CN219273828U

CN219273828U - Wafer cleaning device

Info

Publication number: CN219273828U
Application number: CN202223438056.4U
Authority: CN
Inventors: 马强; 李昌坤
Original assignee: Suzhou Mega Technology Co Ltd
Current assignee: Suzhou Mega Technology Co Ltd
Priority date: 2022-12-20
Filing date: 2022-12-20
Publication date: 2023-06-30
Anticipated expiration: 2032-12-20

Abstract

The utility model discloses a wafer cleaning device which comprises a cleaning tank arranged on a bottom plate, wherein the cleaning tank comprises a shell, a cleaning table is rotatably connected to the shell, a liquid receiving tank which is arranged around the edge of the cleaning table is arranged on the inner side surface of the shell, and the liquid receiving tank is arranged between the cleaning table and the bottom surface of the shell. The wafer cleaning device can prevent cleaning liquid from splashing on the cleaning table, and has better waterproof effect.

Description

Wafer cleaning device

Technical Field

The utility model relates to the technical field of wafer cutting, in particular to a wafer cleaning device.

Background

A wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer has a circular shape.

After the wafer is cut, it needs to be cleaned to remove impurities, chips, and the like remaining on the wafer. The prior device for cleaning the wafer comprises a shell and a cleaning table which is arranged in the shell and can rotate and support the wafer, wherein a spray head above the cleaning table sprays water towards the wafer in the rotating process of the cleaning table so as to clean the wafer. In the prior art, after the cleaning water is sprayed onto the wafer, the cleaning water can splash onto the bottom surface inside the shell from the edge of the cleaning table, and the cleaning effect and the drying effect on the wafer are affected because the height difference between the cleaning table and the bottom surface is large and then the water splashes above the cleaning table.

Disclosure of Invention

In view of the above, the utility model provides a wafer cleaning device, which can prevent cleaning liquid from splashing on a cleaning table, and has better waterproof effect.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the utility model provides a wafer belt cleaning device, includes the washing tank of setting on the bottom plate, the washing tank includes the shell, the inside rotatable wash platform that is provided with of shell, the medial surface of shell is provided with the liquid receiving groove that encircles the edge setting of wash platform, liquid receiving groove set up in wash platform with between the bottom surface of shell.

Optionally, the diameter of the inner groove edge of the liquid receiving groove is smaller than the edge diameter of the cleaning table, and the diameter of the outer groove edge of the liquid receiving groove is larger than the edge diameter of the cleaning table.

Optionally, at least one liquid draining hole is arranged on the bottom surface of the liquid receiving groove, and the liquid draining hole is used for draining the liquid in the liquid receiving groove to the bottom of the shell;

the bottom of the shell is communicated with the outside through a liquid discharge pipe.

Optionally, the shell includes upper casing and lower casing, the bottom of upper casing sets up the liquid receiving groove, lower casing fixed connection is in on the bottom plate.

Optionally, the bottom surface of wash platform is connected with the drive shaft, the drive shaft periphery is equipped with and shelters from the structure, shelter from the structure and include first baffle, first baffle sets up on the bottom surface of lower casing.

Optionally, the shielding structure further comprises a second baffle, the second baffle is wound on the outer side of the first baffle, the second baffle is fixedly connected with the top of the driving shaft, or the second baffle is fixedly connected with a connecting plate arranged on the top of the driving shaft, and the second baffle rotates under the driving of the driving shaft;

the second baffle is wound on the inner side of the liquid receiving groove.

Optionally, the first baffle and the lower housing are integrally formed.

Optionally, the first baffle is L-shaped plate body, including perpendicular baffle and the horizontal baffle that links together, perpendicular baffle with the bottom surface of lower casing is connected, the horizontal baffle is connected perpendicular baffle is kept away from one side of the bottom surface of lower casing.

Optionally, the bottom of the upper shell is sleeved on the inner side of the top of the lower shell, and the side surface of the upper shell is connected with the side surface of the lower shell through a connecting piece.

Optionally, the outer groove edge of the liquid receiving groove is connected to the inner side surface of the shell, or the outer groove edge of the liquid receiving groove is a side plate of the shell.

According to the technical scheme, the liquid receiving groove is arranged at the edge of the cleaning table and is arranged around the cleaning table, so that the cleaning liquid left on the cleaning table can be contained. The liquid receiving groove is arranged between the cleaning table and the bottom surface of the shell, so that the drop of the cleaning liquid flowing down from the cleaning table is reduced, the buffer effect is achieved on the water flowing out from the cleaning table, the cleaning liquid is prevented from splashing onto the cleaning table, and the waterproof effect of the cleaning device is better.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of an angle structure of a wafer cleaning apparatus according to an embodiment of the present utility model;

FIG. 2 is a schematic view of another angle of a wafer cleaning apparatus according to an embodiment of the present utility model;

FIG. 3 is a schematic cross-sectional view of the structure at A-A in FIG. 2;

FIG. 4 is a schematic cross-sectional view of a liquid receiving tank according to an embodiment of the present utility model;

fig. 5 is a schematic diagram of a partial enlarged structure of a shielding structure according to an embodiment of the present utility model.

