing liquid is used, and a part of the polishing liquid flows out of the wafer during the polishing operation, so the embodiment further includes: the first liquid drain 10 is annularly provided on the casing 1 and located outside the driving ring 7, and the first liquid drain 10 is provided with a liquid drain hole 11.
By providing the first liquid discharge portion 10, when the polishing liquid is sprayed to the outside by the centrifugal force, the polishing liquid can be collected by the first liquid discharge portion 10 and then discharged to the outside through the liquid discharge hole 11. In addition, by transferring the driving device to the lower part of the driving ring 7, the driving device can avoid interference to the top area of the first liquid discharge part 10, because the polishing equipment provided by the application is very convenient for cleaning the first liquid discharge part 10, the inconvenience caused by the operation of dismantling the driving device when the horizontal position arrangement is adopted in the prior art is avoided.
Specifically, the first liquid discharge portion 10 itself has a groove-like structure, which is fixed to the casing 1 and is provided with a liquid discharge hole 11 thereon, as shown in fig. 1 and 2, and the polishing liquid entering the inside of the first liquid discharge portion 10 flows out to the outside through the liquid discharge hole 11. In this embodiment, the first liquid draining portion 10 may adopt a circular ring structure or a polygonal structure, and a concave region is formed under the first liquid draining portion 10, so that the polishing liquid entering the first liquid draining portion 10 may be continuously collected in the concave region, and the liquid draining hole 11 is also disposed in the concave region.
In the wafer polishing apparatus provided in this embodiment, the second liquid draining portion 12 capable of containing the polishing liquid is formed in the force transmitting member 6, and the second liquid draining portion 12 is communicated with the first liquid draining portion 10. When the bearing plate rotates, the part of the polishing liquid on the lower polishing head inevitably flows downwards directly, the polishing liquid flowing downwards directly enters the second liquid discharging part 12, then enters the first liquid discharging part 10 through the second liquid discharging part 12 and further flows out to the outside, so that the pollution to the structures such as the force transmission piece 6 is avoided.
Specifically, the communication method between the first liquid discharge portion 10 and the second liquid discharge portion 12 is not limited, and a liquid guide tube may be provided between the first liquid discharge portion 10 and the second liquid discharge portion 12. In this embodiment, as shown in fig. 5, at least one notch portion 13 is provided on the inner wall of the force-transmitting member 6, and the notch portion 13 communicates with the first liquid discharge portion 10.
Further, in the present embodiment, the wafer polishing apparatus further includes a third liquid discharging portion 14 disposed below the lower processing tray 4; and a transfer pipe 15 having one end communicating with the third liquid discharge portion 14 and the other end extending into the second liquid discharge portion 12.
Specifically, during the rotation of the lower processing disc 4, the polishing solution carried on the polishing cloth thereon gradually flows downward, and at this time, in order to avoid corrosion of the first driving device 3 by the polishing solution, a third liquid draining portion 14 is formed in the embodiment, and as shown in fig. 2, the third liquid draining portion 14 is arranged in an annular groove. Meanwhile, in order to discharge the polishing liquid in the third liquid discharge portion 14 to the outside, a transfer pipe 15 is provided in the third liquid discharge portion 14, and as shown in fig. 6, the inner end of the transfer pipe 15 is connected to the lowermost end of the third liquid discharge portion 14, and the other end extends to the outside into the second liquid discharge portion 12.
In this embodiment, as shown in fig. 2 and 4, the method further includes:
the support disc 16 is sleeved on the driving shaft in an annular manner, and the force transmission piece 6 is arranged at the upper part of the support disc 16;
specifically, the supporting disc 16 is sleeved on the driving shaft, and the force transmission piece 6 is driven to synchronously perform lifting motion through lifting motion of the supporting disc 16.
