CN109727903A - Absorbent module, bonding pad disassembling apparatus and method and semiconductor packaging system - Google Patents
Absorbent module, bonding pad disassembling apparatus and method and semiconductor packaging system Download PDFInfo
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- CN109727903A CN109727903A CN201711060523.5A CN201711060523A CN109727903A CN 109727903 A CN109727903 A CN 109727903A CN 201711060523 A CN201711060523 A CN 201711060523A CN 109727903 A CN109727903 A CN 109727903A
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- sucker
- bonding pad
- pad
- absorbent module
- flexible pad
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Abstract
The present invention provides a kind of absorbent module, bonding pad disassembling apparatus and method and semiconductor packaging system, the absorbent modules, comprising: the first sucker, flexible pad and vacuum supply unit；The flexible pad is equipped with through-hole；The flexible pad is set between the surface in first sucker and the slab construction with protrusion, and the vacuum supply unit provides vacuum for first sucker, for adsorbing the slab construction through the through-hole.The present invention avoid or reduces surface irregularity and bring gap, improves adsorption effect.
Description
Technical field
The present invention relates to semiconductor field more particularly to a kind of absorbent module, bonding pad disassembling apparatus and method, Yi Jiban
Conductor package system.
Background technique
Bonding technology is solved, is a ring important in semiconductor packaging process, with the hair of Wafer level packaging (WSP)
Exhibition, surface have the bonding pad of three-dimension packaging structure (implantation tin ball) after disassembling, can directly enter subsequent scribing process, phase
Than be thinned after replant into tin ball, the former in packaging technology have more advantage.
It, can be using heat sliding dismantling technique, wherein can use sucker suction key in conventional solution bonding technology mode
Piece surface is closed, by the mobile dismantling bonding pad of sucker, however, due to bonding pad surface irregularity (the tin ball for being implanted into tin ball
Height 80um or so), more gap can be generated between sucker and bonding pad, so as to cause the adsorption effect failure of sucker or drop
It is low.
Summary of the invention
The present invention provides a kind of absorbent module, bonding pad disassembling apparatus and method and semiconductor packaging systems, to solve
The technical issues of adsorption effect of sucker fails or reduces.
A kind of absorbent module is provided according to the first aspect of the invention, and there is the plate knot of protrusion for absorption surface
Structure, comprising: the first sucker, flexible pad and vacuum supply unit；The flexible pad is equipped with through-hole；The flexible pad is set to described the
Between surface on one sucker and the slab construction with protrusion, the vacuum supply unit provides very for first sucker
Sky, for adsorbing the slab construction through the through-hole.
Optionally, the recessed of the protrusion can be accommodated by opening up on the surface for connecting the slab construction of the flexible pad
Slot, the edge of the flexible pad are contacted with the flush edge Region Matching of the slab construction.
Optionally, the groove is circular groove.
Optionally, the flexible pad is silica gel material.
According to the second aspect of the invention, a kind of bonding pad disassembling apparatus is provided, the bonding pad includes device wafers
With carrying wafer, there is three-dimensional structure in the device wafers, the bonding pad disassembling apparatus includes first aspect and its optional
The absorbent module that scheme provides, the flexible pad are placed in the surface in the device wafers with three-dimensional structure and described first and inhale
Between disk.
Optionally, it is equipped with cooling duct in first sucker, is passed through cooling medium in the cooling duct.
Optionally, the device, further includes: thermal insulation board, the sucker are set on the thermal insulation board.
Optionally, the device, further includes upper Suction cup assembly and driving assembly, and the upper Suction cup assembly includes the second suction
Disk, wafer is carried described in second sucker suction, and the driving component drives the upper Suction cup assembly and the absorbent module
Relative motion, so that the device wafers and carrying wafer are separated.
According to the third aspect of the invention we, a kind of semiconductor packaging system, including second aspect and its optional side are provided
The device that case provides.
