CN210129491U - Cleaning device for semiconductor wafer - Google Patents
Cleaning device for semiconductor wafer Download PDFInfo
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- CN210129491U CN210129491U CN201921557072.0U CN201921557072U CN210129491U CN 210129491 U CN210129491 U CN 210129491U CN 201921557072 U CN201921557072 U CN 201921557072U CN 210129491 U CN210129491 U CN 210129491U
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Abstract
The utility model discloses a belt cleaning device of semiconductor wafer relates to a belt cleaning device, including wasing the case, wash case rear side below fixedly connected with motor, motor output shaft runs through and washs the case and is connected with the carousel, the eccentric fixedly connected with drive bull stick of department in the carousel outside, it is connected with the fixed axle to wash incasement wall rotation, and fixed axle outside fixedly connected with drive pendulum rod, drive groove have been seted up to drive pendulum rod lower extreme, and the fixed axle cooperatees with the drive groove, drive pendulum rod top fixedly connected with arc washs the bottom plate, and a plurality of locating holes have been seted up on the arc washs the bottom plate, motor output shaft middle part fixedly connected with driving pulley. The utility model discloses simple structure, convenient to use, it is with low costs, be suitable for a small amount of wafers clean, can rinse polylith semiconductor wafer simultaneously when using to the cleaning method that combines together through relative rotational motion and relative horizontal motion washs semiconductor wafer, can fully ensure the cleaning performance.
Description
Technical Field
The utility model relates to a belt cleaning device specifically is a belt cleaning device of semiconductor wafer.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit element structures can be processed on a silicon wafer to form an integrated circuit product with specific electrical functions.
Chinese patent (No. CN 208240615U) discloses a cleaning device for semiconductor wafers, which comprises a cleaning chamber, a quick-discharge quick-flushing chamber, a drying chamber, a transmission system, an acid adding box, a control system and a touch panel, wherein the transmission system is respectively connected with the control system, the cleaning chamber, the quick-discharge quick-flushing chamber and the drying chamber, the acid adding box is connected with the cleaning chamber, and the control system is connected with the touch panel. The cleaning device integrates almost all functions required by cleaning of the semiconductor wafer, reduces the frequency of manual participation, realizes automatic cleaning to the maximum extent, effectively solves various problems existing in the existing cleaning, and has good cleaning effect on the semiconductor wafer, high cleaning yield and good application prospect.
Although the device can clean the semiconductor wafer to the greatest extent in an automated manner, the device is complex in structure, high in cleaning cost, suitable for large-batch cleaning and not suitable for small-quantity wafer cleaning.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a semiconductor wafer's belt cleaning device to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
a cleaning device for semiconductor wafers comprises a cleaning box, wherein a motor is fixedly connected below the rear side of the cleaning box, a motor output shaft penetrates through the cleaning box and is connected with a rotary plate, a driving rotary rod is fixedly connected at the eccentric position of the outer side of the rotary plate, the inner wall of the cleaning box is rotatably connected with a fixed shaft, a driving swing rod is fixedly connected at the outer side of the fixed shaft, a driving groove is formed in the lower end of the driving swing rod, the fixed shaft is matched with the driving groove, an arc-shaped cleaning bottom plate is fixedly connected at the top of the driving swing rod, a plurality of positioning holes are formed in the arc-shaped cleaning bottom plate, a driving belt wheel is fixedly connected at the middle part of the motor output shaft, a transmission shaft is rotatably connected at the rear side of the top of the cleaning box, a driven belt wheel is fixedly connected, the top of the longitudinal cleaning shaft is fixedly connected with a driven bevel gear meshed with the driving bevel gear, the bottom of the longitudinal cleaning shaft is fixedly connected with a cleaning brush, and the cleaning brush is matched with the arc cleaning bottom plate.
As a further aspect of the present invention: the left and right symmetrical bottom of the cleaning box is fixedly connected with supporting pads.
As a further aspect of the present invention: the curvature radius of the arc-shaped cleaning bottom plate is consistent with the rotation radius.
As a further aspect of the present invention: the cleaning box is fixedly connected with a liquid inlet pipe.
As a further aspect of the present invention: the front side wall of the cleaning box is rotatably connected with a box door.
As a further aspect of the present invention: the motor is electrically connected with the power supply through the switch.
As a further aspect of the present invention: and the bottom of the positioning hole is provided with a through hole with the diameter smaller than that of the positioning hole.
