TWI744988B - A device for cleaning and etching - Google Patents
A device for cleaning and etching Download PDFInfo
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- TWI744988B TWI744988B TW109124295A TW109124295A TWI744988B TW I744988 B TWI744988 B TW I744988B TW 109124295 A TW109124295 A TW 109124295A TW 109124295 A TW109124295 A TW 109124295A TW I744988 B TWI744988 B TW I744988B
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Abstract
Description
本發明涉及半導體晶圓片或類似技術領域的清洗與蝕刻裝置,特別是可以提昇清洗與蝕刻性能的清洗及蝕刻裝置。 The invention relates to a cleaning and etching device for semiconductor wafers or similar technical fields, in particular to a cleaning and etching device that can improve cleaning and etching performance.
晶圓片製造過程需要依照製程需求對晶圓片反復地清洗及蝕刻,在習知的清洗或蝕刻製程中,係將多個晶圓片放置在晶舟內,再將晶圓片連同晶舟放置在製程槽的晃動裝置的承載架上,當進行清洗或蝕刻製程時,將晶舟與晶圓片一起置入清洗液或蝕刻液中,並且開啟晃動裝置驅動在垂直方向上晃動,使清洗液或蝕刻液得得充分接觸到每一個晶圓片的每一個位置。 The wafer manufacturing process requires repeated cleaning and etching of the wafer according to the process requirements. In the conventional cleaning or etching process, multiple wafers are placed in a wafer boat, and then the wafers and the wafer boat are placed together. Placed on the carrier of the shaking device of the process tank, when cleaning or etching process, put the wafer boat and wafer into the cleaning solution or etching solution together, and turn on the shaking device to drive the shaking in the vertical direction to make the cleaning The liquid or etching liquid must fully contact each position of each wafer.
所述習知的清洗及蝕刻裝置雖然可以達到預定的功能與效果,但達到徹底清洗或徹底蝕刻所需要的時間可能較長,或晶舟間隔板接觸到晶圓片的部分會蝕刻不到或不均勻。 Although the conventional cleaning and etching device can achieve the predetermined functions and effects, it may take a long time to achieve thorough cleaning or thorough etching, or the part of the wafer boat spacer that contacts the wafer may not be etched or Uneven.
本發明的目的在於提供一種可以進一步提升晶圓片清洗或蝕刻性能,進而縮短製程時間、提升清洗及蝕刻效率及均勻度的清洗及蝕刻裝置。 The purpose of the present invention is to provide a cleaning and etching device that can further improve wafer cleaning or etching performance, thereby shortening the process time, and improving the efficiency and uniformity of cleaning and etching.
本發明提供的清洗及蝕刻裝置,具有一旋轉單元,該旋轉單元可以包括:一基座;一第一馬達組件,設於該基座;一承載座,連接該基座,該承載座設有連接該第一馬達組件的一驅動機構;以及一吊籃架,提供以安置在該承載座,該吊籃架的底部可旋轉地設置至少一支轉軸,該吊籃架設有連接至該至少一支轉軸的一被驅動機構,並且當該吊籃架安置於該承載座後,該被驅動機構與該驅動機構產生連接,使得該第一馬達組件通過該驅動機構與該被驅動機構帶動該至少一支轉軸旋轉,其中,該至少一支轉軸上方的該吊籃架內可 置入至少一個晶舟,並且使放置在該晶舟內的晶圓片邊緣接觸該至少一支轉軸,使該晶圓片被該至少一支轉軸帶動旋轉。 The cleaning and etching device provided by the present invention has a rotating unit, and the rotating unit may include: a base; a first motor assembly arranged on the base; a bearing seat connected to the base, the bearing seat provided with A driving mechanism connected to the first motor assembly; and a gondola frame provided to be placed on the bearing base, at least one rotating shaft is rotatably arranged at the bottom of the gondola frame, and the gondola frame is provided with a connection to the at least one A driven mechanism supporting the rotating shaft, and when the hanging basket frame is placed on the bearing base, the driven mechanism is connected to the driving mechanism, so that the first motor assembly drives the at least one through the driving mechanism and the driven mechanism. A rotating shaft rotates, wherein the hanging basket frame above the at least one rotating shaft can be At least one wafer boat is placed, and the edge of the wafer placed in the wafer boat contacts the at least one rotating shaft, so that the wafer is driven to rotate by the at least one rotating shaft.
