CN110421481B - Sapphire slice free abrasive grinding device - Google Patents
Sapphire slice free abrasive grinding device Download PDFInfo
- Publication number
- CN110421481B CN110421481B CN201910732814.7A CN201910732814A CN110421481B CN 110421481 B CN110421481 B CN 110421481B CN 201910732814 A CN201910732814 A CN 201910732814A CN 110421481 B CN110421481 B CN 110421481B
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- grinding
- grinding disc
- annular groove
- liquid discharge
- discharge hole
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- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 48
- 239000010980 sapphire Substances 0.000 title claims abstract description 48
- 239000007788 liquid Substances 0.000 claims abstract description 97
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 230000003028 elevating effect Effects 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 2
- 238000006073 displacement reaction Methods 0.000 claims 1
- 239000012530 fluid Substances 0.000 abstract description 21
- 230000007246 mechanism Effects 0.000 description 14
- 238000005498 polishing Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 7
- 239000002002 slurry Substances 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to the technical field of grinding equipment, and provides a sapphire slice free abrasive grinding device, which comprises: the upper surface of the grinding disc is provided with a plurality of annular grooves with different diameters; each annular groove is connected with a liquid discharge hole, one end of each liquid discharge hole is connected with the annular groove, and the other end of each liquid discharge hole is connected with the peripheral surface of the grinding disc; a check ring capable of contacting or not contacting one end of the drain hole; the feed pipe, the feed pipe sets up the top of abrasive disc, the interval is equipped with a plurality of confession liquid holes on the feed pipe. According to the invention, the annular groove is arranged on the upper surface of the grinding disc, and the grinding fluid is stored by utilizing the annular groove, so that the loss of the grinding fluid is avoided; after the grinding fluid is discharged through the liquid discharge holes, the grinding fluid is supplied to the grinding disc through the liquid supply pipe, so that the grinding fluid on the surface of the grinding disc can be updated quickly, and the processing quality of the grinding disc is improved.
Description
Technical Field
The invention relates to the technical field of grinding equipment, in particular to a sapphire slice free abrasive grinding device.
Background
The sapphire single crystal has the characteristics of high hardness, good light transmittance, high wear resistance, good chemical stability, good heat conductivity, electromagnetic insulation property, excellent mechanical property and the like, and is widely used as a window and sapphire wafer material in advanced scientific and technological research of national defense industry and civil fields.
Sapphire is fragile and is a typical difficult-to-process material, and at present, the preparation of a sapphire slice mainly comprises the working procedures of slicing, flattening, polishing and the like. In the flattening process, the free abrasive is mainly used for grinding and removing the cutting marks generated in the wire cutting process, and a smoother surface is obtained, so that a good foundation is provided for subsequent polishing.
In the grinding processing of the free abrasive, the relative rotation speed and the pressure of the sapphire slice and the grinding disc directly influence the processing quality and the processing efficiency, generally, the abrasive in the grinding fluid is supplied between the sapphire slice and the grinding disc during the grinding processing, and meanwhile, the broken abrasive and the grinding dust of the sapphire slice during the grinding are discharged through the gap between the sapphire slice and the grinding disc, so that the relative rotation speed and the pressure of the sapphire slice and the grinding disc are not large. Under high-speed grinding, grinding fluid is more easily thrown out of the grinding disc, so that the grinding materials distributed in the grinding disc are reduced, and the grinding materials are more unevenly distributed along the radial direction under the action of inertia, so that the waste of the grinding materials, the reduction of the processing efficiency and the poorer surface appearance of a processed sample piece are caused. Under higher grinding pressure, the abrasive material that permeates into sapphire section and abrasive disc clearance diminishes, and the difference of abrasive disc material can lead to the embedding effect of abrasive material different simultaneously to the material removal rate of influence processing, and cause the abrasive disc wearing and tearing inhomogeneous.
Therefore, the invention provides a grinding device capable of improving the relative rotation speed and pressure of a sapphire slice and a grinding disc.