As a further aspect of the present invention: the diameter of the driving bevel gear is larger than that of the driven bevel gear.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model discloses simple structure, convenient to use, it is with low costs, be suitable for a small amount of wafers clean, can rinse polylith semiconductor wafer simultaneously when using to the cleaning method that combines together through relative rotational motion and relative horizontal motion washs semiconductor wafer, can fully ensure the cleaning performance, is worth promoting.
Drawings
FIG. 1 is a schematic diagram of a semiconductor wafer cleaning apparatus;
FIG. 2 is a left side view of a semiconductor wafer cleaning apparatus;
FIG. 3 is a schematic diagram of an arc-shaped cleaning bottom plate of the semiconductor wafer cleaning apparatus;
in the figure: 1-cleaning box, 2-motor, 3-rotary table, 4-driving rotary rod, 5-fixed shaft, 6-driving swing rod, 7-driving groove, 8-arc cleaning bottom plate, 9-positioning hole, 10-driving pulley, 11-transmission shaft, 12-driven pulley, 13-transmission belt, 14-driving bevel gear, 15-longitudinal cleaning shaft, 16-driven bevel gear, 17-cleaning brush, 18-supporting pad, 19-liquid inlet pipe, 20-box door and 21-through hole.
Detailed Description
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
The first embodiment is as follows: referring to fig. 1-3, a cleaning device for semiconductor wafers comprises a cleaning box 1, wherein a motor 2 is fixedly connected to the lower portion of the rear side of the cleaning box 1, an output shaft of the motor 2 penetrates through the cleaning box 1 and is connected with a rotary table 3, a driving rotary rod 4 is fixedly connected to an eccentric position on the outer side of the rotary table 3, a fixed shaft 5 is rotatably connected to the inner wall of the cleaning box 1, a driving swing rod 6 is fixedly connected to the outer side of the fixed shaft 5, a driving groove 7 is formed in the lower end of the driving swing rod 6, the fixed shaft 5 is matched with the driving groove 7, the motor 2 rotates to drive the driving rotary rod 4 to rotate through the rotary table 3, then the driving swing rod 6 is driven to swing through the driving;
the top of the driving swing rod 6 is fixedly connected with an arc-shaped cleaning bottom plate 8, a plurality of positioning holes 9 are formed in the arc-shaped cleaning bottom plate 8, the middle of an output shaft of the motor 2 is fixedly connected with a driving belt pulley 10, the rear side of the top of the cleaning box 1 is rotatably connected with a transmission shaft 11, the rear end of the transmission shaft 11 is fixedly connected with a driven belt pulley 12, a transmission belt 13 is sleeved between the driving belt pulley 10 and the driven belt pulley 12, the front end of the transmission shaft 11 is fixedly connected with a driving bevel gear 14, the inner side of the cleaning box 1 is rotatably connected with a longitudinal cleaning shaft 15 through a horizontal fixing rod, the top of the longitudinal cleaning shaft 15 is fixedly connected with a driven bevel gear 16 meshed with the driving bevel gear 14;
when the cleaning device is used, a semiconductor wafer is placed on the arc-shaped cleaning bottom plate 9, then the arc-shaped cleaning plate 9 of the opening device can run in a swinging state in a reciprocating mode, at the moment, the motor 2 drives the driven belt wheel 12 to rotate through the main belt driving wheel 10 and the transmission belt 13 synchronously, then the cleaning brush 17 rotates through bevel gear transmission, the rotation of the cleaning brush 17 is matched with the semiconductor wafer swinging in a reciprocating mode, the semiconductor wafer swinging in an arc shape and the cleaning brush 17 are in a relative horizontal motion state, and therefore cleaning can be achieved to the maximum extent.
The bottom of the cleaning box 1 is fixedly connected with supporting pads 18 in a bilateral symmetry mode.
The curvature radius of the arc-shaped cleaning bottom plate 8 is consistent with the rotation radius.
The cleaning box 1 is fixedly connected with a liquid inlet pipe 19.
The front side wall of the cleaning box 1 is rotatably connected with a box door 20.
The motor 2 is electrically connected with a power supply through a switch.
The diameter of the driving bevel gear 14 is larger than that of the driven bevel gear 16.
Example two: this embodiment is a further improvement of the previous embodiment: the bottom of the positioning hole 9 is provided with a through hole 21 with a diameter smaller than that of the positioning hole 9, the semiconductor wafer is fixed in the positioning hole 9 under the action of atmospheric pressure, and the semiconductor wafer can be conveniently taken down by applying thrust in the through hole 21 when the semiconductor wafer needs to be taken down.