A plurality of lifting devices 17 arranged on the shell 1, wherein the lifting devices 17 are provided with lifting heads 172, and the end parts of the lifting heads 172 are propped against the lower part of the supporting disc 16;
specifically, the lifting device 17 includes a fixed end and a lifting head 172, the fixed end is disposed on the casing 1, and the lifting head 172 can move relative to the casing 1. The support plate 16 is further driven to rise and fall by the rising and falling actions of the elevating head 172.
It should be noted that, in order to ensure stable lifting of the support plate 16, a plurality of lifting devices 17 may be provided, and a plurality of lifting devices 17 may be uniformly arranged at a lower portion of the support plate 16. As shown in fig. 5, the connecting lines between the three elevating devices 17 form a regular triangle, thereby achieving stable support of the support plate 16.
As shown in fig. 4, the third driving device 18 is disposed on the casing 1, and the power output end of the third driving device 18 is in transmission connection with the lifting device 17.
Specifically, the third driving device 18 may adopt a motor, and by setting a transmission structure, the power of the third driving device 18 can be transmitted to the lifting device 17, and further the lifting head 172 is driven to move.
The lifting device 17 is driven to lift through the third driving device 18, the lifting device 17 further drives the supporting disc 16 to lift, the scheme is as a whole, the force transmission piece 6, the driving ring 7 and other structures can drive the bearing disc to move upwards together, so that the bearing disc can be conveniently lifted to a certain distance, polishing cloth and the like on the lower processing disc 4 are conveniently replaced, the force transmission piece 6, the driving ring 7 and the like are also conveniently maintained, and in addition, after the force transmission piece 6 and other structures ascend, the first liquid draining part 10 can be conveniently cleaned.
Further, in this embodiment, the specific structure of the supporting disc 16 is not limited, and the force transmission member 6 can be driven to realize lifting action mainly under the pushing of external force:
as an embodiment, the support disc 16 includes a sleeve portion 161, and a support portion 162 extending along the sleeve portion 161, the sleeve portion 161 is sleeved on the driving shaft, a first bearing 19 is disposed on an outer wall of the sleeve portion 161, and an outer ring of the first bearing 19 abuts against an inner wall of the force transmission member 6.
Specifically, the supporting portion 162 extends outward along the outer wall of the sleeving portion 161, the sleeving portion 161 is arranged in a circular ring shape, and the sleeving portion 161 and the supporting portion 162 can be integrally formed, or can be mounted on the supporting portion 162 in a welding manner. Meanwhile, the sleeve portion 161 and the force transmission member 6 can be directly connected, and at this time, friction force is easily generated between the sleeve portion 161 and the force transmission member 6 due to surface contact. As shown in fig. 2 and 4, the first bearing 19 is thus provided separately in this embodiment, the inner ring of the first bearing 19 being mounted on the outer wall of the sleeve portion 161, and the outer ring of the first bearing 19 being mounted on the inner wall of the force transmitting member 6.
In this embodiment, as shown in fig. 2, in addition to the lifting of the force transmission member 6, in order to ensure that the transmission assembly and the second driving device 5 can synchronously perform lifting operations, a through hole 20 is provided on the casing 1 corresponding to the second driving device 5, a connection housing 21 is mounted on the second driving device 5, an edge of the supporting portion 162 is connected with the connection housing 21, and the connection housing 21 passes through the through hole 20 and can lift in the through hole 20 under the driving of the supporting portion 162.
Specifically, the connection shell 21 is separately arranged on the second driving device 5, the edge of the supporting part 162 is connected to the connection shell 21, meanwhile, the through hole 20 is arranged on the casing 1, and under the driving of the lifting action of the supporting part 162, the second driving device 5, the transmission component and the force transmission component 6 can be synchronously lifted, so that the problem that errors occur when the force transmission component 6 descends and is in butt joint with the force transmission component 6 due to the fact that the force transmission component 6 and the transmission component cannot synchronously lift is avoided.
