CN113113346A - Bearing device and semiconductor cleaning equipment - Google Patents
Bearing device and semiconductor cleaning equipment Download PDFInfo
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- CN113113346A CN113113346A CN202110340243.XA CN202110340243A CN113113346A CN 113113346 A CN113113346 A CN 113113346A CN 202110340243 A CN202110340243 A CN 202110340243A CN 113113346 A CN113113346 A CN 113113346A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 130
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 230000005540 biological transmission Effects 0.000 claims description 63
- 230000007797 corrosion Effects 0.000 claims description 5
- 238000005260 corrosion Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000007788 liquid Substances 0.000 abstract description 40
- 239000002245 particle Substances 0.000 abstract description 26
- 230000000694 effects Effects 0.000 abstract description 20
- 238000004220 aggregation Methods 0.000 abstract description 4
- 230000002776 aggregation Effects 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 199
- 238000000034 method Methods 0.000 description 21
- 239000000126 substance Substances 0.000 description 13
- 239000003814 drug Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000036632 reaction speed Effects 0.000 description 4
- 239000008237 rinsing water Substances 0.000 description 4
- 229910021642 ultra pure water Inorganic materials 0.000 description 4
- 239000012498 ultrapure water Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 208000032369 Primary transmission Diseases 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a bearing device and a semiconductor cleaning device, wherein the bearing device is used for the semiconductor cleaning device and comprises a bearing structure and a driving assembly, the bearing structure is provided with a bearing groove for placing a wafer, the bearing device is arranged in a cleaning chamber of the semiconductor cleaning device, and the driving assembly can provide driving force for contacting with the wafer borne on the bearing structure so as to drive the wafer to move in the bearing structure relative to the bearing groove. The bearing device and the semiconductor cleaning equipment provided by the invention can improve the fluidity of the cleaning liquid so as to improve the effect of removing particles, avoid the condition of particle aggregation, and accelerate the reaction of the cleaning liquid and the wafer so as to improve the cleaning effect.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a bearing device and semiconductor cleaning equipment.
Background
The wet cleaning process generally comprises the steps of firstly placing a bearing device bearing a wafer in a cleaning tank containing cleaning liquid medicine, cleaning the surface of the wafer by chemical or physical reaction between the cleaning liquid medicine and a film layer on the surface of the wafer or defects on the surface of the wafer, then transferring the bearing device bearing the wafer into a rinsing tank containing ultrapure water, and rinsing particles remained on the surface of the wafer and in the liquid film through a large amount of ultrapure water, so as to realize efficient cleaning of the surface of the wafer. The wet cleaning process plays a role in the whole semiconductor manufacturing process, and almost covers more than thirty percent of the whole semiconductor manufacturing process, so the wet cleaning process is very important in the whole semiconductor manufacturing process.
However, in the prior art, the position of the wafer contacting the carrier device during the cleaning process is fixed, and therefore, the cleaning liquid medicine is obstructed when flowing to the contact position of the wafer and the carrier device, which results in poor fluidity of the cleaning liquid medicine, which makes the particles on the wafer difficult to remove, and the particles removed from the wafer are also easy to gather at the contact position of the wafer and the carrier device, which results in poor cleaning effect.
Disclosure of Invention
The present invention is directed to at least one of the technical problems of the prior art, and provides a carrier and a semiconductor cleaning apparatus, which can improve the fluidity of the cleaning liquid to improve the effect of removing particles, prevent the particles from aggregating, and accelerate the reaction between the cleaning liquid and the wafer to improve the cleaning effect.
The bearing device comprises a bearing structure, wherein the bearing structure is provided with a bearing groove for placing a wafer, the bearing device is arranged in a cleaning chamber of the semiconductor cleaning equipment, and the bearing device further comprises a driving assembly which can provide driving force for contacting with the wafer borne on the bearing structure so as to drive the wafer to move on the bearing structure relative to the bearing groove.
Preferably, the driving assembly comprises a rotary driving part and a rotary shaft, and the rotary shaft is used for contacting the wafer carried on the carrying structure;
the rotation driving part is connected with the rotation shaft and used for providing rotation driving force for the rotation shaft so as to drive the wafer contacted with the rotation shaft to move relative to the bearing structure by driving the rotation shaft to rotate.
Preferably, the rotating shaft comprises a first shaft section and a second shaft section, the first shaft section is used for contacting the wafer, one end of the second shaft section is connected with the first shaft section, and the shaft center of the second shaft section and the shaft center of the first shaft section are eccentrically arranged; the rotary driving part is connected with the other end of the second shaft section, so that the wafer is contacted with or separated from the bearing structure through the first shaft section while the contact position of the wafer and the bearing structure is changed.
Preferably, the rotation driving part includes a rotation driving source and a transmission part, wherein the transmission part is connected to the other end of the second shaft section; the rotary driving source is connected with the transmission component and used for providing rotary driving force for the transmission component so as to drive the second shaft section to rotate by driving the transmission component to rotate.
Preferably, the transmission part comprises a main transmission part and a plurality of sub transmission parts, the sub transmission parts and the rotating shafts are arranged in a one-to-one correspondence manner, and the second shaft section is connected with the sub transmission parts; the main transmission piece is connected with the rotary driving source and drives the sub transmission pieces to synchronously rotate.