一較佳實施例,該驅動機構可以包括:一主動齒輪,連接該第一馬達組件的一輸出軸;一被動齒輪,設於該承載座,該被動齒輪同心地設有一被動小齒輪;以及一惰齒輪組,嚙合該主動齒輪與該被動齒輪;其中,該被驅動機構包括:至少一個齒輪,設於該至少一支轉軸的一端;一動力接收齒輪,設於該吊籃架的側壁,該動力接收齒輪同心地設有一轉向齒輪,該轉向齒輪嚙合該至少一個齒輪,其中,當該吊籃架安置於該承載座後,該被動小齒輪與該動力接收齒輪嚙合,使得旋轉單元可以通過該驅動機構與被驅動機構帶動轉軸旋轉;利用齒輪帶動,可避免化學液體造成傳動機構打滑而失去傳動能力。 In a preferred embodiment, the driving mechanism may include: a driving gear connected to an output shaft of the first motor assembly; a driven gear provided on the bearing seat, and the driven gear is concentrically provided with a driven pinion; and a Idler gear set meshes with the driving gear and the driven gear; wherein, the driven mechanism includes: at least one gear arranged on one end of the at least one rotating shaft; a power receiving gear arranged on the side wall of the gondola, the The power receiving gear is concentrically provided with a steering gear, the steering gear meshes with the at least one gear, wherein, when the gondola frame is placed on the bearing seat, the passive pinion meshes with the power receiving gear, so that the rotating unit can pass through the The driving mechanism and the driven mechanism drive the rotating shaft to rotate; the use of gears can prevent the chemical liquid from causing the transmission mechanism to slip and lose the transmission capacity.
一較佳實施例,該吊籃架可以包括二支彼此平行的轉軸,每一支該轉軸的一端均設有齒輪,並且轉向齒輪同時嚙合該二個齒輪,藉以使得二支轉軸被帶動往彼此相反的方向旋轉。 In a preferred embodiment, the gondola frame may include two rotating shafts parallel to each other, and one end of each rotating shaft is provided with a gear, and the steering gear meshes with the two gears at the same time, so that the two rotating shafts are driven to each other Rotate in the opposite direction.
一較佳實施例,該轉軸的外徑圓周可以為多邊形,使得晶圓片被帶動旋轉的同時亦產生上下晃動。 In a preferred embodiment, the outer diameter circumference of the rotating shaft can be polygonal, so that the wafer is driven to rotate while also shaking up and down.
一較佳實施例,該承載座設有至少一個定位塊,且吊籃架的底部設有對應該定位塊的定位槽,當吊籃架安置於承載座後,該定位塊與該定位槽彼此接合,使得吊籃架被定位在承載座。 In a preferred embodiment, the supporting base is provided with at least one positioning block, and the bottom of the gondola frame is provided with a positioning groove corresponding to the positioning block. When the gondola frame is placed on the supporting base, the positioning block and the positioning groove are mutually Engaged so that the gondola frame is positioned on the carrier.
本發明之清洗及蝕刻裝置,一般包括有一晃動單元,該晃動單元連接該旋轉單元,以驅動該旋轉單元在垂直方向上往復晃動,使得晶圓片被帶動旋轉的同時亦在垂直方向上晃動,利用晶圓片的自轉及上下晃動加速製程能力。 The cleaning and etching device of the present invention generally includes a shaking unit connected to the rotating unit to drive the rotating unit to reciprocate in the vertical direction, so that the wafer is driven to rotate while also shaking in the vertical direction. Utilize the rotation and shaking of the wafer to accelerate the process capability.
