TWI744988B - A device for cleaning and etching - Google Patents

Abstract

A device for cleaning and etching comprising: a rotatable unit having a driving mechanism which a basket may be loaded thereon. At least one rotatable shaft is disposed at a bottom of the basket and a driven mechanism disposed at the basket is connected to the at least one rotatable shaft. At least one wafer boat may be placed into the basket, so that the lower edge of wafers inside the wafer boat are touched with the at least one rotatable shaft. When the basket is loaded on a loading seat of the rotatable unit, the driven mechanism is connected with the driving mechanism and the at least one rotatable shaft is driven by the driven mechanism, so that the wafers are driven to be rotating and moving up and down, as thus to enhance a degree of homogeneity and effect of cleaning and etching and reduce the process time.

Description

Cleaning and etching device

The invention relates to a cleaning and etching device for semiconductor wafers or similar technical fields, in particular to a cleaning and etching device that can improve cleaning and etching performance.

The wafer manufacturing process requires repeated cleaning and etching of the wafer according to the process requirements. In the conventional cleaning or etching process, multiple wafers are placed in a wafer boat, and then the wafers and the wafer boat are placed together. Placed on the carrier of the shaking device of the process tank, when cleaning or etching process, put the wafer boat and wafer into the cleaning solution or etching solution together, and turn on the shaking device to drive the shaking in the vertical direction to make the cleaning The liquid or etching liquid must fully contact each position of each wafer.

Although the conventional cleaning and etching device can achieve the predetermined functions and effects, it may take a long time to achieve thorough cleaning or thorough etching, or the part of the wafer boat spacer that contacts the wafer may not be etched or Uneven.

The purpose of the present invention is to provide a cleaning and etching device that can further improve wafer cleaning or etching performance, thereby shortening the process time, and improving the efficiency and uniformity of cleaning and etching.

The cleaning and etching device provided by the present invention has a rotating unit, and the rotating unit may include: a base; a first motor assembly arranged on the base; a bearing seat connected to the base, the bearing seat provided with A driving mechanism connected to the first motor assembly; and a gondola frame provided to be placed on the bearing base, at least one rotating shaft is rotatably arranged at the bottom of the gondola frame, and the gondola frame is provided with a connection to the at least one A driven mechanism supporting the rotating shaft, and when the hanging basket frame is placed on the bearing base, the driven mechanism is connected to the driving mechanism, so that the first motor assembly drives the at least one through the driving mechanism and the driven mechanism. A rotating shaft rotates, wherein the hanging basket frame above the at least one rotating shaft can be At least one wafer boat is placed, and the edge of the wafer placed in the wafer boat contacts the at least one rotating shaft, so that the wafer is driven to rotate by the at least one rotating shaft.

In a preferred embodiment, the driving mechanism may include: a driving gear connected to an output shaft of the first motor assembly; a driven gear provided on the bearing seat, and the driven gear is concentrically provided with a driven pinion; and a Idler gear set meshes with the driving gear and the driven gear; wherein, the driven mechanism includes: at least one gear arranged on one end of the at least one rotating shaft; a power receiving gear arranged on the side wall of the gondola, the The power receiving gear is concentrically provided with a steering gear, the steering gear meshes with the at least one gear, wherein, when the gondola frame is placed on the bearing seat, the passive pinion meshes with the power receiving gear, so that the rotating unit can pass through the The driving mechanism and the driven mechanism drive the rotating shaft to rotate; the use of gears can prevent the chemical liquid from causing the transmission mechanism to slip and lose the transmission capacity.

In a preferred embodiment, the gondola frame may include two rotating shafts parallel to each other, and one end of each rotating shaft is provided with a gear, and the steering gear meshes with the two gears at the same time, so that the two rotating shafts are driven to each other Rotate in the opposite direction.

In a preferred embodiment, the outer diameter circumference of the rotating shaft can be polygonal, so that the wafer is driven to rotate while also shaking up and down.

In a preferred embodiment, the supporting base is provided with at least one positioning block, and the bottom of the gondola frame is provided with a positioning groove corresponding to the positioning block. When the gondola frame is placed on the supporting base, the positioning block and the positioning groove are mutually Engaged so that the gondola frame is positioned on the carrier.