Preferably, the main transmission member includes a main gear, and each of the sub-transmission members includes sub-gears, and each of the sub-gears is spaced apart from each other and surrounds the main gear, and is engaged with the main gear.
Preferably, the main transmission member, the sub transmission member and the rotating shaft are made of corrosion-resistant materials.
Preferably, the supporting structure includes at least two supporting bodies connected to each other, each of the supporting bodies is spaced from each other and arranged in parallel, the supporting body is provided with a plurality of supporting grooves along a length direction, and the supporting grooves on the same plane on each of the supporting bodies are matched with each other to support the wafer together;
the rotating shaft is arranged between two adjacent supporting bodies and is arranged in parallel with the supporting bodies.
Preferably, the bearing structure comprises four support bodies, the four support bodies are divided into two support groups, and each support group comprises two support bodies;
the number of the rotating shafts is two, and the two rotating shafts are respectively positioned between the two supporting bodies in the two supporting groups.
The invention also provides semiconductor cleaning equipment which comprises a cleaning chamber and a bearing device capable of being placed in the cleaning chamber, wherein the bearing device adopts the bearing device provided by the invention and is used for bearing wafers.
The invention has the following beneficial effects:
the bearing device provided by the invention drives the wafer to move on the bearing structure relative to the bearing groove by contacting the wafer with the wafer when the wafer is borne on the bearing structure by the driving component, so that the contact position between the wafer and the bearing groove of the bearing structure is not fixed any more in the cleaning process, but the wafer is borne on the bearing structure by moving relative to the bearing groove of the bearing structure in the cleaning process, the contact position between the wafer and the bearing groove is changed, the obstruction of the contact position between the wafer and the bearing groove to the flow of cleaning liquid is weakened, the fluidity of the cleaning liquid at the contact position between the wafer and the bearing groove can be improved, the effect of removing particles at the contact position between the wafer and the bearing groove is improved, and the condition that the particles removed from the wafer are gathered at the contact position between the wafer and the bearing groove is avoided, in addition, the fluidity of the cleaning liquid relative to the wafer is improved, so that the chemical or physical reaction speed between the cleaning liquid and the wafer is improved, the reaction between the cleaning liquid and the wafer is accelerated, and the cleaning effect is improved.
According to the semiconductor cleaning equipment provided by the invention, the wafer is loaded in the cleaning chamber by virtue of the loading device provided by the invention, so that the fluidity of the cleaning liquid can be improved, the effect of removing particles is improved, the condition of particle aggregation is avoided, the reaction of the cleaning liquid and the wafer is accelerated, and the cleaning effect is improved.
Drawings
FIG. 1 is a schematic view of a wafer being brought into contact with a supporting body by a carrier and a semiconductor cleaning apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic view of a wafer separated from a support body by a carrier and a semiconductor cleaning apparatus according to an embodiment of the present invention;
fig. 3 is a schematic top view of the carrier and the semiconductor cleaning apparatus of the present invention corresponding to fig. 1 and 2;
FIG. 4 is a schematic side view of a carrier according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a carrier and a semiconductor cleaning apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a carrier device in the prior art;
description of reference numerals:
10-a wafer; 11-a support body; 12-a rotating shaft; 121-a first shaft section; 122-a second shaft section; 13-a rotary drive source; 14-a transmission member; 141-a primary transmission; 142-a sub-transmission member; 15-a washing chamber; 151-a first cleaning tank; 152-a second cleaning tank; 16-a connecting body; 17-a circulation line; 18-a filter element; 19-a heating means; 21-a circulating pump; 22-support column.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the carrying device and the semiconductor cleaning apparatus provided by the present invention are described in detail below with reference to the accompanying drawings.
For convenience of explaining the difference between the carrier apparatus provided in the embodiment of the present invention and the carrier apparatus in the prior art, a carrier apparatus for carrying a wafer 10 in the prior art will be described first. As shown in fig. 6, a conventional carrier device for carrying a wafer 10 has four supporting columns 22 connected to each other, the four supporting columns 22 are spaced from each other and arranged in parallel, a plurality of carrying grooves are formed in the supporting columns 22 along the length direction, and the carrying grooves on the same plane on each supporting column 22 cooperate with each other to support the wafer 10. In the wet cleaning process, one side edge of the bottom of the wafer 10 is accommodated in two carrying grooves located on the same plane on two supporting columns 22 located on the side among the four supporting columns 22, and the other side edge of the bottom of the wafer 10 is accommodated in two carrying grooves located on the same plane on the other two supporting columns 22 located on the side among the four supporting columns 22, so that the four carrying grooves located on the same plane on the four supporting columns 22 cooperate with each other to support the wafer 10, and the wafer 10 can stably stand on the four supporting columns 22. The inventor of the present application found in the research process that the wafer 10 is carried by using the conventional carrying device for carrying the wafer 10 as shown in fig. 6, in the wet cleaning process, the wafer 10 is fixedly placed on the four supporting columns 22, so that the contact position between the wafer 10 and each carrying groove is fixed during the wet cleaning process, and since the cleaning solution is hindered when flowing to the contact position between the wafer 10 and each carrying groove, the particles at the contact position between the wafer 10 and each carrying groove are not easily removed, and the particles removed from the wafer 10 are also easily gathered at the contact position between the wafer 10 and each carrying groove, which affects the cleaning effect.
