WO2012171298A1

WO2012171298A1 - Scrubbing device for wafer

Info

Publication number: WO2012171298A1
Application number: PCT/CN2011/082380
Authority: WO
Inventors: 路新春; 裴召辉; 梅赫赓; 何永勇
Original assignee: 清华大学
Priority date: 2011-06-15
Filing date: 2011-11-17
Publication date: 2012-12-20
Also published as: CN102214554A; CN102214554B

Abstract

A scrubbing device for wafer, comprising: a frame; a supporting member, which is located on the frame for rotatably supporting the wafer(40) on the supporting member; and first and second brush components(20、30), which are oppositely and separately mounted on the frame for scrubbing the two sides of the wafer(40) respectively, wherein the first brush component(20) and the second brush component(30) each includes: an active rotary disk(100), which is rotatably mounted on the frame; a brush(200), which is rotatably mounted on the active rotary disk(100) and rotation axis of the active rotary disk(100) is parallel to rotation axis of the brush(200); and a drive component, which is connected to the active rotary disk(100) and the brush(200) respectively to drive the active rotary disk(100) and the brush(200) to rotate about each rotation axis.

Description

Brushing device for wafers

The present invention relates to the field of semiconductor manufacturing, and in particular to a brushing apparatus for a wafer. Background technique

The chemical mechanical polishing process of wafers (hereinafter referred to as CMP process) is recognized as an effective global planarization technology and is widely used in chip manufacturing. After the wafer CMP process, surface impurities such as organic compounds, particles and metal impurities remain on the surface of the wafer, and surface contamination will affect the next process of the wafer, thereby seriously impairing the performance and reliability of the chip. To do this, the wafer needs to be brushed after the CMP process to remove surface contamination.

In the existing brush cleaning device for a wafer, the rotating shaft directly drives the brush to rotate and squeezes the wafer for brushing, and the brush is disengaged when the robot picks up the wafer. When the existing brush cleaning device for the wafer is stopped, the wettability of the brush surface cannot be guaranteed, so if the direct restart is performed, the wafer cleaning effect is affected. In order to ensure the wetting condition of the brush surface during restarting, if the brush is replaced, the cost is greatly increased; and if the liquid is directly injected into the sealed chamber and the brush is wetted, the dynamic seal of the main shaft of the brush may be infiltrated. Secondary pollution; If the brush is removed and infiltrated and then installed, labor and equipment space is wasted and secondary pollution may be introduced. Summary of the invention

The present invention aims to solve at least one of the technical problems existing in the prior art.

To this end, it is an object of the present invention to provide a brushing device for a wafer that can keep the surface of the brush wet. In order to achieve the above object, a brushing device for a wafer is provided according to an embodiment of the present invention, the brushing device for a wafer includes: a frame; a support member, the support member is disposed on the frame For rotatably supporting the wafer on the support; and first and second brush assemblies, the first and second brush assemblies are mounted oppositely and spaced apart from the machine Shearing for respectively cleaning the two side surfaces of the wafer, wherein the first brush assembly and the second brush assembly each comprise: an active rotating disk, the active rotating disk being rotatably mounted on the machine a brush, the brush is rotatably mounted on the active rotating disk and the axis of rotation of the active rotating disk is parallel to the axis of rotation of the brush to be driven by the active rotating disk Having the brush revolve around an axis of rotation of the active rotating disk; and a drive assembly, the drive assembly being coupled to the active rotating disk and the brush, respectively, to drive the active rotating disk and the hair Brushing their respective turns Rotate the axis.

