CN110858560A - Lifting device, assembling device of semiconductor manufacturing device and assembling method thereof - Google Patents

Lifting device, assembling device of semiconductor manufacturing device and assembling method thereof Download PDF

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Publication number
CN110858560A
CN110858560A CN201910773338.3A CN201910773338A CN110858560A CN 110858560 A CN110858560 A CN 110858560A CN 201910773338 A CN201910773338 A CN 201910773338A CN 110858560 A CN110858560 A CN 110858560A
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China
Prior art keywords
lifting
unit
tube
elevating
lifting device
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Granted
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CN201910773338.3A
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Chinese (zh)
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CN110858560B (en
Inventor
井上久司
小林正寿
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN110858560B publication Critical patent/CN110858560B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a lifting device, an assembling device of a semiconductor manufacturing device and an assembling method thereof, which can reduce the burden of an operator when assembling the semiconductor manufacturing device. An elevator apparatus according to an aspect of the present invention includes: a shaft portion extending in the vertical direction; a first elevating portion capable of elevating along the shaft portion; a first driving unit configured to move the first lifting unit up and down; a second lifting portion which can be lifted along the shaft portion at a position lower than the first lifting portion; and a second driving unit configured to move the second lifting unit up and down.

Description

Lifting device, assembling device of semiconductor manufacturing device and assembling method thereof
Technical Field
The invention relates to a lifting device, an assembling device of a semiconductor manufacturing device and an assembling method thereof.
Background
A semiconductor manufacturing apparatus such as a batch-type heat treatment apparatus that collectively processes a plurality of substrates is assembled by mounting a plurality of components (for example, a reaction tube, a gas introduction tube, and a thermocouple) at an installation site of the apparatus (for example, see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 8-115908
Patent document 2: japanese laid-open patent publication No. 4-206635
Disclosure of Invention
Technical problem to be solved by the invention
The invention provides a technique capable of reducing the burden of an operator when assembling a semiconductor manufacturing device.
Technical solution for solving technical problem
An elevator apparatus according to an aspect of the present invention includes: a shaft portion extending in the vertical direction; a first elevating portion capable of elevating along the shaft portion; a first driving unit configured to move the first lifting unit up and down; a second lifting portion which can be lifted along the shaft portion at a position lower than the first lifting portion; and a second driving unit configured to move the second lifting unit up and down.
Effects of the invention
According to the present invention, it is possible to reduce the burden on the operator when assembling the semiconductor manufacturing apparatus.
Drawings
FIG. 1 is a longitudinal sectional view showing a structural example of a vertical heat treatment apparatus.
FIG. 2 is a cross-sectional view showing a structural example of the vertical heat treatment apparatus.
FIG. 3 is a perspective view (1) showing a structural example of an assembling apparatus of the vertical heat treatment apparatus.
FIG. 4 is a perspective view (2) showing a structural example of an assembling apparatus of the vertical heat treatment apparatus.
Fig. 5 is a diagram showing a configuration example of the lifting device.
Fig. 6 is a diagram (1) illustrating the first elevating unit of the elevating device of fig. 5.
Fig. 7 is a view (2) for explaining the first elevating unit of the elevating device of fig. 5.
Fig. 8 is a diagram (3) illustrating the first elevating unit of the elevating device of fig. 5.
Fig. 9 is a flowchart showing an example of an assembling method of the semiconductor manufacturing apparatus.
Fig. 10 is an explanatory view of a process of feeding the outer tube into the assembly apparatus.
Fig. 11 is an explanatory view of a process of mounting the inner pipe inside the outer pipe.
Fig. 12 is an explanatory view of a process of attaching the gas supply pipe.
Fig. 13 is an explanatory diagram of a process of performing a leak test.
FIG. 14 is an explanatory view of a process of feeding the reaction tube unit from the assembly apparatus.
Description of the reference numerals
110 main body
130 lifting device
131 guide part
131d screw shaft
131f, 131g guide rail
132 first lifting part
132c nut
132d, 132e Block
132g pneumatic clamp
133 second lifting part
135 first driving part
135a motor with speed reducer
135c transmission mechanism
135d belt damage sensor
135f, 135e belt wheel
135g synchronous belt
136 second driving part
137 anti-collision mechanism
150 gas supply device
160 exhaust means.
Detailed Description
Non-limiting exemplary embodiments of the present invention will be described below with reference to the attached drawings. In all the drawings attached hereto, the same or corresponding reference numerals are given to the same or corresponding parts or components, and the duplicate explanation is omitted.
(vertical heat treatment apparatus)
First, a configuration example of a vertical heat treatment apparatus that can be assembled using the assembly apparatus according to one embodiment will be described. Although a vertical heat treatment apparatus of a double pipe structure is described below, a vertical heat treatment apparatus of a single pipe structure may be used. FIG. 1 is a longitudinal sectional view showing a structural example of a vertical heat treatment apparatus. FIG. 2 is a cross-sectional view showing a structural example of the vertical heat treatment apparatus.
As shown in fig. 1, the vertical heat treatment apparatus 1 includes a reaction tube 34, a lid 36, a boat 38, a gas supply device 40, an exhaust device 41, and a heating device 42.
The reaction tube 34 receives a boat 38. The wafer boat 38 is a substrate holder that holds a plurality of semiconductor wafers (hereinafter referred to as "wafers W") at predetermined intervals. The reaction tube 34 includes: an inner tube 44 of a cylindrical shape with a top open at the lower end; and an outer tube 46 of a topped cylindrical shape whose lower end is open and which covers the outside of the inner tube 44. The inner tube 44 and the outer tube 46 are made of a heat-resistant material such as quartz, and are arranged coaxially to form a double tube structure.
