CN216262401U - Arranged megasonic cleaning device for cleaning wafers - Google Patents
Arranged megasonic cleaning device for cleaning wafers Download PDFInfo
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- CN216262401U CN216262401U CN202122519276.9U CN202122519276U CN216262401U CN 216262401 U CN216262401 U CN 216262401U CN 202122519276 U CN202122519276 U CN 202122519276U CN 216262401 U CN216262401 U CN 216262401U
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- 238000004140 cleaning Methods 0.000 title claims abstract description 130
- 235000012431 wafers Nutrition 0.000 title claims abstract description 101
- 239000007788 liquid Substances 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 4
- 238000001514 detection method Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 7
- 239000002245 particle Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000004323 axial length Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000033764 rhythmic process Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Abstract
The utility model discloses an arrangement type megasonic cleaning device for cleaning wafers, which comprises: a cleaning tank; the first driving shaft and the second driving shaft are arranged in the cleaning tank in parallel and can rotate around the center line of the first driving shaft and the second driving shaft in the circumferential direction under the driving of the driving unit; at least two first clamping grooves are formed in the first driving shaft along the length direction, at least two second clamping grooves are formed in the second driving shaft along the length direction, and the second clamping grooves are arranged corresponding to the first clamping grooves; the wafer placing device comprises a first clamping groove, a second clamping groove, a first driving shaft, a second driving shaft and a wafer positioning mechanism, wherein the first clamping groove and the second clamping groove are respectively matched with each other to realize placing of a plurality of wafers; the first driving shaft and the second driving shaft rotate along the same direction, and can drive a plurality of wafers to rotate simultaneously in a friction mode so as to achieve cleaning. The cleaning tank can be used for placing a plurality of wafers for simultaneous cleaning, so that the floor area of the cleaning tank is reduced to the greatest extent on the premise of ensuring the same cleaning efficiency, and the consistency of the cleaning effect of the wafers is ensured.
Description
Technical Field
The utility model belongs to the technical field of semiconductor integrated circuit chip manufacturing, and particularly relates to an arrangement type megasonic cleaning device for cleaning wafers.
Background
The function of cleaning each process unit is to remove the polishing solution residue and other contamination particles on the wafer, and comprises three process units: megasonic cleaning unit, scrubbing unit and drying unit. The megasonic cleaning principle is that a high-frequency alternating current power supply emits high-frequency oscillation current, the high-frequency oscillation current is converted into mechanical vibration waves through a transducer and transmitted into a cleaning medium, so that two phenomena of cavitation and acoustic wave flow are generated in liquid, and particles attached to the surface of a wafer are removed under the resultant force of the two phenomena. The megasonic cleaning has small damage to the surface and can remove particles with the particle size of less than 0.2 mu m.
The problems exist at present: it is known to place wafers in a cleaning tank, separate the wafers by a partition plate, and clean CN206966220U by megasonic waves. The wafer in the scheme is static in the cleaning tank, and the uniformity and consistency of cleaning are poor.
At present, the requirement on the wafer yield of chemical mechanical planarization equipment in unit time is higher and higher, and the working efficiency of a conventional single-groove single-wafer megasonic cleaning mode cannot meet the cleaning requirement. In order to improve the wafer yield, if a plurality of single-wafer megasonic cleaning tanks are arranged, the occupied space of megasonic cleaning is too large, the transmission distance is lengthened, the transmission efficiency is reduced, and the production requirement cannot be met.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides the arrayed megasonic cleaning device for cleaning the wafers, which can simultaneously clean a plurality of wafers, meet higher wafer yield and ensure the uniformity and consistency of cleaning.
