CN109225973A - A kind of pad brush device for silicon polished pad cleaning machine - Google Patents
A kind of pad brush device for silicon polished pad cleaning machine Download PDFInfo
- Publication number
- CN109225973A CN109225973A CN201811047882.1A CN201811047882A CN109225973A CN 109225973 A CN109225973 A CN 109225973A CN 201811047882 A CN201811047882 A CN 201811047882A CN 109225973 A CN109225973 A CN 109225973A
- Authority
- CN
- China
- Prior art keywords
- brush body
- baffle
- brush
- pad
- column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 63
- 239000010703 silicon Substances 0.000 title claims abstract description 63
- 238000004140 cleaning Methods 0.000 title claims abstract description 44
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 230000008878 coupling Effects 0.000 claims abstract description 29
- 238000010168 coupling process Methods 0.000 claims abstract description 29
- 238000005859 coupling reaction Methods 0.000 claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 23
- 239000012498 ultrapure water Substances 0.000 claims abstract description 10
- 229910021642 ultra pure water Inorganic materials 0.000 claims abstract description 9
- 238000005096 rolling process Methods 0.000 claims description 11
- 241000628997 Flos Species 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 239000004372 Polyvinyl alcohol Substances 0.000 description 32
- 229920002451 polyvinyl alcohol Polymers 0.000 description 32
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 9
- 239000002245 particle Substances 0.000 description 5
- 230000009471 action Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003344 environmental pollutant Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 231100000719 pollutant Toxicity 0.000 description 4
- 230000003749 cleanliness Effects 0.000 description 3
- 238000011010 flushing procedure Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000005213 imbibition Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 239000002957 persistent organic pollutant Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 238000009991 scouring Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 210000000476 body water Anatomy 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B08B1/20—
-
- B08B1/12—
-
- B08B1/32—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
Abstract
The present invention provides a kind of pad brush devices for silicon polished pad cleaning machine, including brush body and the water intake mechanism being set on brush body, driving mechanism, brush body includes the first brush body and the second brush body, second brush body is cylindric sponge, the outer wall of first brush body is additionally provided with multiple grooves, the slot bottom of groove also lays multiple through-holes, and the first brush body passes through the stepped hole connection water intake mechanism and driving mechanism at both ends respectively；The water intake mechanism includes connector and inflow column, and ultrapure water flows into the inner cavity of the first brush body by inflow column and connector；The driving mechanism includes motor and the shaft coupling for being connected to motor, and the shaft coupling is set in the stepped hole of the first brush body other end.The present invention effectively improves pad cleaning machine to the cleaning effect of silicon wafer, realizes the high-cleanness, high requirement on silicon polished surface.
Description
Technical field
The invention belongs to silicon polished production fields, are related to the two-sided pad wiper mechanism of monocrystalline silicon buffing sheet, specifically
It is a kind of pad brush device for silicon polished pad cleaning machine.
Background technique
Monocrystalline silicon buffing sheet surface in production and processing receives serious pollution, and polishes the surface cleanliness of monocrystalline silicon piece
It is one of the mass parameter of product key, even if there are the mistakes that the other micropollution of submicron order also results in subsequent device processing
Effect.For monocrystalline silicon piece after chemical machinery mirror-finishes, surface, which can remain, is such as polished silicon wafer, polishing fluid, buffing wax and atmosphere
The impurity such as environment bring impurity particle, metal ion and organic pollutant, it is necessary to by wet-cleaning removal silicon chip surface
Pollutant, to reach the requirement of silicon wafer ultra-clean degree.
Pad cleaning machine is a kind of board for carrying out silicon wafer wet-cleaning, is commonly used in the wiping of monocrystalline silicon buffing sheet at present
Piece cleaning machine mostly cleans the surface of silicon wafer using the brush rotation of flexible porous, and the axle center that pure water then passes through brush flows to silicon wafer
Surface achievees the purpose that remove monocrystalline silicon buffing sheet surface contaminant, this kind of silicon wafer cleaner institute by the mechanical scrub of brush
Brush volume is larger, and the gap between bristle is also larger, while to avoid deformation and the damage to workpiece, to the material of brush
Matter requires relatively high；Separately there is a kind of cleaning device cleaned in a manner of translation to silicon wafer (monocrystalline silicon piece), possesses preferably
Particle cleaning ability, but for cleaning pure water generally use be stored in sink impregnate or by way of spray head spray reality
Existing, the former frequently need to replace or recycle pure water, cause a large amount of wastes of pure water, and the latter is only capable of spray and covers to the not cleaned brush of silicon wafer
The place of lid, the particle for causing silicon chip surface to fall off are not easy to be taken away by water flow, the particle being adsorbed in brush surface porous structure
Silicon chip surface easily is returned to, influences the cleaning effect of monocrystalline silicon silicon wafer.