A brushing device for a wafer according to an embodiment of the present invention, wherein the brush is driven to revolve around a rotation axis of the active rotating disk by providing the active rotating disk, since the rotation axis of the active rotating disk is parallel to The axis of rotation of the brush (ie, the axis of rotation of the active rotating disk does not coincide with the axis of rotation of the brush;), so that the dynamic seal of the active rotating disk can be contacted without contact with liquid At least a majority of the brush is submerged in the liquid, and Moreover, the entire surface of the brush can be wetted by the rotation of the brush, so that the cleaning effect of the wafer can be improved. Moreover, the brush can be self-cleaned by self-rotation, so that the service life of the brush can be extended. In addition, the revolving of the brush around the rotation axis of the active rotating disk by the active rotating disk can adjust the pressing amount between the brush and the wafer, thereby further improving the cleaning effect of the wafer.

According to an embodiment of the present invention, the driving assembly includes: a self-rotating shaft and a revolving shaft, the revolving shaft is rotatably mounted on the frame and connected to the active rotating disc to drive the active rotating disc to rotate The rotation axis is set on the rotation axis, the rotation axis of the revolution axis coincides with the rotation axis of the rotation axis; the drive motor unit, the drive motor unit and the rotation axis and the a rotating shaft connected to respectively rotate the rotating shaft and the rotating shaft about respective rotation axes; and a transmission member, wherein the transmission member is respectively connected with the rotation shaft and the brush to pass the rotation shaft through the The transmission member drives the brush to rotate.

According to an embodiment of the present invention, the active rotating disk defines a receiving cavity, and the first end of the rotating shaft extends into the receiving cavity and is rotatably mounted on an inner wall of the active rotating disk. a first end of the brush protrudes into the receiving cavity and is rotatably mounted on the active rotating disk, wherein the transmission member is disposed in the receiving cavity and respectively respectively with the first end of the rotating shaft Connected to the first end of the brush. The structure of the first brush assembly and the second brush assembly can be further improved by defining the receiving cavity in the active rotating disk and by providing the transmission member in the receiving cavity. compact.

According to an embodiment of the present invention, the transmission member includes a first gear and a second gear that are engaged, wherein the first gear is set on a first end of the rotation shaft, and the second gear is disposed in the Said on the first end of the brush.

According to an embodiment of the invention, the transmission member includes a first magnetic wheel and a second magnetic wheel spaced apart from each other, wherein the first magnetic wheel is sleeved on the first end of the rotation shaft, the Two magnetic wheels are placed on the first end of the brush.

According to an embodiment of the present invention, each of the first brush assembly and the second brush assembly further comprises: a driven rotating disk, the driven rotating disk being rotatably mounted on the frame and a rotation axis of the driven rotating disk coincides with an axis of rotation of the active rotating disk, wherein a first end of the brush is rotatably mounted on the active rotating disk and a second end is rotatably mounted on the On the driven rotating disk, the active rotating disk drives the driven rotating disk to rotate by the brush. This allows the brush to rotate more stably (including revolution and rotation).

According to an embodiment of the invention, the first brush assembly and the second brush assembly each further comprise: a connecting rod, the first end of the connecting rod is connected to the active rotating disc and the second end is The driven rotating disks are connected, wherein an axis of rotation of the connecting rod coincides with an axis of rotation of the active rotating disk. This allows the active rotating disk and the driven rotating disk to stop rotating at the same time, i.e., the active rotating disk and the driven rotating disk can be synchronized.

According to an embodiment of the present invention, an axis of rotation between an axis of rotation of the active rotating disk of the first brush assembly and an axis of rotation of the active rotating disk of the second brush assembly, wherein 0 degrees < α < 4 degrees.

According to an embodiment of the present invention, a distance between a rotation axis of each of the first brush assembly and the second brush assembly and an axis of rotation of the brush is greater than the hair The radius of the brush. In this way, the entire brush can be immersed in the liquid without the dynamic seal of the active rotating disk being in contact with the liquid, even when the brushing device for the wafer is in a shutdown state. The entire surface of the brush is wetted, thereby further High wafer cleaning effect.

