CN210255676U - Sapphire slice free abrasive grinding device - Google Patents
Sapphire slice free abrasive grinding device Download PDFInfo
- Publication number
- CN210255676U CN210255676U CN201921285293.7U CN201921285293U CN210255676U CN 210255676 U CN210255676 U CN 210255676U CN 201921285293 U CN201921285293 U CN 201921285293U CN 210255676 U CN210255676 U CN 210255676U
- Authority
- CN
- China
- Prior art keywords
- grinding
- grinding disc
- disc
- annular groove
- liquid discharge
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model relates to a grinding device technical field provides a sapphire section free abrasive grinding device, include: the upper surface of the grinding disc is provided with a plurality of annular grooves with different diameters; each annular groove is connected with a liquid discharge hole, one end of each liquid discharge hole is connected with the annular groove, and the other end of each liquid discharge hole is connected with the peripheral surface of the grinding disc; a check ring capable of contacting or not contacting one end of the drain hole; the feed pipe, the feed pipe sets up the top of abrasive disc, the interval is equipped with a plurality of confession liquid holes on the feed pipe. The utility model has the advantages that the annular groove is arranged on the upper surface of the grinding disc, and the grinding fluid is stored by the annular groove, so that the loss of the grinding fluid is avoided; after the grinding fluid is discharged through the liquid discharge holes, the grinding fluid is supplied to the grinding disc through the liquid supply pipe, so that the grinding fluid on the surface of the grinding disc can be updated quickly, and the processing quality of the grinding disc is improved.
Description
Technical Field
The utility model relates to a grinding device technical field, in particular to sapphire section free abrasive grinding device.
Background
The sapphire single crystal has the characteristics of high hardness, good light transmittance, high wear resistance, good chemical stability, good heat conductivity, electromagnetic insulation property, excellent mechanical property and the like, and is widely used as a window and sapphire wafer material in advanced scientific and technological research of national defense industry and civil fields.
Sapphire is fragile and is a typical difficult-to-process material, and at present, the preparation of a sapphire slice mainly comprises the working procedures of slicing, flattening, polishing and the like. In the flattening process, the free abrasive is mainly used for grinding and removing the cutting marks generated in the wire cutting process, and a smoother surface is obtained, so that a good foundation is provided for subsequent polishing.
In the grinding processing of the free abrasive, the relative rotation speed and the pressure of the sapphire slice and the grinding disc directly influence the processing quality and the processing efficiency, generally, the abrasive in the grinding fluid is supplied between the sapphire slice and the grinding disc during the grinding processing, and meanwhile, the broken abrasive and the grinding dust of the sapphire slice during the grinding are discharged through the gap between the sapphire slice and the grinding disc, so that the relative rotation speed and the pressure of the sapphire slice and the grinding disc are not large. Under high-speed grinding, grinding fluid is more easily thrown out of the grinding disc, so that the grinding materials distributed in the grinding disc are reduced, and the grinding materials are more unevenly distributed along the radial direction under the action of inertia, so that the waste of the grinding materials, the reduction of the processing efficiency and the poorer surface appearance of a processed sample piece are caused. Under higher grinding pressure, the abrasive material that permeates into sapphire section and abrasive disc clearance diminishes, and the difference of abrasive disc material can lead to the embedding effect of abrasive material different simultaneously to the material removal rate of influence processing, and cause the abrasive disc wearing and tearing inhomogeneous.
Therefore, the utility model provides a can improve the grinder of the relative speed and the pressure of sapphire section and abrasive disc.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention is directed to a sapphire slice free abrasive grinding device, which stores grinding fluid by providing an annular groove, so as to avoid uneven distribution of the grinding fluid; through setting up outage and stagnant flow ring, the change of lapping liquid in the control annular groove.
In order to achieve the above purpose, the technical scheme of the utility model is realized like this:
a sapphire slice free abrasive grinding device comprises:
the grinding disc is characterized in that a plurality of annular grooves with different diameters are formed in the upper surface of the grinding disc, and the annular grooves are arranged by taking the axis of the grinding disc as the center of a circle; each annular groove is connected with a liquid discharge hole, one end of each liquid discharge hole is connected with the annular groove, and the other end of each liquid discharge hole is connected with the peripheral surface of the grinding disc;
the flow stopping ring is sleeved on the periphery of the grinding disc and can move along the axial direction of the grinding disc so as to be in contact with or not in contact with one end of the liquid discharge hole;
the feed pipe, the feed pipe sets up the top of abrasive disc, the interval is equipped with a plurality of confession liquid holes on the feed pipe.