The top 44A of the inner tube 44 is flat, for example. A nozzle housing portion 48 for housing a gas supply pipe is formed on one side of the inner tube 44 along the longitudinal direction (vertical direction). For example, as shown in fig. 2, a projection 50 is formed by projecting a part of the side wall of the inner tube 44 outward, and the nozzle housing 48 is formed in the projection 50. A rectangular opening 52 having a width L1 is formed in the longitudinal direction (vertical direction) of the inner tube 44 in the side wall on the opposite side of the inner tube 44 to the nozzle housing portion 48.
The opening 52 is a gas exhaust port formed to be able to exhaust the gas inside the inner tube 44. The length of the opening 52 is formed to be the same as the length of the wafer holder plate 38 or to extend in the up-down direction longer than the length of the wafer holder plate 38, respectively. That is, the upper end of the opening 52 is located at a height extending above a position corresponding to the upper end of the wafer carrier plate 38, and the lower end of the opening 52 is located at a height extending below a position corresponding to the lower end of the wafer carrier plate 38. Specifically, as shown in fig. 1, a height-direction distance L2 between the upper end of the wafer holder plate 38 and the upper end of the opening 52 is in the range of 0mm to 5 mm. The height-directional distance L3 between the lower end of the wafer carrier plate 38 and the lower end of the opening 52 is in the range of approximately 0mm to 350 mm.
The lower end of the reaction tube 34 is supported by a cylindrical manifold (manifold)54 formed of, for example, stainless steel. A flange (flange) portion 56 is formed at the upper end of the manifold 54, and the lower end of the outer tube 46 is provided and supported on the flange portion 56. A seal member 58 such as an O-ring is interposed between the flange portion 56 and the lower end of the outer tube 46 to hermetically seal the inside of the outer tube 46.
An annular support portion 60 is provided on the inner wall of the upper portion of the manifold 54, and the lower end of the inner tube 44 is supported by the support portion 60. The cover 36 is attached to the lower end opening of the manifold 54 in an airtight manner by a sealing member 62 such as an O-ring, and the lower end opening of the reaction tube 34, that is, the opening of the manifold 54 is closed in an airtight manner. The cover 36 is formed of, for example, stainless steel.
A rotary shaft 66 is provided in a central portion of the cover 36 so as to penetrate through the magnetic fluid seal portion 64. The lower portion of the rotating shaft 66 is rotatably supported by an arm 68A of a lifting device 68 formed of a plate-type lifting device.
A rotary plate 70 is provided at the upper end of the rotary shaft 66, and the wafer stage plate 38 for holding the wafer W is placed on the rotary plate 70 via a quartz heat retaining table 72. Therefore, by moving the lifting means 68 up and down, the lid 36 and the wafer support plate 38 are moved up and down integrally, and the wafer support plate 38 can be inserted into and removed from the reaction tube 34.
The gas supply device 40 is provided in the manifold 54, and introduces a gas such as a film forming gas, an etching gas, or a purge gas into the inner pipe 44. The gas supply device 40 has a plurality of (e.g., 3) quartz gas supply pipes 76, 78, and 80. The gas supply pipes 76, 78, and 80 are provided in the inner pipe 44 along the longitudinal direction of the inner pipe 44, and are supported such that the root ends of the gas supply pipes 76, 78, and 80 are bent in an L shape to penetrate the manifold 54.
As shown in fig. 2, the gas supply pipes 76, 78, 80 are arranged in a row in the circumferential direction in the nozzle housing portion 48 of the inner pipe 44. The gas supply pipes 76, 78, and 80 have a plurality of gas holes 76A, 78A, and 80A formed at predetermined intervals along the longitudinal direction, and the gas holes 76A, 78A, and 80A allow the gas to be discharged in the horizontal direction. The predetermined interval is set to be, for example, the same as the interval of the wafers W supported by the wafer support plate 38. Further, the gas holes 76A, 78A, and 80A are set at positions in the height direction at intermediate positions between vertically adjacent wafers W, and the respective gases can be efficiently supplied to the space between the wafers W. The types of gases include a film forming gas, an etching gas, and a purge gas, and the gases can be supplied from the gas supply pipes 76, 78, and 80 as needed while controlling the flow rate of the gases.
A gas outlet 82 is formed in the upper side wall of the manifold 54 and above the support portion 60, and the gas in the inner tube 44 discharged from the opening 52 can be discharged through a space 84 between the inner tube 44 and the outer tube 46. An exhaust device 41 is provided at the gas outlet 82. The exhaust device 41 has an exhaust passage 86 connected to the gas outlet 82, and a pressure regulating valve 88 and a vacuum pump 90 are provided in this order in the exhaust passage 86, so that the inside of the reaction tube 34 can be evacuated.
A cylindrical heating device 42 is provided on the outer circumferential side of the outer tube 46 so as to cover the outer tube 46. The heating device 42 heats the wafer W accommodated in the reaction tube 34.
The overall operation of the vertical heat treatment apparatus 1 is controlled by a control device 95 such as a computer. Further, a computer program for performing the overall operation of the vertical heat treatment apparatus 1 is stored in the storage medium 96. The storage medium 96 may be, for example, a floppy disk, an optical disk, a hard disk, a flash memory, a DVD, etc.
(Assembly apparatus for semiconductor manufacturing apparatus)
An assembling apparatus according to an embodiment is an apparatus for assembling a reaction tube unit by mounting a plurality of components of a batch-type vertical heat treatment apparatus capable of collectively performing heat treatment on a plurality of wafers. Examples of the component are a reaction tube, a gas introduction tube, and a thermocouple. The reaction tube may have a single-tube structure or a double-tube structure having an inner tube and an outer tube. According to the assembling apparatus of one embodiment, since the reaction tube unit can be assembled at a place different from the installation place of the vertical heat treatment apparatus, the operation space can be easily secured. Thus, a plurality of operators can simultaneously perform the assembly work of the reaction tube units, and thus the assembly period of the vertical heat treatment apparatus can be shortened. In addition, a plurality of operators can simultaneously perform maintenance of the reaction tube units, and the non-operating time of the vertical heat treatment apparatus can be reduced.
