TW200609081A - Oscar type double-faced grinder - Google Patents
Oscar type double-faced grinderInfo
- Publication number
- TW200609081A TW200609081A TW094117186A TW94117186A TW200609081A TW 200609081 A TW200609081 A TW 200609081A TW 094117186 A TW094117186 A TW 094117186A TW 94117186 A TW94117186 A TW 94117186A TW 200609081 A TW200609081 A TW 200609081A
- Authority
- TW
- Taiwan
- Prior art keywords
- carrier
- grinding
- work
- type double
- driving means
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/10—Single-purpose machines or devices
- B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
- B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
To provide an Oscar type double-faced grinder, capable of simultaneously grinding both faces of a work, which is extremely thin, by using a carrier, comprising a pair of grinding plates disposed oppositely, with the work (WK) held on the carrier 1 sandwiched therebetween, and having larger diameter than that of the work (WK), a carrier driving means (gears G1, G2) for holding and rotating said carrier (1), carrier supports (upper carrier support 2M and lower carrier support 2D) for holding said carrier driving means (gears G1, G2) so as to swing it in the radius direction of said grinding plates (U1, D1), grinding plate driving means (M1, M2) for driving said pair of grinding plates (U1, D1) to rotate, and swinging means (motor M3, crank shaft 28) for swinging said carrier supports (2U, 2D).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004266972A JP2006082145A (en) | 2004-09-14 | 2004-09-14 | Oscar type double-sided grinder |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200609081A true TW200609081A (en) | 2006-03-16 |
Family
ID=36161063
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094117186A TW200609081A (en) | 2004-09-14 | 2005-05-26 | Oscar type double-faced grinder |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006082145A (en) |
KR (1) | KR20060049513A (en) |
TW (1) | TW200609081A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116372786A (en) * | 2023-06-05 | 2023-07-04 | 北京特思迪半导体设备有限公司 | Wafer polishing equipment |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103273401A (en) * | 2013-05-15 | 2013-09-04 | 成都精密光学工程研究中心 | Initiative translation type double-sided polishing machine |
CN107471012B (en) * | 2017-09-22 | 2019-02-19 | 芜湖火龙动力科技有限公司 | A kind of crankshaft sprue polishing device |
CN114227421B (en) * | 2022-01-12 | 2022-09-20 | 江苏益芯半导体有限公司 | Polishing machine for wafer surface processing |
-
2004
- 2004-09-14 JP JP2004266972A patent/JP2006082145A/en active Pending
-
2005
- 2005-05-26 TW TW094117186A patent/TW200609081A/en unknown
- 2005-06-02 KR KR1020050047244A patent/KR20060049513A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116372786A (en) * | 2023-06-05 | 2023-07-04 | 北京特思迪半导体设备有限公司 | Wafer polishing equipment |
CN116372786B (en) * | 2023-06-05 | 2023-08-18 | 北京特思迪半导体设备有限公司 | Wafer polishing equipment |
Also Published As
Publication number | Publication date |
---|---|
JP2006082145A (en) | 2006-03-30 |
KR20060049513A (en) | 2006-05-19 |
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