As shown in fig. 1-4, the present embodiment provides a carrying device for a semiconductor cleaning apparatus, the carrying device includes a carrying structure and a driving component, wherein the carrying structure has a carrying groove for placing a wafer 10, the carrying device is configured to be disposed in a cleaning chamber 15 of the semiconductor cleaning apparatus, and the driving component can provide a driving force for contacting the wafer 10 carried on the carrying structure, that is, when the wafer 10 is carried on the carrying structure, the driving component can contact the wafer 10 to drive the wafer 10 to move on the carrying structure relative to the carrying groove.
The carrying device provided by this embodiment, by means of the driving component contacting the wafer 10 when the wafer 10 is carried on the carrying structure, the wafer 10 is driven to move on the carrying structure relative to the carrying groove, so that the wafer 10 is not carried on the carrying structure in a fixed manner any more during the cleaning process, and the position of contact between the wafer 10 and the carrying groove of the carrying structure is not fixed any more, but during the cleaning process, the wafer 10 is carried on the carrying structure in a moving manner relative to the carrying groove of the carrying structure, so that the position of contact between the wafer 10 and the carrying groove is changed, thereby reducing the obstruction of the position of contact between the wafer 10 and the carrying groove to the flow of the cleaning liquid, so as to improve the fluidity of the cleaning liquid at the position of contact between the wafer 10 and the carrying groove, and further improve the effect of removing particles at the position of contact between the wafer 10 and the carrying groove, the particles removed from the wafer 10 are prevented from being accumulated at the position where the wafer 10 contacts the carrying groove, and the chemical or physical reaction speed between the cleaning liquid and the wafer 10 is increased due to the improved fluidity of the cleaning liquid relative to the wafer 10, so that the reaction between the cleaning liquid and the wafer 10 is accelerated, and the cleaning effect is improved.
In a preferred embodiment of the present invention, the driving assembly may include a rotation driving part and a rotation shaft 12, the rotation shaft 12 being used to contact the wafer 10 carried on the carrying structure; the rotation driving component is connected to the rotation shaft 12 and configured to provide a rotation driving force to the rotation shaft 12, so as to drive the rotation shaft 12 to rotate, thereby driving the wafer contacting with the rotation shaft 12 to move relative to the carrying structure.
When the wafer 10 is carried on the carrying structure, the rotation shaft 12 contacts with the wafer 10, and the rotation driving component is connected to the rotation shaft 12, and can provide a rotation driving force to the rotation shaft 12 to drive the rotation shaft 12 to rotate, because the rotation shaft 12 contacts with the wafer 10, the rotation shaft 12 can drive the wafer 10 contacting with it to move when rotating, and the carrying structure is stationary at this time, so the rotation shaft 12 can drive the wafer 10 contacting with it to move relative to the carrying structure when rotating, that is, the rotation driving component can drive the rotation shaft 12 to rotate by providing a rotation driving force to the rotation shaft 12, and drive the wafer 10 contacting with the rotation shaft 12 to move relative to the carrying structure.
Therefore, in the cleaning process, the wafer 10 can be movably supported on the bearing structure relative to the bearing groove of the bearing structure, so that the contact position between the wafer 10 and the bearing groove can be changed, the obstruction of the contact position between the wafer 10 and the bearing groove to the flow of the cleaning liquid is reduced, the fluidity of the cleaning liquid at the contact position between the wafer 10 and the bearing groove can be improved, the effect of removing particles at the contact position between the wafer 10 and the bearing groove is improved, the condition that the particles removed from the wafer 10 are gathered at the contact position between the wafer 10 and the bearing groove is avoided, in addition, the relative rotation speed between the cleaning liquid and the wafer 10 is increased in the cleaning process, the fluidity of the cleaning liquid relative to the wafer 10 is improved, and the chemical or physical reaction speed between the cleaning liquid and the wafer 10 is improved, thereby accelerating the reaction of the cleaning liquid with the wafer 10 and further improving the cleaning effect.
As shown in fig. 1-3, in a preferred embodiment of the present invention, the supporting structure may include four supporting bodies 11 connected to each other, the four supporting bodies 11 are divided into two supporting groups, each supporting group includes two supporting bodies 11, the four supporting bodies 11 are spaced from each other and are arranged in parallel, each supporting body 11 is provided with a plurality of supporting grooves along the length direction, and the supporting grooves on the same plane on each supporting body 11 are matched with each other to support the wafer 10; the number of the rotation shafts 12 may be two, and the two rotation shafts 12 are respectively located between the two support bodies 11 in the two support groups and are arranged in parallel with the support bodies 11.
