ATE306518T1 - Härtbare silikonharz-zusammensetzung und reaktive siliziumverbindungen - Google Patents

Härtbare silikonharz-zusammensetzung und reaktive siliziumverbindungen

Info

Publication number
ATE306518T1
ATE306518T1 AT01940358T AT01940358T ATE306518T1 AT E306518 T1 ATE306518 T1 AT E306518T1 AT 01940358 T AT01940358 T AT 01940358T AT 01940358 T AT01940358 T AT 01940358T AT E306518 T1 ATE306518 T1 AT E306518T1
Authority
AT
Austria
Prior art keywords
silicone resin
resin composition
group
curable silicone
silicon compounds
Prior art date
Application number
AT01940358T
Other languages
German (de)
English (en)
Inventor
Pierre Chevalier
Iain A Mackinnon
Bizhong Zhu
Robert Jean-Pierre Corriu
Genevieve Marie-Louise Cerveau
Saint Loup Pic
Bertrand Francois Dabiens
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Application granted granted Critical
Publication of ATE306518T1 publication Critical patent/ATE306518T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0836—Compounds with one or more Si-OH or Si-O-metal linkage
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
AT01940358T 2000-04-27 2001-04-24 Härtbare silikonharz-zusammensetzung und reaktive siliziumverbindungen ATE306518T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP00401160 2000-04-27
PCT/EP2001/004606 WO2001083608A1 (en) 2000-04-27 2001-04-24 Curable silicone resin composition and reactive silicon compounds

Publications (1)

Publication Number Publication Date
ATE306518T1 true ATE306518T1 (de) 2005-10-15

Family

ID=8173660

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01940358T ATE306518T1 (de) 2000-04-27 2001-04-24 Härtbare silikonharz-zusammensetzung und reaktive siliziumverbindungen

Country Status (7)

Country Link
US (1) US6780471B2 (enExample)
EP (1) EP1276807B1 (enExample)
JP (1) JP2003531942A (enExample)
AT (1) ATE306518T1 (enExample)
AU (1) AU2001273963A1 (enExample)
DE (1) DE60120147T2 (enExample)
WO (1) WO2001083608A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492469B2 (en) 2008-05-07 2013-07-23 Sumitomo Bakelite Co., Ltd. Positive-type photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device including the cured film
KR101266290B1 (ko) * 2008-12-30 2013-05-22 제일모직주식회사 레지스트 하층막용 하드마스크 조성물 및 이를 이용한 반도체 집적회로 디바이스의 제조방법
KR101266291B1 (ko) * 2008-12-30 2013-05-22 제일모직주식회사 레지스트 하층막용 조성물 및 이를 이용한 반도체 집적회로디바이스의 제조방법
JP7406300B2 (ja) * 2018-11-12 2023-12-27 信越化学工業株式会社 ヨウ素含有ケイ素化合物の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA691206A (en) 1964-07-21 Dow Corning Corporation Method of damping vibration
GB1119666A (en) 1965-08-06 1968-07-10 Ici Ltd Organosilicon polymers
GB1101589A (en) 1965-09-09 1968-01-31 Ici Ltd Organosilicon resins
JPS6131461A (ja) * 1984-07-24 1986-02-13 Shin Etsu Chem Co Ltd 室温硬化性オルガノシロキサン組成物
JPS6164753A (ja) * 1984-09-06 1986-04-03 Shin Etsu Chem Co Ltd 室温硬化性オルガノシロキサン組成物
US5034061A (en) 1990-03-15 1991-07-23 General Electric Company Transparent shatter-resistant silicone coating
JP2001506283A (ja) * 1993-12-17 2001-05-15 ハイトコ カーボン コンポジッツ インコーポレイテッド 高温抵抗性を有するシリコーン複合体
JP3277749B2 (ja) * 1995-04-03 2002-04-22 信越化学工業株式会社 シリコーンゲル組成物及びポッティング材
US5747608A (en) 1996-12-31 1998-05-05 Dow Corning Corporation Rubber-modified rigid silicone resins and composites produced therefrom
US5830950A (en) 1996-12-31 1998-11-03 Dow Corning Corporation Method of making rubber-modified rigid silicone resins and composites produced therefrom
JP3518399B2 (ja) * 1999-03-12 2004-04-12 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物

Also Published As

Publication number Publication date
US20030130389A1 (en) 2003-07-10
EP1276807A1 (en) 2003-01-22
AU2001273963A1 (en) 2001-11-12
DE60120147T2 (de) 2006-09-28
EP1276807B1 (en) 2005-10-12
WO2001083608A1 (en) 2001-11-08
DE60120147D1 (de) 2006-07-06
JP2003531942A (ja) 2003-10-28
US6780471B2 (en) 2004-08-24

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Legal Events

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