According to a fourth aspect of the present invention, a kind of bonding pad disassembling method is provided, is provided for third aspect optinal plan
Device the bonding pad is disassembled, comprising:
The flexible pad is placed between surface and first sucker in the device wafers with three-dimensional structure, is opened
Vacuum is opened, first sucker adsorbs the device wafers along first direction through the through-hole；
Control the upper Suction cup assembly along described in the first direction vacuum suction carrying wafer along with the three-dimensional structure
Opposite one side；
The upper Suction cup assembly or/and the absorbent module is driven to move in a second direction, so that the bonding pad is torn open
Solution, wherein the first direction is vertical with the second direction.
Absorbent module, bonding pad disassembling apparatus and method provided by the invention and semiconductor packaging system, by absorption
In the use and absorbent module of component, flexible pad is used, avoid or reduces surface irregularity and bring gap,
Improve adsorption effect.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without any creative labor, may be used also for those of ordinary skill in the art
To obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of an absorbent module of the invention；
Fig. 2 is the structural schematic diagram of a bonding pad of the invention；
Fig. 3 is the structural schematic diagram of a bonding pad disassembling apparatus of the invention；
Fig. 4 is the structural schematic diagram of one first sucker of the invention；
Fig. 5 is the structural schematic diagram one of a flexible pad of the invention；
Fig. 6 is the structural schematic diagram two of a flexible pad of the invention；
Fig. 7 is the structural schematic diagram three of a flexible pad of the invention；
Fig. 8 is the flow diagram of a bonding pad disassembling method of the invention；
Fig. 9 a to Fig. 9 d is the schematic diagram of each step of a bonding pad disassembling method of the invention.
In figure:
The second sucker of 1-；
2- bonding pad；
21- carries wafer；
22- is bonded glue；
23- device wafers；
24- tin ball；
3- flexible pad；
31- through-hole；
32- groove；
The first sucker of 4-；
41- vacuum passage；
The cooling duct 42-；
43- thermal insulation board；
44- import；
The outlet 45-；
46- vacuum port；
5- slab construction；
6- vacuum supply unit.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
Technical solution of the present invention is described in detail with specifically embodiment below.These specific implementations below
Example can be combined with each other, and the same or similar concept or process may be repeated no more in some embodiments.
Fig. 1 is the structural schematic diagram of an absorbent module of the invention.
Referring to FIG. 1, the absorbent module, has the slab construction 5 of protrusion for absorption surface, comprising: first inhales
Disk 2, flexible pad 3 and vacuum supply unit 6；The flexible pad 3 is equipped with through-hole 31；The flexible pad 3 is set to first sucker 2
Between the surface in the slab construction 5 with protrusion, by taking Fig. 1 as an example, i.e. the lower surface of slab construction 5；The vacuum supplies
Answering unit 6 is that first sucker 2 provides vacuum, for adsorbing the slab construction 5 through the through-hole 31.Absorbent module
In, flexible pad is used, surface irregularity is avoid or reduced and bring gap, improves adsorption effect.Simultaneously as
Flexible pad is equipped with through-hole, has ensured the realization of adsorption function.
Wherein, the flexible pad can for silica gel material or other have flexibility, so as to for can with bumps not
Flat surface and any material that a certain amount of deformation occurs.First sucker 4, it can be understood as arbitrarily can be by vacuum supply unit 6
Vacuum action is applied to slab construction 5 and flexible pad 3, to realize the structure of absorption, is specifically as follows and is formed with vacuum passage
Structure.
In the embodiment, due to simultaneously as flexible pad is equipped with through-hole, having ensured adsorption function in absorbent module
It realizes.Meanwhile flexible pad is used, it avoid or reduces surface irregularity and bring gap, improves adsorption effect.
Absorbent module illustrated above is applied in the disassembling apparatus of bonding pad, slab construction 5 therein can be specially key
Close piece.
Fig. 2 is the structural schematic diagram of a bonding pad of the invention.