The cleaning and etching device of the present invention generally includes a shaking unit connected to the rotating unit to drive the rotating unit to reciprocate in the vertical direction, so that the wafer is driven to rotate while also shaking in the vertical direction. Utilize the rotation and shaking of the wafer to accelerate the process capability.

The cleaning and etching device provided by the present invention, because the wafer placed in the wafer boat is driven to rotate in the cleaning solution or etching solution, the upper and lower vectors are swayed, and the wafer boat is also driven in the vertical direction along with the carrier. Shaking makes the cleaning liquid or etching liquid more quickly and completely contact all parts of the wafer surface to more efficiently clean or etch the wafer thoroughly.

1: Rotating unit

10: Pedestal

101: vertical axis

11: The first motor assembly

111: output shaft

112: driving gear

12: Idler gear set

13: Passive gear

131: Passive pinion

14: bearing seat

140: seat body

141: bearing plate

142: positioning block

143: Riser

2: hanging basket

21A: The first shaft

21B: second shaft

22A: First gear

22B: second gear

23: Power receiving gear

231: steering gear

24: Chute

3: crystal boat

31: Slot

32: convex rail

4: Wafer

5: Shaking unit

51: The second motor assembly

52: reducer

53: Eccentric

54: fixed seat

541: Slide

55: sliding seat

551: Clamping seat

Figure 1 shows the combination of the rotating unit of the present invention in the shaking unit, and the combination of the hanging basket frame and the rotating unit Fig. 2 is a three-dimensional schematic diagram of a gondola rack of the present invention that can be placed into a wafer boat and its configuration relationship; Fig. 3 is a three-dimensional diagram of a gondola rack of the present invention can be placed into two wafer boats and its configuration Fig. 4 is a schematic plan view showing that a wafer boat shown in Fig. 2 is placed in the hanging basket and the wafer is rotated by two rotating shafts; and Fig. 5 is a schematic diagram showing the two wafers shown in Fig. 3 A schematic plan view of the boat placed in the gondola and the wafers are rotated by two rotating shafts.

The following is a more detailed description of the implementation of the present invention in conjunction with the drawings and component symbols, so that those who are familiar with the art can implement it after studying this manual.

As shown in FIG. 1 and FIG. 2, a preferred embodiment of the cleaning and etching device provided by the present invention includes a rotating unit 1, a hanging basket 2 and a shaking unit 5.

Among them, the rotating unit 1 is a component used to rotate the wafer 4 in the wafer boat 3 placed in the hanging basket rack 2. The rotating unit 1 includes: a base 10, a first set on the base 10 The motor assembly 11 and the supporting base 14 connected to the base 10 are provided with a driving mechanism between the first motor assembly 11 and the supporting base 14. Specifically, the base 10 is substantially a plate-shaped body, the first motor assembly 11 is arranged on the base plate 10, and the first motor assembly 11 includes a first motor (not shown in the figure) arranged inside the housing and extends from The output shaft 111 of the first motor is provided with a driving gear 112.

The supporting base 14 basically has a horizontal base 140 and a vertical plate 143 connected to the horizontal base, so that the supporting base 14 substantially forms an L shape; the supporting base 14 is fixed to the base 10 by the upper end of the vertical plate 143; An idle gear set 12 composed of a plurality of idle gears and a driven gear 13 are arranged on 143, and the plurality of idle gears are arranged in series and meshed, and the idle gear at one end (upper end) of the idle gear set 12 meshes with the driving gear 112 , The idler gear at the other end (lower end) of the idler gear set 12 meshes with the passive gear 13; the passive gear 13 is also provided with a passive pinion 131 concentrically; therefore, when the first motor assembly 11 is running, the active gear 112 drives the idler gear The set 12 rotates, and the idle gear set 12 drives the driven gear 13 and the driven pinion 131 to rotate.

The seat body 140 of the bearing seat 14 is substantially a frame with a hollowed-out bottom, and a bearing plate 141 is formed on two opposite sides between the surroundings, and at least one positioning block 142 is respectively provided on the two bearing plates 141; the seat body 140 is used for In order to provide the gondola frame 2 to be placed therein, and the gondola frame 2 to be supported on the supporting plate 141.