Summary of the invention
To solve the above problems, the present invention provides a kind of pad brush device for silicon polished pad cleaning machine, pass through
The setting of brush body, water intake mechanism and driving mechanism effectively improves Slicer to the cleaning effect of silicon wafer, realizes silicon polished surface
High-cleanness, high requirement.
To achieve the goals above, the technical solution adopted by the present invention are as follows:
A kind of pad brush device for silicon polished pad cleaning machine, it is characterised in that: including brush body and be set on brush body
Water intake mechanism, driving mechanism, the brush body includes the first brush body and the second brush body, and second brush body is cylindric sea
Silk floss, first brush body are set to the inside of the second brush body, and first brush body is the circular cylindrical shell of both ends open, the first brush body
Outer wall be additionally provided with multiple grooves, the groove is parallel with the central axis of the first brush body, and the slot bottom of the groove is also laid
Multiple through-holes, the through-hole are connected with the inner cavity of the first brush body, and the both ends of the first brush body further respectively have stepped hole, and described
One brush body passes through the stepped hole connection water intake mechanism and driving mechanism at both ends respectively；The water intake mechanism includes connector and water inlet
Column, the connector include baffle, connecting column and effluent column, and the connecting column is set in the stepped hole of first brush body one end, even
The both ends for connecing column are separately connected baffle and effluent column, and the effluent column is set to the inside of first brush body, and the baffle is set
It is placed in the outside of the first brush body, the intake tunnel being connected to each other is further respectively had on the baffle, connecting column and effluent column, it is described
Inflow column is set on the side wall of baffle；The inflow column be cylindrical shape, the inner cavity of inflow column also with the intake tunnel on baffle
It is connected；The driving mechanism includes motor and the shaft coupling for being connected to motor, and it is another that the shaft coupling is set to the first brush body
In the stepped hole at end, it is reserved with pin hole on one end end face that the first brush body is connected with shaft coupling, the pin on shaft coupling also passes through
Pin hole is connected to first brush body；The motor is set to the outside of the first brush body, and the motor is also along the first brush body axis
The direction of line is connected to the shaft coupling.
Further, the both ends of the brush body further respectively have first flap and second flap, the first flap and
Two baffles offer mounting hole along central axis direction, and first flap and second flap are also sheathed on baffle by mounting hole respectively
At the outer wall of shaft coupling.
Further, the first flap and the second flap are circular slab, and the outer diameter of baffle is greater than the second brush body
Diameter.
Further, the sponge is PVA sponge.
Further, the groove is set as six, and the angle between two adjacent grooves is 60 °.
Further, the connecting column and effluent column are cylindrical type, and the baffle is rectangular slab, and the both ends of baffle are also divided
Not She You cambered surface, be additionally provided with positioning through hole on the baffle, first flap and second flap also pass through positioning through hole and be fixed on wiping
Piece cleans on the column of machine worktable.
Further, the central axis of the baffle, connecting column and effluent column also coincides.
Further, the baffle is also in contact with the end face of the first brush body, and the end face of baffle is also greater than opening for stepped hole
Mouthful.
Further, rolling bearing, the effluent column and shaft coupling of connector are further respectively had in the stepped hole at the first brush body both ends
The hole that the axis of device is also each passed through rolling bearing is set to the intracavitary of the first brush body.
Further, the first intake tunnel being connected to each other, are further respectively had on the baffle, connecting column and effluent column
The central axes of two intake tunnels and third intake tunnel, first intake tunnel and baffle are perpendicular, the first intake tunnel
Two passways are respectively arranged at baffle sidewall and baffle center point；Second intake tunnel and the third intake tunnel
It is also respectively arranged on the central axes of connecting column and effluent column, and the passway of second intake tunnel one end and third intake tunnel
The passway of one end is connected, and the passway of the second intake tunnel other end and the passway of the first intake tunnel are in baffle center
It is connected at point, the third intake tunnel is also connected with the inner cavity of the first brush body, and ultrapure water also passes through the inflow column, the
One intake tunnel, the second intake tunnel and third intake tunnel enter the inner cavity of the first brush body.