Hereinafter, a configuration example of the assembly apparatus according to one embodiment will be described. Fig. 3 and 4 are perspective views showing configuration examples of the assembly device according to the embodiment, and each of the views shows a state seen from another viewing angle. For convenience of explanation, the description will be given with the + X direction as the front direction, the-X direction as the rear direction, the + Y direction as the right direction, the-Y direction as the left direction, the + Z direction as the up direction, and the-Z direction as the down direction in fig. 3 and 4. Fig. 3 and 4 show a state in which the assembly apparatus holds the reaction tube.
As shown in fig. 3 and 4, the assembly apparatus 100 includes a main body 110, a slide device 120, a lifting device 130, a cover 140, a gas supply device 150, an exhaust device 160, and a control unit 170.
The main body 110 includes a frame 111, a first bottom plate 112, a second bottom plate 113, side plates 114, a positioning part 115, a foot 116, and casters 117. The frame 111, the first bottom plate 112, the second bottom plate 113, and the side plates 114 form a box-like appearance constituting a housing.
The frame 111 includes a lower frame 111a, a column 111b, and an upper frame 111 c. The lower frame 111a is formed by connecting 4 aluminum frames, for example, in a rectangular shape. The column 111b is formed of, for example, 4 aluminum frames extending upward in parallel from four corners of the lower frame 111 a. The upper frame 111c is formed by connecting 4 aluminum frames in a rectangular shape, for example, and is connected to the upper end of the column 111 b. In addition, the frame 111 may include a reinforcing member 111d that connects aluminum frames to each other for reinforcement, in addition to the lower frame 111a, the pillar 111b, and the upper frame 111 c.
The first base plate 112 is mounted on the upper surface of the lower frame 111 a. The first base plate 112 may be, for example, a plate-like member of a rectangular shape. Near the center of the first base plate 112, a circular opening 112h having a larger outer diameter than the cover 140 is formed.
The second base plate 113 is attached to the left side surface of the frame 111 so as to protrude outward from the frame 111. The second base plate 113 may be, for example, a plate-like member of a rectangular shape. The second base plate 113 may be formed integrally with the first base plate 112.
The side plate 114 is attached to the left side surface of the frame 111. The side plate 114 may be, for example, a plate-like member of a rectangular shape.
The positioning unit 115 is a portion connected to a carriage 500 (see fig. 10), for example, on the front surface of the lower frame 111a, and the carriage 500 carries a transport vehicle 510 for supporting the lower end of the reaction tube 34 and transports the same to the assembly apparatus 100. However, the positioning portion 115 may be formed on the rear surface or the right side surface of the lower frame 111a, for example. The positioning portion 115 has a function of determining the positions of the assembly apparatus 100 and the carriage 500. The shape of the positioning portion 115 is not particularly limited, and the positioning portion may be connected to the carriage 500 to position between the assembly device 100 and the carriage 500.
The leg 116 is a support member for supporting the assembly apparatus 100 from below, and is attached to, for example, the lower surface of the four corners of the lower frame 111 a. The foot 116 is retractable. The assembly apparatus 100 can be fixed to an installation surface by extending the leg portions 116, and the assembly apparatus 100 can be moved by the caster wheels 117 by contracting the leg portions 116 to space the leg portions 116 from the installation surface.
The caster 117 is a member for movably supporting the assembly apparatus 100 from below, and is attached to, for example, the lower surface of the four corners of the lower frame 111 a. The caster 117 is, for example, a caster suitable for a clean room.
The sliding device 120 is mounted to the upper surface of the first base plate 112. The slide device 120 transports a transport cart 510 for supporting the lower end of the reaction tube 34 between the assembly device 100 and the outside of the assembly device 100. The slide device 120 may be 2 guide rails 121 arranged to extend from the end surface on which the positioning portion 115 is provided. The guide rail 121 is provided with a stopper 122. For example, when the positioning portion 115 is formed on the front surface of the lower frame 111a, the slide device 120 may be 2 guide rails arranged in parallel with the front-rear direction being the longitudinal direction. For example, when the positioning portion 115 is formed on the right side surface of the lower frame 111a, the slide device 120 may be 2 guide rails arranged in parallel with the left-right direction being the longitudinal direction. The transport vehicle 510 is moved in the front-rear direction on the guide rail 121 by 4 wheels 511 provided at each end in the left-right direction. The slide device 120 is not limited in its structure as long as it can transport the transport vehicle 510 between the assembly device 100 and the outside of the assembly device 100. For example, when the transport vehicle 510 is held by the transport arm and transported between the assembly apparatus 100 and the outside of the assembly apparatus 100, the slide device 120 may not be provided.
The elevating device 130 is an elevating device which is attached to the main body 110 and holds and elevates the reaction tube 34. The lifting device 130 is a double slide device having 2 lifting portions. The lifting device 130 includes a base mounting plate 130a, a guide portion 131, a first lifting portion 132, a second lifting portion 133, and a tilt adjusting mechanism 134.
The base mounting plate 130a is mounted on the left side surface of the frame 111. The base mounting plate 130a is formed to extend from the lower frame 111a to the upper frame 111c in the up-down direction, for example. The base attachment plate 130a may be, for example, a rectangular plate-like member, and is fixed to the first base plate 112, the upper frame 111c, and the reinforcing member 111 d.
The guide 131 is attached to the base attachment plate 130a and guides the first elevating unit 132 and the second elevating unit 133 in the vertical direction so as to be movable. The guide portion 131 is formed to extend from the lower frame 111a to the upper frame 111c in the vertical direction, for example.
The first elevating portion 132 is attached to the guide portion 131 so as to be able to elevate, and is configured to be able to hold the outer tube 46. The first elevating portion 132 includes: a moving part 132a that moves in the vertical direction while being guided by the guide part 131; and a substantially annular plate-shaped holding portion 132b attached to the moving portion 132a, and holding the outer tube 46 in a state of surrounding the outer periphery of the outer tube 46.