The shaking unit 5 is a component used to connect the rotating unit 1 to drive the rotating unit 1 to reciprocate in a vertical direction. Specifically, as shown in FIG. 1, the shaking unit 5 has a fixed seat 54 which is provided with two sliding rails 541 extending in the vertical direction, and a sliding seat 55 is provided on the sliding rail 541 in a sliding manner. A clamping base 551 is provided at the upper end of 55; a vertical shaft 101 extending from the base 10 of the rotating unit 1 passes through the hole of the clamping base 551 and is clamped and fixed. A speed reducer 52 is arranged near the bottom of the fixed seat 54. The input shaft of the speed reducer 52 is connected to the second motor assembly 51, and the output shaft of the speed reducer 52 is connected to an eccentric wheel 53, which is in contact with the lower end of the sliding seat 55 . When the second motor assembly 51 of the shaking unit 5 is activated, the reducer 52 is driven to decelerate. The reducer 52 then drives the eccentric wheel 53 to rotate. The eccentric wheel 53 drives the sliding seat 55 to the highest stroke and then uses gravity to move the sliding seat 55 by itself. Sliding down means that the sliding seat 55 reciprocates up and down, and the entire rotating unit 1 is shaken up and down through the vertical shaft 101 and the base 10.

Figure 2 is a three-dimensional schematic diagram of an embodiment of the present invention in which one gondola frame 2 can be inserted into a wafer boat 3 and its configuration relationship; Figure 3 is a three-dimensional diagram of an embodiment of the present invention where one gondola frame 2 can be placed into two wafer boats 3 and its configuration A perspective view of another embodiment of the relationship. As shown in FIG. 2, the hanging basket rack 2 is provided with a component in which the wafer boat 3 carrying the wafer 4 is placed, and the hanging basket rack 2 is placed on the carrier 14 of the rotating unit 1, so that the wafer boat 3 The hanging basket frame 2 and the rotating unit 1 are transported into the cleaning solution of the cleaning tank for cleaning operation, or the etching operation is performed in the etching solution of the etching tank.

As shown in Figures 2 and 4, the first embodiment of the hanging basket 2 provided by the present invention is suitable for cleaning or etching larger-sized wafers (for example, 4-inch wafers to 12-inch wafers) . Specifically, two relatively close rotating shafts can be rotatably provided at the bottom of the gondola frame 2, namely, the first rotating shaft 21A and the second rotating shaft 21B. In a preferred embodiment of the present invention, the first rotating shaft 21A and the second rotating shaft 21A The outer diameter circumference of the rotating shaft 21B is formed in a polygonal shape (for example, a hexagonal shape or an octagonal shape). A driven mechanism connected to the first rotating shaft 21A and the second rotating shaft 21B is provided on the outer side of the side wall of the hanging basket frame 2, and the driven mechanism is used to connect the driving mechanism of the rotating unit 1. More specifically, the driven mechanism includes: a first gear 22A and a second gear 22B, which are respectively arranged at the ends of the central shaft of the first shaft 21A and the second shaft 21B extending outside the side wall of the gondola frame 2, The side wall is also provided with a power receiving gear 23. The power receiving gear 23 is concentrically provided with a steering gear 231, and the steering gear 231 meshes with the first gear 22A and the second gear 22B at the same time. When the power receiving gear 23 rotates, it passes through the steering gear 231 drives the first gear 22A and the second gear 22B to rotate in opposite directions.

As shown in Figure 2, the wafer boat 3 is a container used to carry a plurality of wafers 4, viewed from the end, the wafer boat 3 is substantially in the shape of "H", and the opposite sides of the inside are respectively formed with corresponding Slot 31, After the wafer 4 is inserted into each slot 31, a predetermined distance is maintained between two adjacent wafers, and the lower edge of each wafer 4 protrudes below the hollow of the wafer boat 3.