The invention has the benefit that
1, a kind of pad brush device for silicon polished pad cleaning machine of the invention, silicon wafer is in pad platform with horizontality quilt
It is clipped between two pad brush devices up and down, the second brush body of brush body is manufactured using PVA (polyvinyl alcohol) sponge, and material is soft
And it is porous, water imbibition is strong, damaged with that will not be formed to silicon chip surface when silicon wafer CONTACT WITH FRICTION, silicon wafer is in guide wheel in cleaning process
The rotary motion between upper and lower two PVA sponge brushes under drive, at the same two PVA sponge brushes under the drive of driving mechanism with rolling
Dynamic mode moves, and the light press contacts silicon chip surface of the convex granular texture of PVA sponge brush appearance can have comprehensively monocrystalline silicon piece
The cleaning of effect；
2, a kind of pad brush device for silicon polished pad cleaning machine of the invention, pure water enter brush body by water intake mechanism
It is interior and flowed out by the through-hole of the first brush body and diffused into the porous organization of the second brush body, then via the PVA sponge of the second brush body
It being flowed out after water suction, the pure water of outflow washes away silicon chip surface, under the scouring of PVA sponge brush and the flushing action of pure water, pollutant
Fall off silicon chip surface, and the through-hole on the first brush body is set in the groove of the first brush body outer wall, the through-hole and PVA of bottom portion of groove
There are gaps between sponge brush inner wall, so that the water outlet of the first brush body through-hole is unobstructed, improve the ultrapure water stream outside from through-hole
Uniformity coefficient is measured, Wafer Cleaning effect is improved.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is the structural schematic diagram of connector；
Fig. 3 is the installation diagram of the first brush body and the second brush body.
Wherein, each label in figure are as follows: the 1, first brush body；2, the second brush body；3, groove；4, through-hole；5, baffle；6, it connects
Column；7, effluent column；8, intake tunnel；801, the first intake tunnel；802, the second intake tunnel；803, third intake tunnel；9,
Inflow column；10, motor；11, shaft coupling；12, first flap；13, second flap；14, positioning through hole；15, rolling bearing；16,
Pin hole；17 keyways.
Specific embodiment
Below in conjunction with attached drawing of the invention, technical scheme in the embodiment of the invention is clearly and completely described.
Silicon wafer in production and processing its surface by serious pollution, and the surface cleanliness of polished silicon slice be product the most
Crucial one of mass parameter, even if there are sub-micron rank micropollutions to also result in subsequent device processing failure.Silicon wafer warp
After crossing chemical machinery mirror finish, surface, which can remain, is polished silicon wafer, polishing fluid, buffing wax and atmospheric environment bring impurity
Grain, metal ion and organic pollutant, it is necessary to by the pollutant of wet-cleaning removal silicon chip surface, it is super just to can achieve silicon wafer
The requirement of cleanliness.
Pad cleaning machine is a kind of board for carrying out silicon wafer wet-cleaning, and pad platform therein is that the realization of pad cleaning machine is gone
Except the workbench of silicon chip surface particle pollution.Silicon wafer pad platform with horizontality be sandwiched in up and down two pad brush devices it
Between, the column of pad cleaning machine worktable is fixed on the worktable in the vertical direction, and one end of pad brush device connector passes through
Pad brush device is fixed on column by screw, and pad brush device is set as two up and down in the vertical direction, cleaned list
Crystal silicon chip is sandwiched between two pad brush devices with horizontality, in cleaning process, band of the silicon wafer in pad cleaning machine guide wheel
The rotary motion between upper and lower two pad brush devices under dynamic, while two pad brush devices move in a rolling manner, pad
The light press contacts of convex granular texture of the outermost PVA sponge of brush device in appearance are in silicon chip surface；Each brush body includes first
Brush body 1 and the second brush body 2, the second brush body 2 are manufactured using PVA (polyvinyl alcohol) sponge, material extremely flexible porous, water imbibition
By force, damage will not be formed to silicon chip surface with when silicon wafer CONTACT WITH FRICTION.Band of the silicon wafer in pad cleaning machine guide wheel in cleaning process
The rotary motion between upper and lower two PVA sponge brushes under dynamic, while two PVA sponge brushes move in a rolling manner, PVA sponge
The light press contacts silicon chip surface of the convex granular texture of brush appearance, PVA sponge brush constantly have ultrapure water from PVA sponge brush while rolling
Middle outflow, washes away silicon chip surface, and under the scouring of PVA sponge brush and the flushing action of pure water, pollutant falls off silicon chip surface.