As shown in fig. 1 to fig. 3, optionally, two groups of support groups may be respectively located at two sides of the bottom of the wafer 10, each support body 11 is provided with a plurality of bearing grooves along the length direction, each support body 11 is divided into a plurality of planes along the length direction, the bearing grooves located on the same plane are mutually matched to jointly support the wafer 10, so that the four support bodies 11 can simultaneously bear a plurality of wafers 10, the intervals between two support bodies 11 in the two groups of support groups are the same, the interval between the two groups of support groups may be greater than the interval between two support bodies 11 in each support group, and the two rotation shafts 12 are respectively located between two support bodies 11 in the two groups of support groups. In the cleaning process, the bearing grooves on the same plane on the four supporting bodies 11 limit the edge of the same wafer 10, so that the wafer 10 can stably stand on the four supporting bodies 11, so as to be mutually and cooperatively contacted by the bearing grooves on the same plane on the supporting bodies 11, to support the wafer 10, so that the wafer 10 is carried on the carrying structure, and both of the two rotating shafts 12 are also in contact with the edge of the wafer 10, the wafer 10 is supported, the rotation driving component can be connected with both of the two rotation shafts 12 to drive the two rotation shafts 12 to rotate simultaneously, thereby driving the wafer 10 contacting with the two rotating shafts 12 to move, so that the wafer 10 moves relative to the four supporting bodies 11 and the carrying grooves on the supporting bodies 11, so that the points of contact between the wafer 10 and the carrier grooves on the four support bodies 11 are varied.
Through set up a plurality of bearing grooves in the length direction of supporting subject 11, can make bearing structure can bear a plurality of wafers 10 simultaneously, a plurality of wafers 10 can be along the length direction interval distribution of supporting subject 11, through rotation axis 12 and wafer 10 contact, and drive wafer 10 and rotate, and make rotation axis 12 and supporting subject 11 parallel arrangement, can make drive assembly contact with a plurality of wafers 10 simultaneously, and drive a plurality of wafers 10 simultaneous movement simultaneously, in order to improve bearing device's bearing capacity, and the efficiency of driving wafer 10 for bearing structure's bearing groove motion.
However, in the embodiment of the present invention, the number of the support bodies 11 included in the bearing structure is not limited thereto, and the number of the rotation shafts 12 is not limited thereto, for example, the bearing structure may include two support bodies 11, the two support bodies 11 are spaced apart from each other and are arranged in parallel, each support body 11 is provided with a plurality of bearing slots along the length direction, the bearing slots on the same plane on each support body 11 cooperate with each other to support the wafer 10, that is, the two bearing slots on the same plane on the two support bodies 11 are respectively in contact with different positions of the wafer 10, so as to support the wafer 10 through the two bearing slots on the same plane on the two support bodies 11, at this time, the number of the rotation shafts 12 may be one, the rotation shaft 12 may be located between the two support bodies 11 and arranged in parallel with the two support bodies 11, and when the wafer 10 is carried on the two support bodies 11, the wafer 10 contacts with the wafer 10, so that the wafer 10 can be supported together with the two support bodies 11, and the rotation driving part is connected with the rotation shaft 12 to drive the rotation shaft 12 to rotate, so as to drive the wafer 10 contacting with the rotation shaft 12 to move on the two support bodies 11 relative to the carrying groove.
Therefore, in a preferred embodiment of the present invention, the supporting structure may include at least two supporting bodies 11 connected to each other, each supporting body 11 is spaced from and parallel to each other, the supporting body 11 is provided with a plurality of supporting slots along the length direction, and each supporting slot on the same plane on each supporting body 11 is matched with each other to support the wafer 10; the rotation shaft 12 is disposed between adjacent two support bodies 11, and is disposed in parallel with the support bodies 11.
As shown in fig. 1 to 4, in a preferred embodiment of the present invention, the load bearing structure may further include a connecting body 16, and the connecting body 16 is connected with all the support main bodies 11 such that all the support main bodies 11 are connected with each other by the connecting body 16.
As shown in fig. 3 to 4, alternatively, the bearing structure may include two connecting bodies 16, and the two connecting bodies 16 are respectively located at both ends of all the support main bodies 11 and connected with both ends of all the support main bodies 11, that is, one connecting body 16 of the two connecting bodies 16 is connected with one end of all the support main bodies 11, and the other connecting body 16 of the two connecting bodies 16 is connected with the other end of all the support main bodies 11.
As shown in fig. 1 to 4, in a preferred embodiment of the present invention, the rotation shaft 12 may include a first shaft segment 121 and a second shaft segment 122, the first shaft segment 121 is used for contacting the wafer 10, one end of the second shaft segment 122 is connected to the first shaft segment 121, and the axis of the second shaft segment 122 is eccentric to the axis of the first shaft segment 121; a rotational driving member may be coupled to the other end of the second shaft section 122 to contact or separate the wafer 10 with or from the carrier structure through the first shaft section 121 while changing the contact position of the wafer 10 with the carrier structure.
