CN109202697A - The application method of rubbing head, polissoir and rubbing head - Google Patents

The application method of rubbing head, polissoir and rubbing head Download PDF

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Publication number
CN109202697A
CN109202697A CN201811384642.0A CN201811384642A CN109202697A CN 109202697 A CN109202697 A CN 109202697A CN 201811384642 A CN201811384642 A CN 201811384642A CN 109202697 A CN109202697 A CN 109202697A
Authority
CN
China
Prior art keywords
soft film
ring
plate
gas
soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811384642.0A
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Chinese (zh)
Inventor
杨师
费玖海
李玉敏
刘福强
佀海燕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing Semiconductor Equipment Institute
Original Assignee
Beijing Semiconductor Equipment Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing Semiconductor Equipment Institute filed Critical Beijing Semiconductor Equipment Institute
Priority to CN201811384642.0A priority Critical patent/CN109202697A/en
Publication of CN109202697A publication Critical patent/CN109202697A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/27Work carriers
    • B24B37/30Work carriers for single side lapping of plane surfaces
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/04Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool

Abstract

The application method of a kind of rubbing head provided by the invention, polissoir and rubbing head, is related to chemical-mechanical polisher technical field, comprising: matrix;Matrix pressure ring is mounted in matrix and connect with matrix;Ventilation partition is connect with matrix by helix tube, and is set in outside matrix pressure ring;Soft membrane pressure plate is connect with ventilation partition, and is set in outside matrix pressure ring;Inner septum is set on matrix pressure ring, and the outer end of inner septum is connect with ventilation partition and soft membrane pressure plate;Ring is maintained to connect with soft membrane pressure plate;Soft film is mounted on the inner ring for maintaining ring, and the subregion slot of at least two layers annular is provided on the inside of soft film;It is annular plate-like that soft film supporting plate leads to plate in;It is positioned opposite that soft film supporting plate leads to plate or more in, and is installed on the inside of soft film and connect with the inner end of soft film, by the different subregions slot sealed separation of soft film at different gas subregions;In lead to plate on be provided with multiple gas circuit holes, for being connected to multiple gas subregions.