Preferably, the surface of the annular groove close to the circumferential surface of the grinding disc is an outer annular surface, one end of the liquid discharge hole is connected with the outer annular surface, the other end of the liquid discharge hole is connected with the circumferential surface of the grinding disc, and the height of the end of the liquid discharge hole connected with the outer annular surface is not lower than the height of the end of the liquid discharge hole connected with the circumferential surface of the grinding disc.
Preferably, the liquid discharge holes are arranged in a radial direction of the abrasive disk.
Preferably, at least two liquid discharge holes are connected to each annular groove.
Preferably, at least two liquid discharge holes connected with the same annular groove are arranged at equal intervals.
Preferably, the inner diameter of the check ring is the same as the diameter of the grinding disc, and the check ring and the grinding disc are coaxially arranged.
Preferably, sapphire section free abrasive grinding device includes elevating system and controller, elevating system includes the cylinder, the cylinder includes telescopic link and cylinder body, the one end setting of telescopic link is in the cylinder body, the other end with only flow ring connects, in order to drive only flow ring edge the axial motion of abrasive disc, the controller with the cylinder electricity is connected, in order to control the motion of telescopic link. Preferably, the projection of each liquid supply hole on the grinding disc is positioned in the annular groove.
Preferably, each of the annular grooves corresponds to at least one of the liquid supply holes.
Preferably, the abrasive disc is horizontally disposed.
Compared with the prior art, the sapphire slice free abrasive grinding device of the utility model has the advantages that the annular groove is arranged on the upper surface of the grinding disc, the grinding fluid is stored by the annular groove, the loss of the grinding fluid is avoided, meanwhile, the grinding pressure between the grinding disc and the sapphire slice can be improved, and the processing efficiency is favorably improved; by arranging the liquid discharge hole and the flow stopping ring, the used grinding liquid in the annular groove can be discharged through the liquid discharge hole, and the opening and closing of the liquid discharge hole are controlled by the flow stopping ring; after the grinding fluid is discharged through the liquid discharge holes, the grinding fluid is supplied to the grinding disc through the liquid supply pipe, so that the grinding fluid on the surface of the grinding disc can be updated quickly, and the processing quality of the grinding disc is improved.
Other features and advantages of the present invention will be described in detail in the detailed description which follows.
Drawings
The accompanying drawings, which form a part hereof, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the invention without undue limitation. In the drawings:
fig. 1 is a schematic structural view of a sapphire slice free abrasive grinding device of the present invention;
FIG. 2 is a schematic structural view of another angle of the sapphire slice free abrasive grinding device of the present invention;
FIG. 3 is a front view of the sapphire slice loose abrasive grinding device of the present invention;
fig. 4 is a top view of the sapphire slice loose abrasive grinding device of the present invention;
fig. 5 is a bottom view of the sapphire slice loose abrasive grinding device of the present invention.
Description of reference numerals:
1 grinding disc 2 flow stop ring
3 liquid supply pipe 4 lifting mechanism
5 annular groove of motor 11
12 liquid discharge hole 31 liquid supply hole
Detailed Description
The following detailed description of the embodiments of the present invention will be made with reference to the accompanying drawings. It is to be understood that the description of the embodiments herein is for purposes of illustration and explanation only and is not intended to limit the invention.
In the present invention, unless otherwise specified, the use of directional terms such as "upper, lower, left, and right" generally means upper, lower, left, and right as illustrated with reference to the accompanying drawings; "inner and outer" refer to the inner and outer relative to the profile of the components themselves. The present invention will be described in detail with reference to the accompanying drawings in conjunction with embodiments.
The utility model provides a sapphire section free abrasive grinding device, as shown in fig. 1 to 5, sapphire section free abrasive grinding device, include:
the grinding disc 1 is cylindrical, the grinding disc 1 comprises an upper surface, a lower surface and a peripheral surface, the upper surface is a working surface, a plurality of annular grooves 11 with different diameters are formed in the upper surface of the grinding disc 1, and the annular grooves 11 are formed by taking the axis of the grinding disc 1 as the center of a circle; each annular groove 11 is connected with a liquid discharge hole 12, one end of each liquid discharge hole 12 is connected with the annular groove 11, and the other end of each liquid discharge hole 12 is connected with the peripheral surface of the grinding disc 1;
the flow stopping ring 2 is sleeved on the periphery of the grinding disc 1 and can move along the axial direction of the grinding disc 1, so that the flow stopping ring is in contact with or not in contact with one end of the liquid discharge hole 12, and the liquid discharge hole 12 is controlled to be closed and unblocked;
the liquid supply pipe 3, the liquid supply pipe 3 sets up the top of abrasive disc 1, the interval is equipped with a plurality of liquid supply holes 31 on the liquid supply pipe 3.