By connecting the two ends of the second shaft segment 122 with the first shaft segment 121 and the rotation driving component respectively, so that the rotation driving component is not directly connected with the first shaft segment 121, but is connected with the first shaft segment 121 through the second shaft segment 122, when the rotation driving component provides the rotation driving force, the rotation driving component firstly provides the rotation driving force for the second shaft segment 122, and drives the first shaft segment 121 connected with the second shaft segment 122 to rotate by driving the second shaft segment 122 to rotate, because the shaft center of the second shaft segment 122 is eccentrically arranged with the shaft center of the first shaft segment 121, namely, the shaft axis of the second shaft segment 122 is not on the same straight line with the shaft axis of the first shaft segment 121, the first shaft segment 121 rotates eccentrically when rotating, so that the wafer 10 in contact with the first shaft segment 121 is eccentrically moved by the first shaft segment 121, and thus the contact position between the wafer 10 and the carrying groove of the carrying structure can be changed, the wafer 10 can also be brought into contact with or separated from the bottom of the carrier, i.e. the wafer 10 can be brought into contact with or separated from the carrier structure.
The following description will be given taking an example in which the number of the rotary shafts 12 is two, and the two rotary shafts 12 are respectively located between the two support bodies 11 in the two support groups and are arranged in parallel with the support bodies 11. When the rotation driving means drives the second shaft segments 122 of the two rotation shafts 12 to rotate in the same direction and always at the same height, the first shaft segments 121 of the two rotation shafts 12 are driven by the second shaft segments 122 to rotate in the same direction and always at the same height as the rotation direction of the second shaft segments 122, that is, the first shaft segments 121 of the two rotation shafts 12 are driven to rotate in the same direction and always at the same height, at this time, the wafer 10 contacting the first shaft segments 121 of the two rotation shafts 12 rotates in the direction opposite to the rotation direction of the first shaft segments 121, and since the shaft center of the second shaft segments 122 is eccentrically disposed from the shaft center of the first shaft segments 121, that is, the shaft center of the second shaft segments 122 is not on the same straight line as the shaft center of the first shaft segments 121, the first shaft segments 121 rotate eccentrically, so that the wafer 10 contacting the first shaft segments 121 also rotates eccentrically when driven to rotate by the first shaft segments 121, therefore, the wafer 10 can not only rotate relative to the bearing structure, but also vibrate up and down relative to the bearing structure, and further, the contact position between the wafer 10 and the bearing groove of the bearing structure can be changed, and the wafer 10 can also be in contact with or separated from the groove bottom of the bearing groove. For example, when the wafer 10 is rotated by the first shaft segment 121 relative to the supporting structure, and is also moved by the first shaft segment 121 to ascend relative to the supporting structure, the wafer 10 is separated from the bottom of the supporting groove, i.e., the supporting structure, and when the wafer 10 is rotated by the first shaft segment 121 relative to the supporting structure, and is also moved by the first shaft segment 121 to descend relative to the supporting structure, the wafer contacts the bottom of the supporting groove, i.e., the supporting structure. However, the manner of the carrying device driving the wafer 10 to move is not limited thereto.
For example, when the rotation driving means drives the second shaft segments 122 of the two rotation shafts 12 to rotate in opposite directions and always at the same height, the first shaft segments 121 of the two rotation shafts 12 are driven by the second shaft segments 122 to rotate in the same direction and always at the same height as the rotation direction of the second shaft segments 122, that is, the first shaft segments 121 of the two rotation shafts 12 are driven by the second shaft segments 122 to rotate in opposite directions and always at the same height, at this time, the wafer 10 in contact with the first shaft segments 121 of the two rotation shafts 12 does not rotate, but because the axial center of the second shaft segments 122 is eccentric to the axial center of the first shaft segments 121, that is, the axial center of the second shaft segments 122 is not on the same straight line with the axial center of the first shaft segments 121, the first shaft segments 121 rotate eccentrically during rotation, which enables the wafer 10 in contact with the first shaft segments 121 to vibrate up and down relative to the carrying structure, that is, in this case, the wafer 10 merely vibrates up and down with respect to the carrier structure, and does not rotate with respect to the carrier structure.
For another example, when the rotation driving part drives the second shaft segments 122 of the two rotation shafts 12 to rotate in the same direction and at different heights, the first shaft segments 121 of the two rotation shafts 12 are driven by the second shaft segments 122 to rotate in the same direction and at different heights as the rotation direction of the second shaft segments 122, that is, the first shaft segments 121 of the two rotation shafts 12 are driven by the second shaft segments 122 to rotate in the same direction and at different heights, at this time, the wafer 10 contacting with the first shaft segments 121 of the two rotation shafts 12 rotates in the direction opposite to the rotation direction of the first shaft segments 121, and since the shaft center of the second shaft segments 122 is eccentric to the shaft center of the first shaft segments 121, that is, the shaft center of the second shaft segments 122 is not on the same straight line as the shaft center of the first shaft segments 121, the first shaft segments 121 rotate eccentrically, and since the two first shaft segments 121 are at different heights, therefore, the two sides of the wafer 10 contacting the first shaft segment 121 are also at different heights, so that the wafer 10 can not only rotate relative to the carrying structure, but also vibrate up and down relative to the carrying structure and swing in the horizontal direction, and further, the contact position between the wafer 10 and the carrying groove of the carrying structure can be changed, and the wafer 10 can also contact or separate from the bottom of the carrying groove.