The technical scheme adopted by the utility model for solving the technical problems is as follows: an inline megasonic cleaning apparatus for cleaning wafers, comprising:
the cleaning tank is internally provided with a cleaning solution and a megasonic generating device;
the first driving shaft and the second driving shaft are arranged in the cleaning tank in parallel and can rotate around the center line of the first driving shaft and the second driving shaft in the circumferential direction under the driving of the driving unit;
the first driving shaft is provided with at least two first clamping grooves along the length direction, the second driving shaft is provided with at least two second clamping grooves along the length direction, and the second clamping grooves are arranged corresponding to the first clamping grooves;
the wafer placing method comprises the following steps that a plurality of wafers are placed through matching of a first clamping groove and a second clamping groove respectively, and a first driving shaft and a second driving shaft are constructed to be located on two sides of a central axis of each wafer respectively;
the first driving shaft and the second driving shaft rotate along the same direction, and can drive a plurality of wafers to rotate simultaneously in a friction mode so as to achieve cleaning.
Furthermore, the wafer edge device further comprises a driven shaft which is provided with at least two limiting grooves, the first clamping groove and the second clamping groove are located in the same vertical plane, and the edge part of the wafer falls into the limiting grooves.
The cleaning tank can be used for placing a plurality of wafers for simultaneous cleaning, so that the floor area of the cleaning tank is reduced to the greatest extent on the premise of ensuring the same cleaning efficiency, and the consistency of the cleaning effect of the wafers is ensured; when a plurality of wafers are cleaned, the using amount of cleaning fluid in the cleaning tank can be saved, and the cost is reduced; for the transfer of the wafers, a group of mechanical arms can be supported to simultaneously take and place a plurality of wafers, and the transfer is more convenient.
Further, the driven shaft is configured to be positioned below the wafer and offset from a central axis of the wafer. The distance between the megasonic cleaning device and the wafer 5 is relatively short, and the cleaning effect is better.
Furthermore, a gap is formed between the inner wall of the limiting groove and the wafer. The friction resistance of the rotation of the wafer is reduced, and the limiting groove can limit the excessive shaking of the wafer.
Furthermore, the side surface of the limiting groove is in contact with the wafer to drive the driven shaft to rotate, the driven shaft is externally connected with a rotating speed detection unit to monitor the rotating speed of the wafer, and a gap exists between the bottom surface of the limiting groove and the wafer. The wafer drives the driven shaft to synchronously rotate through the limiting groove, so that the rotating speed of the wafer is conveniently monitored; the bottom surface of the limiting groove is not contacted with the wafer, so that the processing precision is reduced, and the processing is convenient.
Further, the rotating speeds of the first driving shaft and the second driving shaft are the same.
Furthermore, one end of the first driving shaft and/or the second driving shaft is connected with the side wall of the cleaning tank, and the other end of the first driving shaft and/or the second driving shaft is connected with the driving unit; or one end of the first driving shaft and/or the second driving shaft is/are suspended in the cleaning tank, and the other end of the first driving shaft and/or the second driving shaft is/are connected with the driving unit.
Further, the driven shaft includes first axis body and second axis body, and this first axis body and the coaxial setting of second axis body, and both adjacent one end unsettled setting.
Furthermore, the first driving shaft and/or the second driving shaft comprise a left shaft body and a right shaft body, and the left shaft body and the right shaft body are coaxially arranged and are driven to rotate by the driving unit respectively. The left side axis body of first driving shaft and the left side axis body of second driving shaft can cooperate and be used for driving the rotatory washing of a batch of wafer, and the left side axis body of second driving shaft and the right side axis body of second driving shaft can cooperate and be used for driving another batch of rotatory washing of wafer, and the rotation of two batches of wafers is relatively independent, and the rotation rate can be different, realizes having the purpose that two kinds of differences wash the rhythm in a washing tank, and it is more various to wash the form, uses more in a flexible way.
Further, the rotating speeds of the left shaft body and the right shaft body are different.