Sapphire section free abrasive grinding device still includes motor 5, the axis of rotation of motor 5 with the axis of abrasive disc 1 is connected in order to drive abrasive disc 1 rotates.
The sapphire slice free abrasive grinding device of the utility model has the advantages that the annular groove 11 is arranged on the upper surface of the grinding disc 1, the grinding fluid is stored by the annular groove 11, the loss of the grinding fluid is avoided, meanwhile, the grinding pressure between the grinding disc 1 and the sapphire slice can be improved, and the processing efficiency is favorably improved; by arranging the liquid discharge hole 12 and the check ring 2, the used grinding liquid in the annular groove 11 can be discharged through the liquid discharge hole 12, and the opening and closing of the liquid discharge hole 12 are controlled by the check ring 2; after the polishing liquid is discharged through the liquid discharge holes 12, the polishing liquid is supplied to the polishing disc 1 through the liquid supply pipe 3, so that the polishing liquid on the surface of the polishing disc 1 can be quickly updated, and the processing quality of the polishing disc 1 is improved.
In the above, in order to facilitate the discharge of the polishing slurry, the annular groove 11 includes an inner annular surface, an outer annular surface and a bottom surface, the surface of the annular groove 11 away from the circumferential surface of the polishing disk 1 is the inner annular surface, the surface of the annular groove 11 close to the circumferential surface of the polishing disk 1 is the outer annular surface, the plane connecting the inner annular surface and the outer annular surface is the bottom surface, one end of the liquid discharge hole 12 is connected to the outer annular surface, the other end is connected to the circumferential surface of the polishing disk 1, and the height of the end of the liquid discharge hole 12 connected to the outer annular surface is not lower than the height of the end connected to the circumferential surface of the polishing disk; preferably, the height of the end of the liquid discharge hole 12 connected to the outer annular surface is the same as the height of the end connected to the circumferential surface of the polishing disc 1. The arrangement enables the grinding fluid in the annular groove 11 to perform centrifugal motion, and the distance between the grinding fluid and the annular groove 11 is close to one side of the outer annular surface, and one end of the liquid discharge hole 12 is connected with the outer annular surface, so that the grinding fluid can be discharged quickly.
Further, the liquid discharge holes 12 are arranged in a radial direction of the abrasive disc 1. Such setting can improve the speed that lapping liquid discharges annular groove 11, is favorable to the quick replacement of lapping liquid.
In order to increase the speed of the slurry discharging from the annular grooves 11, at least two liquid discharge holes 12 are connected to each annular groove 11.
In the above, at least two of the liquid discharge holes 12 connected to the same annular groove 11 are arranged at equal intervals. Such an arrangement facilitates uniform outflow of slurry from different locations in the annular groove 11 out of the annular groove 11.
In order to control the opening and closing of the liquid discharge hole 12, the inner diameter of the check ring 2 is the same as the diameter of the grinding disc 1, the check ring 2 is arranged coaxially with the grinding disc 1, and the check ring 2 can move along the axial direction of the grinding disc 1, so that the check ring 2 is in contact with or not in contact with the liquid discharge hole 12.
In the foregoing, in order to drive the axial motion of the stop ring 2 along the grinding disc 1, the sapphire slice free abrasive grinding device includes an elevating mechanism 4 and a controller, the elevating mechanism 4 includes a cylinder, the cylinder includes a telescopic rod and a cylinder body, one end of the telescopic rod is disposed in the cylinder body, the other end is connected with the stop ring 2 to drive the stop ring 2 to move along the axial motion of the grinding disc 1, and the controller is electrically connected with the cylinder to control the motion of the telescopic rod. In addition, the lifting mechanism 4 may further include a screw-nut pair and a scissor lifting mechanism, when the screw-nut pair is adopted, the screw-nut pair includes a screw and a nut, the screw is in threaded connection with the nut, the flow stopping ring 2 is fixedly connected with the nut, and the screw rotates to drive the nut to move along the axial direction of the screw; when the scissor lifting mechanism is adopted, the scissor lifting mechanism comprises a scissor mechanism and a driving mechanism, the driving mechanism is installed at one end of the scissor mechanism, the flow stopping ring 2 is installed at the other end of the scissor mechanism, and the driving mechanism drives the flow stopping ring 2 to lift through the scissor mechanism.