When the wafer 4 is to be cleaned or etched, first insert the wafer 4 into each slot 31 of the wafer boat 3, and then align the raised rails 32 on both sides of the wafer boat 3 that has been inserted into the wafer 4 Slide the chute 24 on the opposite sides of the gondola 2 to place the wafer boat 3 in the gondola 2. In this state, the lower edge of each wafer 4 contacts the first shaft 21A and the second shaft 21B ( As shown in Figure 4), then the hanging basket rack 2 that has been placed in the wafer boat 3 is placed on the bearing seat 14 of the rotating unit 1, so that the lower end of the hanging basket rack 2 is placed in the seat body 140, and at the same time, the hanging basket The positioning groove (not shown in the figure) under the frame 2 is fitted with the positioning block 142 on the bearing plate 141 and positioned to prevent the gondola frame 2 from shaking, and in this state, the passive pinion 131 and the power receiving gear 23 meshing. Subsequently, the rotating unit 1 and the shaking unit 5 are driven by another conveying device (not shown in the figure) to sink the carrier 14 and the hanging basket 2 into the cleaning solution in the cleaning tank or the etching solution in the etching tank. In this state, the first motor assembly 11 and the second motor assembly 51 are started to operate, respectively, and the operation of the first motor assembly 11 drives the power receiving gear 23 through the driving gear 112, the idle gear set 12 and the driven pinion 131 The steering gear 231 drives the first shaft 21A and the second shaft 21B to rotate synchronously and reversely via the first gear 22A and the second gear 22B. Because the outer circumferences of the first shaft 21A and the second shaft 21B are polygonal and both The lower edge of the wafer 4 is in contact with each other. Therefore, each wafer 4 will jump up and down along with the rotating first shaft 21A and second shaft 21B. At the same time, the second motor assembly 51 in operation also drives the base 10 of the rotating unit 1 to sway in the vertical direction, so that the cleaning solution or etching solution can quickly and completely contact the surface of the wafer to more Efficiently clean or etch wafers thoroughly.

As shown in FIGS. 3 and 5, the second embodiment of the hanging basket 2 provided by the present invention is suitable for cleaning or etching smaller-sized wafers (for example, 2-inch wafers to 4-inch wafers) . Similarly, two relatively separated rotating shafts are rotatably provided at the bottom of the hanging basket frame 2, namely, a first rotating shaft 21A and a second rotating shaft 21B. The outer diameter circumferences of the first rotating shaft 21A and the second rotating shaft 21B are also polygonal. A driven mechanism connected to the first rotating shaft 21A and the second rotating shaft 21B is provided on the outer side of the side wall of the hanging basket frame 2, and the driven mechanism is used to connect the driving mechanism of the rotating unit 1. More specifically, the driven mechanism includes: a first gear 22A and a second gear 22B, which are respectively arranged at the ends of the central shaft of the first shaft 21A and the second shaft 21B extending outside the side wall of the gondola frame 2, The side wall is also provided with a power receiving gear 23. The power receiving gear 23 is concentrically provided with a steering gear 231, and the steering gear 231 meshes with the first gear 22A and the second gear 22B at the same time. When the power receiving gear 23 rotates, it passes through the steering gear 231 drives the first gear 22A and the second gear 22B to rotate in opposite directions.