The utility model has the advantages that a plurality of wafers can be placed in the cleaning tank for simultaneous cleaning, so that the floor area of the cleaning tank is reduced to the greatest extent on the premise of ensuring the same cleaning efficiency, and the consistency of the cleaning effect of the wafers is ensured; the requirement of higher chip yield is met; the wafer rotates in the cleaning tank, so that the problems of poor cleaning uniformity and poor consistency are solved; when a plurality of wafers are cleaned, the using amount of cleaning fluid in the cleaning tank can be saved, and the cost is reduced; for the transfer of the wafers, a group of mechanical arms can be supported to simultaneously take and place a plurality of wafers, and the transfer is more convenient.
Drawings
Fig. 1 is a perspective view of an arrayed megasonic cleaning apparatus according to an embodiment of the utility model.
Fig. 2 is a top view of an inline megasonic cleaning apparatus according to one embodiment of the utility model.
Fig. 3 is a cross-sectional view of an inline megasonic cleaning apparatus according to an embodiment of the utility model.
Fig. 4 is a longitudinal cross-sectional view of an inline megasonic cleaning apparatus according to one embodiment of the utility model.
Fig. 5 is a perspective view of the arrayed megasonic cleaning apparatus with the cleaning tank removed, according to a first embodiment of the present invention.
Fig. 6 is a top view of an arrayed megasonic cleaning apparatus according to a second embodiment of the utility model.
Fig. 7 is a transverse cross-sectional view of an inline megasonic cleaning apparatus according to a second embodiment of the present invention.
Fig. 8 is a perspective view of the arrayed megasonic cleaning apparatus of the second embodiment of the present invention with the cleaning tank removed.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example one
An inline megasonic cleaning apparatus for cleaning wafers, comprising:
a cleaning tank 3, the interior of which is provided with cleaning fluid, and the bottom of which is provided with a megasonic generating device 31;
a first driving shaft 1 disposed in the cleaning tank 3 and capable of rotating circumferentially around a center line of the first driving shaft 1 itself under the driving of a driving unit 4; the axial length of the bearing is 60-350 mm;
the second driving shaft 2 is arranged in the cleaning tank 3 in parallel with the first driving shaft 1, and can rotate around the central line of the second driving shaft 2 in the circumferential direction under the driving of a driving unit, and the driving unit can share one driving unit with the driving unit of the first driving shaft 1 or be different; the axial length of the bearing is 60-350 mm;
at least two first clamping grooves 11 are formed in the first driving shaft 1 along the length direction of the first driving shaft;
at least two second clamping grooves 21 are formed in the second driving shaft 2 along the length direction of the second driving shaft, the second clamping grooves 21 are arranged corresponding to the first clamping grooves 11, the correspondence here means that the number of the first clamping grooves 11 corresponds to that of the second clamping grooves 21, and the positions of the first clamping grooves 11 correspond to that of the second clamping grooves 21, specifically, the projection of the first clamping grooves 11 on the side wall of the cleaning tank 3 is overlapped with that of the second clamping grooves 21 on the side wall of the cleaning tank 3, or at least partially overlapped.
Thereby two or more wafer 5 realize placing through the cooperation of first draw-in groove 11 and second draw-in groove 21 respectively, just first driving shaft 1 and second driving shaft 2 are constructed as the both sides that are located the axis of wafer 5 respectively, and every wafer 5 is placed respectively on a set of first draw-in groove 11 and the second draw-in groove 21 that corresponds promptly, and the lateral wall of wafer 5 contacts with the diapire of first draw-in groove 11 and second draw-in groove 21.
The first driving shaft 1 and the second driving shaft 2 rotate along the same direction, and can drive the wafer 5 to rotate simultaneously under the action of friction force, so that the wafer 5 is cleaned in a rotating manner.
Of course, the driven shaft 6 may also include at least two limiting grooves 63, and the limiting grooves 63 are located in the same vertical plane with the first and second clamping grooves 11 and 21. More specifically, the limiting grooves 63 correspond to the number and positions of the first card slots 11 and the second card slots 21. The edge portion of the wafer 5 falls into the stopper groove 63.
The driven shaft 6 is configured to be positioned below the wafer 5 and is disposed offset from the central axis of the wafer 5. Therefore, the distance between the megasonic cleaning device 31 and the wafer 5 is relatively short, and the cleaning effect is better.