Disclosure of Invention
In view of this, the present invention provides a sapphire slice free abrasive grinding apparatus, which stores grinding fluid by arranging an annular groove to avoid uneven distribution of the grinding fluid; through setting up outage and stagnant flow ring, the change of lapping liquid in the control annular groove.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a sapphire slice free abrasive grinding device comprises:
the grinding disc is characterized in that a plurality of annular grooves with different diameters are formed in the upper surface of the grinding disc, and the annular grooves are arranged by taking the axis of the grinding disc as the center of a circle; each annular groove is connected with a liquid discharge hole, one end of each liquid discharge hole is connected with the annular groove, and the other end of each liquid discharge hole is connected with the peripheral surface of the grinding disc;
the flow stopping ring is sleeved on the periphery of the grinding disc and can move along the axial direction of the grinding disc so as to be in contact with or not in contact with one end of the liquid discharge hole;
the feed pipe, the feed pipe sets up the top of abrasive disc, the interval is equipped with a plurality of confession liquid holes on the feed pipe.
Preferably, the surface of the annular groove close to the circumferential surface of the grinding disc is an outer annular surface, one end of the liquid discharge hole is connected with the outer annular surface, the other end of the liquid discharge hole is connected with the circumferential surface of the grinding disc, and the height of the end of the liquid discharge hole connected with the outer annular surface is not lower than the height of the end of the liquid discharge hole connected with the circumferential surface of the grinding disc.
Preferably, the liquid discharge holes are arranged in a radial direction of the abrasive disk.
Preferably, at least two liquid discharge holes are connected to each annular groove.
Preferably, at least two liquid discharge holes connected with the same annular groove are arranged at equal intervals.
Preferably, the inner diameter of the check ring is the same as the diameter of the grinding disc, and the check ring and the grinding disc are coaxially arranged.
Preferably, sapphire section free abrasive grinding device includes elevating system and controller, elevating system includes the cylinder, the cylinder includes telescopic link and cylinder body, the one end setting of telescopic link is in the cylinder body, the other end with only flow ring connects, in order to drive only flow ring edge the axial motion of abrasive disc, the controller with the cylinder electricity is connected, in order to control the motion of telescopic link. Preferably, the projection of each liquid supply hole on the grinding disc is positioned in the annular groove.
Preferably, each of the annular grooves corresponds to at least one of the liquid supply holes.
Preferably, the abrasive disc is horizontally disposed.
Compared with the prior art, the sapphire slice dissociative abrasive grinding device has the advantages that the annular groove is formed in the upper surface of the grinding disc, grinding liquid is stored in the annular groove, loss of the grinding liquid is avoided, meanwhile, grinding pressure between the grinding disc and the sapphire slice can be improved, and machining efficiency is improved; by arranging the liquid discharge hole and the flow stopping ring, the used grinding liquid in the annular groove can be discharged through the liquid discharge hole, and the opening and closing of the liquid discharge hole are controlled by the flow stopping ring; after the grinding fluid is discharged through the liquid discharge holes, the grinding fluid is supplied to the grinding disc through the liquid supply pipe, so that the grinding fluid on the surface of the grinding disc can be updated quickly, and the processing quality of the grinding disc is improved.
Additional features and advantages of the invention will be set forth in the detailed description which follows.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic structural view of a sapphire slice free abrasive grinding device according to the present invention;
FIG. 2 is a schematic view of another angle structure of the sapphire slice loose abrasive grinding device of the present invention;
FIG. 3 is a front view of the sapphire slice loose abrasive grinding apparatus of the present invention;
FIG. 4 is a top view of the sapphire slice loose abrasive grinding apparatus of the present invention;
FIG. 5 is a bottom view of the sapphire slice loose abrasive grinding apparatus of the present invention.
Description of reference numerals:
1 grinding disc 2 flow stop ring
3 liquid supply pipe 4 lifting mechanism
5 annular groove of motor 11
12 liquid discharge hole 31 liquid supply hole
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
In the present invention, the use of directional terms such as "upper, lower, left, right" generally means upper, lower, left, right as viewed with reference to the accompanying drawings, unless otherwise specified; "inner and outer" refer to the inner and outer relative to the profile of the components themselves. The present invention will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.