Wherein:

1. a cleaning table is arranged on the cleaning table,

2. an upper shell body, a lower shell body and a lower shell body,

3. a lower shell body, a lower shell body and a lower shell body,

4. the bottom plate is provided with a bottom plate,

5. a liquid receiving groove for receiving the liquid,

501. inner groove edges, 502 and liquid discharge holes,

6. a second baffle plate is arranged on the upper surface of the first baffle plate,

7. the first baffle plate is arranged on the upper surface of the first baffle plate,

701. the vertical baffle, 702, the horizontal baffle,

8. the motor is arranged on the side of the motor,

9. a driving shaft is arranged on the inner side of the driving shaft,

10. a water spray head.

Detailed Description

The utility model discloses a wafer cleaning device which is capable of avoiding cleaning liquid from splashing onto a cleaning table and has a better waterproof effect.

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1 to 5, the wafer cleaning device of the present utility model includes a cleaning tank disposed on a bottom plate 4, the cleaning tank includes a housing, a rotatable cleaning table 1 is disposed inside the housing, a liquid receiving tank 5 disposed around an edge of the cleaning table 1 is disposed on an inner side surface of the housing, and the liquid receiving tank 5 is disposed between the cleaning table 1 and a bottom surface of the housing.

Wherein, the cleaning table 1 top hangs and is equipped with sprinkler bead 10, and sprinkler bead 10 passes through the swing arm and connects on bottom plate 4, and sprinkler bead 10 sets up in the shell, sprinkler bead 10 change position under the drive of swing arm, realizes the change of sprinkler bead 10 position. The cleaning table 1 is preferably a ceramic chuck, and after the wafer is placed on the cleaning table 1, the ceramic chuck adsorbs the wafer to play a fixed role. The liquid receiving groove 5 is used for receiving the cleaning liquid left on the cleaning platform 1.

According to the wafer cleaning device, the liquid receiving groove 5 is arranged at the edge of the cleaning table 1, and the liquid receiving groove 5 is arranged around the cleaning table 1, so that the cleaning liquid left on the cleaning table 1 can be contained. The liquid receiving groove 5 is arranged between the cleaning table 1 and the bottom surface of the shell, so that the drop of the cleaning liquid flowing down from the cleaning table 1 is reduced, the water flowing out from the cleaning table 1 is buffered, the cleaning liquid is prevented from splashing onto the cleaning table 1, and the waterproof effect of the cleaning device is better.

Specifically, the diameter of the inner groove edge 501 of the liquid receiving groove 5 is smaller than the edge diameter of the cleaning table 1, and the diameter of the outer groove edge of the liquid receiving groove 5 is larger than the edge diameter of the cleaning table 1, so that the water thrown or dropped from the outer edge of the cleaning table 1 is concentrated in the liquid receiving groove 5.

In one embodiment, the outer trough edge of the liquid receiving trough 5 is connected to the inner side of the housing. In another embodiment, the outer groove edge of the liquid receiving groove 5 is a side plate of the shell, so that the cleaning liquid splashed onto the side plate of the shell can flow back into the liquid receiving groove 5, and the collecting effect of the cleaning liquid is better.

In order to facilitate the discharge of the cleaning liquid contained in the liquid receiving tank 5, at least one liquid discharge hole 502 is provided on the tank bottom surface of the liquid receiving tank 5, and as shown in fig. 4, the liquid discharge hole 502 is used for discharging the liquid in the liquid receiving tank 5 to the bottom of the housing. In order to drain the cleaning liquid collected at the bottom of the shell, the bottom of the shell is communicated with the outside through a liquid drain pipe. The cleaning liquid discharged by the liquid discharge pipe can be reused after being filtered, and can be discharged after being treated.

Further, the housing comprises an upper housing 2 and a lower housing 3 which are detachably connected. The bottom of the upper shell 2 is provided with a liquid receiving groove 5, the lower shell 3 is fixedly connected to the bottom plate 4, and the upper shell 2 is connected to the lower shell 3.

Wherein, the bottom surface of wash platform 1 is connected with drive shaft 9, and drive shaft 9 passes through motor 8 and drives wash platform 1 rotation by motor 8 to the wafer is convenient for wash better. In order to prevent the cleaning solution flowing down on the cleaning table 1 from flowing to the driving shaft 9, a shielding structure is arranged on the periphery of the driving shaft 9, the shielding structure comprises a first baffle plate 7, and the first baffle plate 7 is arranged on the bottom surface of the lower shell 3, so that the cleaning solution in the lower shell 3 is prevented from flowing to the driving shaft 9, and the service life of the driving shaft 9 and a supporting bearing thereof is prolonged. The first baffle 7 is annularly wound on the outside of the drive shaft 9.