A gap is formed between the inner wall of the limiting groove 63 and the wafer 5, a gap exists between the bottom wall of the limiting groove 63 and the side wall of the wafer 5, and a gap also exists between the side wall of the limiting groove 63 and the surface of the wafer 5.
Of course, in another form, the side surface of the stopper groove 63 contacts the surface of the wafer 5, so that the driven shaft 6 is driven to rotate by the friction force, but there is a gap between the bottom surface of the stopper groove 63 and the wafer 5. At this time, the driven shaft 6 is externally connected to the rotation speed detecting unit 64, and since the driven shaft 6 is synchronously rotated by the wafer 5, the rotation speed of the wafer 5 can be indirectly monitored by monitoring the rotation speed of the driven shaft 6.
More specifically, in the present embodiment, as shown in fig. 1 to 5, the first motive shaft 1 and the second motive shaft 2 are powered by the same driving unit 4, in other words, the rotational speeds of the first motive shaft 1 and the second motive shaft 2 are the same. The connection mode of the first driving shaft 1 and the second driving shaft 2 and the driving unit 4 can be direct drive of a motor, belt transmission and the like, and is not limited specifically.
And one end of the first driving shaft 1 is rotatably connected with the side wall of the cleaning tank 3, the other end of the first driving shaft is connected with the driving unit 4, the second driving shaft 2 is arranged in parallel with the first driving shaft 1, one end of the second driving shaft is rotatably connected with the side wall of the cleaning tank 3, and the other end of the second driving shaft is connected with the driving unit 4. Both ends of the driven shaft 6 are connected with the side wall of the cleaning tank 3.
In other embodiments, the above structure may be replaced by that one end of the first driving shaft 1 is connected to the driving unit 4, and the other end is not rotatably connected to the sidewall of the cleaning tank 3, but suspended in the cleaning tank 3; one end of the second driving shaft 2 is connected with the driving unit 4, and the other end of the second driving shaft is not rotatably connected with the side wall of the cleaning tank 3 but is suspended in the cleaning tank 3; one end of the driven shaft 6 is connected with the side wall of the cleaning tank 3, and the other end of the driven shaft is suspended in the cleaning tank 3.
Of course, it can be combined, that is, in the same cleaning tank 3, one end of the first driving shaft 1 is connected with the driving unit 4, and the other end is suspended in the cleaning tank 3, one end of the first driving shaft 1 is connected with the driving unit 4, and the other end is connected with the side wall of the cleaning tank 3, one end of the second driving shaft 2 is connected with the driving unit 4, and the other end is rotatably connected with the side wall of the cleaning tank 3, one end of the second driving shaft 2 is connected with the driving unit 4, and the other end is suspended in the cleaning tank 3, one end of the driven shaft 6 is connected with the side wall of the cleaning tank 3, and the other end is suspended in the cleaning tank 3, both ends of the driven shaft 6 are connected with the side wall of the cleaning tank 3, the first driving shaft 1 and the second driving shaft 2 are driven by the same driving unit 4, the first driving shaft 1 and the second driving shaft 2 are driven by different driving units 4, and the driven shaft 6 is not provided, the nine features can be combined freely without limitation. Three wafers 5 are respectively clamped between three first clamping grooves 11 on the first driving shaft 1 and three second clamping grooves 21 on the second driving shaft 2, and under the condition that the first driving shaft 1 and the second driving shaft 2 rotate along the same direction, the three wafers 5 rotate simultaneously and are cleaned while rotating.
As shown in fig. 4, the follower shaft 6 is located below the wafer 5, between the first drive shaft 1 and the second drive shaft 2, and is offset from the central axis of the wafer 5. Therefore, the driven shaft 6 is located on the central axis of the wafer 5, so that on the premise that the distance between the first driving shaft 1 and the second driving shaft 2 is the largest and the stability of the wafer 5 is guaranteed, the distance between the megasonic cleaning device 31 at the bottom of the cleaning tank 3 and the wafer 5 is relatively shortest, and the cleaning effect is better.