本發明提供的清洗及蝕刻裝置,由於放置在晶舟中的晶圓片在清洗液或蝕刻液中被帶動旋轉的同時產生上下向量晃動,並且晶舟亦隨著承載架被驅動在垂直方向上晃動,使得清洗液或蝕刻液更能快速、完全地接觸晶圓片表面各處,以更有效率地徹底清洗或徹底蝕刻晶圓片。 The cleaning and etching device provided by the present invention, because the wafer placed in the wafer boat is driven to rotate in the cleaning solution or etching solution, the upper and lower vectors are swayed, and the wafer boat is also driven in the vertical direction along with the carrier. Shaking makes the cleaning liquid or etching liquid more quickly and completely contact all parts of the wafer surface to more efficiently clean or etch the wafer thoroughly.
1:旋轉單元 1: Rotating unit
10:基座 10: Pedestal
101:豎軸 101: vertical axis
11:第一馬達組件 11: The first motor assembly
111:輸出軸 111: output shaft
112:主動齒輪 112: driving gear
12:惰齒輪組 12: Idler gear set
13:被動齒輪 13: Passive gear
131:被動小齒輪 131: Passive pinion
14:承載座 14: bearing seat
140:座體 140: seat body
141:承板 141: bearing plate
142:定位塊 142: positioning block
143:豎板 143: Riser
2:吊籃架 2: hanging basket
21A:第一轉軸 21A: The first shaft
21B:第二轉軸 21B: second shaft
22A:第一齒輪 22A: First gear
22B:第二齒輪 22B: second gear
23:動力接收齒輪 23: Power receiving gear
231:轉向齒輪 231: steering gear
24:滑槽 24: Chute
3:晶舟 3: crystal boat
31:插槽 31: Slot
32:凸軌 32: convex rail
4:晶圓片 4: Wafer
5:晃動單元 5: Shaking unit
51:第二馬達組件 51: The second motor assembly
52:減速機 52: reducer
53:偏心輪 53: Eccentric
54:固定座 54: fixed seat
541:滑軌 541: Slide
55:滑動座 55: sliding seat
551:夾持座 551: Clamping seat
圖1為顯示本發明之旋轉單元組合於晃動單元,以及吊籃架與旋轉單元之配 置關係之立體示意圖;圖2為本發明之一個吊籃架可以置入一個晶舟及其配置關係之立體示意圖;圖3為本發明之一個吊籃架可以置入二個晶舟及其配置關係之立體示意圖;圖4為顯示圖2所示之一個晶舟置入吊籃架,並且由二支轉軸帶動晶圓片旋轉之平面示意圖;以及圖5為顯示圖3所示之二個晶舟置入吊籃架,並且由二支轉軸帶動晶圓片旋轉之平面示意圖。 Figure 1 shows the combination of the rotating unit of the present invention in the shaking unit, and the combination of the hanging basket frame and the rotating unit Fig. 2 is a three-dimensional schematic diagram of a gondola rack of the present invention that can be placed into a wafer boat and its configuration relationship; Fig. 3 is a three-dimensional diagram of a gondola rack of the present invention can be placed into two wafer boats and its configuration Fig. 4 is a schematic plan view showing that a wafer boat shown in Fig. 2 is placed in the hanging basket and the wafer is rotated by two rotating shafts; and Fig. 5 is a schematic diagram showing the two wafers shown in Fig. 3 A schematic plan view of the boat placed in the gondola and the wafers are rotated by two rotating shafts.
以下配合圖示及元件符號對本發明之實施方式做更詳細的說明,俾使熟習該項技藝者在研讀本說明書後能據以實施。 The following is a more detailed description of the implementation of the present invention in conjunction with the drawings and component symbols, so that those who are familiar with the art can implement it after studying this manual.