In addition, the connection manner between the connection housing 21 and the edge of the supporting portion 162 is not limited, and as an embodiment, the supporting portion 162 may be inserted into the connection housing 21, and in this case, an insertion hole needs to be formed in the connection housing 21 correspondingly; as another embodiment, the support portion 162 and the link housing may be connected by welding.
It should be noted that the size of the through-hole 20 itself is larger than the outer diameter of the connection housing 21, thereby ensuring that the connection housing 21 can be lifted up and down in the through-hole 20. Meanwhile, the second driving device 5 comprises a motor and a power output shaft arranged on the motor, the power output shaft is used as a power output end and is connected with the connecting shell 21, so that the effect of driving the whole second driving device 5 to move is achieved.
In this embodiment, as shown in fig. 4, a gap 22 is provided between the outer race of the first bearing 19 and the support portion 162. By providing this slit 22, when the outer race of the first bearing 19 rotates, it does not rub against the support portion 162, thereby ensuring smooth rotation of the outer race of the first bearing 19.
As an embodiment, the upper surface of the supporting portion 162 is thinned to form the slit 22.
As another embodiment, the outer race of the first bearing 19 may be subjected to a thinning operation to form the slit 22 above the supporting portion 162.
Further, as shown in fig. 4, the polishing apparatus further includes: and a gland disposed above the support plate 16, the gland being disposed on the sleeve portion 161, a lower end surface of the gland abutting against an inner ring of the first bearing 19. By simultaneously applying the gland to the sleeve portion 161 and the inner ring, the stability of the first bearing 19 itself on the support plate 16 can be improved, and the first bearing 19 is prevented from coming off.
Specifically, a connection region may be formed at the tip end of the sleeve portion 161, on which the inner ring of the first bearing 19 is mounted; as another embodiment, the gland may be welded directly to the sleeve portion 161, and the gland may extend outward to a position above the inner ring. In this embodiment, the gland may be directly made of metal, so as to facilitate subsequent connection operations.
In the present embodiment, the structure of the lifting device 17 itself is not limited, and as shown in fig. 4, the lifting device 17 includes a housing 171, and the housing 171 is fixed to the casing 1; the lifting head 172 is disposed inside the casing 171, for lifting movement of the lifting head 172, the lifting head 172 is provided with threads on the outside to form a screw-like structure, an inner sleeve 173 is disposed at the bottom of the casing 171, an inner thread is disposed on the inner wall of the inner sleeve 173, the inner sleeve 173 is engaged with the lifting head 172 through the threads, the inner sleeve 173 itself can rotate at the bottom of the casing 171, and meanwhile, lifting movement does not occur, and at this time, in order to improve smoothness of rotation of the inner sleeve 173 itself, a second bearing 174 is disposed between the inner sleeve 173 and the casing 171.
Further, in order to realize the rotation of the inner sleeve 173, a sprocket 24 is disposed on the outer wall of the inner sleeve 173, and a sprocket 24 belt is disposed on the sprocket 24, it should be noted that the movement of the plurality of lifting devices 17 can be realized between the third driving device 18 and the plurality of lifting devices 17 through the same sprocket 24, that is, the sprocket 24 belt can drive the sprocket 24 on each lifting device 17 at the same time.
It should be noted that, the wafer polishing apparatus provided in this embodiment may be used for polishing only one surface of a wafer, or may be used for polishing both the upper surface and the lower surface of the wafer, and when the upper surface of the wafer needs to be polished, the entire polishing apparatus further includes an upper processing disc, which is not shown in the specific structure diagram. At this time, in order to realize the lifting movement or the rotation movement of the upper processing disc, the whole polishing device comprises a lifting frame or a rotating arm, and when the lifting frame is adopted, a lifting mechanism is arranged on the lifting frame, and the upper processing disc is connected on the lifting structure. The lifting mechanism can adopt a threaded screw rod structure, and is simultaneously provided with a related driving motor, and after the driving motor is started, the screw rod is lifted, and then lifting is realized.