For another example, when the rotation driving part drives the second shaft segments 122 of the two rotation shafts 12 to rotate in opposite directions and at different heights, the first shaft segments 121 of the two rotation shafts 12 are driven by the second shaft segments 122 to rotate in the same direction as the rotation direction of the second shaft segments 122 and at different heights, that is, the first shaft segments 121 of the two rotation shafts 12 are driven by the second shaft segments 122 to rotate in opposite directions and at different heights, at this time, the wafer 10 contacting with the first shaft segments 121 of the two rotation shafts 12 does not rotate, but because the axial centers of the second shaft segments 122 and the axial centers of the first shaft segments 121 are eccentrically arranged, that is, the axial centers of the second shaft segments 122 and the axial centers of the first shaft segments 121 are not on the same straight line, the first shaft segments 121 are eccentrically rotated, and because the two first shaft segments 121 are at different heights, the two sides 121 contacting with the first shaft segments 10 are also at different heights, thereby enabling the wafer 10 to oscillate up and down and in a horizontal direction relative to the load bearing structure.
By means of the first shaft segment 121 and the second shaft segment 122 which are eccentrically arranged, the wafer 10 which is in contact with the first shaft segment 121 can be vibrated up and down relative to the bearing structure while rotating relative to the bearing structure, so that during the cleaning process, the position of the wafer 10 in contact with the bearing groove of the bearing structure can be changed, and the wafer 10 can be contacted with or separated from the bottom of the bearing groove of the bearing structure, that is, not only the wafer 10 can be rotated relative to the bearing groove of the bearing structure, but also the wafer 10 can be vibrated up and down relative to the bearing groove of the bearing structure, because the wafer 10 can be separated from the bottom of the bearing groove during the cleaning process, no contact point exists between the wafer 10 and the bottom of the bearing groove during the cleaning process, and the obstruction of the contact position between the wafer 10 and the bearing groove to the flow of the cleaning liquid can be further reduced, the fluidity of the cleaning liquid at the contact position of the wafer 10 and the bearing groove can be further improved, the effect of removing particles at the contact position of the wafer 10 and the bearing groove is further improved, the particles removed from the wafer 10 are prevented from being gathered at the contact position of the wafer 10 and the bearing groove, in addition, in the cleaning process, the relative up-and-down vibration speed between the cleaning liquid and the wafer 10 is increased, the fluidity of the cleaning liquid relative to the wafer 10 is further improved, the chemical or physical reaction speed between the cleaning liquid and the wafer 10 is further improved, the reaction between the cleaning liquid and the wafer 10 is further accelerated, and the cleaning effect is further improved.
In practical use, the distance between the axis of the second shaft section 122 and the axis of the first shaft section 121 may be adjusted, that is, the eccentric distance between the second shaft section 122 and the first shaft section 121 is adjusted, so that the first shaft section 121 drives the wafer 10 to vibrate up and down relative to the carrying structure, and when the wafer 10 contacts or separates from the bottom of the carrying groove, the vibration amplitude of the first shaft section 121 driving the wafer 10 is smaller than the depth of the carrying groove, so that the height of the first shaft section 121 driving the wafer 10 to rise is smaller than the depth of the carrying groove, thereby preventing the wafer 10 from separating from the carrying groove, avoiding the wafer 10 from being damaged due to the fact that the wafer 10 cannot stand on the carrying structure, and further improving the stability of the carrying device.
As shown in fig. 1 to 3, in a preferred embodiment of the present invention, the rotation driving part may include a rotation driving source 13 and a transmission part 14, wherein the transmission part 14 may be connected with the other end of the second shaft section 122; the rotation driving source 13 may be connected to the transmission member 14 for providing a rotation driving force to the transmission member 14 to rotate the second shaft section 122 by driving the transmission member 14 to rotate.
By connecting the transmission member 14 to the second shaft section 122 and the rotation driving source 13 respectively, and connecting the rotation driving source 13 to the second shaft section 122 through the transmission member 14, when the rotation driving source 13 provides the rotation driving force, the rotation driving force is firstly provided to the transmission member 14, and the transmission member 14 is driven to rotate, so as to drive the second shaft section 122 connected to the transmission member 14 to rotate, and thus drive the first shaft section 121 connected to the second shaft section 122 to rotate.
As shown in fig. 1 to 4, in a preferred embodiment of the present invention, the transmission member 14 may include a main transmission member 141 and a plurality of sub transmission members 142, the sub transmission members 142 are disposed in one-to-one correspondence with the rotating shafts 12, and the second shaft segments 122 are connected to the sub transmission members 142; the main transmission member 141 is connected to the rotation driving source 13, and drives the plurality of sub transmission members 142 to rotate synchronously.
The main transmission member 141 is connected to each sub transmission member 142 and the rotation driving source 13, so that the rotation driving source 13 is not directly connected to each sub transmission member 142, but is connected to each sub transmission member 142 through the main transmission member 141, so that when the rotation driving source 13 provides the rotation driving force, the rotation driving force is firstly provided to the main transmission member 141, and the rotation driving force drives each sub transmission member 142 connected to the main transmission member 141 to rotate by driving the main transmission member 141, thereby driving the second shaft sections 122 connected to each sub transmission member 142 in a one-to-one correspondence, so that the rotation driving source 13 can simultaneously drive the plurality of sub transmission members 142 to rotate, and further can simultaneously drive the plurality of second shaft sections 122 to rotate.