如圖1及圖2所示,本發明提供的清洗及蝕刻裝置,較佳實施方式包括有旋轉單元1、吊籃架2與晃動單元5。
As shown in FIG. 1 and FIG. 2, a preferred embodiment of the cleaning and etching device provided by the present invention includes a rotating
其中,旋轉單元1係用以使放置在吊籃架2內之晶舟3中的晶圓片4旋轉的組件,該旋轉單元1包括有:基座10、設於基座10上的第一馬達組件11、以及連接至基座10的承載座14,第一馬達組件11與承載座14之間設置有驅動機構。具體而言,基座10大致上為一板狀體,第一馬達組件11設於基板10的上面,第一馬達組件11包含設置在外殼內部的第一馬達(圖中未顯示),延伸自第一馬達的輸出軸111設置一主動齒輪112。
Among them, the rotating
承載座14基本上具有水平的座體140以及連接在該水平座體的豎板143,使得承載座14大致上構成L形狀;承載座14利用豎板143的上端固定至基座10;豎板143上配置由多個惰齒輪構成的惰齒輪組12以及一個被動齒輪13,該多個惰齒輪系列地串聯配置且嚙合,並且使惰齒輪組12一端(上端)的惰齒輪和主動齒輪112嚙合,惰齒輪組12另一端(下端)的惰齒輪和被動齒輪13嚙合;所述被動齒輪13還同心地設有被動小齒輪131;因此,第一馬達組件11運轉時,主動齒輪112帶動惰齒輪組12旋轉,惰齒輪組12則驅動被動齒輪13與被動小齒輪131旋轉。
The supporting
承載座14的座體140大體上為底部鏤空的框體,其周圍之間的相對兩側分別形成有承板141,兩承板141上分別設置至少一個定位塊142;該座體140係用以提供吊籃架2安置在其中,並且使吊籃架2被支承在承板141上。
The
所述晃動單元5係用以連接旋轉單元1以驅動旋轉單元1在垂直方向上往復晃動的組件。具體而言,如圖1所示,晃動單元5具有一固定座54,固定座54設置有在垂直方向上延伸的二支滑軌541,滑軌541上滑動配合地設置滑動座55,滑動座55的上端設置一夾持座551;延伸自旋轉單元1之基座10下方的豎軸101係穿設於夾持座551的洞孔並且被夾持固定。固定座54接近下方的位置配置一減速機52,減速機52的輸入軸連接第二馬達組件51,減速機52的輸出軸連接一偏心輪53,偏心輪53係接觸至滑動座55的下端邊。當晃動單元5的第二馬達組件51作動時帶動減速機52減速運轉,減速機52再驅動偏心輪53旋轉,偏心輪53則帶動滑動座55上升至最高行程後利用重力使滑動座55自行往下滑動,亦即使得滑動座55上下往復滑動,進而通過豎軸101與基座10使得整個旋轉單元1上下晃動。
The
圖2為本發明之一個吊籃架2可以置入一個晶舟3及其配置關係之實施例立體示意圖;圖3為本發明之一個吊籃架2可以置入二個晶舟3及其配置關係之另一實施例立體示意圖。如圖2所示,所述吊籃架2係提供以放置承載晶圓片4的晶舟3於其中的組件,吊籃架2則被安置在旋轉單元1的承載座14,使得晶舟3和吊籃架2隨同旋轉單元1被輸送進入清洗槽的清洗液中進行清洗作業,或蝕刻槽的蝕刻液中進行蝕刻作業。
Figure 2 is a three-dimensional schematic diagram of an embodiment of the present invention in which one
如圖2及圖4所示,本發明提供之吊籃架2的第一實施例適用於對較大尺寸的晶圓片(例如4吋晶圓片到12吋晶圓片)進行清洗或蝕刻。具體而言,可以在吊籃架2的底部可旋轉地設置相對靠近的二支轉軸,即第一轉軸21A與第二轉軸21B,本發明的較佳實施例,該第一轉軸21A與第二轉軸21B的外徑圓周係形成為多邊形(例如六邊形或八邊形)。吊籃架2的側壁外側則設置有連接至該第一轉軸21A與第二轉軸21B的被驅動機構,該被驅動機構用以連接旋轉單元1的驅動機構。更明確地說,該被驅動機構包括:第一齒輪22A與第二齒輪22B,分別設置在第一轉軸21A與第二轉軸21B之延伸出吊籃架2的側壁外的中心軸的端部,該側壁還設置一動力接收齒輪23,該動力接收齒輪23同心地設有一轉向齒輪231,並且轉向齒輪231同時嚙合第一齒輪22A與第二齒輪22B,當動力接收齒輪23旋轉時,通過轉向齒輪231驅動第一齒輪22A與第二齒輪22B往彼此相反的方向旋轉。
As shown in Figures 2 and 4, the first embodiment of the
如圖2所示,所述晶舟3係用以承載複數個晶圓片4的容器,從端部觀看,晶舟3大體上呈「H」形狀,其內部的相對兩側分別形成對應的插槽31,
當晶圓片4插入各個插槽31中後,相鄰兩晶圓片之間保持預定的距離,並且各晶圓片4的下緣突出晶舟3的鏤空下方。
As shown in Figure 2, the