The utility model discloses a theory of operation is: during the use, semiconductor wafer is arranged on the arc cleaning bottom plate 9, then the arc cleaning plate 9 of the opening device can be in the reciprocating operation in the swinging state, at the moment, the motor 2 synchronously drives the driven belt wheel 12 to rotate through the main belt driving wheel 10, the driving belt 13 drives the driven belt wheel 12 to rotate, then the bevel gear transmission is carried out, the cleaning brush 17 is driven to rotate, the rotation of the cleaning brush 17 is matched with the semiconductor wafer in the reciprocating swing, the semiconductor wafer in the arc swing and the cleaning brush 17 are in the relative horizontal motion state, the cleaning can be realized to the maximum extent, the motor 2 rotates to drive the driving rotating rod 4 to rotate through the turntable 3, then the driving groove 7 below the driving oscillating rod 6 drives the driving oscillating rod 6 to swing, and.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. A cleaning device for semiconductor wafers comprises a cleaning box (1), wherein a motor (2) is fixedly connected to the lower portion of the rear side of the cleaning box (1), an output shaft of the motor (2) penetrates through the cleaning box (1) to be connected with a rotary table (3), a driving rotary rod (4) is fixedly connected to the eccentric position of the outer side of the rotary table (3), a fixed shaft (5) is rotatably connected to the inner wall of the cleaning box (1), a driving swing rod (6) is fixedly connected to the outer side of the fixed shaft (5), a driving groove (7) is formed in the lower end of the driving swing rod (6), the fixed shaft (5) is matched with the driving groove (7), the cleaning device is characterized in that an arc cleaning bottom plate (8) is fixedly connected to the top of the driving swing rod (6), a plurality of positioning holes (9) are formed in the arc cleaning bottom plate (8), a driving belt wheel (10) is fixedly, transmission shaft (11) rear end fixedly connected with driven pulley (12), has cup jointed driving belt (13) between driving pulley (10) and driven pulley (12), transmission shaft (11) front end fixedly connected with drive bevel gear (14), it is connected with vertical washing axle (15) to wash case (1) inboard through horizontal fixed rod rotation, vertically washs driven bevel gear (16) that axle (15) top fixedly connected with and drive bevel gear (14) engaged with, vertically washs axle (15) bottom fixedly connected with and washs brush (17), washs brush (17) and arc and washs bottom plate (8) and cooperatees.
2. The cleaning device for semiconductor wafers as claimed in claim 1, characterized in that the bottom of the cleaning tank (1) is fixedly connected with support pads (18) in bilateral symmetry.
3. The apparatus for cleaning a semiconductor wafer as defined in claim 1, wherein the radius of curvature of the arcuate cleaning base (8) coincides with the radius of rotation.
4. The apparatus for cleaning semiconductor wafers as claimed in claim 1, characterized in that the cleaning tank (1) is fixedly connected with a liquid inlet pipe (19).
5. The apparatus for cleaning semiconductor wafers as claimed in claim 1, wherein a door (20) is rotatably attached to a front side wall of the cleaning tank (1).
6. The apparatus for cleaning a semiconductor wafer as defined in claim 1, wherein the motor (2) is electrically connected to a power source through a switch.
7. The semiconductor wafer cleaning apparatus according to any one of claims 1 to 6, wherein the bottom of the positioning hole (9) is provided with a through hole (21) having a diameter smaller than that of the positioning hole (9).
8. The semiconductor wafer cleaning apparatus according to claim 1, wherein the diameter of the drive bevel gear (14) is larger than the diameter of the driven bevel gear (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921557072.0U CN210129491U (en) | 2019-09-19 | 2019-09-19 | Cleaning device for semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921557072.0U CN210129491U (en) | 2019-09-19 | 2019-09-19 | Cleaning device for semiconductor wafer |
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| Publication Number | Publication Date |
|---|---|
| CN210129491U true CN210129491U (en) | 2020-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921557072.0U Active CN210129491U (en) | 2019-09-19 | 2019-09-19 | Cleaning device for semiconductor wafer |
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| CN (1) | CN210129491U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466780A (en) * | 2020-10-29 | 2021-03-09 | 威科赛乐微电子股份有限公司 | Wafer cleaning tank and wafer cleaning method |
-
2019
- 2019-09-19 CN CN201921557072.0U patent/CN210129491U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112466780A (en) * | 2020-10-29 | 2021-03-09 | 威科赛乐微电子股份有限公司 | Wafer cleaning tank and wafer cleaning method |
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