The hanging basket 2 shown in FIG. 3 can accommodate two wafer boats 3 in it. When the wafer 4 is to be cleaned or etched, the wafer 4 is first inserted into each slot 31 of the wafer boat 3 respectively. , And then slide the convex rails 32 on both sides of the wafer boat 3 into which the wafer 4 has been inserted along the two sets of slide grooves 24 on the opposite sides of the gondola 2 to place the two wafer boats 3 into the gondola 2 In this state, the lower edge of each wafer 4 in one group of wafer boat 3 contacts the first rotating shaft 21A, and the lower edge of the wafer 4 in the other group of wafer boat 3 contacts the second rotating shaft 21B ( As shown in Figure 5), then the hanging basket rack 2 that has been placed in the wafer boat 3 is placed on the bearing seat 14 of the rotating unit 1, so that the lower end of the hanging basket rack 2 is placed in the seat body 140, and at the same time, the hanging basket The positioning groove (not shown in the figure) under the frame 2 is fitted with the positioning block 142 on the bearing plate 141 and positioned to prevent the gondola frame 2 from shaking, and in this state, the passive pinion 131 and the power receiving gear 23 meshing. Subsequently, the rotating unit 1 and the shaking unit 5 are driven by another conveying device (not shown in the figure) to sink the carrier 14 and the hanging basket 2 into the cleaning solution in the cleaning tank or the etching solution in the etching tank. In this state, the first motor assembly 11 and the second motor assembly 51 are started to operate, respectively, and the operation of the first motor assembly 11 drives the power receiving gear 23 through the driving gear 112, the idle gear set 12 and the driven pinion 131 The steering gear 231 drives the first shaft 21A and the second shaft 21B to rotate synchronously and reversely via the first gear 22A and the second gear 22B. Because the outer circumferences of the first shaft 21A and the second shaft 21B are polygonal and both The lower edge of the wafer 4 is in contact with each other. Therefore, each wafer 4 will rotate with the rotating first rotating shaft 21A and the second rotating shaft 21B. At the same time, the second motor assembly 51 in operation also drives the base 10 of the rotating unit 1 to sway in the vertical direction, so that the cleaning solution or etching solution can quickly and completely contact the surface of the wafer to more Efficiently and thoroughly clean or etch wafers thoroughly and evenly.

The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to restrict the present invention in any form. Therefore, any modification or change related to the present invention is made under the same spirit of the invention. , Should still be included in the scope of the present invention's intended protection.

1: Rotating unit

10: Pedestal

101: vertical axis

11: The first motor assembly

111: output shaft

112: driving gear

12: Idler gear set

13: Passive gear

131: Passive pinion

14: bearing seat

140: seat body

141: bearing plate

142: positioning block

143: Riser

2: hanging basket

21A: The first shaft

21B: second shaft

23: Power receiving gear

5: Shaking unit

51: The second motor assembly

52: reducer

53: Eccentric

54: fixed seat

541: Slide

55: sliding seat

551: Clamping seat

Claims (5)

A cleaning and etching device has a rotating unit. The rotating unit includes: a base; a first motor assembly arranged on the base; A driving mechanism of the motor assembly; and a gondola frame provided to be placed on the bearing seat, the bottom of the gondola frame is rotatably provided with at least one rotating shaft, and the hanging basket frame is provided with a hanging basket connected to the at least one rotating shaft Driven mechanism, and when the gondola frame is placed on the bearing base, the driven mechanism is connected with the drive mechanism, so that the first motor assembly drives the at least one rotating shaft to rotate through the drive mechanism and the driven mechanism , Wherein at least one wafer boat can be placed in the hanging basket above the at least one rotating shaft, and the edge of the wafer placed in the wafer boat is brought into contact with the at least one rotating shaft, so that the wafer is At least one rotating shaft drives rotation, wherein the driving mechanism includes: a driving gear connected to an output shaft of the first motor assembly; a passive gear arranged on the bearing seat, and the passive gear is concentrically provided with a passive pinion; And an idler gear set meshing with the driving gear and the driven gear; wherein, the driven mechanism includes: at least one gear arranged on one end of the at least one rotating shaft; and a power receiving gear arranged on the gondola frame On the side wall, the power receiving gear is concentrically provided with a steering gear, and the steering gear meshes with the at least one gear; wherein, when the gondola frame is placed on the bearing seat, the passive pinion meshes with the power receiving gear. The cleaning and etching device according to claim 1, wherein it includes two rotating shafts parallel to each other, and one end of each rotating shaft is provided with the gear, and the steering gear meshes with the two gears at the same time. The cleaning and etching device according to claim 1 or 2, wherein the outer diameter circumference of the rotating shaft is polygonal. The cleaning and etching device according to claim 1 or 2, wherein the supporting base is provided with at least one positioning block, and the bottom of the hanging basket frame is provided with a positioning groove corresponding to the positioning block, when the hanging basket frame is placed in After the bearing seat, the positioning block and the positioning groove are engaged with each other. The cleaning and etching device according to claim 1 or 2, further comprising a shaking unit connected to the rotating unit to drive the rotating unit to reciprocate in a vertical direction.

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