In order to ensure the consistency of the cleaning effect of the wafers, each chemical liquid in the cleaning liquid in each cleaning tank 3 needs to have complex closed-loop flow control, so that the cleaning liquid has accurate proportion, and the same cleaning tank 3 can clean a plurality of wafers 5, so that each wafer 5 can be ensured to be in the cleaning liquid with the same proportion, the cleaning consistency is ensured, and the cost of liquid preparation is reduced. Moreover, compared with a plurality of cleaning grooves and a plurality of wafers 5 placed in one cleaning groove 3, the total volume of cleaning liquid is smaller; a cleaning tank 3 is used for placing a plurality of wafers 5, the distance between every two wafers 5 is small, and a group of mechanical hands can be supported to simultaneously take and place the wafers 5.
Example two
As shown in fig. 6 to 8, the difference between the first embodiment and the second embodiment is that the first driving shaft 1 includes a left shaft 12 and a right shaft 13 coaxially arranged, one end of the left shaft 12 and one end of the right shaft 13 adjacent to each other are arranged in a floating manner, the second driving shaft 2 includes a left shaft 22 and a right shaft 23 coaxially arranged, one end of the left shaft 22 and one end of the right shaft 23 adjacent to each other are arranged in a floating manner, the left shaft 12 of the first driving shaft 1 and the left shaft 22 of the second driving shaft 2 are driven by the same driving unit 4 to rotate synchronously, and the right shaft 13 of the first driving shaft 1 and the right shaft 23 of the second driving shaft 2 are driven by the other driving unit 4 to rotate synchronously.
Therefore, the rotation speeds of the left and right shaft bodies 12 and 13 of the first driving shaft 1 may be different, and the rotation speeds of the left and right shaft bodies 22 and 23 of the second driving shaft 2 may be different.
The driven shaft 6 comprises a first shaft body 61 and a second shaft body 62 which are coaxially arranged, and one ends of the first shaft body 61 and the second shaft body 62 which are adjacent are arranged in a suspended mode.
A batch of wafers 5 can be placed between the first clamping groove 11 of the left shaft body 12 of the first driving shaft 1 and the second clamping groove 21 of the left shaft body 22 of the second driving shaft 2, and are matched with the limiting groove 63 on the first shaft body 61 to be rotationally cleaned.
Another batch of wafers 5 can be placed between the first engaging groove 11 of the right shaft 13 of the first driving shaft 1 and the second engaging groove 21 of the right shaft 23 of the second driving shaft 2, and simultaneously cooperate with the limiting groove 63 on the second shaft 62 to perform rotational cleaning.
Therefore, the two batches of wafers 5 can be respectively driven by different driving units 4 to rotate for cleaning, the rotating cleaning speeds can be different, relatively independent cleaning rhythms are formed, and different cleaning requirements are met.
Of course, the first driving shaft 1 is divided into the left shaft body 12 and the right shaft body 13, the second driving shaft 2 is divided into the left shaft body 22 and the right shaft body 23, and the driven shaft 6 is divided into the first shaft body 61 and the second shaft body 62, which can be combined with the nine features of the first embodiment without limitation.
The foregoing detailed description is intended to illustrate and not limit the utility model, which is intended to be within the spirit and scope of the appended claims, and any changes and modifications that fall within the true spirit and scope of the utility model are intended to be covered by the following claims.