Description

The application method of rubbing head, polissoir and rubbing head
Technical field
The present invention relates to chemical-mechanical polisher technical field, more particularly, to a kind of rubbing head, polissoir and The application method of rubbing head.
Background technique
Integrated circuit (IC) manufacture is the core of electronics and information industry, development of promoting the IT development for national economic and social development One of most important new and high technology.As wafer develops to large scale hachure direction, wafer surface flatness is required increasingly It is high.Wherein, chemical-mechanical polisher is got more and more attention in integrated circuit fields.
In CMP process, rubbing head effect it is most important, must transmission wafer again precisely transmitting pressure with Polishing process is realized in rotation.But rubbing head in the prior art can not but reach and meet requirement.
Summary of the invention
The purpose of the present invention is to provide the application methods of a kind of rubbing head, polissoir and rubbing head, existing to solve There is the technical issues of rubbing head present in technology is unable to satisfy precisely transmitting pressure and rotation.
A kind of rubbing head provided by the invention, comprising:
Matrix;
Matrix pressure ring, described matrix pressure ring are mounted in described matrix and connect with described matrix;
Ventilation partition, the ventilation partition is connect with described matrix by helix tube, and is set in outside described matrix pressure ring, For transmitting gas circuit;
Soft membrane pressure plate, the soft membrane pressure plate is connect with the ventilation partition, and is set in outside described matrix pressure ring, for passing Pass gas circuit;
Inner septum, the inner septum are set on described matrix pressure ring, and the outer end of the inner septum and it is described ventilation every Plate is connected with the soft membrane pressure plate;
Packed is formed between described matrix pressure ring, the ventilation partition, the inner septum and the soft membrane pressure plate One gas subregion;The inner septum can be deformed according to the gas pressure in the first gas subregion, drive described matrix Pressure ring, the ventilation partition and the soft membrane pressure plate move down;
Ring is maintained, the maintenance ring is connect with the soft membrane pressure plate;
Soft film, the soft film are mounted on the inner ring for maintaining ring, at least two layers annular are provided on the inside of the soft film Subregion slot;
Soft film supporting plate and in lead to plate, the soft film supporting plate and it is described in lead to plate be annular plate-like;The soft film supporting plate and It is positioned opposite to lead to plate or more in described, and is installed on the inside of the soft film and is connect with the inner end of the soft film, it will be described soft The different subregions slot sealed separation of film is at different gas subregions;
Lead on plate in described and be provided with multiple gas circuit holes, for being connected to multiple gas subregions.
Further, in an embodiment of the present invention, the subregion slot of the inside setting shellring shape of the soft film;
The soft film supporting plate and it is described in lead to plate and be installed on the inside of the soft film and connect with the inner end of the soft film, general Three layers of subregion slot sealed separation of the soft film are at second gas subregion, third gas subregion and the 4th gas subregion.
Further, in an embodiment of the present invention, the inner end of the soft film is provided with protrusion;
The soft film supporting plate and it is described in lead to plate and the soft film inner end protrusion compression seal.
Further, in an embodiment of the present invention, the maintenance ring includes that upper layer maintains ring and lower layer to maintain ring;
The upper layer maintains ring and the lower layer to maintain to be stacked between ring.
Further, in an embodiment of the present invention, it includes ceramics or polyether-ether-ketone that the upper layer, which maintains the material of ring,;
With or, the lower layer maintains the material of ring to include polyether-ether-ketone or gather stupid thioether.
Further, in an embodiment of the present invention, further includes:
Porous disc, the porous disc are mounted in the soft film.
Further, in an embodiment of the present invention, the radius of multiple gas subregions is different.
Further, in an embodiment of the present invention, the material of the soft film includes silicon rubber;
With or, the soft film supporting plate and it is described in lead to plate material include polyether-ether-ketone.
Present invention also provides a kind of polissoirs, including the rubbing head.
Present invention also provides a kind of application methods of rubbing head, including the rubbing head, the method is as follows:
Rubbing head is moved to above wafer;
Gas is inputted to the first gas subregion, declines the maintenance ring close to wafer;
To the soft film and it is described in lead between plate and input gas in the gas subregion that is formed, so that soft film is touched wafer, and Make crystal round fringes and soft film opposing seal;
Negative pressure is added into the gas subregion formed between the soft film and the soft film supporting plate, makes shape between soft film and wafer At vacuum chamber wafer is sucked, rubbing head is removed.
In the above-mentioned technical solutions, not only air-tightness is good for rubbing head described above, but also structure is simple, is easily installed Disassembly, can be realized good wafer and polishing effect in the actual manufacturing.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the first structure diagram of rubbing head provided by one embodiment of the present invention;