Fig. 1 is the structural diagram of the present invention, in order to realize that ultrapure water is flowed out from PVA sponge brush, in PVA sponge brush
First brush body 1 is installed, the first brush body 1 is cylindrical shape, is provided with through-hole 4 on barrel, one end of the first brush body 1 is connected with into water machine
Structure, ultrapure water enter from inflow column 9, then are flowed into the first brush body 1 by connector, and under the action of water pressure, ultrapure water passes through first
The through-hole 4 of brush body 1 diffuses into the porous organization of PVA sponge brush, flows to silicon chip surface, plays flushing action to silicon wafer.
The other end of first brush body 1 passes through the pin connection on 11 one end of pin hole 16 and shaft coupling on end face, shaft coupling 11
The first brush body 1 is driven to rotate under the driving of motor 10, PVA is a kind of macromolecular organic compound, PVA sponge brush made of it
There is high scalability, it is plug with the first brush body 1 that PVA sponge brush, which is sleeved on the first brush body 1, and in 1 frictional force of the first brush body
Drive lower rotation.For the friction for reducing the first brush body 1 inner wall and connector, shaft coupling 11,1 both ends of the first brush body are also devised with step
Hole, two rolling bearings 15 are individually positioned in the stepped hole at 1 both ends of the first brush body, 11 axis of effluent column 7 and shaft coupling of connector
It is inserted into 15 hole of rolling bearing, keeps the rotation of the first brush body 1 more stable smooth.
To avoid 1 through-hole 4 of the first brush body from being wrapped up by PVA sponge brush, keeps PVA sponge brush water yield insufficient, cause silicon wafer table
The particle that emaciated face is fallen is not easy to be taken away by water flow, is adsorbed in PVA sponge brush porous structure, and returns to silicon chip surface, influences
Wafer Cleaning effect, 1 appearance of the first brush body devise 6 arc grooves 3 for being mutually 60 degree of angles, and groove 3 and the first brush body 1 are flat
It goes, is provided with an exhausting hole 4 on each groove 3, so that there are gaps between through-hole 4 and PVA sponge brush inner wall, so that first
1 through-hole 4 of brush body is discharged unobstructed, improves the ultrapure water uninterrupted uniformity coefficient outside from through-hole 4, improves Wafer Cleaning effect
Fruit.
Pure water is easy to leak from two end faces of PVA sponge brush, drenches other components of equipment lower part, causes equipment zero
The problems such as part gets rusty, failure.One round wall shape is respectively installed on 11 one end of water supply connector one end and shaft coupling of PVA sponge brush
The outer diameter of first flap 12 and second flap 13, baffle is greater than PVA sponge brush diameter, plays barrier effect to the water of side leakage, makes
Water flows to inside pad platform along baffle, and in-line arrangement waterpipe is drained, without side leakage.
In specific assembly, the first brush body 1, first flap 12, second flap 13, connector, shaft coupling 11 are all by PVDF
The machining manufacture of (Kynoar) stick, PVDF have good chemical corrosion resistance, oxidative resistance, have ensured high purity water and PVA
Pad brush is not contaminated.First brush body 1 outer diameter 50mm, length 210mm, 1 appearance of the first brush body are mutually 60 degree of angles and are provided with 6
2 millimeters of groove depth, an exhausting hole 4 is provided on each groove 3 for arc groove 3, and 4 quantity of through-hole is 10, aperture 2mm.First brush
Expense hole 16 on one end end face that body 1 is connected with shaft coupling 11, the pin on shaft coupling 11 cooperate assembly with it, and shaft coupling 11 is another
One end face is equipped with keyway 17, and motor shaft flat key matches assembly with the keyway 17 of shaft coupling, for the transmission of motor 10, shaft coupling
Device 11 drives the first brush body 1 to rotate under the driving of motor 10.Circular hole is provided among two baffles, it is a piece of to be sleeved on shaft coupling 11
On, it is a piece of to be sleeved on connector.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention,
And the present invention will not be limited to the embodiments shown herein, and be to fit to and principles disclosed herein and novelty
The consistent widest scope of feature.