當要對晶圓片4進行清洗或蝕刻時,首先將晶圓片4分別插入晶舟3的各個插槽31內,再將已插入晶圓片4的晶舟3兩側的凸軌32沿著吊籃架2相對兩側的滑槽24滑入而將晶舟3置入吊籃架2內,在此狀態下各個晶圓片4的下緣接觸第一轉軸21A與第二轉軸21B(如圖4所示),然後將已置入晶舟3的吊籃架2安置於旋轉單元1的承載座14,使得吊籃架2的下端置入座體140內,同時使設於吊籃架2下方的定位槽(圖中未顯示),與承板141上的定位塊142相互嵌合而定位,以避免吊籃架2晃動,並且在此狀態中,被動小齒輪131與動力接收齒輪23嚙合。隨後,旋轉單元1與晃動單元5一起由另外的輸送裝置(圖中未顯示)驅動,以將承載座14與吊籃架2一起沉入清洗槽內的清洗液中或蝕刻槽內的蝕刻液中,在此狀態下,第一馬達組件11與第二馬達組件51分別被啟動運轉,第一馬達組件11的運轉則通過主動齒輪112、惰齒輪組12與被動小齒輪131帶動動力接收齒輪23旋轉,並由轉向齒輪231經由第一齒輪22A與第二齒輪22B帶動第一轉軸21A與第二轉軸21B同步反向旋轉,由於第一轉軸21A與第二轉軸21B的外圓周係多邊形並且均與晶圓片4的下端緣接觸,因此,各個晶圓片4將會隨著旋轉中的第一轉軸21A與第二轉軸21B而上下跳動。於此同時,運轉中的第二馬達組件51亦驅動旋轉單元1的基座10在垂直方向上晃動,使得清洗液或蝕刻液更能快速、完全地接觸晶圓片表面各處,以更有效率地徹底清洗或徹底蝕刻晶圓片。
When the
如圖3及圖5所示,本發明提供之吊籃架2的第二實施例適用於對較小尺寸的晶圓片(例如2吋晶圓片到4吋晶圓片)進行清洗或蝕刻。其同樣在吊籃架2的底部可旋轉地設置相對分開的二支轉軸,即第一轉軸21A與第二轉軸21B,該第一轉軸21A與第二轉軸21B的外徑圓周亦形成為多邊形。吊籃架2的側壁外側則設置有連接至該第一轉軸21A與第二轉軸21B的被驅動機構,該被驅動機構用以連接旋轉單元1的驅動機構。更明確地說,該被驅動機構包括:第一齒輪22A與第二齒輪22B,分別設置在第一轉軸21A與第二轉軸21B之延伸出吊籃架2的側壁外的中心軸的端部,該側壁還設置一動力接收齒輪23,該動力接收齒輪23同心地設有一轉向齒輪231,並且轉向齒輪231同時嚙合第一齒輪22A與第二齒輪22B,當動力接收齒輪23旋轉時,通過轉向齒輪231驅動第一齒輪22A與第二齒輪22B往彼此相反的方向旋轉。
As shown in FIGS. 3 and 5, the second embodiment of the
圖3所示的吊籃架2可供二個晶舟3置入其中,當要對晶圓片4進行清洗或蝕刻時,首先將晶圓片4分別插入晶舟3的各個插槽31內,再將已插入晶圓片4的晶舟3兩側的凸軌32沿著吊籃架2相對兩側的二組滑槽24滑入而將兩個晶舟3置入吊籃架2內,在此狀態下,其中一組晶舟3中的各個晶圓片4的下緣接觸第一轉軸21A,另一組晶舟3中的晶圓片4的下緣則接觸第二轉軸21B(如圖5所示),然後將已置入晶舟3的吊籃架2安置於旋轉單元1的承載座14,使得吊籃架2的下端置入座體140內,同時使設於吊籃架2下方的定位槽(圖中未顯示),與承板141上的定位塊142相互嵌合而定位,以避免吊籃架2晃動,並且在此狀態中,被動小齒輪131與動力接收齒輪23嚙合。隨後,旋轉單元1與晃動單元5一起由另外的輸送裝置(圖中未顯示)驅動,以將承載座14與吊籃架2一起沉入清洗槽內的清洗液中或蝕刻槽內的蝕刻液中,在此狀態下,第一馬達組件11與第二馬達組件51分別被啟動運轉,第一馬達組件11的運轉則通過主動齒輪112、惰齒輪組12與被動小齒輪131帶動動力接收齒輪23旋轉,並由轉向齒輪231經由第一齒輪22A與第二齒輪22B帶動第一轉軸21A與第二轉軸21B同步反向旋轉,由於第一轉軸21A與第二轉軸21B的外圓周係多邊形並且均與晶圓片4的下端緣接觸,因此,各個晶圓片4將會隨著旋轉中的第一轉軸21A與第二轉軸21B而轉動。於此同時,運轉中的第二馬達組件51亦驅動旋轉單元1的基座10在垂直方向上晃動,使得清洗液或蝕刻液更能快速、完全地接觸晶圓片表面各處,以更有效率地徹底清洗或徹底均勻地蝕刻晶圓片。
The
以上所述者僅為用以解釋本發明之較佳實施例,並非企圖據以對本發明做任何形式上之限制,是以,凡有在相同之發明精神下所作有關本發明之任何修飾或變更,皆仍應包括在本發明意圖保護之範疇。 The above descriptions are only used to explain the preferred embodiments of the present invention, and are not intended to restrict the present invention in any form. Therefore, any modification or change related to the present invention is made under the same spirit of the invention. , Should still be included in the scope of the present invention's intended protection.
