JP2003531942A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2003531942A5 JP2003531942A5 JP2001580225A JP2001580225A JP2003531942A5 JP 2003531942 A5 JP2003531942 A5 JP 2003531942A5 JP 2001580225 A JP2001580225 A JP 2001580225A JP 2001580225 A JP2001580225 A JP 2001580225A JP 2003531942 A5 JP2003531942 A5 JP 2003531942A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- silicone resin
- composition
- uncured silicone
- optionally substituted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920002050 silicone resin Polymers 0.000 description 9
- 239000000203 mixture Substances 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 3
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 3
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229910008051 Si-OH Inorganic materials 0.000 description 2
- 229910006358 Si—OH Inorganic materials 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 125000000732 arylene group Chemical group 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP00401160 | 2000-04-27 | ||
| EP00401160.7 | 2000-04-27 | ||
| PCT/EP2001/004606 WO2001083608A1 (en) | 2000-04-27 | 2001-04-24 | Curable silicone resin composition and reactive silicon compounds |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003531942A JP2003531942A (ja) | 2003-10-28 |
| JP2003531942A5 true JP2003531942A5 (enExample) | 2011-06-16 |
Family
ID=8173660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001580225A Pending JP2003531942A (ja) | 2000-04-27 | 2001-04-24 | 硬化性シリコーン樹脂組成物及び反応性珪素化合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6780471B2 (enExample) |
| EP (1) | EP1276807B1 (enExample) |
| JP (1) | JP2003531942A (enExample) |
| AT (1) | ATE306518T1 (enExample) |
| AU (1) | AU2001273963A1 (enExample) |
| DE (1) | DE60120147T2 (enExample) |
| WO (1) | WO2001083608A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8492469B2 (en) | 2008-05-07 | 2013-07-23 | Sumitomo Bakelite Co., Ltd. | Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film |
| KR101266290B1 (ko) * | 2008-12-30 | 2013-05-22 | 제일모직주식회사 | 레지스트 하층막용 하드마스크 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법 |
| KR101266291B1 (ko) * | 2008-12-30 | 2013-05-22 | 제일모직주식회사 | 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로디바이스의 제조방법 |
| JP7406300B2 (ja) * | 2018-11-12 | 2023-12-27 | 信越化学工業株式会社 | ヨウ素含有ケイ素化合物の製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA691206A (en) | 1964-07-21 | Dow Corning Corporation | Method of damping vibration | |
| GB1119666A (en) | 1965-08-06 | 1968-07-10 | Ici Ltd | Organosilicon polymers |
| GB1101589A (en) | 1965-09-09 | 1968-01-31 | Ici Ltd | Organosilicon resins |
| JPS6131461A (ja) * | 1984-07-24 | 1986-02-13 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノシロキサン組成物 |
| JPS6164753A (ja) * | 1984-09-06 | 1986-04-03 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノシロキサン組成物 |
| US5034061A (en) | 1990-03-15 | 1991-07-23 | General Electric Company | Transparent shatter-resistant silicone coating |
| JP2001506283A (ja) * | 1993-12-17 | 2001-05-15 | ハイトコ カーボン コンポジッツ インコーポレイテッド | 高温抵抗性を有するシリコーン複合体 |
| JP3277749B2 (ja) * | 1995-04-03 | 2002-04-22 | 信越化学工業株式会社 | シリコーンゲル組成物及びポッティング材 |
| US5747608A (en) | 1996-12-31 | 1998-05-05 | Dow Corning Corporation | Rubber-modified rigid silicone resins and composites produced therefrom |
| US5830950A (en) | 1996-12-31 | 1998-11-03 | Dow Corning Corporation | Method of making rubber-modified rigid silicone resins and composites produced therefrom |
| JP3518399B2 (ja) * | 1999-03-12 | 2004-04-12 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
-
2001
- 2001-04-24 AU AU2001273963A patent/AU2001273963A1/en not_active Abandoned
- 2001-04-24 US US10/258,722 patent/US6780471B2/en not_active Expired - Fee Related
- 2001-04-24 JP JP2001580225A patent/JP2003531942A/ja active Pending
- 2001-04-24 AT AT01940358T patent/ATE306518T1/de not_active IP Right Cessation
- 2001-04-24 EP EP01940358A patent/EP1276807B1/en not_active Expired - Lifetime
- 2001-04-24 DE DE60120147T patent/DE60120147T2/de not_active Expired - Fee Related
- 2001-04-24 WO PCT/EP2001/004606 patent/WO2001083608A1/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3029680B2 (ja) | オルガノペンタシロキサンおよびその製造方法 | |
| US10815339B2 (en) | Method for preparing organopolysiloxane resins | |
| JP2003201293A (ja) | アミノアルキルアルコキシシロキサン含有混合物、その製造方法及び使用並びにそれを含有するペイント、ラッカー及び樹脂 | |
| CN106317412A (zh) | 一种具有光反应活性的巯丙聚硅氧烷及其制备方法 | |
| TWI482818B (zh) | A hardening composition containing silicon oxide and a hardened product thereof | |
| KR970700744A (ko) | 접착성 조성물과 그의 경화 방법(adhesive composition and process for curing the same) | |
| JP5540750B2 (ja) | 環状シラザン化合物及びその製造方法 | |
| JP4221089B2 (ja) | シロキサンを含有する組成物 | |
| CN101298498A (zh) | 烷氧基封端线形聚硅氧烷偶联剂及其合成方法 | |
| JP4187974B2 (ja) | シリコーン化合物の製造方法 | |
| TW593441B (en) | Film-forming silicone resin composition | |
| JP2003531942A5 (enExample) | ||
| JP3859851B2 (ja) | 接着促進剤および硬化性シリコーン組成物 | |
| CN1037003C (zh) | 含有机氧基团的有机聚硅氧烷的制备方法 | |
| JP2596706B2 (ja) | オルガノポリシロキサン樹脂の製法 | |
| JP3296440B2 (ja) | ケイ素系ハイブリッド材料 | |
| JP2014077092A (ja) | 表面修飾複合金属酸化物を含有する樹脂組成物 | |
| JP2003535171A5 (enExample) | ||
| JP2000265063A (ja) | シリコーンゴム組成物 | |
| JP4453827B2 (ja) | シロキサン結合を有するオルガノキシシラン化合物及びその製造方法 | |
| JPS5819370A (ja) | 被覆用組成物および被覆方法 | |
| JPH05105766A (ja) | ケイ素系ハイブリツド材料 | |
| CN104788677B (zh) | T链节含h基的苯基氢基硅树脂及其制备方法 | |
| JP3999827B2 (ja) | オルガノペンタシロキサンの製造方法 | |
| JPH0586188A (ja) | ケイ素系ハイブリツド材料 |