The additional aspects and advantages of the invention will be set forth in part in the description which follows. DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from

1 is a schematic structural view of a brushing device for a wafer according to an embodiment of the present invention;

2 is a schematic view of brushing a wafer surface using a brushing device for a wafer according to an embodiment of the present invention; and FIG. 3 is a schematic view of a brushing device for a wafer according to an embodiment of the present invention in different operating states. Where A indicates that the brushing device is in a stopped state and the brush is immersed in the liquid, B indicates that the brushing device is in a standby state after the brushing is completed, and the brush releases the wafer to be removed, and C indicates that the brushing device is in the brushing state. The state and the brush squeeze the wafer from both sides of the wafer. detailed description

The embodiments of the present invention are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the drawings are intended to be illustrative of the invention and are not to be construed as limiting.

In the description of the present invention, the terms "portrait", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", " The orientation or positional relationship of the top, "bottom" and the like is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of describing the present invention and does not require that the invention must be constructed and operated in a specific orientation, and therefore cannot be understood as Limitations of the invention.

In the description of the present invention, unless otherwise specified and limited, it should be noted that the terms "installation", "connected", and "connected" are to be understood broadly, and may be, for example, mechanical or electrical, or both. The internal connections of the components may be directly connected or indirectly connected through an intermediate medium. The connection between the two adjacent devices on the device through the processing medium is also referred to as "connected" or "connected". For those of ordinary skill in the art, the specific meaning of the above terms may be understood on a case-by-case basis.

A brushing apparatus for a wafer according to an embodiment of the present invention will be described below with reference to FIGS. 1 and 2. As shown in FIGS. 1 and 2, a brushing apparatus for a wafer according to an embodiment of the present invention includes a frame (not shown), a support member, a first brush assembly 20, and a second brush assembly 30.

In particular, the support member is disposed on the frame for rotatably supporting the wafer 40 on the support member. The first brush assembly 20 and the second brush assembly 30 are mounted oppositely and spaced apart on the frame for scrubbing the two side surfaces of the wafer 40, respectively. The first brush assembly 20 and the second brush assembly 30 each include an active rotating disk 100, a brush 200, and a drive assembly. The active rotating disk 100 is rotatably mounted on the frame. The brush 200 is rotatably mounted on the active rotating disk 100, and the rotational axis of the active rotating disk 100 is parallel to the rotational axis of the brush 200 to rotate the brush 200 around the active rotating disk 100 under the driving of the active rotating disk 100. The axis of rotation is revolutionized. The drive assembly is coupled to the active rotating disk 100 and the brush 200, respectively, to drive the active rotating disk 100 and the brush 200 to rotate about respective axes of rotation.

The brushing device for a wafer according to an embodiment of the present invention drives the brush 200 to revolve around the rotation axis of the active rotating disk 100 by providing the active rotating disk 100, since the rotation axis of the active rotating disk 100 is parallel to the rotation of the brush 200 The axis (i.e., the axis of rotation of the active rotating disk 100 does not coincide with the axis of rotation of the brush 200), so that at least a majority of the brush 200 can be immersed in the liquid without the dynamic seal of the active rotating disk 100 coming into contact with the liquid. And the entire surface of the brush 200 can be wetted by the rotation of the brush 200, so that the cleaning effect of the wafer 40 can be improved. Moreover, the brush 200 can be self-cleaned by self-rotation, thereby extending the life of the brush 200. In addition, the rotation of the brush 200 around the rotation axis of the active rotating disk 100 by the active rotating disk 100 can adjust the amount of pressing between the brush 200 and the wafer 40, thereby further improving the cleaning effect of the wafer 40.

The revolution refers to a rotational motion of the brush 200 with the rotation axis of the active rotary disk 100 as an axis of rotation, and the rotation refers to a rotational motion of the brush 200 about its own axis of rotation.