Similarly, the upper processing plate is provided with a processing surface, and the rotating direction of the upper processing plate after starting is opposite to the rotating direction of the lower processing plate.
The working process of the wafer polishing device provided in this embodiment is as follows:
the second driving device 5 is started, power is transmitted to the force transmission piece 6 through the first gear 8, the second gear 9 and the third gear in sequence, the force transmission piece 6 further drives the driving ring 7 to rotate, driving pins arranged on the driving ring 7 act on outer teeth of the bearing disc and drive the bearing disc to rotate, and wafers to be polished are placed on the bearing disc;
the lower processing disc 4 performs polishing operation on the lower surface of the wafer, and when double-sided polishing is required to be performed on the wafer, the upper processing disc moves downwards under the drive of the threaded screw rod structure until the upper processing disc moves to the upper surface position of the wafer. At this time, the wafer on the carrier plate is placed between the upper processing plate and the lower processing plate 4, and the upper processing plate and the lower processing plate rotate to polish the upper and lower surfaces of the wafer.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the application.

Claims (10)

1. A wafer polishing apparatus, comprising:
a housing (1);
a lower processing disc (4) on which a carrier disc is supported;
the driving ring (7) is used for driving the bearing disc to rotate, and a space for bearing the wafer is arranged on the bearing disc;
a force transmission member (6) arranged below the drive ring (7), wherein the lower end of the force transmission member (6) extends in a direction away from the drive ring (7) and forms a power part (62);
a second drive device (5) provided with a power output end which acts on the power section (62);
a transmission assembly arranged between the second driving device (5) and the power part (62);
a drive shaft (2) provided on the housing (1);
the support disc (16) is sleeved on the driving shaft (2) in an annular mode, and the force transmission piece (6) is arranged at the upper part of the support disc (16);
the supporting disc (16) comprises a sleeving part (161) and a supporting part (162) extending along the sleeving part (161), the sleeving part (161) is sleeved on the driving shaft (2), a first bearing (19) is arranged on the outer wall of the sleeving part (161), and the outer ring of the first bearing (19) is propped against the inner wall of the force transmission piece (6);
the shell (1) is provided with a through hole (20) corresponding to the second driving device (5), the second driving device (5) is provided with a connecting shell (21), the edge of the supporting part (162) is connected with the connecting shell (21), and the connecting shell (21) penetrates through the through hole (20) and can be driven by the supporting part (162) to lift in the through hole (20);
a gap is arranged between the outer ring of the first bearing (19) and the supporting part (162);
the lifting devices (17) are arranged on the shell (1), the lifting devices (17) are provided with lifting heads, and the end parts of the lifting heads are propped against the lower part of the supporting disc (16);
the third driving device (18) is arranged on the shell (1), and the power output end of the third driving device (18) is in transmission connection with the lifting device (17).
2. The wafer polishing apparatus according to claim 1, wherein the transmission assembly is a gear pair including a first gear (8) provided at the power output end, and a second gear (9) provided on the transmission assembly.
3. Wafer polishing apparatus according to claim 2, characterized in that a third gear is arranged on the force transmission member (6) in correspondence of the second gear (9).
4. A wafer polishing apparatus according to claim 3, wherein the force transmitting member (6) comprises:
an annular portion (61) connected to the drive ring (7);
the power part (62) is connected with the annular part (61) and extends towards the second gear (9), and the third gear is arranged on the power part (62).
5. The wafer polishing apparatus according to any one of claims 1 to 4, further comprising:
the first liquid draining part (10) is annularly arranged on the shell (1) and positioned at the outer side of the driving ring (7), and a liquid draining hole (11) is formed in the first liquid draining part (10).
6. Wafer polishing apparatus according to claim 5, characterized in that the force transmitting member (6) is internally formed with a second liquid discharge portion (12) which can accommodate a polishing liquid, the second liquid discharge portion (12) being in communication with the first liquid discharge portion (10).