1:旋轉單元 1: Rotating unit
10:基座 10: Pedestal
101:豎軸 101: vertical axis
11:第一馬達組件 11: The first motor assembly
111:輸出軸 111: output shaft
112:主動齒輪 112: driving gear
12:惰齒輪組 12: Idler gear set
13:被動齒輪 13: Passive gear
131:被動小齒輪 131: Passive pinion
14:承載座 14: bearing seat
140:座體 140: seat body
141:承板 141: bearing plate
142:定位塊 142: positioning block
143:豎板 143: Riser
2:吊籃架 2: hanging basket
21A:第一轉軸 21A: The first shaft
21B:第二轉軸 21B: second shaft
23:動力接收齒輪 23: Power receiving gear
5:晃動單元 5: Shaking unit
51:第二馬達組件 51: The second motor assembly
52:減速機 52: reducer
53:偏心輪 53: Eccentric
54:固定座 54: fixed seat
541:滑軌 541: Slide
55:滑動座 55: sliding seat
551:夾持座 551: Clamping seat
Claims (5)
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TW109124295A TWI744988B (en) | 2020-07-17 | 2020-07-17 | A device for cleaning and etching |
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TW202204230A TW202204230A (en) | 2022-02-01 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI834210B (en) * | 2022-07-01 | 2024-03-01 | 弘塑科技股份有限公司 | Wafer carrier device with position limiting functions and wafer carrier cassette device thereof |
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TW201409560A (en) * | 2012-05-15 | 2014-03-01 | Lam Res Ag | Method and apparatus for liquid treatment of wafer-shaped articles |
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TW201816174A (en) * | 2016-08-03 | 2018-05-01 | 日商東京威力科創股份有限公司 | Film forming apparatus, film forming method, and memory medium capable of ensuring high productivity by allowing ALD process to be simultaneously carried out on plural wafers |
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TW504041U (en) * | 1997-02-21 | 2002-09-21 | Canon Kk | Wafer processing apparatus |
TW201409560A (en) * | 2012-05-15 | 2014-03-01 | Lam Res Ag | Method and apparatus for liquid treatment of wafer-shaped articles |
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TWI834210B (en) * | 2022-07-01 | 2024-03-01 | 弘塑科技股份有限公司 | Wafer carrier device with position limiting functions and wafer carrier cassette device thereof |
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