The present invention provides a sapphire slice free abrasive grinding apparatus, as shown in fig. 1 to 5, the sapphire slice free abrasive grinding apparatus includes:
the grinding disc 1 is cylindrical, the grinding disc 1 comprises an upper surface, a lower surface and a peripheral surface, the upper surface is a working surface, a plurality of annular grooves 11 with different diameters are formed in the upper surface of the grinding disc 1, and the annular grooves 11 are formed by taking the axis of the grinding disc 1 as the center of a circle; each annular groove 11 is connected with a liquid discharge hole 12, one end of each liquid discharge hole 12 is connected with the annular groove 11, and the other end of each liquid discharge hole 12 is connected with the peripheral surface of the grinding disc 1;
the flow stopping ring 2 is sleeved on the periphery of the grinding disc 1 and can move along the axial direction of the grinding disc 1, so that the flow stopping ring is in contact with or not in contact with one end of the liquid discharge hole 12, and the liquid discharge hole 12 is controlled to be closed and unblocked;
the liquid supply pipe 3, the liquid supply pipe 3 sets up the top of abrasive disc 1, the interval is equipped with a plurality of liquid supply holes 31 on the liquid supply pipe 3.
Sapphire section free abrasive grinding device still includes motor 5, the axis of rotation of motor 5 with the axis of abrasive disc 1 is connected in order to drive abrasive disc 1 rotates.
According to the sapphire slice free abrasive grinding device, the annular groove 11 is formed in the upper surface of the grinding disc 1, and the grinding fluid is stored in the annular groove 11, so that the loss of the grinding fluid is avoided, meanwhile, the grinding pressure between the grinding disc 1 and a sapphire slice can be improved, and the processing efficiency is favorably improved; by arranging the liquid discharge hole 12 and the check ring 2, the used grinding liquid in the annular groove 11 can be discharged through the liquid discharge hole 12, and the opening and closing of the liquid discharge hole 12 are controlled by the check ring 2; after the polishing liquid is discharged through the liquid discharge holes 12, the polishing liquid is supplied to the polishing disc 1 through the liquid supply pipe 3, so that the polishing liquid on the surface of the polishing disc 1 can be quickly updated, and the processing quality of the polishing disc 1 is improved.
In the above, in order to facilitate the discharge of the polishing slurry, the annular groove 11 includes an inner annular surface, an outer annular surface and a bottom surface, the surface of the annular groove 11 away from the circumferential surface of the polishing disk 1 is the inner annular surface, the surface of the annular groove 11 close to the circumferential surface of the polishing disk 1 is the outer annular surface, the plane connecting the inner annular surface and the outer annular surface is the bottom surface, one end of the liquid discharge hole 12 is connected to the outer annular surface, the other end is connected to the circumferential surface of the polishing disk 1, and the height of the end of the liquid discharge hole 12 connected to the outer annular surface is not lower than the height of the end connected to the circumferential surface of the polishing disk; preferably, the height of the end of the liquid discharge hole 12 connected to the outer annular surface is the same as the height of the end connected to the circumferential surface of the polishing disc 1. The arrangement enables the grinding fluid in the annular groove 11 to perform centrifugal motion, and the distance between the grinding fluid and the annular groove 11 is close to one side of the outer annular surface, and one end of the liquid discharge hole 12 is connected with the outer annular surface, so that the grinding fluid can be discharged quickly.
Further, the liquid discharge holes 12 are arranged in a radial direction of the abrasive disc 1. Such setting can improve the speed that lapping liquid discharges annular groove 11, is favorable to the quick replacement of lapping liquid.
In order to increase the speed of the slurry discharging from the annular grooves 11, at least two liquid discharge holes 12 are connected to each annular groove 11.
In the above, at least two of the liquid discharge holes 12 connected to the same annular groove 11 are arranged at equal intervals. Such an arrangement facilitates uniform outflow of slurry from different locations in the annular groove 11 out of the annular groove 11.
In order to control the opening and closing of the liquid discharge hole 12, the inner diameter of the check ring 2 is the same as the diameter of the grinding disc 1, the check ring 2 is arranged coaxially with the grinding disc 1, and the check ring 2 can move along the axial direction of the grinding disc 1, so that the check ring 2 is in contact with or not in contact with the liquid discharge hole 12.
In the foregoing, in order to drive the axial motion of the stop ring 2 along the grinding disc 1, the sapphire slice free abrasive grinding device includes an elevating mechanism 4 and a controller, the elevating mechanism 4 includes a cylinder, the cylinder includes a telescopic rod and a cylinder body, one end of the telescopic rod is disposed in the cylinder body, the other end is connected with the stop ring 2 to drive the stop ring 2 to move along the axial motion of the grinding disc 1, and the controller is electrically connected with the cylinder to control the motion of the telescopic rod. In addition, the lifting mechanism 4 may further include a screw-nut pair and a scissor lifting mechanism, when the screw-nut pair is adopted, the screw-nut pair includes a screw and a nut, the screw is in threaded connection with the nut, the flow stopping ring 2 is fixedly connected with the nut, and the screw rotates to drive the nut to move along the axial direction of the screw; when the scissor lifting mechanism is adopted, the scissor lifting mechanism comprises a scissor mechanism and a driving mechanism, the driving mechanism is installed at one end of the scissor mechanism, the flow stopping ring 2 is installed at the other end of the scissor mechanism, and the driving mechanism drives the flow stopping ring 2 to lift through the scissor mechanism.