As shown in fig. 1 to fig. 3, the driving assembly includes two rotation shafts 12, the second shaft segment 122 of the two rotation shafts 12 is eccentrically connected to the first shaft segment 121, that is, the second shaft segment 122 of one rotation shaft 12 of the two rotation shafts 12 is eccentrically connected to the first shaft segment 121 of the rotation shaft 12, the second shaft segment 122 of the other rotation shaft 12 of the two rotation shafts 12 is eccentrically connected to the first shaft segment 121 of the rotation shaft 12, and the rotation driving component drives the two second shaft segments 122 to rotate clockwise, so as to drive the two first shaft segments 121 respectively connected to the two second shaft segments 122 to rotate clockwise, thereby driving the wafer 10 contacting with the two first shaft segments 121 to rotate counterclockwise.
By eccentrically connecting the second shaft segment 122 of one of the two rotary shafts 12 to the first shaft segment 121 of the rotary shaft 12 and eccentrically connecting the second shaft segment 122 of the other of the two rotary shafts 12 to the first shaft segment 121 of the rotary shaft 12, when the rotary driving means rotates the two rotary shafts 12, the first shaft segments 121 of the two rotary shafts 12 can drive the wafer 10 in contact therewith to vibrate on each support body 11, so that the wafer 10 can be brought into contact with or separated from each support body 11. As shown in fig. 1, the rotation driving part drives the two rotation shafts 12 to rotate, so that the wafer 10 contacts with each support body 11, and after the rotation driving part drives the two rotation shafts 12 to rotate clockwise or counterclockwise, as shown in fig. 2, since the first shaft sections 121 and the second shaft sections 122 of the two rotation shafts 12 are eccentrically connected, the first shaft sections 121 of the two rotation shafts 12 move the wafer 10 contacting therewith upward, so that the wafer 10 is separated from each support body 11. Meanwhile, when the rotation driving part drives the two rotation shafts 12 to rotate clockwise, the wafer 10 contacting with the first sections 121 of the two rotation shafts 12 rotates counterclockwise, and when the rotation driving part drives the two rotation shafts 12 to rotate counterclockwise, the wafer 10 contacting with the first sections 121 of the two rotation shafts 12 rotates clockwise.
As shown in fig. 1 to 3, in a preferred embodiment of the present invention, the main transmission member 141 may include a main gear, and each of the sub-transmission members 142 may include sub-gears, which are spaced apart from each other, surround the main gear and are engaged with the main gear.
As shown in fig. 1 to 3, for example, the transmission component 14 includes two sub-transmission components 142, and each of the two sub-transmission components 142 is a sub-gear, and the two sub-gears are spaced apart from each other and surround the main gear and are respectively located at two sides of the main gear, and the two sub-gears are engaged with the main gear to be rotated by the main gear.
Alternatively, the rotation drive source 13 may include a rotating motor.
In a preferred embodiment of the present invention, the main transmission member 141, the sub transmission member 142 and the rotary shaft 12 may be made of corrosion-resistant materials, so that corrosion by the cleaning liquid can be prevented, thereby improving durability of the carrying device.
As another technical solution, as shown in fig. 5, an embodiment of the present invention further provides a semiconductor cleaning apparatus, which includes a cleaning chamber 15 and a carrying device capable of being placed in the cleaning chamber 15, where the carrying device provided in the embodiment of the present invention is used for carrying a wafer 10.
In the semiconductor cleaning apparatus provided in this embodiment of the present invention, the wafer 10 is supported in the cleaning chamber 15 by the supporting device provided in this embodiment of the present invention, so as to improve the fluidity of the cleaning liquid, thereby improving the effect of removing particles, avoiding the occurrence of particle aggregation, and accelerating the reaction between the cleaning liquid and the wafer 10, thereby improving the cleaning effect.
Alternatively, the wafer 10 may be the wafer 10, and when the carrier device carries the wafer 10 and is placed in the cleaning chamber 15, the carrier device may be placed at the bottom of the cleaning chamber 15.
Alternatively, the cleaning fluid may be a chemical solution.
In a preferred embodiment of the present invention, the cleaning chamber 15 may include a first cleaning tank 151 and a second cleaning tank 152, the first cleaning tank 151 is used for placing the carrying device and containing the chemical solution, the second cleaning tank 152 and the first cleaning tank 151 may be communicated through a circulation pipeline 17, and the circulation pipeline 17 may be provided with a filtering part 18, a heating part 19 and a circulation pump 21. In the process of cleaning the wafer 10, the carrier device carrying the wafer 10 is placed in the first cleaning tank 151, and the chemical liquid contained in the first cleaning tank 151 reacts with the surface film layer or the defect of the wafer 10 chemically or physically, so as to clean the surface defect, the corrosion, and the like of the wafer 10. In the cleaning process, the chemical solution can flow the corroded particles into the second cleaning tank 152 through the overflow port at the bottom of the first cleaning tank 151, and in order to save the amount of the chemical solution and reduce the cleaning cost, the chemical solution with the corroded particles flowing into the second cleaning tank 152 can circulate back into the first cleaning tank 151 through the circulating pipeline 17 by virtue of the suction force of the circulating pump 21, the filtration of the filtering part 18 and the heating of the heating part 19, so that the recycling of the chemical solution is realized.