The second lifting/lowering unit 133 is attached to the guide unit 131 so as to be able to lift below the first lifting/lowering unit 132, and is configured to be able to hold the inner tube 44. The second lift portion 133 includes: a moving part 133a that moves in the vertical direction while being guided by the guide part 131; and a substantially disk-shaped holding portion 133b attached to the moving portion 133a and holding the lower end of the inner tube 44 from below (see fig. 11).
The tilt adjusting mechanism 134 is a mechanism for adjusting the tilt condition of the first elevating portion 132. The tilt adjusting mechanism 134 includes, for example: a rod-shaped member 134a having a variable length, one end of which is fixed to the moving portion 132a and the other end of which is fixed to the holding portion 132 b; and an adjusting portion 134b capable of adjusting the length of the rod-like member 134 a. In this case, the rod-shaped member 134a is shortened by the adjustment portion 134b, and thereby the first elevating portion 132 is pulled upward to correct the inclination of the first elevating portion 132 that is inclined downward. Further, the rod-like member 134a is lengthened by the adjustment portion 134b, and the first elevating portion 132 is pushed downward, thereby correcting the inclination of the first elevating portion 132 inclined upward. The tilt adjusting mechanism 134 may be in other forms as long as it can adjust the tilt of the first elevating unit 132. In addition, in the case where the first elevating unit 132 has no problem of inclination, the inclination adjusting mechanism 134 may not be provided.
The lid 140 is a member for hermetically closing the lower end opening of the reaction tube 34. The cover 140 is disposed below the guide rail 121. The cover 140 includes: a disk-shaped plate member 141 that hermetically closes the opening at the lower end of the reaction tube 34; and a gas port 142 (see fig. 13) formed through the plate member 141. The gas port 142 is connected to the gas box 151 via an introduction pipe 152, and gas is introduced from the gas box 151 into the reaction tube 34 via the gas port 142. The gas port 142 is connected to an exhaust device 161 via an exhaust pipe 162, and the inside of the reaction tube 34 is exhausted by the exhaust device 161 via the exhaust pipe 162. Further, the gas port 142 may also include a supply port and an exhaust port. In this case, the supply port is connected to the gas tank 151 via the introduction pipe 152, and the exhaust port is connected to the exhaust device 161 via the exhaust pipe 162.
The gas supply device 150 supplies gas to the inside of the reaction tube 34. The gas supply device 150 includes a gas tank 151 and an introduction pipe 152 (see fig. 13). The gas box 151 is mounted to the side plate 114 of the main body 110. The gas tank 151 mixes gases supplied from a plurality of gas supply sources (not shown) and supplies the mixed gases to the introduction pipe 152. The gas tank 151 includes a housing, a plurality of pipes, a plurality of valves, a plurality of mass flow controllers, and the like. Devices such as a plurality of pipes, a plurality of valves, and a plurality of mass flow controllers are housed inside the casing. The introduction pipe 152 has one end connected to the pipe of the gas box 151 and the other end connected to the gas port 142 of the lid body 140, and introduces the gas supplied from the gas box 151 into the reaction tube 34 through the gas port 142 of the lid body 140.
The exhaust device 160 exhausts the inside of the reaction tube 34. Exhaust apparatus 160 includes an exhaust apparatus 161 and an exhaust pipe 162. The exhaust unit 161 is disposed on the second base plate 113 via a vibration eliminating member 163 such as a vibration eliminating gel or a vibration eliminating pad. Since the exhaust unit 161 is disposed on the second base plate 113 via the vibration eliminating member 163, it is possible to suppress transmission of vibration generated by the exhaust unit 161 to the reaction tube 34 and the like held by the elevating unit 130. The exhaust unit 161 may be a vacuum pump such as a dry pump. The exhaust pipe 162 has one end connected to the gas port 142 of the lid body 140 and the other end connected to the exhaust device 161, and exhausts the inside of the reaction tube 34 through the gas port 142 and the exhaust pipe 162.
The control unit 170 controls the operations of the respective units of the assembly apparatus 100. The control unit 170 includes an electrical control board 171 and an information terminal 172. The electrical equipment control panel 171 is attached to the side plate 114 of the main body 110, for example, adjacent to the gas box 151. The information terminal 172 is attached to the electrical control board 171. The information terminal 172 is a terminal equipped with a touch panel that receives an input from an operator and displays various information, for example.
(lifting device)
Next, the lifter 130 will be described in detail. Fig. 5 is a diagram showing a configuration example of the elevating device 130. In fig. 5, the holding portions 132b and 133b and the tilt adjusting mechanism 134 are not illustrated. Fig. 6 to 8 are views for explaining the first elevating unit 132 of the elevating device 130 of fig. 5. Fig. 6 is a diagram for explaining a driving mechanism of the first elevating unit 132 in the elevating device 130. Fig. 7 is a view of the guide portion 131 and the first elevating portion 132 of the elevating device 130 when viewed from the rear side of the assembly device 100. Fig. 8 is a view of the guide portion 131 and the first lifting portion 132 of the lifting device 130 as viewed from the right side surface side of the assembly device 100.
As shown in fig. 5, the lifting device 130 includes a base mounting plate 130a, a guide 131, a first lifting unit 132, a second lifting unit 133, a tilt adjusting mechanism 134 (see fig. 3), a first driving unit 135, a second driving unit 136, and an anti-collision mechanism 137.
The base attachment plate 130a is attached to the left side surface of the frame 111, and is formed to extend from the lower frame 111a to the upper frame 111c in the vertical direction, for example (see fig. 3). The base attachment plate 130a may be, for example, a rectangular plate-like member, and is attached to the first base plate 112, the upper frame 111c, and the reinforcing member 111d (see fig. 3).