7. Wafer polishing apparatus according to claim 6, characterized in that at least one notch (13) is provided on the inner wall of the force-transmitting member (6), the notch (13) being in communication with the first liquid discharge (10).
8. The wafer polishing apparatus as set forth in claim 6, further comprising
A third liquid discharge unit (14) provided below the lower processing tray (4); the method comprises the steps of,
and a conveying pipe (15) with one end communicated with the third liquid draining part (14) and the other end extending into the second liquid draining part (12).
9. The wafer polishing apparatus according to claim 1, wherein an upper surface of the support portion (162) is thinned to form the slit.
10. The wafer polishing apparatus as set forth in claim 9, further comprising:
and the gland is arranged above the supporting disc (16), the gland is arranged on the sleeving part (161), and the lower end surface of the gland abuts against the inner ring of the first bearing (19).
CN202310653791.7A 2023-06-05 2023-06-05 Wafer polishing equipment Active CN116372786B (en)

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CN106312718A (en) * 2016-10-30 2017-01-11 云南蓝晶科技有限公司 Four-drive two-face chip polishing machine
CN208601317U (en) * 2018-03-15 2019-03-15 重庆晶宇光电科技有限公司 Chip is ground device
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CN111515850A (en) * 2020-05-08 2020-08-11 深圳市晶龙达光学实业有限公司 Lens thickness processing system and processing technology thereof
CN113579970A (en) * 2021-07-05 2021-11-02 周勤 Self-rotating efficient polishing equipment for semiconductor wafer silicon wafer
CN114683128A (en) * 2022-06-02 2022-07-01 成都泰美克晶体技术有限公司 Thin wafer edge polishing equipment
CN218697516U (en) * 2022-06-28 2023-03-24 山东力创拓智能装备有限公司 Double-sided chemical mechanical polishing equipment for single crystal diamond wafer
CN116175403A (en) * 2022-12-28 2023-05-30 华海清科股份有限公司 Chemical mechanical polishing driving assembly

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1638057A (en) * 2000-05-12 2005-07-13 多平面技术公司 Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
TW575475B (en) * 2000-09-21 2004-02-11 Nippon Kogaku Kk Polishing apparatus, semiconductor device manufacturing method using the polishing apparatus, and semiconductor device manufactured by the manufacturing method
TW200609081A (en) * 2004-09-14 2006-03-16 M & S Finetech Corp Oscar type double-faced grinder
CN205129541U (en) * 2015-11-23 2016-04-06 云南蓝晶科技股份有限公司 Double track driven wafer grinds flat -bed machine
CN106312718A (en) * 2016-10-30 2017-01-11 云南蓝晶科技有限公司 Four-drive two-face chip polishing machine
CN208601317U (en) * 2018-03-15 2019-03-15 重庆晶宇光电科技有限公司 Chip is ground device
CN210255676U (en) * 2019-08-09 2020-04-07 衢州学院 Sapphire slice free abrasive grinding device
CN110666678A (en) * 2019-09-23 2020-01-10 黄建中 Chemical mechanical planarization equipment
CN111515850A (en) * 2020-05-08 2020-08-11 深圳市晶龙达光学实业有限公司 Lens thickness processing system and processing technology thereof
CN113579970A (en) * 2021-07-05 2021-11-02 周勤 Self-rotating efficient polishing equipment for semiconductor wafer silicon wafer
CN114683128A (en) * 2022-06-02 2022-07-01 成都泰美克晶体技术有限公司 Thin wafer edge polishing equipment
CN218697516U (en) * 2022-06-28 2023-03-24 山东力创拓智能装备有限公司 Double-sided chemical mechanical polishing equipment for single crystal diamond wafer
CN116175403A (en) * 2022-12-28 2023-05-30 华海清科股份有限公司 Chemical mechanical polishing driving assembly

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