In some embodiments of the present invention, as shown in Fig. 1, the drive assembly may include a rotation shaft 310, a revolution shaft 320, a drive motor unit (not shown), and a transmission member. The revolving shaft 320 can be rotatably mounted on the frame, and the revolving shaft 320 can be coupled to the active rotating disc 100 to drive the active rotating disc 100 to rotate. The revolving shaft 320 can be set on the rotating shaft 310, and the revolving shaft 320 The axis of rotation may coincide with the axis of rotation of the axis of rotation 310. The drive motor unit may be coupled to the rotation shaft 310 and the revolution shaft 320, respectively, to respectively rotate the rotation shaft 310 and the revolution shaft 320 about respective rotation axes. The transmission member may be coupled to the rotation shaft 310 and the brush 200, respectively, to cause the rotation shaft 310 to rotate the brush 200 through the transmission member. Specifically, the revolving shaft 320 can be rotatably mounted on the frame by bearings 710.

In a specific example of the present invention, the drive motor unit may include a rotation axis drive motor and a revolution axis drive motor. The rotation axis driving motor may be connected to the rotation shaft 310 to drive the rotation shaft 310 to rotate. The revolution shaft drive motor may be coupled to the revolution shaft 320 to drive the revolution shaft 320 to rotate. Thus, the rotation shaft 310 and the revolution shaft 320 can be independently rotated, that is, when the rotation shaft 310 rotates, the revolution shaft 320 can be stationary; when the revolution shaft 320 rotates, the rotation shaft 310 can be stationary. Specifically, the rotation axis driving motor may be directly connected to the rotation axis 310, and the revolution axis driving motor may be connected to the revolution shaft 320 through a belt, thereby preventing the rotation shaft driving motor and the revolution shaft driving motor from being assembled. There is a conflict.

As shown in FIG. 1 , in some examples of the present invention, the accommodating cavity 110 may be defined in the active rotating disc 100. The first end of the rotating shaft 310 may protrude into the accommodating cavity 110, and the first end of the rotating shaft 310 may be Rotatable installation On the inner wall of the rotating disc 100, the first end of the brush 200 can protrude into the receiving cavity 110, and the first end of the brush 200 can be rotatably mounted on the active rotating disc 100, wherein the transmission member can be disposed on The accommodating chamber 110 is disposed, and the transmission member may be respectively connected to the first end of the rotating shaft 310 and the first end of the brush 200. The structure of the first brush assembly 20 and the second brush assembly 30 can be made more compact by defining the housing cavity 110 within the active rotating disk 100 and by locating the transmission member within the receiving cavity 110.

In an embodiment of the invention, the transmission member may include a first gear 330 and a second gear 340 that are engaged, wherein the first gear 330 may be sleeved on the first end of the rotation shaft 310, and the second gear 340 may The suit is placed on the first end of the brush 200. Thus, the rotation shaft 310 can drive the first gear 330 to rotate, and the first gear 330 can drive the second gear 340 to rotate, and the second gear 340 can drive the brush 200 to rotate. The first gear 330 and the second gear 340 may also be disposed spaced apart from each other, and the first gear 330 and the second gear 340 may be coupled by a chain for transmission.

In another embodiment of the present invention, the transmission member may include a first magnetic wheel and a second magnetic wheel that are spaced apart from each other, wherein the first magnetic wheel may be sleeved on the first end of the rotation shaft 310. The second magnetic wheel may be fitted over the first end of the brush 200.

As shown in FIG. 1, in one specific example of the present invention, the active rotating disk 100 may include a disk body 130 and an end cover 140 that may be mounted on the disk body 130 between the disk body 130 and the end cover 140. The receiving chamber 110 is defined. Specifically, the end cap 140 may be formed with an external thread, the disc body 130 may be formed with an internal thread, and the end cap 140 may be threadedly fitted to the disc body 130. Specifically, the revolution shaft 320 may be coupled to the end cover 140. The first end of the rotation shaft 310 may be rotatably mounted on the inner wall of the active rotating disc 100 via a bearing 720, and the first end of the brush 200 may be rotatable through the bearing 730. Mounted on the active rotating disk 100.