In order to uniformly distribute the grinding fluid on the grinding disk 1, the grinding disk 1 is horizontally arranged. This arrangement allows the slurry to be evenly distributed over the upper surface of the abrasive disc 1 under the influence of gravity.
In order to reduce the loss of the grinding fluid, the projection of each fluid supply hole 31 on the grinding disk 1 is positioned in the annular groove 11. The arrangement enables the grinding liquid flowing out of the liquid supply hole 31 to naturally drop into the annular groove 11, and the grinding liquid in the annular groove 11 overflows to the upper surface of the grinding disc 1 to grind the sapphire slice.
In order to improve the grinding quality of the grinding disc 1, each annular groove 11 corresponds to at least one liquid supply hole 31. This arrangement allows each of the liquid supply tubes 3 to supply the abrasive liquid to the annular groove 11, so that the distribution of the abrasive liquid is more uniform to improve the grinding quality of the sapphire slices.
When the sapphire slice free abrasive grinding device is used, a sapphire slice is installed on a clamping device and is in contact with the upper surface of a grinding disc 1, a stop ring 2 is in contact with one end of a liquid discharge hole 12, the liquid discharge hole 12 is closed, a liquid storage tank for storing grinding liquid pumps the grinding liquid into a liquid supply pipe 3 through a pump, the grinding liquid flows out through a liquid supply hole 31 and drips into an annular groove 11 until the grinding liquid in the annular groove 11 overflows to the upper surface of the grinding disc 1, a motor 5 drives the grinding disc 1 to rotate, the grinding liquid is distributed between the sapphire slice and the upper surface of the grinding disc 1 to grind the sapphire slice, sapphire chips and abrasive chips enter the annular groove 11 under the centrifugal action and the gravity action, a controller controls a lifting device to drive the stop ring 2 to move along the axial direction of the grinding disc 1, and the stop ring 2 is not in contact with one end of the liquid discharge hole 12, the liquid discharge hole 12 is unblocked, sapphire fragments and abrasive material fragments flow out through the liquid discharge hole 12 along with the grinding fluid, and after a certain time, the controller controls the lifting device to drive the flow stopping ring 2 to move along the axial direction of the grinding disc 1, the flow stopping ring 2 is in contact with one end of the liquid discharge hole 12, and the liquid discharge hole 12 is closed. And the sapphire slice free abrasive grinding device finishes updating the grinding liquid.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A sapphire slice free abrasive grinding device, characterized by includes:
the grinding disc (1), the upper surface of the grinding disc (1) is provided with a plurality of annular grooves (11) with different diameters, and the annular grooves (11) are arranged by taking the axis of the grinding disc (1) as the center of a circle; each annular groove (11) is connected with a liquid discharge hole (12), one end of each liquid discharge hole (12) is connected with the annular groove (11), and the other end of each liquid discharge hole is connected with the peripheral surface of the grinding disc (1);
the flow stopping ring (2) is sleeved on the periphery of the grinding disc (1) and can move along the axial direction of the grinding disc (1) so as to be in contact with or not in contact with one end of the liquid discharging hole (12);
liquid supply pipe (3), liquid supply pipe (3) set up the top of abrasive disc (1), interval is equipped with a plurality of liquid supply holes (31) on liquid supply pipe (3).
2. The sapphire slice free abrasive grinding device according to claim 1, wherein the surface of the annular groove (11) near the circumferential surface of the grinding disc (1) is an outer circumferential surface, one end of the liquid discharge hole (12) is connected with the outer circumferential surface, the other end is connected with the circumferential surface of the grinding disc (1), and the height of the end of the liquid discharge hole (12) connected with the outer circumferential surface is not lower than the height of the end connected with the circumferential surface of the grinding disc (1).
3. The sapphire slice loose abrasive grinding device according to claim 1, wherein the drain hole (12) is provided in a radial direction of the grinding disk (1).
4. The sapphire slice loose abrasive grinding device according to claim 1, wherein at least two drain holes (12) are connected to each annular groove (11).
5. The sapphire slice loose abrasive grinding device according to claim 4, wherein at least two drain holes (12) connected with the same annular groove (11) are arranged at equal intervals.
6. The sapphire slice loose abrasive grinding device according to claim 1, characterized in that the inner diameter of the check ring (2) is the same as the diameter of the grinding disc (1), and the check ring (2) is arranged coaxially with the grinding disc (1).