Fig. 2 is the partial structural diagram of rubbing head shown in FIG. 1;
Fig. 3 is the second structural schematic diagram of rubbing head provided by one embodiment of the present invention;
Fig. 4 is the gas subregion distributed architecture schematic diagram of rubbing head provided by one embodiment of the present invention.
Appended drawing reference:
1- matrix;2- matrix pressure ring;
3- ventilation partition;The soft membrane pressure plate of 4-;
5- inner septum;6- maintains ring;
The soft film of 7-;The soft film supporting plate of 8-;
Lead to plate in 9-;10- porous disc;
11- first gas subregion;
12- second gas subregion;
13- third gas subregion;
The 4th gas subregion of 14-.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical", The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ", " third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can To be mechanical connection, it is also possible to be electrically connected;It can be directly connected, can also can be indirectly connected through an intermediary Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition Concrete meaning in invention.
Fig. 1 is the first structure diagram of rubbing head provided by one embodiment of the present invention;Fig. 2 is polishing shown in FIG. 1 The partial structural diagram of head;Fig. 3 is the second structural schematic diagram of rubbing head provided by one embodiment of the present invention;Fig. 4 is this The gas subregion distributed architecture schematic diagram for the rubbing head that invention one embodiment provides.
As shown in Figs 1-4, a kind of rubbing head provided in this embodiment, comprising:
Matrix 1;
Matrix pressure ring 2, described matrix pressure ring 2 are mounted in described matrix 1 and connect with described matrix 1;
Ventilation partition 3, the ventilation partition 3 is connect with described matrix 1 by helix tube, and is set in described matrix pressure ring Outside 2, for transmitting gas circuit;
Soft membrane pressure plate 4, the soft membrane pressure plate 4 is connect with the ventilation partition 3, and is set in outside described matrix pressure ring 2, is used In transmitting gas circuit;
Inner septum 5, the inner septum 5 are set on described matrix pressure ring 2, and the outer end of the inner septum 5 leads to described Air bound plate 3 and the soft membrane pressure plate 4 connect;
Sealing is formed between described matrix pressure ring 2, the ventilation partition 3, the inner septum 5 and the soft membrane pressure plate 4 First gas subregion 11;The inner septum 5 can be deformed according to the gas pressure in the first gas subregion 11, driving Described matrix pressure ring 2, the ventilation partition 3 and the soft membrane pressure plate 4 move down;
Ring 6 is maintained, the maintenance ring 6 is connect with the soft membrane pressure plate 4;
Soft film 7, the soft film 7 are mounted on the inner ring for maintaining ring 6, and the inside of the soft film 7 is provided at least two layers The subregion slot of annular;
Soft film supporting plate 8 and in lead to plate 9, the soft film supporting plate 8 and it is described in lead to plate 9 be annular plate-like;The soft film support Plate 8 and it is described in lead to about 9 plate positioned opposite, and be installed on the inside of the soft film 7 and connect with the inner end of the soft film 7, By the different subregions slot sealed separation of the soft film 7 at different gas subregions;
Lead on plate 9 in described and be provided with multiple gas circuit holes, for being connected to multiple gas subregions.
From the foregoing, it will be observed that described matrix 1 is the foundation structure of entire rubbing head, with reference to Fig. 1-4, by described matrix 1 Installation base body pressure ring 2, ventilation partition 3, soft membrane pressure plate 4 and inner septum 5, make above-mentioned component form first in described matrix 1 Gas subregion 11.
Upper part-structure based on rubbing head, when inputting gas into the first gas subregion 11, by institute Stating inner septum 5 can deform according to the gas pressure in the first gas subregion 11, so described matrix can be driven Pressure ring 2, the ventilation partition 3 and the soft membrane pressure plate 4 move down.
Specifically, ventilating using the helix tube, and then gas is inputted to the first gas subregion 11, helix tube is logical Extending or shortening after gas, and can play the role of connecting matrix 1.When the gas pressure hair in the first gas subregion 11 When changing, deformation occurs for the inner septum 5, to drive described matrix pressure ring 2, the ventilation partition 3 and the soft membrane pressure What plate 4 moved down, so by adjusting the gas pressure in the first gas subregion 11, it will be able to swollen using inner septum 5 Driving force caused by swollen moves down described matrix pressure ring 2, the ventilation partition 3 and the soft membrane pressure plate 4.
Continue to refer to figure 1-4, the maintenance ring 6, soft film 7, soft film supporting plate 8 and in lead to plate 9 common in the lower part of rubbing head Constitute multiple and different gas subregions, be all mutually indepedent sealed set between multiple gas subregion, and it is described in lead to Be provided with multiple gas circuit holes on plate 9, can be used to be connected to multiple gas subregions, to different gas subregion conveying gases or Person extracts gas.
Based on the part-structure, when to the soft film 7 and it is described in lead in the gas subregion formed between plate 9 and input gas Body, so that it may so that soft film 7 touch wafer, and make crystal round fringes and soft 7 opposing seal of film;And to the soft film 7 and the soft film Negative pressure is added in the gas subregion formed between supporting plate 8, so that it may so as to form vacuum chamber between soft film 7 and wafer so that wafer is sucked.