Referring to FIG. 2, the present invention and its optinal plan are for disassembling the bonding pad of structure similar to Figure 2.Its
In, bonding pad 2 includes: carrying wafer 21, bonding glue 22, device wafers 23 and tin ball 24；Carrying wafer 21 can be glass,
Glued by being bonded glue 22 between carrying wafer 21 and device wafers 23, the tin ball 24 is set to device wafers 23, as shown in Figure 2
For direction, tin ball 24 is set to the lower surface of device wafers 23, and the lower surface of device wafers 23 also is understood as the implantation of tin ball
Face, the upper surface of device wafers 23 are glued at carrying wafer 21 by being bonded glue 22, and carrying wafer 21 also can be replaced other
Meaning can carry the structure of device wafers.Bonding pad disassembling apparatus provided by of the invention and its optinal plan can be used for realizing device
The dismantling of wafer 23 and carrying wafer 21.
Tin ball 24 therein may be that other protrude from the raised structures on the surface, can be arbitrary three-dimensional knot
Structure, so, the absorbent module shown in Fig. 1 is applied to bonding pad when disassembling, and the protrusion of slab construction 5 shown in Fig. 1 can be specially key
Close the three-dimensional structure on 23 surface of device wafers of piece.
Fig. 3 is the structural schematic diagram of a bonding pad disassembling apparatus of the invention.
Referring to FIG. 3, described device, comprising: absorbent module referred to above, the flexible pad 3 are placed in the device
Between surface and first sucker 4 on wafer 23 with three-dimensional structure.
Wherein, with the surface of three-dimensional structure, face can be implanted into for previously described tin ball.
Flexible pad 3 can further use material resistant to high temperature, to guarantee that its performance will not become in technical process
Change.In one of embodiment, silica gel material can be used, is flexible soft materials.Meanwhile silica gel is 180
At DEG C can long-term work, a little higher than 200 DEG C can also bear several weeks or longer time it is still flexible, be instantaneously resistant to 300 DEG C or more
High temperature.In addition, flexible pad 3 can also protect bonding pad surface three dimension structure not to be destroyed.
In one of embodiment, referring to FIG. 3, the device, further includes upper Suction cup assembly and driving assembly, institute
Stating Suction cup assembly includes the second sucker 1, and second sucker 1 adsorbs the carrying wafer 21, and the driving component drives institute
Suction cup assembly and the absorbent module relative motion are stated, so that the device wafers 23 and carrying wafer 21 are separated.
Driving assembly can be used for driving Suction cup assembly, it can also be used to the absorbent module, or upper sucker is driven simultaneously
Component and absorbent module do not depart from the description of the present invention or more as long as meeting the relative motion of the two.
Fig. 4 is the structural schematic diagram of one second sucker of the invention.
Referring to FIG. 4, the device further includes cooling structure, the cooling structure includes being set to second sucker 4
Interior cooling duct 42 is passed through cooling medium in the cooling duct 42, is specifically as follows: the import 44 of the cooling duct 42
Cold source is connected to the outlet 45 of the cooling duct 42.
Cooling duct 42, it can be understood as the channel of any negotiable cooling medium, arrangement and structure type root
Any variation can occur for the specific structure according to the required effect of cooling and the first sucker 4.In addition, cooling medium therein can
To be enumerated as cooling water, it can also be not limited to cooling water, realized for example, by using cooling gas or other cooling fluids.
Cold source can provide the device of cooling medium to be any, meanwhile, can also have and provide circulation for cooling medium
Any device and control structure of power.
Tin ball 24 is pressed into inside the flexible pad 3 of such as silica gel by external force, and after being adsorbed on the first sucker 4, in order to avoid
First sucker 4 and cooling structure are made of one, i.e., are arranged in the first sucker by the risk that tin ball 24 is melted under hot conditions
Cooling duct, it is ensured that the heat that wafer 23 is implanted into tin ball side directly passes through the first sucker 4 and is pulled away, it is ensured that bonding pad 2
Underlaying surface temperature be not higher than tin ball 24 fusion temperature, and then prevent tin ball side melt.