In order to uniformly distribute the grinding fluid on the grinding disk 1, the grinding disk 1 is horizontally arranged. This arrangement allows the slurry to be evenly distributed over the upper surface of the abrasive disc 1 under the influence of gravity.
In order to reduce the loss of the grinding fluid, the projection of each fluid supply hole 31 on the grinding disk 1 is positioned in the annular groove 11. The arrangement enables the grinding liquid flowing out of the liquid supply hole 31 to naturally drop into the annular groove 11, and the grinding liquid in the annular groove 11 overflows to the upper surface of the grinding disc 1 to grind the sapphire slice.
In order to improve the grinding quality of the grinding disc 1, each annular groove 11 corresponds to at least one liquid supply hole 31. This arrangement allows each of the liquid supply tubes 3 to supply the abrasive liquid to the annular groove 11, so that the distribution of the abrasive liquid is more uniform to improve the grinding quality of the sapphire slices.
When the sapphire slice free abrasive grinding device is used, a sapphire slice is arranged on a clamping device and is in contact with the upper surface of a grinding disc 1, a flow stopping ring 2 is in contact with one end of a liquid discharge hole 12, the liquid discharge hole 12 is closed, a liquid storage tank for storing grinding liquid pumps the grinding liquid into a liquid supply pipe 3 through a pump, the grinding liquid flows out through a liquid supply hole 31 and drops into an annular groove 11 until the grinding liquid in the annular groove 11 overflows to the upper surface of the grinding disc 1, a motor 5 drives the grinding disc 1 to rotate, the grinding liquid is distributed between the sapphire slice and the upper surface of the grinding disc 1 to grind the sapphire slice, sapphire scraps and abrasive scraps enter the annular groove 11 under the centrifugal action and the gravity action, a controller controls a lifting device to drive the flow stopping ring 2 to move along the axial direction of the grinding disc 1, and the flow stopping ring 2 is not in contact with one end of the liquid discharge hole 12, the liquid discharge hole 12 is unblocked, sapphire fragments and abrasive material fragments flow out through the liquid discharge hole 12 along with the grinding fluid, and after a certain time, the controller controls the lifting device to drive the flow stopping ring 2 to move along the axial direction of the grinding disc 1, the flow stopping ring 2 is in contact with one end of the liquid discharge hole 12, and the liquid discharge hole 12 is closed. And the sapphire slice free abrasive grinding device finishes updating the grinding liquid.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (7)
1. A sapphire slice free abrasive grinding device, characterized by includes:
the grinding disc (1), the upper surface of the grinding disc (1) is provided with a plurality of annular grooves (11) with different diameters, and the annular grooves (11) are arranged by taking the axis of the grinding disc (1) as the center of a circle; each annular groove (11) is connected with a liquid discharge hole (12), one end of each liquid discharge hole (12) is connected with the annular groove (11), and the other end of each liquid discharge hole is connected with the peripheral surface of the grinding disc (1);
the flow stopping ring (2) is sleeved on the periphery of the grinding disc (1) and can move along the axial direction of the grinding disc (1) so as to be in contact with or not in contact with one end of the liquid discharging hole (12);
the liquid supply pipe (3) is arranged above the grinding disc (1), and a plurality of liquid supply holes (31) are formed in the liquid supply pipe (3) at intervals;
the surface of the annular groove (11) close to the peripheral surface of the grinding disc (1) is an outer annular surface, one end of the liquid discharge hole (12) is connected with the outer annular surface, the other end of the liquid discharge hole is connected with the peripheral surface of the grinding disc (1), and the height of one end of the liquid discharge hole (12) connected with the outer annular surface is not lower than the height of one end of the liquid discharge hole connected with the peripheral surface of the grinding disc (1);
the inner diameter of the check ring (2) is the same as the diameter of the grinding disc (1), and the check ring (2) and the grinding disc (1) are arranged coaxially;
sapphire section free abrasive grinding device still includes elevating system (4), elevating system (4) include that screw nut is vice, screw nut is vice including lead screw and nut, the lead screw with nut threaded connection, only flow ring (2) with nut fixed connection, the lead screw rotates the drive the nut is followed the axial displacement of lead screw.