Claims (10)
1. An inline megasonic cleaning apparatus for cleaning wafers, comprising:
a cleaning tank (3) which is internally provided with a cleaning liquid and a megasonic generating device (31);
the first driving shaft (1) and the second driving shaft (2) are arranged in the cleaning tank (3) in parallel and can rotate around the center line of the first driving shaft in the circumferential direction under the driving of the driving unit (4);
at least two first clamping grooves (11) are formed in the first driving shaft (1) along the length direction, at least two second clamping grooves (21) are formed in the second driving shaft (2) along the length direction, and the second clamping grooves (21) are arranged corresponding to the first clamping grooves (11);
the wafer placing method comprises the following steps that a plurality of wafers (5) are placed through matching of a first clamping groove (11) and a second clamping groove (21) respectively, and the first driving shaft (1) and the second driving shaft (2) are located on two sides of a central axis of each wafer (5) respectively;
the first driving shaft (1) and the second driving shaft (2) rotate along the same direction, and can drive a plurality of wafers (5) to rotate simultaneously in a friction mode so as to achieve cleaning.
2. The inline megasonic cleaning apparatus of claim 1, wherein: the wafer clamping device is characterized by further comprising a driven shaft (6) which is provided with at least two limiting grooves (63), the first clamping groove (11) and the second clamping groove (21) are located in the same vertical plane, and the edge portion of the wafer (5) falls into the limiting grooves (63).
3. The inline megasonic cleaning apparatus of claim 2, wherein: the driven shaft (6) is configured to be positioned below the wafer (5) and is disposed offset from a central axis of the wafer (5).
4. The inline megasonic cleaning apparatus of claim 2, wherein: a gap is formed between the inner wall of the limiting groove (63) and the wafer (5).
5. The inline megasonic cleaning apparatus of claim 2, wherein: the side face of the limiting groove (63) is in contact with the wafer (5) to drive the driven shaft (6) to rotate, the driven shaft (6) is externally connected with a rotating speed detection unit (64) to monitor the rotating speed of the wafer (5), and a gap exists between the bottom face of the limiting groove (63) and the wafer (5).
6. The inline megasonic cleaning apparatus of claim 1, wherein: the rotating speeds of the first driving shaft (1) and the second driving shaft (2) are the same.
7. The inline megasonic cleaning apparatus of claim 1, wherein: one end of the first driving shaft (1) and/or the second driving shaft (2) is connected with the side wall of the cleaning groove (3), and the other end of the first driving shaft and/or the second driving shaft is connected with the driving unit (4); or one end of the first driving shaft (1) and/or the second driving shaft (2) is suspended in the cleaning tank (3), and the other end of the first driving shaft and/or the second driving shaft is connected with the driving unit (4).
8. The inline megasonic cleaning apparatus of claim 2, wherein: the driven shaft (6) comprises a first shaft body (61) and a second shaft body (62), the first shaft body (61) and the second shaft body (62) are coaxially arranged, and one ends of the first shaft body and the second shaft body, which are adjacent to each other, are arranged in a hanging mode.
9. The inline megasonic cleaning apparatus of claim 1, wherein: the first driving shaft (1) and/or the second driving shaft (2) comprise a left shaft body and a right shaft body, and the left shaft body and the right shaft body are coaxially arranged and are driven to rotate by the driving unit (4) respectively.
10. The inline megasonic cleaning apparatus of claim 9, wherein: the rotation speed of the left shaft body is different from that of the right shaft body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122519276.9U CN216262401U (en) | 2021-10-19 | 2021-10-19 | Arranged megasonic cleaning device for cleaning wafers |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122519276.9U CN216262401U (en) | 2021-10-19 | 2021-10-19 | Arranged megasonic cleaning device for cleaning wafers |
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| CN216262401U true CN216262401U (en) | 2022-04-12 |
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| CN202122519276.9U Active CN216262401U (en) | 2021-10-19 | 2021-10-19 | Arranged megasonic cleaning device for cleaning wafers |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023066406A1 (en) * | 2021-10-19 | 2023-04-27 | 杭州众硅电子科技有限公司 | Array-type megasonic cleaning device for cleaning wafers |
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- 2021-10-19 CN CN202122519276.9U patent/CN216262401U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023066406A1 (en) * | 2021-10-19 | 2023-04-27 | 杭州众硅电子科技有限公司 | Array-type megasonic cleaning device for cleaning wafers |
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