The guide portion 131 is attached to extend in the vertical direction along the longitudinal direction of the base attachment plate 130a, and guides the first elevating portion 132 and the second elevating portion 133 in the vertical direction so as to be movable. The guide 131 includes a base 131a, an upper support 131b, a lower support 131c, a screw shaft 131d, and 2 guide rails 131f, 131 g.
The base 131a is mounted to the base mounting plate 130 a. The base 131a is a long member having a U-shaped cross section and extending in the vertical direction, for example, as shown in fig. 6. The base 131a may be an aluminum base formed by machining aluminum, for example.
The upper support portion 131b is attached to the upper end of the base 131a, and is formed in a substantially plate shape so as to extend perpendicularly to the surface of the base 131a on the side opposite to the base attachment plate 130 a. The upper support portion 131b is provided with a fastening portion (not shown) for fixing the upper end of the screw shaft 131d and the upper ends of the guide rails 131f and 131 g.
The lower support portion 131c is attached to the lower end of the base 131a, and is formed in a substantially plate shape so as to extend perpendicularly to the surface of the base 131a on the side opposite to the base attachment plate 130 a. The lower support portion 131c is provided with a fastening portion (not shown) for fixing the lower end of the screw shaft 131d and the lower ends of the guide rails 131f and 131 g.
The screw shaft 131d is an example of a shaft portion, and an upper end fastened portion (not shown) is fixed to the upper support portion 131b, and a lower end fastened portion (not shown) is fixed to the lower support portion 131 c.
The guide rails 131f and 131g are mounted on the base 131a in parallel with the screw shafts 131d with a space between the screw shafts 131 d. The upper ends of the guide rails 131f and 131g are fixed to the upper support portion 131b, and the lower ends are fixed to the lower support portion 131 c.
The first elevating portion 132 is attached to the guide portion 131 so as to be able to elevate, and is configured to be able to hold the outer tube 46. The first elevating portion 132 includes a moving portion 132a and a holding portion 132 b.
The moving portion 132a moves in the vertical direction while being guided by the guide portion 131. The moving portion 132a includes a nut 132c, blocks 132d, 132e, a table 132f, and a pneumatic clamp (airfamper) 132 g.
The nut 132c is screwed to the screw shaft 131d, and is provided on the screw shaft 131d so as to be vertically movable by being rotated relative to the screw shaft 131 d. The nut 132c functions as a ball screw that converts rotational motion into linear motion together with the screw shaft 131 d. The nut 132c is rotated by power of a motor 135a with a reduction gear, which will be described later. The nut 132c is fixed to the table 132f via a nut pad 132 i. Further, instead of the ball screw, a rack and pinion (rack and pinion) may be used to convert the rotational motion into the linear motion.
The blocks 132d and 132e are provided on the guide rails 131f and 131g, respectively, so as to be movable in the vertical direction. The blocks 132d and 132e function as linear guides that guide the first elevating unit 132 to move in the vertical direction together with the guide rails 131f and 131 g. A table 132f is attached to the blocks 132d and 132 e.
The table 132f is formed in a rectangular plate shape, is fixed with the nut 132c via a nut pad 132i, and is fixed with the blocks 132d, 132 e. Thus, when the nut 132c moves in the vertical direction with respect to the screw shaft 131d, the table 132f moves in the vertical direction together with the nut 132c while being guided by the linear guide. A holding portion 132b (see fig. 3) is attached to the table 132f, and the table 132f moves in the vertical direction, whereby the holding portion 132b moves in the vertical direction together with the table 132 f.
The air jig 132g is attached to the table 132f, and is lifted and lowered together with the table 132 f. The air jig 132g is an example of a lock mechanism, and when a belt breakage sensor 135d (described later) detects breakage of a timing belt 135g, the air jig locks the vertical movement of the first elevating portion 132 with respect to the screw shaft 131d by pinching the screw shaft 131 d. By providing the air jig 132g, the first raising/lowering portion 132 can be prevented from being rapidly lowered when the timing belt 135g is damaged.
The holding portion 132b is attached to the moving portion 132a, and holds the outer tube 46 in a state of surrounding the outer periphery of the outer tube 46. The holding portion 132b is, for example, substantially annular plate-shaped. The holding portion 132b may hold the outer tube 46 in a state of surrounding the outer periphery of the outer tube 46, and various forms may be adopted.
The second lifting/lowering unit 133 is attached to the guide unit 131 so as to be able to lift and lower below the first lifting/lowering unit 132, and is configured to be able to hold the inner tube 44. The second elevating portion 133 includes a moving portion 133a and a holding portion 133 b.
The moving portion 133a moves in the vertical direction while being guided by the guide portion 131. The moving portion 133a may have the same structure as the moving portion 132 a.
The holding portion 133b is attached to the moving portion 133a, and holds the lower end of the inner tube 44 from below (see fig. 11). The holding portion 133b is, for example, substantially disc-shaped. The holding portion 133b may hold the lower end of the inner tube 44 from below, and various methods may be employed.
The first driving unit 135 is a driving mechanism for moving up and down the first lifting unit 132. The first driving unit 135 is attached to the first elevating unit 132 and ascends and descends together with the first elevating unit 132. The first driving part 135 includes a motor 135a with a speed reducer, a helical bevel gear 135b, a transmission mechanism 135c, and a belt damage sensor 135 d.
The motor 135a with a reducer is a motor that generates a rotational force. The motor 135a with a reduction gear is disposed horizontally so that its rotation axis is perpendicular to the screw shaft 131 d. In this way, since the reducer-equipped motor 135a is disposed horizontally, the height of the reducer-equipped motor 135a is reduced, and the movable region in the vertical direction of the first elevating unit 132 can be enlarged. The reducer-equipped motor 135a may be of absolute type (absolute), for example. In the motor 135a with a reduction gear, the motor and the reduction gear may be formed separately.