In some embodiments of the present invention, as shown in FIG. 1, the first brush assembly 20 and the second brush assembly 30 may each further include a driven rotating disk 400, and the driven rotating disk 400 may be rotatably mounted thereon. Said frame, and the axis of rotation of the driven rotating disk 400 may coincide with the axis of rotation of the active rotating disk 100, wherein the first end of the brush 200 may be rotatably mounted on the active rotating disk 100, and the brush 200 The second end may be rotatably mounted on the driven rotating disk 400, and the active rotating disk 100 may rotate the driven rotating disk 400 by the brush 200. Both ends of the brush 200 can be supported by providing the active rotating disk 100 and the driven rotating disk 400, so that the brush 200 can be rotated more stably (including revolution and rotation).

In a specific example of the present invention, the driven rotating disk 400 may be rotatably mounted on the frame by a driven shaft 600, that is, the driven shaft 600 may be rotatably mounted on the frame through a bearing 740. And the driven shaft 600 can be connected to the driven rotating disc 400. Specifically, the first end and the second end of the brush 200 may be the rotating shafts 210, 220, and the first end and the second end of the brush 200 may be rotatably mounted on the active rotating disc 100 through bearings 730, 750, respectively. And the driven rotary disk 400. In an example of the present invention, the main plane of the active rotating disk 100 and the main plane of the driven rotating disk 400 may each be elliptical, wherein the revolution axis 320 may be connected to the first focus of the main plane of the active rotating disk 100, The driven shaft 600 may be coupled to a first focus of the main plane of the driven rotating disc 400, and the first end of the brush 200 may be rotatably mounted at a second focus of the main plane of the active rotating disc 100, the brush 200 The second end may be rotatably mounted at a second focus of the main plane of the driven rotating disk 400. The principal plane of the active rotating disk 100 refers to the plane in which the area of the active rotating disk 100 is the largest, and the principal plane of the driven rotating disk 400 refers to the plane in which the area of the driven rotating disk 400 is the largest.

As shown in FIGS. 1 and 1, in some examples of the present invention, the first brush assembly 20 and the second brush assembly 30 may each further include a connecting rod 500, and the first end of the connecting rod 500 may be coupled to the active rotating disc. The 100 ends are connected, and the second end of the connecting rod 500 can be coupled to the driven rotating disc 400, wherein the rotational axis of the connecting rod 500 can coincide or be parallel with the rotational axis of the active rotating disc 100.

Since the driven rotary disk 400 is rotated by the active rotary disk 100, after the active rotary disk 100 stops rotating, the driven rotary disk 400 continues to rotate by a certain angle under the action of inertia. By providing the connecting rods 500 respectively connected to the active rotating disc 100 and the driven rotating disc 400, the active rotating disc 100 and the driven rotating disc 400 can be simultaneously stopped, that is, the active rotating disc 100 and the driven rotating disc 400 can be synchronized. .

The first brush assembly 20 and the second brush assembly 30 may have the same structure or may be slightly different as long as the first brush assembly 20 and the second brush assembly 30 have the same function. For example, the transmission member of the first brush assembly 20 may include a first gear and a second gear that are engaged, and the transmission member of the second brush assembly 30 may include a first magnetic wheel and a first interval that are spaced apart from each other. Two magnetic wheels. The differences between the first brush assembly 20 and the second brush assembly 30 may not be listed here.

The axis of rotation of the active rotating disk 100 of the first brush assembly 20 may be parallel to the axis of rotation of the active rotary disk 100 of the second brush assembly 30.