The shielding structure further comprises a second baffle plate 6, the second baffle plate 6 is wound on the outer side of the first baffle plate 7, the second baffle plate 6 is fixedly connected with the top of the driving shaft 9, or the second baffle plate 6 is fixedly connected with a connecting plate arranged at the top of the driving shaft 9, so that the second baffle plate 6 rotates under the driving of the driving shaft 9, and cleaning liquid is prevented from entering the driving shaft 9 through a gap at the top of the first baffle plate 7. It will be appreciated that the second baffle 6 is disposed around the inside of the liquid receiving trough 5. The shielding structure is arranged right below the cleaning table 1.

In one embodiment, the first baffle 7 is integrally formed with the lower housing 3. The first baffle 7 is formed by flanging and bending the inner side of the lower shell 3.

Specifically, the first baffle 7 is an L-shaped plate body, and includes a vertical baffle 701 and a horizontal baffle 702 connected together, the vertical baffle 701 is connected to the bottom surface of the lower housing 3, and the horizontal baffle 702 is connected to a side of the vertical baffle 701 away from the bottom surface of the lower housing 3, as shown in fig. 5. The first baffle 7 and the second baffle 6 form labyrinth seal, so that water inside the lower shell 3 is effectively prevented from splashing to the driving shaft 9.

Wherein, the bottom of the upper shell 2 is sleeved on the inner side of the top of the lower shell 3, thereby further avoiding the leakage of the cleaning liquid through the connecting seam between the upper shell 2 and the lower shell 3. The side of the upper case 2 is connected with the side of the lower case 3 through a connecting member. The lower housing 3 is fixed on the bottom plate 4, and the connection of the bottom plate 4, the lower housing 3 and the upper housing 2 is realized.

According to the wafer cleaning device, the liquid receiving groove 5 is arranged at the lower edge of the cleaning table 1, so that the cleaning liquid sprayed from the cleaning table 1 is buffered, the cleaning liquid is prevented from splashing back to the cleaning table 1, equipment damage caused by the fact that the cleaning liquid splashes to a motor and other structures can be prevented, the cleaning and drying effects of the wafer on the cleaning table 1 are better, and the waterproof effect of the cleaning device is better.

In the description of the present embodiment, it should be understood that the directions or positional relationships indicated by the terms "upper", "lower", "vertical", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present embodiment, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a wafer belt cleaning device, includes the washing tank of setting on the bottom plate, the washing tank includes the shell, the inside rotatable wash platform that is provided with of shell, its characterized in that, the medial surface of shell is provided with the liquid receiving groove that encircles the edge setting of wash platform, liquid receiving groove set up in wash platform with between the bottom surface of shell.

2. The wafer cleaning apparatus of claim 1, wherein the diameter of the inner trough edge of the liquid receiving trough is smaller than the diameter of the edge of the cleaning table, and the diameter of the outer trough edge of the liquid receiving trough is larger than the diameter of the edge of the cleaning table.

3. The wafer cleaning apparatus according to claim 1, wherein at least one drain hole for draining the liquid in the liquid receiving tank to the bottom of the housing is provided on a tank bottom surface of the liquid receiving tank;

4. The wafer cleaning apparatus of claim 1, wherein the housing comprises an upper housing and a lower housing, the bottom of the upper housing is provided with the liquid receiving tank, and the lower housing is fixedly connected to the bottom plate.

5. The wafer cleaning apparatus of claim 4, wherein a bottom end surface of the cleaning stage is connected to a drive shaft, and a shielding structure is provided at a periphery of the drive shaft, the shielding structure including a first baffle plate disposed on a bottom surface of the lower housing.

6. The wafer cleaning apparatus according to claim 5, wherein the shielding structure further comprises a second baffle, the second baffle is wound on the outer side of the first baffle, the second baffle is fixedly connected with the top of the driving shaft, or the second baffle is fixedly connected with a connecting plate installed on the top of the driving shaft, and the second baffle is driven by the driving shaft to rotate;

the second baffle is wound on the inner side of the liquid receiving groove.

7. The wafer cleaning apparatus of claim 5, wherein the first baffle is of unitary construction with the lower housing.

8. The wafer cleaning apparatus of claim 5, wherein the first baffle is an L-shaped plate comprising a vertical baffle and a horizontal baffle connected together, the vertical baffle being connected to the bottom surface of the lower housing, the horizontal baffle being connected to a side of the vertical baffle remote from the bottom surface of the lower housing.

9. The wafer cleaning apparatus of claim 4, wherein the bottom of the upper housing is sleeved on the top inner side of the lower housing, and the side surface of the upper housing is connected with the side surface of the lower housing through a connecting piece.

10. The wafer cleaning apparatus of claim 2, wherein an outer tub edge of the liquid receiving tub is connected to an inner side surface of the housing, or wherein an outer tub edge of the liquid receiving tub is a side plate of the housing.