2. The sapphire slice loose abrasive grinding device according to claim 1, wherein the drain hole (12) is provided in a radial direction of the grinding disk (1).
3. The sapphire slice loose abrasive grinding device according to claim 1, wherein at least two drain holes (12) are connected to each annular groove (11).
4. The sapphire slice loose abrasive grinding device according to claim 3, wherein at least two drain holes (12) connected with the same annular groove (11) are arranged at equal intervals.
5. The sapphire slice loose abrasive grinding device according to claim 1, wherein the projection of each liquid supply hole (31) on the grinding disc (1) is located in the annular groove (11).
6. The sapphire slice loose abrasive grinding device according to claim 5, wherein each annular groove (11) corresponds to at least one liquid supply hole (31).
7. The sapphire slice loose abrasive grinding device according to claim 1, wherein the grinding disc (1) is horizontally disposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732814.7A CN110421481B (en) | 2019-08-09 | 2019-08-09 | Sapphire slice free abrasive grinding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910732814.7A CN110421481B (en) | 2019-08-09 | 2019-08-09 | Sapphire slice free abrasive grinding device |
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| Publication Number | Publication Date |
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| CN110421481A CN110421481A (en) | 2019-11-08 |
| CN110421481B true CN110421481B (en) | 2021-03-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910732814.7A Active CN110421481B (en) | 2019-08-09 | 2019-08-09 | Sapphire slice free abrasive grinding device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113510612A (en) * | 2021-05-14 | 2021-10-19 | 嘉兴星微纳米科技有限公司 | Semiconductor free polishing device and semiconductor polishing method |
| CN116967883B (en) * | 2023-09-21 | 2023-11-24 | 江苏缪斯光电科技有限公司 | Polishing device for lens of sighting telescope |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH07256558A (en) * | 1994-03-18 | 1995-10-09 | Honda Motor Co Ltd | Rotary grinding wheel |
| CN204062011U (en) * | 2014-09-13 | 2014-12-31 | 山东沃亚森曼机械科技有限公司 | A kind of external underground water draws water and recharges hydraulic dual-purpose valve |
| CN105500181A (en) * | 2014-10-10 | 2016-04-20 | 株式会社荏原制作所 | Buffing apparatus, substrate processing apparatus, and buffing method |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3968924B2 (en) * | 1999-09-22 | 2007-08-29 | 三菱マテリアル株式会社 | Single layer whetstone and method for manufacturing the same |
| JP2007144597A (en) * | 2005-11-30 | 2007-06-14 | Tdk Corp | Electrodeposition grindstone and grinding method using it |
| CN104249290B (en) * | 2013-06-28 | 2016-06-22 | 上海华虹宏力半导体制造有限公司 | Milling apparatus has the buffer table device of the second block ring |
| CN108621023B (en) * | 2017-03-20 | 2021-02-02 | 台湾积体电路制造股份有限公司 | Chemical mechanical polishing machine and chemical mechanical polishing process |
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2019
- 2019-08-09 CN CN201910732814.7A patent/CN110421481B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07256558A (en) * | 1994-03-18 | 1995-10-09 | Honda Motor Co Ltd | Rotary grinding wheel |
| CN204062011U (en) * | 2014-09-13 | 2014-12-31 | 山东沃亚森曼机械科技有限公司 | A kind of external underground water draws water and recharges hydraulic dual-purpose valve |
| CN105500181A (en) * | 2014-10-10 | 2016-04-20 | 株式会社荏原制作所 | Buffing apparatus, substrate processing apparatus, and buffing method |
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| CN110421481A (en) | 2019-11-08 |
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Effective date of registration: 20240105 Address after: No.58, Chengnan Road, Nanming street, Xinchang County, Shaoxing City, Zhejiang Province Patentee after: XINCHANG LIANHANG MACHINERY Co.,Ltd. Address before: 324000 North China Road No. 78, Quzhou, Quzhou, Zhejiang Patentee before: QUZHOU University |
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