In a preferred embodiment of the present invention, the semiconductor cleaning apparatus may further include a rinsing water tank (not shown), the rinsing water tank may contain ultrapure water, the wafer 10 cleaned by the first cleaning tank 151 may be placed in the rinsing water tank, and the rinsing water tank may be configured to perform water rinsing on the wafer 10 cleaned by the first cleaning tank 151, and rinse the surface of the wafer 10 and particles remaining in the liquid film with a large amount of ultrapure water, so as to achieve efficient cleaning of the surface of the wafer 10.
In summary, the carrying device and the semiconductor cleaning apparatus provided in the embodiments of the present invention can improve the fluidity of the cleaning liquid to improve the effect of removing the particles, avoid the occurrence of particle aggregation, and accelerate the reaction between the cleaning liquid and the wafer 10, thereby improving the cleaning effect.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. The bearing device is used for semiconductor cleaning equipment and comprises a bearing structure, wherein the bearing structure is provided with a bearing groove for placing a wafer, and the bearing device is arranged in a cleaning chamber of the semiconductor cleaning equipment.
2. The carrier as claimed in claim 1, wherein the drive assembly includes a rotary drive member and a rotary shaft for contacting the wafer carried on the carrier structure;
the rotation driving part is connected with the rotation shaft and used for providing rotation driving force for the rotation shaft so as to drive the wafer contacted with the rotation shaft to move relative to the bearing structure by driving the rotation shaft to rotate.
3. The carrying device according to claim 2, wherein the rotating shaft comprises a first shaft section and a second shaft section, the first shaft section is used for contacting with the wafer, one end of the second shaft section is connected with the first shaft section, and the axis of the second shaft section is eccentric to the axis of the first shaft section; the rotary driving part is connected with the other end of the second shaft section, so that the wafer is contacted with or separated from the bearing structure through the first shaft section while the contact position of the wafer and the bearing structure is changed.
4. The carrier according to claim 3 wherein the rotary drive component comprises a rotary drive source and a transmission component, wherein the transmission component is connected to the other end of the second shaft section; the rotary driving source is connected with the transmission component and used for providing rotary driving force for the transmission component so as to drive the second shaft section to rotate by driving the transmission component to rotate.
5. The carrying device according to claim 4, wherein the transmission member comprises a main transmission member and a plurality of sub transmission members, the sub transmission members are arranged in one-to-one correspondence with the rotating shafts, and the second shaft section is connected with the sub transmission members; the main transmission piece is connected with the rotary driving source and drives the sub transmission pieces to synchronously rotate.
6. A carrier device according to claim 5, wherein the main transmission member comprises a main gear, and each of the sub-transmission members comprises sub-gears which are spaced around the main gear and each of which is engaged with the main gear.
7. The carrying device according to claim 5, wherein the main transmission member, the sub transmission member and the rotation shaft are made of corrosion-resistant materials.
8. The apparatus according to claim 2, wherein the supporting structure comprises at least two supporting bodies connected to each other, the supporting bodies are spaced apart from each other and arranged in parallel, the supporting bodies are provided with a plurality of supporting slots along a length direction, and the supporting slots on the supporting bodies located on a same plane are matched with each other to support the wafer;
the rotating shaft is arranged between two adjacent supporting bodies and is arranged in parallel with the supporting bodies.
9. The carrying device according to claim 8, wherein the carrying structure comprises four of the supporting bodies, the four supporting bodies being divided into two supporting groups, each supporting group comprising two of the supporting bodies;
the number of the rotating shafts is two, and the two rotating shafts are respectively positioned between the two supporting bodies in the two supporting groups.
10. A semiconductor cleaning apparatus comprising a cleaning chamber and a carrier device capable of being placed in the cleaning chamber, wherein the carrier device is the carrier device according to any one of claims 1 to 9, and the carrier device is used for carrying a wafer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110340243.XA CN113113346B (en) | 2021-03-30 | 2021-03-30 | Bearing device and semiconductor cleaning equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110340243.XA CN113113346B (en) | 2021-03-30 | 2021-03-30 | Bearing device and semiconductor cleaning equipment |
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| CN113113346A true CN113113346A (en) | 2021-07-13 |
| CN113113346B CN113113346B (en) | 2024-06-21 |
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| CN113822009A (en) * | 2021-09-18 | 2021-12-21 | 武汉精创电子技术有限公司 | Automatic generation method, device and system for crystal grain arrangement scheme |
| CN115815198A (en) * | 2022-11-30 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | Cleaning device |
| CN116564866A (en) * | 2023-07-10 | 2023-08-08 | 盛奕半导体科技(无锡)有限公司 | Semiconductor wet etching cleaning device |
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