The helical bevel gear 135b is attached to an output shaft (rotation shaft) of the motor 135a with a reduction gear, and can transmit the output of the motor 135a with a reduction gear to the transmission mechanism 135c by changing the direction of the rotation shaft by 90 °.
The transmission mechanism 135c is attached to an output shaft of the spiral bevel gear 135b, and can transmit the output of the spiral bevel gear 135b to the nut 132 c. The transmission mechanism 135c includes, for example: a pulley 135e attached to an output shaft of the spiral bevel gear 135 b; a pulley 135f attached to the nut 132 c; and a timing belt 135g that transmits the output of the pulley 135e to the pulley 135 f.
The belt breakage sensor 135d is a sensor for detecting breakage of the timing belt 135 g. The belt breakage sensor 135d may detect breakage of the timing belt 135g, and various sensors may be used.
The second driving unit 136 is a driving mechanism for moving the second lifting unit 133 up and down. The second driving unit 136 is attached to the second lifting unit 133 and lifted together with the second lifting unit 133. The second driving unit 136 may have the same configuration as the first driving unit 135.
The collision prevention mechanism 137 is a mechanism that prevents the first elevating unit 132 from colliding with the second elevating unit 133. The collision preventing mechanism 137 has, for example, as shown in fig. 5, a photosensor 137a and a light shielding member 137 b. The photosensor 137a includes a light-emitting portion that emits light and a light-receiving portion that receives light from the light-emitting portion. The light blocking member 137b blocks light from the light emitting portion to switch ON/OFF (ON/OFF) of the photosensor 137 a. In the example of fig. 5, the photosensor 137a is attached to the moving portion 133a, and the light blocking member 137b is attached to the moving portion 132 a. Then, before the moving portion 132a comes into contact with the moving portion 133a, the light blocking member 137b blocks light from the light emitting portion of the photosensor 137a to switch the photosensor 137a from off (or on) to on (or off). When the optical sensor 137a is switched from on (or off) to off (or on), the control unit 170 receives a signal from the optical sensor 137a and stops the operations of the moving unit 132a and the moving unit 133 a. This can prevent the first elevating portion 132 and the second elevating portion 133 from colliding with each other. The optical sensor 137a may be attached to the moving portion 132a, and the light blocking member 137b may be attached to the moving portion 133 a.
The lifting device 130 may have various sensors. In the example of fig. 5, the lifting device 130 includes a first origin position detection sensor 201, an upper limit position detection sensor 202, a third origin position detection sensor 203, and a lower limit position detection sensor 204.
The first origin position detection sensor 201 includes a photosensor 201a and a light shielding member 201 b. The first home position detection sensor 201 detects that the first elevating unit 132 has moved to the home position by the light blocking member 201b blocking light from the light emitting unit of the photosensor 201a, as in the collision avoidance mechanism 137.
The upper limit position detection sensor 202 includes a photosensor 202a and a light shielding member 201 b. The upper limit position detection sensor 202 detects that the first elevating unit 132 has moved to the upper limit position by the light blocking member 201b blocking light from the light emitting unit of the optical sensor 202a, as in the collision avoidance mechanism 137. Further, the first origin position detection sensor 201 and the upper limit position detection sensor 202 commonly use 1 light shielding member 201b, but different light shielding members may be used.
The third origin position detection sensor 203 includes a photosensor 203a and a light shielding member 203 b. The third home position detection sensor 203 detects that the second raising/lowering unit 133 has moved to the home position by blocking the light from the light emitting unit of the optical sensor 203a with the light blocking member 203b, similarly to the collision avoidance mechanism 137.
The lower limit position detection sensor 204 includes a photosensor 204a and a light shielding member 203 b. The lower limit position detection sensor 204 detects that the second raising/lowering unit 133 has moved to the lower limit position by the light blocking member 203b blocking light from the light emitting unit of the optical sensor 204a, as in the collision avoidance mechanism 137. Further, the third origin position detection sensor 203 and the lower limit position detection sensor 204 use 1 light shielding member 203b in common, but different light shielding members may be used.
(method of assembling semiconductor manufacturing apparatus)
A method of assembling a semiconductor manufacturing apparatus according to an embodiment will be described by taking, as an example, a case where the above-described assembling apparatus 100 is used to assemble a reaction tube unit of a vertical heat treatment apparatus having a double tube structure. Fig. 9 is a flowchart showing an example of an assembling method of the semiconductor manufacturing apparatus.
As shown in fig. 9, the method for manufacturing a semiconductor manufacturing apparatus according to one embodiment includes steps S101 to S105. Step S101 is a step of feeding the outer tube 46 into the assembly apparatus 100, step S102 is a step of providing the inner tube 44 inside the outer tube 46, and step S103 is a step of attaching a gas supply tube. Step S104 is a step of performing a leak test, and step S105 is a step of feeding the reaction tube unit out of the assembly apparatus 100. Hereinafter, each step will be explained.
Fig. 10 is an explanatory diagram of a step S101 of feeding the outer tube 46 into the assembly apparatus 100. In step S101, first, the outer tube 46 is conveyed to the assembly apparatus 100 by the carriage 500 on which the outer tube 46 supported at the lower end thereof by the conveyor vehicle 510 is mounted (see fig. 10 (a)). The front end of the carriage 500 is connected to the positioning portion 115 of the assembly device 100, and the positions of the assembly device 100 and the carriage 500 are determined. The carriage 500 is provided with a rail 520 connected to the rail 121 of the assembly apparatus 100 in a state where the position of the carriage and the assembly apparatus 100 is determined. Next, in a state where the first elevating portion 132 is retracted above the height of the outer tube 46, the transport vehicle 510 is moved on the guide rail 520 of the cart 500 and the guide rail 121 of the assembly device 100, and the outer tube 46 is sent to the assembly device 100. Next, the front end of the carriage 500 is separated from the positioning portion 115 of the assembly apparatus 100 (see fig. 10 (b)). Next, the first elevating portion 132 is moved downward from above the outer tube 46, and the outer tube 46 is held by the first elevating portion 132 (see fig. 10 c). Next, the first elevating portion 132 is raised with the outer tube 46 held, so that the lower end of the outer tube 46 is positioned above the height of the inner tube 44 (see fig. 10 (d)). Next, the leading end of the empty carriage 500 on which the transport vehicle 510 is not mounted is connected to the positioning portion 115 of the assembly device 100. Then, the empty transport vehicle 510 not holding the outer tube 46 is moved on the guide rail 121 of the assembly device 100 and the guide rail 520 of the cart 500, and the empty transport vehicle 510 is sent out from the assembly device 100.