7. The sapphire slice free abrasive grinding device according to claim 6, wherein the sapphire slice free abrasive grinding device comprises a lifting mechanism (4) and a controller, the lifting mechanism (4) comprises a cylinder, the cylinder comprises a telescopic rod and a cylinder body, one end of the telescopic rod is arranged in the cylinder body, the other end of the telescopic rod is connected with the check ring (2) to drive the check ring (2) to move along the axial direction of the grinding disc (1), and the controller is electrically connected with the cylinder to control the movement of the telescopic rod.
8. The sapphire slice loose abrasive grinding device according to claim 1, wherein the projection of each liquid supply hole (31) on the grinding disc (1) is located in the annular groove (11).
9. The sapphire slice loose abrasive grinding device according to claim 8, wherein each annular groove (11) corresponds to at least one liquid supply hole (31).
10. The sapphire slice loose abrasive grinding device according to claim 1, wherein the grinding disc (1) is horizontally disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921285293.7U CN210255676U (en) | 2019-08-09 | 2019-08-09 | Sapphire slice free abrasive grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921285293.7U CN210255676U (en) | 2019-08-09 | 2019-08-09 | Sapphire slice free abrasive grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210255676U true CN210255676U (en) | 2020-04-07 |
Family
ID=70016603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921285293.7U Active CN210255676U (en) | 2019-08-09 | 2019-08-09 | Sapphire slice free abrasive grinding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210255676U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112548883A (en) * | 2020-12-02 | 2021-03-26 | 西安奕斯伟硅片技术有限公司 | Grinding wheel and grinding equipment |
| CN116372786A (en) * | 2023-06-05 | 2023-07-04 | 北京特思迪半导体设备有限公司 | Wafer polishing equipment |
-
2019
- 2019-08-09 CN CN201921285293.7U patent/CN210255676U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112548883A (en) * | 2020-12-02 | 2021-03-26 | 西安奕斯伟硅片技术有限公司 | Grinding wheel and grinding equipment |
| CN116372786A (en) * | 2023-06-05 | 2023-07-04 | 北京特思迪半导体设备有限公司 | Wafer polishing equipment |
| CN116372786B (en) * | 2023-06-05 | 2023-08-18 | 北京特思迪半导体设备有限公司 | Wafer polishing equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210255676U (en) | Sapphire slice free abrasive grinding device | |
| CN110421481B (en) | Sapphire slice free abrasive grinding device | |
| CN103831682B (en) | Grinding attachment | |
| CN108274386B (en) | Double-layer grinding machine capable of automatically feeding | |
| CN108381345A (en) | A kind of metal pipe material grinding device | |
| CN217143515U (en) | Diamond grinding and polishing machine | |
| CN108621025B (en) | Grinding machine | |
| CN215148033U (en) | Mechanical rheological polishing device | |
| CN206998551U (en) | A kind of cylinder sanding machine | |
| CN109277937A (en) | A kind of low specific-speed centrifugal pump impeller cover burnishing device | |
| CN203109746U (en) | Novel stone edge grinding machine | |
| CN106695527B (en) | A kind of centrifugal pump impeller combined type rotation polishing method | |
| CN112792714A (en) | Grinding and polishing head, metallographic machine and method for achieving dripping of polishing solution from rotating shaft | |
| CN108381371B (en) | Double-layer grinding machine for processing cylindrical workpiece | |
| CN208697052U (en) | A kind of tempered glass edger unit | |
| CN112692654B (en) | Multi-station surgical knife blade edge grinding machine | |
| CN211639402U (en) | Double-end-face grinding machine for ceramics | |
| CN209125480U (en) | A kind of novel centerless grinder wheel protective device | |
| CN208358567U (en) | One kind clearing off machine disk lifting assembly | |
| CN110315425B (en) | Grinding equipment for free abrasive of sapphire wafer | |
| CN103659536B (en) | A kind of difunctional buffing machine that can process roundlet arc angle | |
| CN208744490U (en) | Rotary kiln tyre, support roller and the online grinding device of hydraulic blocking wheel working face | |
| CN108466163B (en) | High-efficiency polishing equipment for diamond and diamond composite sheet | |
| CN219092237U (en) | Novel intelligent grinding machine | |
| CN215035395U (en) | Coaxiality machining tool for engine base with cover |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Quzhou Angtai Machinery Equipment Manufacturing Co.,Ltd. Assignor: QUZHOU University Contract record no.: X2023980035620 Denomination of utility model: Free abrasive grinding device for sapphire slices Granted publication date: 20200407 License type: Common License Record date: 20230517 |