In addition, in order to which the cooling control of temperature is better achieved, the cooling structure may also include temperature sensor, be used for
Detect in the first sucker 4, flexible pad 3, bonding pad 2 and environment temperature it is one of any so that: circulate in cooling duct cold
The temperature of matchmaker, speed, time, circulation etc. can be controlled according to the testing result of temperature sensor, control therein
Not only include the quantization variation of temperature enumerated above, speed, time, circulation, also includes the touching whether refrigerant is opened
Hair variation can be more accurately controlled cooling unlatching, be closed by sensor and specific control, and cooling dynamics.
The vacuum passage 41 for realizing absorption, vacuum can be also equipped in one of embodiment, in the first sucker 4
Channel 41 connects vacuum supply unit by vacuum port 46.Vacuum passage 41 can be connected to the connection flexible pad 3 of the first sucker 4
Surface.
Flexible pad 3 uses silica gel material, and the technique of equal cloth hole realizes transition thereon, completes to be implanted between tin ball bonding pad 2
It connecing and is adsorbed with the first sucker 4, tin ball is uneven, just starts to vacuumize, and do not have to external force and compress, will lead to leakage, so, vacuum
Absorption may external force compress bonding pad 2 and flexible pad 3 and could complete to adsorb, to guarantee bonding pad 2 and flexibility in the process
No leakage between pad 3,8 cun of bonding chip sizes are larger, need that the technique can be completed under personnel's matching requirements.
In one of embodiment, the device, further includes: thermal insulation board 43, the thermal insulation board 43 are connected to described
First sucker 4 can be set to the thermal insulation board 43 for the first sucker 4.Specifically, may connect to the second sucker 4 with institute
State the opposite side of middle pad 3.
Fig. 5 is the structural schematic diagram one of a middle pad of the invention.Fig. 6 is the structural schematic diagram two of a middle pad of the invention.
Fig. 7 is the structural schematic diagram three of a middle pad of the invention.
Fig. 5 and Fig. 6 are please referred to, the distribution of through-hole 31 can be non-uniform in flexible pad 3.Opposite, referring to FIG. 6,
The distribution of through-hole 31 is also possible to uniformly in flexible pad 3.
In one of embodiment, referring to FIG. 7, the flexible pad 3 is used to connect the slab construction 5, that is, connect
It connects and opens up the groove 32 that can accommodate the protrusion on the surface of bonding pad 2, edge and the slab construction of the flexible pad 3
The contact of flush edge Region Matching.
Flush edge region, it is possible to understand that are as follows: the layer side edge of the implantation tin spherical surface of bonding pad 2 without actual chips (die),
Also Wuxi ball is implanted into, and by taking 8 cun of bonding pads as an example: its edge 5-10mm is not implanted into tin ball with exterior domain, compared to rough
Interior zone, the region is smooth, can directly adsorb with flexible pad 3, in turn, bonding pad 2 directly can be adsorbed on flexible pad
On 3, in specific implementation process, the circle of 195mm can be chosen on 3 surface of flexible pad of the silica gel of thickness 5mm diameter 200mm,
The slot of a depth 0.5-1mm, i.e. groove 32 are opened in upper surface using tool, gets through several (such as the 7X of hole 31 in lower surface
Φ20mm)；Bonding pad 2 is put into the reeded flexible pad 3 in surface, using the plane contact at edge, can be pressed without external force
Pressure, which directly vacuumizes i.e., can reach bonding pad 2 in the absorption of the first sucker 4, and subsequent solution blade technolgy can be completed.
Optinal plan of the present invention additionally provides a kind of semiconductor packaging system, including device referred to above.
Fig. 8 is the flow diagram of a bonding pad disassembling method of the invention；Fig. 9 a to Fig. 9 d is that a bonding pad of the invention is torn open
The schematic diagram of each step of solution method.
Referring to FIG. 8, and Fig. 9 a to Fig. 9 d, the method, for disassembling dress using bonding pad referred to above
It sets and the bonding pad is disassembled, can specifically include:
S11: by the flexible pad be placed in the device wafers with three-dimensional structure surface and first sucker it
Between, vacuum is opened, first sucker adsorbs the device wafers along first direction through the through-hole.