From the foregoing, it will be observed that not only air-tightness is good for rubbing head described above, but also structure is simple, is easily installed disassembly, It can be realized good wafer and polishing effect in the actual manufacturing.
Further, in an embodiment of the present invention, the subregion slot of the inside setting shellring shape of the soft film 7;
The soft film supporting plate 8 and it is described in lead to plate 9 and be installed in 7 inside of the soft film and the inner end of the soft film 7 and connect It connects, by three layers of subregion slot sealed separation of the soft film 7 at second gas subregion 12, third gas subregion 13 and the 4th gas point Area 14.
In this embodiment, since three layers of subregion slot sealed separation of the soft film 7 are at second gas subregion 12, third gas Body subregion 13 and the 4th gas subregion 14 can realize the operation more refined when drawing wafer.
Specifically, soft film 7 can be made to touch wafer first when inputting gas to the second gas subregion 12;When to When the third gas subregion 13 inputs gas, crystal round fringes and soft 7 opposing seal of film can be made.Divide when to the 4th gas It, can be so as to form vacuum chamber between soft film 7 and wafer so that wafer is sucked when negative pressure being added in area 14.Three gas subregions are real respectively Existing different technical effect, keeps the absorption of wafer more accurate.
Further, in an embodiment of the present invention, the inner end of the soft film 7 is provided with protrusion;
The soft film supporting plate 8 and it is described in lead to the protrusion compression seal of plate 9 with the inner end of the soft film 7.So utilizing The structure of the protrusion can make the inside compression seal of the soft film supporting plate 8 and the soft film 7, improve sealing effect and peace Fill convenience.Similarly, using the structure of the protrusion, the inside compression seal for leading to plate 9 and the soft film 7 in described can be made, Improve sealing effect and installation convenience.
Further, in an embodiment of the present invention, the maintenance ring 6 includes that upper layer maintains ring 6 and lower layer to maintain ring 6;
The upper layer maintains ring 6 and the lower layer to maintain to be stacked between ring 6.
Preferably, in an embodiment of the present invention, it includes ceramics or polyether-ether-ketone that the upper layer, which maintains the material of ring 6,;
With or, the lower layer maintains the material of ring 6 to include polyether-ether-ketone or gather stupid thioether.
Further, in an embodiment of the present invention, further includes: porous disc 10, the porous disc 10 are mounted on described soft In film 7.
Further, in an embodiment of the present invention, the radius of multiple gas subregions is different.
Preferably, in an embodiment of the present invention, the material of the soft film 7 includes silicon rubber;
With or, the soft film supporting plate 8 and it is described in lead to plate 9 material include polyether-ether-ketone.
Present invention also provides a kind of polissoirs, including the rubbing head.
Since the specific structure of the rubbing head, the principle of work and power and technical effect are in detailed hereinbefore, herein just no longer It repeats.So any technology contents about the rubbing head, can refer to above for the record of the rubbing head i.e. It can.
Present invention also provides a kind of application methods of rubbing head, including the rubbing head, the method is as follows:
Rubbing head is moved to above wafer;
Gas is inputted to the first gas subregion 11, declines the maintenance ring 6 close to wafer;
To the soft film 7 and it is described in lead between plate 9 and input gas in the gas subregion that is formed, so that soft film 7 is touched wafer, And make crystal round fringes and soft 7 opposing seal of film;
Negative pressure is added into the gas subregion formed between the soft film 7 and the soft film supporting plate 8, makes soft film 7 and wafer Between formed vacuum chamber wafer is sucked, rubbing head is removed.
Embodiment one
With reference to the structure of Fig. 1-4, when the soft film 7 and it is described in lead to the gas subregion formed between plate 9 be second gas Subregion 12 and third gas subregion 13, when the gas subregion formed between the soft film 7 and the soft film supporting plate 8 is the 4th gas When subregion 14.
Rubbing head can be moved to above wafer first;Gas is inputted to the first gas subregion 11, makes the maintenance Ring 6 declines close to wafer;When inputting gas to the second gas subregion 12, soft film 7 can be made to touch wafer first;To described When third gas subregion 13 inputs gas, crystal round fringes and soft 7 opposing seal of film can be made;Into the 4th gas subregion 14 It, can be so as to form vacuum chamber between soft film 7 and wafer so that wafer is sucked when negative pressure is added.
It should be noted that above-described embodiment one is merely to be described in detail specific embodiment cited by technical solution, when simultaneously Do not indicate that the distribution of the gas subregion is limited in first gas subregion 11, second gas subregion 12,13 and of third gas subregion 4th gas subregion 14.
The quantity of gas subregion can be arranged in those skilled in the art according to the actual situation, just repeat no more herein.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations;To the greatest extent Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into Row equivalent replacement;And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution The range of scheme.