Fig. 11 is an explanatory diagram of the step S102 of attaching the inner pipe 44 to the inside of the outer pipe 46. In step S102, the inner tube 44 is first conveyed to the assembly apparatus 100 by the carriage 500 on which the inner tube 44 supported at the lower end thereof by the conveyance vehicle 510 is mounted (see fig. 11 (a)). The front end of the carriage 500 is connected to the positioning portion 115 of the assembly device 100, thereby determining the positions of the assembly device 100 and the carriage 500. Next, in a state where the second raising/lowering section 133 is retracted below the guide rail 121, the transport vehicle 510 is moved on the guide rail 520 of the cart 500 and on the guide rail 121 of the assembly apparatus 100 and is sent to the assembly apparatus 100. Next, the front end of the carriage 500 is separated from the positioning portion 115 of the assembly apparatus 100 (fig. 11 (b)). Next, the second raising/lowering section 133 is moved upward from below the inner tube 44, and the inner tube 44 is held by the second raising/lowering section 133 (see fig. 11 c). Next, the first elevating portion 132 holding the outer tube 46 is lowered and the second elevating portion 133 holding the inner tube 44 is raised, and the inner tube 44 is housed and attached inside the outer tube 46 (see fig. 11 (d)). In addition, in a state where the first elevating portion 132 holding the outer tube 46 is fixed, only the second elevating portion 133 holding the inner tube 44 may be elevated, and the inner tube 44 may be housed and attached inside the outer tube 46. However, it is preferable to lower the first raised/lowered part 132 holding the outer tube 46 and raise the second raised/lowered part 133 holding the inner tube 44. Thus, for example, when the inner tube 44 housed inside the outer tube 46 is attached to the outer tube 46, or the gas supply tube and the temperature sensor are attached to the reaction tube 34 in the step S103 of attaching the gas supply tube, the work at a high place is not necessary, and the workability is improved.
Fig. 12 is an explanatory diagram of the step S103 of attaching the gas supply pipe. In step S103, first, the second elevating portion 133 is moved downward from the position where the inner tube 44 is held (see fig. 12 a) to be retracted, thereby bringing the lower end of the reaction tube 34 into an open state. Next, a gas supply pipe NZ and a temperature sensor TC are inserted into the reaction tube 34 from the opening at the lower end of the reaction tube 34 (see fig. 12 (b)), and the gas supply pipe NZ and the temperature sensor TC are attached to the reaction tube 34 (see fig. 12 (c)). Thereby, the reaction tube unit U is formed. The gas supply pipes NZ correspond to, for example, the gas supply pipes 76, 78, and 80 of the vertical heat treatment apparatus 1 shown in fig. 1. When the temperature sensor TC is not installed in the reaction tube 34, the temperature sensor TC may not be installed. When there are other members to be attached to the inside of the reaction tube 34, the other members may be attached in the step S103 of attaching the gas supply tube NZ.
Fig. 13 is an explanatory diagram of step S104 of performing the leak inspection. In fig. 13 (b), the lower frame 111a is not shown for convenience of explanation. In step S104, first, a cover member CP is attached to the gas outlet 82 of the outer tube 46 to hermetically close the gas outlet 82 (see fig. 13 (a)). Next, the first elevating unit 132 is lowered, and the opening at the lower end of the reaction tube 34 is hermetically closed by the lid 140 provided below the lower frame 111a (see fig. 13 (b)). Next, the inside of the reaction tube 34 is inspected for leakage while exhausting the inside of the reaction tube 34 through the exhaust pipe 162 and the gas port 142 of the lid body 140 by the exhaust device 161. The method of leak inspection is not particularly limited, and may be, for example, a leak test method using pressure change (JISZ2332) such as a helium leak test method (JISZ2331) or a build-up (built-up) method.
Fig. 14 is an explanatory diagram of the step S105 of feeding the reaction tube unit U from the assembly apparatus 100. In step S105, first, the first elevating unit 132 is raised so that the lower end of the reaction tube 34 is spaced apart from the lid 140, and the empty transport vehicle 510 is loaded onto the guide rail 121 of the assembly apparatus 100 (see fig. 14 (a)). Next, the first elevating unit 132 is lowered to place the reaction tube unit U on the transport vehicle 510 (see fig. 14 (b)). Next, the leading end of the empty carriage 500 on which the transport vehicle 510 is not mounted is connected to the positioning portion 115 of the assembly device 100. Then, the transport vehicle 510 holding the reaction tube unit U is moved on the guide rail 121 of the assembly apparatus 100 and the guide rail 520 of the cart 500, and is sent out from the assembly apparatus 100 (see fig. 14 (c)).
This enables the reaction tube unit U to be assembled. The assembled reaction tube unit U can be transported to, for example, an installation site.
The assembly apparatus 100 described above includes: a main body 110; a lifting device 130 mounted on the body 110 to lift and lower the inner tube 44 and the outer tube 46; a gas supply device 150 for supplying gas into the reaction tube 34; and an exhaust device 160 for exhausting the inside of the reaction tube 34. With the assembly apparatus 100 having this configuration, the reaction tube unit U can be assembled at a place different from the installation place of the vertical heat treatment apparatus, and therefore, the work space can be easily secured. Thus, a plurality of operators can simultaneously perform the assembly work of the reaction tube units U, and thus the assembly period of the vertical heat treatment apparatus can be shortened. In addition, since a plurality of operators can perform maintenance of the reaction tube unit U at the same time, the standby time of the vertical heat treatment apparatus can be reduced.