Claims (10)
1. a kind of pad brush device for silicon polished pad cleaning machine, it is characterised in that: including brush body and be set to brush body
On water intake mechanism, driving mechanism, the brush body includes the first brush body and the second brush body, and second brush body is cylindric sea
Silk floss, first brush body are set to the inside of the second brush body, and first brush body is the circular cylindrical shell of both ends open, the first brush body
Outer wall be additionally provided with multiple grooves, the groove is parallel with the central axis of the first brush body, and the slot bottom of the groove is also laid
Multiple through-holes, the through-hole are connected with the inner cavity of the first brush body, and the both ends of the first brush body further respectively have stepped hole, and described
One brush body passes through the stepped hole connection water intake mechanism and driving mechanism at both ends respectively；
The water intake mechanism includes connector and inflow column, and the connector includes baffle, connecting column and effluent column, and the connecting column is set
It is placed in the stepped hole of first brush body one end, the both ends of connecting column are separately connected baffle and effluent column, and the effluent column is set to
The inside of first brush body, the baffle plate setting are also divided on the outside of the first brush body, the baffle, connecting column and effluent column
The intake tunnel that She You be connected to each other, the inflow column are set on the side wall of baffle；The inflow column is cylindrical shape, water inlet
The inner cavity of column is also connected with the intake tunnel on baffle；
The driving mechanism includes motor and the shaft coupling for being connected to motor, and the shaft coupling is set to the first brush body other end
In stepped hole, it is reserved with pin hole on one end end face that the first brush body is connected with shaft coupling, the pin on shaft coupling also passes through pin hole
It is connected to first brush body；The motor is set to the outside of the first brush body, and the motor is also along the first brush body central axes
Direction is connected to the shaft coupling.
2. a kind of pad brush device for silicon polished pad cleaning machine according to claim 1, it is characterised in that: institute
The both ends for stating brush body further respectively have first flap and second flap, and the first flap and second flap are along central axis direction
Mounting hole is offered, first flap and second flap are also sheathed at the outer wall of baffle and shaft coupling by mounting hole respectively.
3. a kind of pad brush device for silicon polished pad cleaning machine according to claim 2, it is characterised in that: institute
It states first flap and the second flap is circular slab, the outer diameter of baffle is greater than the diameter of the second brush body.
4. a kind of pad brush device for silicon polished pad cleaning machine according to claim 1, it is characterised in that: institute
Stating sponge is PVA sponge.
5. a kind of pad brush device for silicon polished pad cleaning machine according to claim 1, it is characterised in that: institute
It states groove and is set as six, the angle between two adjacent grooves is 60 °.
6. a kind of pad brush device for silicon polished pad cleaning machine according to claim 1, it is characterised in that: institute
It states connecting column and effluent column is cylindrical type, the baffle is rectangular slab, and the both ends of baffle further respectively have cambered surface, the baffle
On be additionally provided with positioning through hole, first flap and second flap also pass through the column that positioning through hole is fixed on pad cleaning machine worktable
On.
7. a kind of pad brush device for silicon polished pad cleaning machine according to claim 6, it is characterised in that: institute
The central axis for stating baffle, connecting column and effluent column also coincides.
8. a kind of pad brush device for silicon polished pad cleaning machine according to claim 1, it is characterised in that: institute
It states baffle to be also in contact with the end face of the first brush body, the end face of baffle is also greater than the opening of stepped hole.
9. a kind of pad brush device for silicon polished pad cleaning machine according to claim 1, it is characterised in that: the
Rolling bearing is further respectively had in the stepped hole at one brush body both ends, the effluent column of connector and the axis of shaft coupling are also each passed through rolling
The hole of bearing is set to the intracavitary of the first brush body.