Claims (10)

1. a kind of rubbing head characterized by comprising
Matrix;
Matrix pressure ring, described matrix pressure ring are mounted in described matrix and connect with described matrix;
Ventilation partition, the ventilation partition is connect with described matrix by helix tube, and is set in outside described matrix pressure ring, is used for Transmit gas circuit;
Soft membrane pressure plate, the soft membrane pressure plate is connect with the ventilation partition, and is set in outside described matrix pressure ring, for transmitting gas Road;
Inner septum, the inner septum are set on described matrix pressure ring, and the outer end of the inner septum and the ventilation partition and The soft membrane pressure plate connection;
Packed first gas is formed between described matrix pressure ring, the ventilation partition, the inner septum and the soft membrane pressure plate Body subregion;The inner septum can be deformed according to the gas pressure in the first gas subregion, driving described matrix pressure ring, The ventilation partition and the soft membrane pressure plate move down;
Ring is maintained, the maintenance ring is connect with the soft membrane pressure plate;
Soft film, the soft film are mounted on the inner ring for maintaining ring, point of at least two layers annular are provided on the inside of the soft film Area's slot;
Soft film supporting plate and in lead to plate, the soft film supporting plate and it is described in lead to plate be annular plate-like;The soft film supporting plate and described In to lead to plate or more positioned opposite, and be installed on the inside of the soft film and connect with the inner end of the soft film, by the soft film Different subregions slot sealed separation is at different gas subregions;
Lead on plate in described and be provided with multiple gas circuit holes, for being connected to multiple gas subregions.
2. rubbing head according to claim 1, which is characterized in that the subregion of the inside setting shellring shape of the soft film Slot;
The soft film supporting plate and it is described in lead to plate and be installed on the inside of the soft film and connect with the inner end of the soft film, will described in Three layers of subregion slot sealed separation of soft film are at second gas subregion, third gas subregion and the 4th gas subregion.
3. rubbing head according to claim 1, which is characterized in that the inner end of the soft film is provided with protrusion;
The soft film supporting plate and it is described in lead to plate and the soft film inner end protrusion compression seal.
4. rubbing head according to claim 1, which is characterized in that the maintenance ring includes that upper layer maintains ring and lower layer to maintain Ring;
The upper layer maintains ring and the lower layer to maintain to be stacked between ring.
5. rubbing head according to claim 4, which is characterized in that it includes ceramics or polyethers that the upper layer, which maintains the material of ring, Ether ketone;
With or, the lower layer maintains the material of ring to include polyether-ether-ketone or gather stupid thioether.
6. rubbing head according to any one of claims 1-5, which is characterized in that further include:
Porous disc, the porous disc are mounted in the soft film.
7. rubbing head according to any one of claims 1-5, which is characterized in that the radius of multiple gas subregions is not Together.
8. rubbing head according to any one of claims 1-5, which is characterized in that the material of the soft film includes silicon rubber Glue;
With or, the soft film supporting plate and it is described in lead to plate material include polyether-ether-ketone.
9. a kind of polissoir, which is characterized in that including rubbing head such as of any of claims 1-8.
10. a kind of application method of rubbing head, which is characterized in that including rubbing head as claimed in claim 9, the method is as follows:
Rubbing head is moved to above wafer;
Gas is inputted to the first gas subregion, declines the maintenance ring close to wafer;
To the soft film and it is described in lead between plate and input gas in the gas subregion that is formed, so that soft film is touched wafer, and make crystalline substance The edge of the circle and soft film opposing seal;
Negative pressure is added into the gas subregion formed between the soft film and the soft film supporting plate, makes to be formed between soft film and wafer true Cavity wafer is sucked, remove by rubbing head.
CN201811384642.0A 2018-11-20 2018-11-20 The application method of rubbing head, polissoir and rubbing head Pending CN109202697A (en)

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CN201811384642.0A CN109202697A (en) 2018-11-20 2018-11-20 The application method of rubbing head, polissoir and rubbing head

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Application Number Priority Date Filing Date Title
CN201811384642.0A CN109202697A (en) 2018-11-20 2018-11-20 The application method of rubbing head, polissoir and rubbing head

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CN109202697A true CN109202697A (en) 2019-01-15

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020253869A1 (en) * 2019-06-21 2020-12-24 清华大学 Air film for chemical mechanical polishing head, chemical mechanical polishing head, and polishing device
CN113829233A (en) * 2021-08-21 2021-12-24 浙江晶盛机电股份有限公司 Polishing carrier

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1440321A (en) * 2000-05-12 2003-09-03 多平面技术公司 Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
US20100240287A1 (en) * 2006-11-22 2010-09-23 Applied Materials, Inc. Flexible Membrane for Carrier Head
US20130065495A1 (en) * 2011-09-12 2013-03-14 Manoj A. Gajendra Carrier head with composite plastic portions
TW201434581A (en) * 2013-03-13 2014-09-16 Applied Materials Inc Reinforcement ring for carrier head
CN108369903A (en) * 2015-10-30 2018-08-03 胜高股份有限公司 Polishing wafer device and rubbing head for the device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1440321A (en) * 2000-05-12 2003-09-03 多平面技术公司 Pneumatic diaphragm head having independent retaining ring and multi-region pressure control, and method to use the same
US20100240287A1 (en) * 2006-11-22 2010-09-23 Applied Materials, Inc. Flexible Membrane for Carrier Head
US20130065495A1 (en) * 2011-09-12 2013-03-14 Manoj A. Gajendra Carrier head with composite plastic portions
TW201434581A (en) * 2013-03-13 2014-09-16 Applied Materials Inc Reinforcement ring for carrier head
CN108369903A (en) * 2015-10-30 2018-08-03 胜高股份有限公司 Polishing wafer device and rubbing head for the device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020253869A1 (en) * 2019-06-21 2020-12-24 清华大学 Air film for chemical mechanical polishing head, chemical mechanical polishing head, and polishing device
CN113829233A (en) * 2021-08-21 2021-12-24 浙江晶盛机电股份有限公司 Polishing carrier

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Application publication date: 20190115