In some embodiments of the invention, the axis of rotation of the active rotating disk 100 of the first brush assembly 20 and the axis of rotation of the active rotating disk 100 of the second brush assembly 30 may be at an angle α greater than 0 degrees. When brushing the surface of the wafer 40, the first brush assembly 20 and the second brush assembly 30 sandwich the wafer 40 due to the rotational axis of the active rotating disk 100 of the first brush assembly 20 and the second brush assembly 30. The rotation axis of the active rotating disk 100 may have an angle α greater than 0 degrees, when the brush 200 of the first brush assembly 20 and the brush 200 of the second brush assembly 30 rotate in opposite rotational directions. The vertical downward frictional force of the brush 200 of the first brush assembly 20 and the brush 200 of the second brush assembly 30 acting on the wafer 40 may gradually evolve from one side of the wafer 40 to the other side. The increased gradient distribution thereby produces a torque on the wafer 40 that drives the rotation of the wafer 40.

Wherein, the range of α may be 0 degrees α < 4 degrees, advantageously, 0.5 degrees < α < 2. 5 degrees. If α is greater than 4 degrees, the cleaning effect of the middle portion of the wafer is poor due to the excessive tilt angle; if the angle is too small, the generated torque may not be sufficient to drive the wafer 40 to rotate. As shown in FIG. 1, in some embodiments of the present invention, the distance between the rotation axis of the respective active rotating disk 100 of the first brush assembly 20 and the second brush assembly 30 and the rotational axis of the brush 200 may be Greater than the radius of the brush 200. In other words, the distance between the axis of rotation of the active rotating disk 100 of the first brush assembly 20 and the axis of rotation of the brush 200 of the first brush assembly 20 may be greater than the radius of the brush 200. The distance between the axis of rotation of the active rotating disk 100 of the second brush assembly 30 and the axis of rotation of the brush 200 of the second brush assembly 30 may be greater than the radius of the brush 200. This allows the entire brush 200 to be located on one side of the rotational axis of the active rotary disk 100 so that the entire brush 200 can be immersed in the liquid without the dynamic seal of the active rotary disk 100 coming into contact with the liquid. In other words, even when the brushing device for the wafer according to the embodiment of the present invention is in a stopped state, the entire surface of the brush 200 can be wetted, thereby further improving the cleaning effect of the wafer 40.

The support may be known, for example the support may comprise a plurality of (e.g. two) rollers 10, which are not described in detail herein.

Next, a process of scrubbing the wafer 40 using the brushing device for a wafer according to an embodiment of the present invention will be described with reference to FIG. 3 is a schematic view showing a brushing device for a wafer in different working states according to an embodiment of the present invention, wherein A indicates that the brushing device is in a stopped state and the brush is immersed in the liquid, and B indicates the brushing device. In the standby state after the brushing is completed and the brush releases the wafer to be removed, the C table is that the brushing device is in the brushing state and the brush presses the wafer from both sides of the wafer.

As shown in Fig. 3, when the brushing device for a wafer according to an embodiment of the present invention is in a stopped state, the brush 200 is in the A position, at which time the entire brush 200 can be immersed in the liquid to keep its surface wet. When the wafer 40 is scrubbed by the brushing device for the wafer, the driving motor unit can drive the revolving shaft 320 to rotate, and the revolving shaft 320 can drive the active rotating disc 100 to rotate, and the active rotating disc 100 can drive the brush 200. Rotating (revolving) to the C position, and the amount of pressing between the brush 200 and the wafer 40 can be adjusted. Subsequently, the driving motor unit can drive the rotation shaft 310 to rotate, and the rotation shaft 310 can drive the brush 200 to rotate (rotate) through the transmission member to scrub the wafer 40 (one side of the brush 200 scrubbing the wafer 40) surface). When the brushing is completed, the active rotating disk 100 can drive the brush 200 to rotate (revolve) to the B position to disengage the brush 200 from the wafer 40, and the wafer 40 can be transported away by the robot.

The brushing device for a wafer according to an embodiment of the present invention can keep the surface of the brush 200 wet, so that the cleaning effect of the wafer 40 can be improved.