In the assembly apparatus 100, the lifting device 130 includes the first lifting unit 132 for lifting and lowering the outer tube 46 and the second lifting unit 133 for lifting and lowering the inner tube 44, and the heights of the outer tube 46 and the inner tube 44 can be arbitrarily adjusted by the first lifting unit 132 and the second lifting unit 133, respectively. This enables the work of attaching the inner tube 44 to the inside of the outer tube 46 and the work of attaching the gas supply tube NZ and the temperature sensor TC to the reaction tube 34 to be performed at arbitrary heights. Therefore, high-altitude work is not required, and workability is improved. Further, since the lifting device 130 is a double slide device in which 2 lifting units (the first lifting unit 132 and the second lifting unit 133) are attached to 1 screw shaft 131d so as to be able to be lifted, the positioning of the lifting units becomes easy, and the time required for the positioning can be shortened.
In the assembly apparatus 100, the inside of the reaction tube 34 can be exhausted through the gas port 142 formed through the plate-shaped portion of the lid body 140 in a state where the opening at the lower end of the reaction tube 34 is hermetically closed by the lid body 140. Accordingly, since the leak inspection of the inside of the reaction tube 34 can be performed at the stage of assembling the reaction tube unit U, the reaction tube unit U can be easily assembled again using the assembling apparatus 100 even if the leak is found in the inside of the reaction tube 34.
In addition, according to the assembly apparatus 100, since the inside of the reaction tube 34 is exhausted through the gas port 142 formed through the plate-shaped portion of the lid body 140, it is not necessary to attach and detach an exhaust pipe to and from the gas outlet 82 of the reaction tube 34. This reduces the risk of breakage of the reaction tube 34.
The disclosed embodiments of the invention are illustrative in all respects and should not be considered as limiting. The above-described embodiments may be omitted, replaced, or changed in various ways without departing from the scope and spirit of the claims.

Claims (13)

1. A lifting device, comprising:
a shaft portion extending in the vertical direction;
a first elevating portion capable of elevating along the shaft portion;
a first driving unit configured to move the first lifting unit up and down;
a second lifting portion that can be lifted and lowered along the shaft portion at a position below the first lifting portion; and
and a second driving unit configured to move the second lifting unit up and down.
2. The lifting device as claimed in claim 1, characterized in that:
the shaft portion is a screw shaft,
the first lifting portion includes a first nut that is threaded on the screw shaft,
the second lifting portion includes a second nut that is threaded onto the screw shaft.
3. The lifting device as claimed in claim 2, characterized in that:
the first driving unit raises and lowers the first lifting unit by rotating the first nut,
the second driving unit raises and lowers the second raising and lowering unit by rotating the second nut.
4. A lifting device as claimed in any one of claims 1 to 3, characterized in that:
the first driving part and the second driving part respectively ascend and descend together with the first ascending and descending part and the second ascending and descending part.
5. The lifting device according to any one of claims 1 to 4, characterized in that:
the first lifting part and the second lifting part are provided with linear guides for guiding the first lifting part and the second lifting part to move relative to the shaft part.
6. The lifting device according to any one of claims 1 to 5, characterized in that:
the first drive unit and the second drive unit are motors having respective rotation shafts arranged perpendicular to the shaft portion,
there is a transmission mechanism that transmits the rotational force of the motor to the first drive portion and the second drive portion.
7. The lifting device as claimed in claim 6, characterized in that:
the transmission mechanism comprises a belt wheel and a transmission belt.
8. The lifting device as claimed in claim 7, characterized in that:
having a sensor for detecting breakage of the belt,
the drive device further includes a lock mechanism that locks the operation of the first elevating portion and the second elevating portion with respect to the shaft portion when the sensor detects the breakage of the belt.
9. The lifting device as claimed in claim 8, characterized in that:
the locking mechanism is a pneumatic clamp.
10. The lifting device according to any one of claims 6 to 8, characterized in that:
the motor is of the absolute type.
11. The lifting device as claimed in any one of claims 1 to 10, characterized in that:
the anti-collision mechanism is provided for preventing the first lifting part and the second lifting part from contacting.
12. An assembling apparatus of a semiconductor manufacturing apparatus, characterized in that:
the semiconductor manufacturing apparatus has a reaction tube having an opening at a lower portion and having a double tube structure including an inner tube and an outer tube,
the assembling device of the semiconductor manufacturing device comprises:
a main body;
a lifting device mounted on the main body;
a gas supply device for supplying gas to the inside of the reaction tube; and
an exhaust device for exhausting the inside of the reaction tube,
the lifting device comprises:
a shaft portion extending in the vertical direction;
a first elevating portion that is attached to the shaft portion so as to be able to elevate and lower, and that is capable of holding the outer tube;
a first driving unit configured to move the first lifting unit up and down;
a second lifting/lowering unit which is attached to the shaft portion so as to be lifted/lowered at a position lower than the first lifting/lowering unit, and which is capable of holding the inner tube; and
and a second driving unit configured to move the second lifting unit up and down.
13. A method for assembling a semiconductor manufacturing apparatus, characterized in that:
the semiconductor manufacturing apparatus has a reaction tube having an opening at a lower portion and having a double tube structure including an inner tube and an outer tube,
the method for assembling the semiconductor manufacturing apparatus includes:
a step of raising the outer tube while holding the outer tube by a first raising and lowering portion attached to a shaft portion extending in a vertical direction so as to be raised and lowered; and
and a step of setting the inner tube inside the outer tube by lifting the inner tube while holding the inner tube by a second lifting unit attached to the shaft portion so as to be lifted and lowered at a position below the first lifting unit.
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