10. a kind of pad brush device for silicon polished pad cleaning machine according to claim 1, it is characterised in that:
The first intake tunnel, the second intake tunnel and third being connected to each other are further respectively had on the baffle, connecting column and effluent column
The central axes of intake tunnel, first intake tunnel and baffle are perpendicular, and two passways of the first intake tunnel are set respectively
It is placed at baffle sidewall and baffle center point；Second intake tunnel and the third intake tunnel are also respectively arranged at connection
On the central axes of column and effluent column, and the passway of second intake tunnel one end is connected with the passway of third intake tunnel one end
Logical, the passway of the second intake tunnel other end is connected at baffle center point with the passway of the first intake tunnel, described
Third intake tunnel is also connected with the inner cavity of the first brush body, and ultrapure water also passes through the inflow column, the first intake tunnel, second
Intake tunnel and third intake tunnel enter the inner cavity of the first brush body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811047882.1A CN109225973A (en) | 2018-09-10 | 2018-09-10 | A kind of pad brush device for silicon polished pad cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811047882.1A CN109225973A (en) | 2018-09-10 | 2018-09-10 | A kind of pad brush device for silicon polished pad cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109225973A true CN109225973A (en) | 2019-01-18 |
Family
ID=65067602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811047882.1A Pending CN109225973A (en) | 2018-09-10 | 2018-09-10 | A kind of pad brush device for silicon polished pad cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109225973A (en) |
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|---|---|---|---|---|
| US6467120B1 (en) * | 1999-09-08 | 2002-10-22 | International Business Machines Corporation | Wafer cleaning brush profile modification |
| US6523210B1 (en) * | 2000-04-05 | 2003-02-25 | Nicholas Andros | Surface charge controlling apparatus for wafer cleaning |
| US6557202B1 (en) * | 1999-12-03 | 2003-05-06 | Lam Research Corporation | Wafer scrubbing brush core having an internal motor and method of making the same |
| CN1863645A (en) * | 2003-08-08 | 2006-11-15 | 安格斯公司 | Methods and materials for making a monolithic porous pad cast onto a rotatable base |
| CN1886206A (en) * | 2003-12-26 | 2006-12-27 | 艾翁株式会社 | Core for washing sponge roller |
| US20080173335A1 (en) * | 2005-04-11 | 2008-07-24 | Doosan Mecatec Co., Ltd | Semiconductor Wafer Cleaning System |
| US20130255721A1 (en) * | 2012-04-03 | 2013-10-03 | Illinois Tool Works Inc. | Concave nodule sponge brush |
| CN108065897A (en) * | 2017-12-15 | 2018-05-25 | 大连百达开成不动产咨询有限公司 | A kind of rotation cup brushing device |
| CN209174423U (en) * | 2018-09-10 | 2019-07-30 | 麦斯克电子材料有限公司 | A kind of pad brush device for silicon polished pad cleaning machine |
-
2018
- 2018-09-10 CN CN201811047882.1A patent/CN109225973A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6467120B1 (en) * | 1999-09-08 | 2002-10-22 | International Business Machines Corporation | Wafer cleaning brush profile modification |
| US6557202B1 (en) * | 1999-12-03 | 2003-05-06 | Lam Research Corporation | Wafer scrubbing brush core having an internal motor and method of making the same |
| US6523210B1 (en) * | 2000-04-05 | 2003-02-25 | Nicholas Andros | Surface charge controlling apparatus for wafer cleaning |
| CN1863645A (en) * | 2003-08-08 | 2006-11-15 | 安格斯公司 | Methods and materials for making a monolithic porous pad cast onto a rotatable base |
| CN1886206A (en) * | 2003-12-26 | 2006-12-27 | 艾翁株式会社 | Core for washing sponge roller |
| US20080173335A1 (en) * | 2005-04-11 | 2008-07-24 | Doosan Mecatec Co., Ltd | Semiconductor Wafer Cleaning System |
| US20130255721A1 (en) * | 2012-04-03 | 2013-10-03 | Illinois Tool Works Inc. | Concave nodule sponge brush |
| CN108065897A (en) * | 2017-12-15 | 2018-05-25 | 大连百达开成不动产咨询有限公司 | A kind of rotation cup brushing device |
| CN209174423U (en) * | 2018-09-10 | 2019-07-30 | 麦斯克电子材料有限公司 | A kind of pad brush device for silicon polished pad cleaning machine |
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