S12: the control upper Suction cup assembly along carrying wafer described in the first direction vacuum suction with the three-dimensional
The opposite one side of structure.
Wherein, first direction can be understood as vertical direction shown in Fig. 9 a to Fig. 9 d.
Please refer to Fig. 9 a and Fig. 9 b, above step concretely: by 3 first sucker 4 of flexible pad of punching, then by bonding pad
It is placed in 2 pairs in flexible pad 3, and may further guarantee that the through-hole in flexible pad 3 is bonded piece 2 and is completely covered.Bonding pad 2
After placement, the vacuum pump of sucker 4 can be opened, bonding pad 2 is adsorbed in the second sucker 4, is specially adsorbed in flexible pad 3.
Then, the first sucker of transverse shifting 4, so that the first sucker 4 and the vertical coincidence of the second sucker 1, then drive under the second sucker 1
It moves, when the second sucker 1 is engaged in bonding pad 2, the vacuum pump of the second sucker 1 can be opened, to realize bonding pad 2 and second
Absorption between sucker 1, i.e. bonding pad 2 are adsorbed by the first sucker 4 and the second sucker 1 simultaneously.
S13: the upper Suction cup assembly or/and the absorbent module is driven to move in a second direction, so that the bonding
Piece dismantling, wherein the first direction is vertical with the second direction.In the signal of Fig. 9 c and Fig. 9 d, second direction can be managed
Solution is horizontal direction.
, can be when the second sucker temperature reach threshold value in specific implementation process, ability implementation steps S13.
Wherein, threshold value can be enumerated as 200 DEG C -210 DEG C of any one temperature value or temperature range.
The signal that its process can refer to Fig. 9 c and Fig. 9 d understands.Wherein it is possible to which the driving motor using driving assembly drives
Two suckers move in the opposite direction, or the one of sucker movement of driving, another sucker is motionless, to complete to disassemble.
The method improves absorption effect in addition to that can avoid or reduce bonding pad surface irregularity and bring gap
Fruit can carry out effective protection with para-linkage piece, it is avoided to be damaged.Further, it is also possible to improve process efficiency, increase wafer envelope
Fill yield.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of absorbent module has the slab construction of protrusion for absorption surface characterized by comprising the first sucker, soft
Property pad and vacuum supply unit；The flexible pad is equipped with through-hole；The flexible pad is set to first sucker and the plate knot
Between surface on structure with protrusion, the vacuum supply unit provides vacuum for first sucker, for through described logical
Adsorb the slab construction in hole.
2. absorbent module according to claim 1, which is characterized in that the flexible pad is used to connect the slab construction
Surface on open up the groove that can accommodate the protrusion, the flush edge region at the edge of the flexible pad and the slab construction
Matching contact.
3. absorbent module according to claim 2, which is characterized in that the groove is circular groove.
4. absorbent module according to claim 1, which is characterized in that the flexible pad is silica gel material.
5. a kind of bonding pad disassembling apparatus, the bonding pad includes device wafers and carrying wafer, is had in the device wafers
Three-dimensional structure, which is characterized in that the bonding pad disassembling apparatus includes the absorbent module as described in claim 1-4 is any, institute
Flexible pad is stated to be placed between the surface and first sucker in the device wafers with three-dimensional structure.
6. device according to claim 5, which is characterized in that be equipped with cooling duct, the cooling in first sucker
Cooling medium is passed through in channel.
7. device according to claim 6, which is characterized in that further include: thermal insulation board, first sucker are set to described
On thermal insulation board.
8. device according to claim 5, which is characterized in that further include upper Suction cup assembly and driving assembly, the upper suction
Disk component includes the second sucker, and wafer is carried described in second sucker suction, and the driving component drives the upper sucker group
Part and the absorbent module relative motion, so that the device wafers and carrying wafer are separated.