In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like means a specific feature described in connection with the embodiment or example. A structure, material or feature is included in at least one embodiment or example of the invention. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. While the embodiments of the present invention have been shown and described, the embodiments of the invention may The scope of the invention is defined by the claims and their equivalents.

Claims

Claim

A brush cleaning device for a wafer, comprising:

Rack

a support member disposed on the frame for rotatably supporting the wafer on the support member;

First and second brush assemblies, the first and second brush assemblies are mounted oppositely and spaced apart on the frame for respectively brushing both side surfaces of the wafer, wherein the first hair The brush assembly and the second brush assembly each include: an active rotating disk, the active rotating disk being rotatably mounted on the frame;

a brush, the brush is rotatably mounted on the active rotating disk and an axis of rotation of the active rotating disk is parallel to an axis of rotation of the brush to enable the driving of the active rotating disk The hair brush revolves around the axis of rotation of the active rotating disk; and

a drive assembly, the drive assembly being coupled to the active rotating disk and the brush, respectively, to drive the active rotating disk and the brush to rotate about respective axes of rotation.

2. The brush cleaning apparatus for a wafer according to claim 1, wherein the driving assembly comprises: a rotation shaft and a revolving shaft, the revolving shaft being rotatably mounted on the frame and The active rotating disk is connected to drive the active rotating disk to rotate, wherein the rotating shaft is set on the rotating shaft, and the rotating axis of the rotating shaft coincides with the rotating axis of the rotating shaft;

a driving motor unit, wherein the driving motor unit is respectively coupled to the rotation axis and the revolution axis to respectively rotate the rotation axis and the revolution axis about respective rotation axes; and

a transmission member, wherein the transmission member is respectively coupled to the rotation shaft and the brush to cause the rotation shaft to drive the brush to rotate through the transmission member.

The brushing device for a wafer according to claim 2, wherein the active rotating disk defines a receiving cavity, and the first end of the rotating shaft extends into the receiving cavity and is rotatable Mounted on the inner wall of the active rotating disk, the first end of the brush extends into the receiving cavity and is rotatably mounted on the active rotating disk, wherein the transmission member is disposed in the receiving The chamber is connected to the first end of the rotation shaft and the first end of the brush, respectively.

4. The brush cleaning apparatus for a wafer according to claim 3, wherein the transmission member includes a first gear and a second gear that are engaged, wherein the first gear is set on the rotation shaft On the first end, the second gear is sleeved on the first end of the brush.

5. The brushing apparatus for a wafer according to claim 3, wherein the transmission member comprises a first magnetic wheel and a second magnetic wheel spaced apart from each other, wherein the first magnetic wheel is set On the first end of the rotation shaft, the second magnetic wheel is sleeved on the first end of the brush.

The brushing device for a wafer according to claim 1, wherein each of the first brush assembly and the second brush assembly further comprises:

a driven rotating disk rotatably mounted on the frame and an axis of rotation of the driven rotating disk coincides with an axis of rotation of the active rotating disk, wherein the first of the brushes An end is rotatably mounted on the active rotating disk and a second end is rotatably mounted on the driven rotating disk, the active rotating disk being driven by the brush The driven rotary disk rotates.

The brushing device for a wafer according to claim 6, wherein the first brush assembly and the second brush assembly each further comprise:

a connecting rod, a first end of the connecting rod is connected to the active rotating disc and a second end is connected to the driven rotating disc, wherein an axis of rotation of the connecting rod coincides with an axis of rotation of the active rotating disc.

8. The brush cleaning apparatus for a wafer according to claim 1, wherein an axis of rotation of the active rotating disk of the first brush assembly and an axis of rotation of the active rotating disk of the second brush assembly There is an angle α between them, where 0 degrees < α < 4 degrees.

9. The brush cleaning apparatus for a wafer according to claim 1, wherein a rotation axis of each of the first brush assembly and the second brush assembly is the same as the rotation axis The distance between the axes of rotation of the brush is greater than the radius of the brush.