9. a kind of semiconductor packaging system, which is characterized in that including the described in any item devices of claim 5 to 8.
10. a kind of bonding pad disassembling method, which is characterized in that for utilizing device according to any one of claims 8 to the bonding pad
It is disassembled, comprising:
The flexible pad is placed between surface and first sucker in the device wafers with three-dimensional structure, is opened true
Sky, first sucker adsorb the device wafers along first direction through the through-hole；
It is opposite with the three-dimensional structure along carrying wafer described in the first direction vacuum suction to control the upper Suction cup assembly
One side；
The upper Suction cup assembly or/and the absorbent module is driven to move in a second direction, so that the bonding pad is disassembled,
In, the first direction is vertical with the second direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711060523.5A CN109727903A (en) | 2017-10-31 | 2017-10-31 | Absorbent module, bonding pad disassembling apparatus and method and semiconductor packaging system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711060523.5A CN109727903A (en) | 2017-10-31 | 2017-10-31 | Absorbent module, bonding pad disassembling apparatus and method and semiconductor packaging system |
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| CN201711060523.5A Pending CN109727903A (en) | 2017-10-31 | 2017-10-31 | Absorbent module, bonding pad disassembling apparatus and method and semiconductor packaging system |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
| CN111244015A (en) * | 2020-01-20 | 2020-06-05 | 杭州立昂东芯微电子有限公司 | Wafer de-bonding auxiliary carrying disc, de-bonding machine and de-bonding method |
| CN113808928A (en) * | 2021-08-04 | 2021-12-17 | 北京华卓精科科技股份有限公司 | Laser annealing method and porous sucker with automatic cooling function |
| CN118380370A (en) * | 2024-06-21 | 2024-07-23 | 上海果纳半导体技术有限公司 | Substrate bearing device and film pasting equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103177997A (en) * | 2011-12-22 | 2013-06-26 | 中芯国际集成电路制造(北京)有限公司 | Reaction device for processing wafers, electrostatic chuck (ESC) and wafer temperature control method |
| CN103489801A (en) * | 2012-06-12 | 2014-01-01 | 国际商业机器公司 | System and method of forming solder bumps on three dimensional module |
| CN103904012A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Vacuum sucker for TSV silicon wafer |
| CN104425312A (en) * | 2013-09-09 | 2015-03-18 | 株式会社东芝 | Semiconductor manufacturing apparatus |
-
2017
- 2017-10-31 CN CN201711060523.5A patent/CN109727903A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103177997A (en) * | 2011-12-22 | 2013-06-26 | 中芯国际集成电路制造(北京)有限公司 | Reaction device for processing wafers, electrostatic chuck (ESC) and wafer temperature control method |
| CN103489801A (en) * | 2012-06-12 | 2014-01-01 | 国际商业机器公司 | System and method of forming solder bumps on three dimensional module |
| CN103904012A (en) * | 2012-12-28 | 2014-07-02 | 上海微电子装备有限公司 | Vacuum sucker for TSV silicon wafer |
| CN104425312A (en) * | 2013-09-09 | 2015-03-18 | 株式会社东芝 | Semiconductor manufacturing apparatus |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110040684A (en) * | 2019-05-14 | 2019-07-23 | 苏州美图半导体技术有限公司 | Automatic solution bonder |
| CN110040684B (en) * | 2019-05-14 | 2024-04-09 | 苏州美图半导体技术有限公司 | Automatic bond-releasing machine |
| CN111244015A (en) * | 2020-01-20 | 2020-06-05 | 杭州立昂东芯微电子有限公司 | Wafer de-bonding auxiliary carrying disc, de-bonding machine and de-bonding method |
| CN113808928A (en) * | 2021-08-04 | 2021-12-17 | 北京华卓精科科技股份有限公司 | Laser annealing method and porous sucker with automatic cooling function |
| CN118380370A (en) * | 2024-06-21 | 2024-07-23 | 上海果纳半导体技术有限公司 | Substrate bearing device and film pasting equipment |
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Application publication date: 20190507 |